CN110174432A - The thermophoresis experimental provision of Electronic Packaging microbonding point - Google Patents
The thermophoresis experimental provision of Electronic Packaging microbonding point Download PDFInfo
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- CN110174432A CN110174432A CN201910561093.8A CN201910561093A CN110174432A CN 110174432 A CN110174432 A CN 110174432A CN 201910561093 A CN201910561093 A CN 201910561093A CN 110174432 A CN110174432 A CN 110174432A
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- thermophoresis
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- electronic packaging
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- microbonding point
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
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Abstract
The invention discloses a kind of thermophoresis experimental provisions of Electronic Packaging microbonding point, the device successively includes heating mechanism, fixture and cooling body from top to bottom, the fixture is set in the space between heating mechanism and cooling body, for fixing sample, the cooling body includes outer housing, inner housing and refrigeration machine, the cavity for accommodating coolant liquid is equipped with inside the inner housing, outer cover is equipped with outer housing, the outer housing is fitted closely with inner housing, and the refrigeration machine is connected to through outer housing and inner housing with cavity by connecting line；The outer housing is made by thermal insulation material, evacuation notch is equipped at position corresponding with fixture, so that the sample in fixture is directly bonded with interior shell surface.It effectively can encapsulate the temperature gradient that microbonding point reaches in actual condition or under extreme conditions by simulation electronic, and then can study variation of the microbonding point under particular temperature gradient, carry out reliability assessment.
Description
Technical field
The present invention relates to a kind of extreme temperature gradient experimental provisions, and in particular to a kind of thermophoresis of Electronic Packaging microbonding point
Experimental provision.
Background technique
With the arrival of big data era, mobile device becomes ubiquitous；The development of Internet of Things is so that people and equipment, set
It is standby to become more and more frequently with exchanging for equipment；Artificial intelligence also continues to develop.With these promotions, it would be desirable to more next
More high performance electronic product.However, the miniaturization impetus of the ultra-large integrated transistor based on Moore's Law has slowed down.
Currently, the extension most promising method of Moore's Law is to be integrated into the three-dimensionally integrated of circuit from the two dimension of circuit.By taking solder joint as an example,
Size is from maximum 760 μm of BGA, to 100 μm of C4 flip-chip welding point, then arrives 10 μm of minimum dimension of micro convex point.
The lasting reduction of microbonding spot size and continuing to increase for device integration density are dissipating so that substrate heating problem is increasingly severe
Heat it is constant or heat dissipation improved under conditions of, the both ends of microbonding point will form huge temperature gradient, when in conductive material exist compared with
When high temperature gradient, along the opposite direction of temperature gradient directional migration, that is, thermophoresis will occur for atom.
In the presence of there is temperature gradient at metal both ends, the thermal vibration energy of the electronics in metal hot end is higher than the heat of cold end electronics
Vibrational energy causes electronics to possess energy gradient thus in metal both ends formation temperature gradient, which will drive electronics
From hot end to cold end directional migration.During a large amount of free electrons are migrated to cold end, the electronics of movement will in solder joint
Inelastic collision occurs for the atom or ion in portion, and a part of momentum is transferred to atom or ion, bring it about from hot end to
The directional migration of cold end.And the temperature gradient at small solder joint both ends will be higher under above-mentioned condition, even up to 10000 DEG C/cm
More than, this will significantly affect the reliability of small solder joint.
For integrity problem of the solder joint small in Electronic Packaging under extreme temperature gradient, need a set of reliable and stable
Experimental provision.
Summary of the invention
The object of the present invention is to provide a kind of thermophoresis experimental provisions of Electronic Packaging microbonding point, can effectively simulate electricity
The temperature gradient that son encapsulation microbonding point reaches in actual condition or under extreme conditions, and then microbonding point can be studied in specific temperature
The variation under gradient is spent, reliability assessment is carried out.
The thermophoresis experimental provision of Electronic Packaging microbonding point of the present invention, the device successively include heating from top to bottom
Mechanism, fixture and cooling body, the fixture is set in the space between heating mechanism and cooling body, for fixing sample,
The cooling body includes outer housing, inner housing and refrigeration machine, is equipped with the cavity for accommodating coolant liquid, outer cover inside the inner housing
Equipped with outer housing, the outer housing is fitted closely with inner housing, and the refrigeration machine runs through outer housing and inner casing by connecting line
Body is connected to cavity；The outer housing is made by thermal insulation material, and evacuation notch is equipped at position corresponding with fixture, so that folder
Sample in tool is directly bonded with interior shell surface.
Further, boss, the boss top surface shape and fixture are equipped at the position corresponding with fixture of the inner housing top surface
Shape is corresponding.
Further, the inner housing and one edge of outer housing top surface are equipped with heavy platform, and the fixture is placed in the heavy platform surface.
Further, the material of the outer housing is glass fibre, foamed cement, aerogel blanket, mineral wool, alumina silicate, gathers
One of urethane foam, styrofoam and phenol formaldehyde foam；The material of the inner housing is one in copper, stainless steel and aluminium alloy
Kind.
Further, the coolant liquid be mother liquor be mixed to prepare with deionized water, the mother liquor be calcium chloride, methanol, ethyl alcohol,
One of ethylene glycol, glycerine and lubricating oil, freezing point are 0 ~ -114 DEG C.
Further, the coolant liquid is liquid nitrogen.
Further, the fixture includes substrate, and multiple installations compatible with specimen shape and size are equipped on substrate
Hole.
Further, the material of the substrate is asbestos board, glass fibre, foamed cement, aerogel blanket, mineral wool and silicic acid
One of aluminium.
Compared with prior art, the present invention has the following advantages:
1, the present invention due to inner housing, outer housing setting, inner housing use with the good coefficient of heat conduction metal material,
Conducive to heat transfer, outer housing is made using thermal insulation material, avoids extraneous factor and impact to cold junction temperature, ensure that cold end temperature
It spends controllable, adjustable, and then biggish temperature gradient can be formed at sample microbonding point both ends, effective analog submodule encapsulation microbonding point exists
Actual condition or the temperature gradient reached under extreme conditions study its variation generated under the temperature gradient, carry out reliable
Property assessment.
2, fixture of the present invention plays the role of clamping sample, guarantees that microbonding point position when temperature gradient loads is permanent
It is fixed, it avoids the occurrence of inclination or collapses.And fixture is made using the biggish material of the coefficient of heat conduction, effectively prevent fixture overheat to micro-
Solder joint has an impact, and improves the accuracy of experimental result.
3, the present invention passes through adjusting by the heavy platform in inner housing and the setting of one edge of outer housing top surface for placing clamp
The height of coolant liquid in shell enables coolant liquid full of heavy platform, and then guarantees refrigeration effect, ensure that cold junction temperature is steady
It is fixed.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention.
In figure, 1-outer housing, 2-inner housings, 3-refrigeration machines, 4-coolant liquids, 5-connecting lines, 6-heating mechanisms,
7-fixtures, 8-samples, 9-heavy platforms, 10-boss.
Specific embodiment
It elaborates in the following with reference to the drawings and specific embodiments to the present invention.
Embodiment one, referring to Fig. 1, shown in Electronic Packaging microbonding point thermophoresis experimental provision, the device is from top to bottom
It successively include heating mechanism 6, fixture 7 and cooling body, the fixture 7 is set to the space between heating mechanism 6 and cooling body
It is interior, for fixing sample 8.
The cooling body includes outer housing 1, inner housing 2 and refrigeration machine 3, is equipped with inside the inner housing 2 and accommodates coolant liquid 4
Cavity, outer cover is equipped with outer housing 1, and the outer housing 1 fits closely with inner housing 2, and there is no gaps between the two.It is described
Refrigeration machine 3 is connected to through outer housing 1 and inner housing 2 with cavity by connecting line 5, adjusts coolant liquid 4 by the refrigeration machine 3
Temperature realizes that cold junction temperature is adjustable.The outer housing 1 is made by thermal insulation material, and evacuation is equipped at position corresponding with fixture 7
Notch, so that the sample 8 in fixture 7 is directly bonded with 2 surface of inner housing.
The inner housing 2 and 1 top surface of outer housing, one edge are equipped with heavy platform 9, and the fixture 7 is placed in 9 surface of heavy platform.It is described
Boss 10 is equipped at the position corresponding with fixture 7 of 2 top surface of inner housing, 10 top surface shape of boss is corresponding with 7 shape of fixture.
The material of the outer housing 1 is glass fibre, foamed cement, aerogel blanket, mineral wool, alumina silicate, polyurethane foam
One of foam, styrofoam and phenol formaldehyde foam.The material of the inner housing 2 is one of copper, stainless steel and aluminium alloy.
The coolant liquid 4 is liquid nitrogen or is mixed to prepare using mother liquor with deionized water.When coolant liquid 4 is liquid nitrogen,
Temperature is -195 DEG C.When coolant liquid 4 is mixed to prepare using mother liquor and deionized water, the mother liquor is calcium chloride, methanol, second
One of alcohol, ethylene glycol, glycerine and lubricating oil, freezing point are 0 ~ -114 DEG C.
The fixture 7 includes substrate, and multiple mounting holes compatible with 8 shape and size of sample are equipped on substrate.Institute
The material for stating substrate is one of asbestos board, glass fibre, foamed cement, aerogel blanket, mineral wool and alumina silicate.
The heating mechanism 6 includes heating core and control system, and the heating temperature of heating core is adjusted by control system, real
Now to the adjusting of microbonding point hot-side temperature, the heated perimeter of the heating core is 50 ~ 800 DEG C.
Embodiment two carries out microbonding point using the thermophoresis experimental provision of Electronic Packaging microbonding point described in embodiment one
Thermophoresis experiment comprising following steps:
The heating temperature of the heating core of heating mechanism is adjusted to 230 DEG C by S1, and mechanism stable to be heated is spare to set temperature；
Ethylene glycol and deionized water are configured coolant liquid according to volume ratio 2:1 by S2, and the freezing point of the coolant liquid is -68 DEG C, will be cooled down
Liquid is filled in the cavity of inner housing, opens refrigeration machine, set temperature to -60 DEG C, to temperature be down to -60 DEG C it is spare；
S3 uses height for the Cu/Sn/Cu sandwich structure sample of 5mm, and wherein the height of microbonding point is 50 μm, microbonding point
Setting in the center of sample, the sample with microbonding point is packed into fixture, and be fixed and clamp；
Fixture with sample is prevented in boss surface, then heated by S4, the coated with thermally conductive silicone grease on the boss of cooling body
Sample top is slowly pressed in mechanism after coated with thermally conductive silicone grease；
S5 is respectively 218.5 DEG C and -67.3 DEG C using the temperature that temperature measuring equipment measures sample both ends, utilizes after temperature is stablized
ANSYS simulation calculate microbonding point both ends temperature is respectively 94.593 DEG C and 77.041 DEG C, and then the temperature at microbonding point both ends is terraced
Degree is 3510.4 DEG C/cm.
Embodiment three carries out microbonding point using the thermophoresis experimental provision of Electronic Packaging microbonding point described in embodiment one
Thermophoresis experiment comprising following steps:
The heating temperature of the heating core of heating mechanism is adjusted to 230 DEG C by S1, and mechanism stable to be heated is spare to set temperature；
Ethylene glycol and deionized water are configured coolant liquid according to volume ratio 19:1 by S2, and the freezing point of the coolant liquid is -99.5 DEG C, will
Coolant liquid is filled in the cavity of inner housing, opens refrigeration machine, set temperature to -80 DEG C, to temperature be down to -80 DEG C it is spare；
S3 uses height for the Cu/Sn/Cu sandwich structure sample of 4mm, and wherein the height of microbonding point is 15 μm, microbonding point
Setting in the center of sample, the sample with microbonding point is packed into fixture, and be fixed and clamp；
Fixture with sample is prevented in boss surface, then heated by S4, the coated with thermally conductive silicone grease on the boss of cooling body
Sample top is slowly pressed in mechanism after coated with thermally conductive silicone grease；
S5 is respectively 218.5 DEG C and -75.5 DEG C using the temperature that temperature measuring equipment measures sample both ends, utilizes after temperature is stablized
ANSYS simulation calculate microbonding point both ends temperature is respectively 85.501 DEG C and 70.499 DEG C, and then the temperature at microbonding point both ends is terraced
Degree is 10001.3 DEG C/cm.
Embodiments above is that further detailed description of the invention, the experimental provision attainable temperature at present
Gradient is spent not less than 10000 DEG C/cm, and it cannot be said that specific implementation of the invention is confined to above description, for institute of the present invention
It states for the those of ordinary skill of technical field, in the case where not departing from present inventive concept and principle, can also make several
It is simple to change or replace, it is regarded as belonging to the scope of protection of the present invention.
Claims (10)
1. a kind of thermophoresis experimental provision of Electronic Packaging microbonding point, which successively includes heating mechanism (6), folder from top to bottom
Have (7) and cooling body, the fixture (7) is set in the space between heating mechanism (6) and cooling body, for fixing sample
(8), it is characterised in that: the cooling body includes outer housing (1), inner housing (2) and refrigeration machine (3), and the inner housing (2) is internal
Equipped with the cavity for accommodating coolant liquid (4), outer cover is equipped with outer housing (1), and the outer housing (1) fits closely with inner housing (2),
The refrigeration machine (3) is connected to through outer housing (1) and inner housing (2) with cavity by connecting line (5)；
The outer housing (1) is made by thermal insulation material, evacuation notch is equipped at position corresponding with fixture (7), so that fixture
(7) sample (8) in is directly bonded with inner housing (2) surface.
2. the thermophoresis experimental provision of Electronic Packaging microbonding point according to claim 1, it is characterised in that: the inner housing
(2) boss (10) are equipped at the position corresponding with fixture (7) of top surface, boss (10) top surface shape is opposite with fixture (7) shape
It answers.
3. the thermophoresis experimental provision of Electronic Packaging microbonding point according to claim 1 or 2, it is characterised in that: in described
Shell (2) and one edge of outer housing (1) top surface are equipped with heavy platform (9), and the fixture (7) is placed in heavy platform (9) surface.
4. the thermophoresis experimental provision of Electronic Packaging microbonding point according to claim 1 or 2, it is characterised in that: described outer
The material of shell (1) is glass fibre, foamed cement, aerogel blanket, mineral wool, alumina silicate, polyurethane foam, styrofoam and phenol
One of aldehyde foam；The material of the inner housing (2) is one of copper, stainless steel and aluminium alloy.
5. the thermophoresis experimental provision of Electronic Packaging microbonding point according to claim 1 or 2, it is characterised in that: described cold
But liquid (4) is that mother liquor is mixed to prepare with deionized water, and the mother liquor is calcium chloride, methanol, ethyl alcohol, ethylene glycol, glycerine and profit
One of lubricating oil, freezing point are 0 ~ -114 DEG C.
6. the thermophoresis experimental provision of Electronic Packaging microbonding point according to claim 1 or 2, it is characterised in that: described cold
But liquid (4) is liquid nitrogen.
7. the thermophoresis experimental provision of Electronic Packaging microbonding point according to claim 1 or 2, it is characterised in that: the folder
Having (7) includes substrate, and multiple mounting holes compatible with sample (8) shape and size are equipped on substrate.
8. the thermophoresis experimental provision of Electronic Packaging microbonding point according to claim 7, it is characterised in that: the substrate
Material is one of asbestos board, glass fibre, foamed cement, aerogel blanket, mineral wool and alumina silicate.
9. the thermophoresis experimental provision of Electronic Packaging microbonding point according to claim 1 or 2, it is characterised in that: described to add
Heat engine structure (6) includes heating core and control system, and the heating temperature of heating core is adjusted by control system, is realized to microbonding point heat
Hold the adjusting of temperature.
10. the thermophoresis experimental provision of Electronic Packaging microbonding point according to claim 9, it is characterised in that: the heating
The heating temperature range of core is 50 ~ 800 DEG C.
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| CN201910561093.8A CN110174432A (en) | 2019-06-26 | 2019-06-26 | The thermophoresis experimental provision of Electronic Packaging microbonding point |
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| CN109813752A (en) * | 2019-02-20 | 2019-05-28 | 重庆理工大学 | A kind of method for evaluating reliability of Electronic Packaging microbonding point |
| CN110530926A (en) * | 2019-09-29 | 2019-12-03 | 重庆理工大学 | A kind of thermophoresis experimental provision of Electronic Packaging microbonding point under the high temperature conditions |
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Application publication date: 20190827 |