CN110139539B

CN110139539B - Self-assembly micro-channel design and implementation method for microwave self-assembly platform

Info

Publication number: CN110139539B
Application number: CN201910447124.7A
Authority: CN
Inventors: 陈雄; 马凯学
Original assignee: Tianjin University
Current assignee: Tianjin University
Priority date: 2019-05-27
Filing date: 2019-05-27
Publication date: 2021-01-05
Anticipated expiration: 2039-05-27
Also published as: CN110139539A

Abstract

The invention discloses a design and implementation method of a self-assembly micro-flow channel for a microwave self-packaging platform, which adopts multilayer preprocessed dielectric plate stack to realize the formation of a micro-flow channel for fluid circulation heat dissipation; groove-shaped channels for fluid circulation are formed on the surfaces of the medium plates in a preprocessing mode, and the two medium plates are buckled to form a micro-fluid channel by means of the buckled groove-shaped channels. The invention can be integrated with the design process of the self-packaging platform, particularly overcomes the complexity that the single micro-channel process is realized by a special encapsulation mould in the traditional micro-channel design, does not bring extra processing process and material cost, and is particularly suitable for improving the thermal reliability and power capacity of the self-packaging platform for high-power microwave application.

Description

Self-assembly micro-channel design and implementation method for microwave self-assembly platform

Technical Field

The invention relates to the technical field of microwave circuit devices, in particular to a design and implementation method of a self-assembly micro-channel for a microwave self-assembly platform.

Background

In a traditional microwave application scenario, in order to increase the thermal reliability and power capacity of a device, a high-power microwave component often has a larger volume, which also causes the traditional high-power microwave device to be clumsy in volume. In contrast, the novel microwave self-packaging platform realizes the miniaturization of the microwave device by combining the packaging and structure design, but the microwave self-packaging platform is oriented to high-power microwave application, and no effective method for improving the power capacity of the structure exists at present. The power capacity of the structure is improved, and a good platform is provided for the design of a novel high-performance high-power microwave device.

The heat effect caused by microwave power loss under the condition of high power is a key factor influencing the reliability of the microwave device and is also a key problem restricting the power capacity of the microwave device. How to ensure the thermal reliability of microwave devices, especially small microwave devices, is a consideration that must be taken into account in the design of microwave devices. In order to avoid changing the overall characteristics of the device and thus increasing the design complexity of the device, the most effective method for improving the thermal reliability is to add a heat dissipation channel of the device on the basis of not changing the main structure of the device, wherein the heat is stored through fluid, and the fluid flow is formed to take away the heat, so that the most effective method for realizing the high thermal reliability under the condition of keeping the miniaturization of the device is realized.

Therefore, how to improve the high power characteristics of the self-packaged device by improving the thermal reliability of the high power microwave device is the technical problem to be solved firstly.

Disclosure of Invention

The invention aims to provide a design and implementation method of a self-assembly micro-channel for a microwave self-packaging platform aiming at the technical defects in the prior art and aiming at improving the high-power characteristic of a self-packaging device.

The technical scheme adopted for realizing the purpose of the invention is as follows:

a design and implementation method of a self-assembly micro-channel for a microwave self-assembly platform adopts multi-layer preprocessed dielectric plates to stack to realize the formation of a micro-fluid channel for fluid circulation heat dissipation; groove-shaped channels for fluid circulation are formed on the surfaces of the medium plates in a preprocessing mode, and the two medium plates are buckled to form a micro-fluid channel by means of the buckled groove-shaped channels.

Liquid is filled in the micro-fluid channel, and heat exchange in the microwave self-packaging platform is realized by means of a pump circulating heat dissipation system so as to improve the power capacity characteristic of the microwave self-packaging platform.

The micro-fluid channel is connected with the pump circulation heat dissipation system through an external switching pipeline and a fluid external circulation pipeline which are connected.

Compared with the prior art, the invention has the beneficial effects that:

the design and implementation method of the self-assembly micro-channel for the microwave self-assembly platform can be integrated with the design process of the self-assembly platform, particularly overcomes the complexity that an independent micro-channel process is realized by a special encapsulation mold in the traditional micro-channel design, does not bring extra processing process and material cost, and is particularly suitable for improving the thermal reliability and power capacity of the self-assembly platform for high-power microwave application.

Drawings

FIG. 1 is a schematic view of a self-contained flat single-layer dielectric slab with half-slots.

Fig. 2 is a schematic diagram of a functional medium with a micro flow channel formed after the double-layer medium plate is attached.

FIG. 3 is a schematic diagram of a microwave self-packaging platform with a self-assembled micro flow channel structure.

FIG. 4 is a schematic diagram of a complete set of microwave self-packaging platform with microfluidic circulation heat dissipation.

In the figure: 1. the liquid circulating system comprises a medium plate, 2, a semicircular groove channel, 3, a closed circular micro channel, 4, a functional medium plate with the closed circular micro channel, 5, a functional circuit wiring line, 6, a functional wiring line, 7, an external switching pipeline, 8, a fluid external circulating pipeline, 9, a fluid circulating pump, 10, a circulating pump radiator and 11, a circulating pump liquid storage box.

Detailed Description

The invention is described in further detail below with reference to the figures and specific examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The realization of the micro-fluid heat dissipation structure of the microwave self-packaging platform depends on a fluid pipeline mixed in a microwave cavity, the main body of the self-packaging transmission line platform forms a self-packaging cavity structure through a laminated dielectric plate and a metal layer, the laminated dielectric plate and the metal structure realize the micro-fluid channel, the micro-fluid channel can be realized by self-assembly after the single-layer via hole dielectric plates are laminated, and the self-packaging platform has a processing mode compatible with the self-packaging platform, so that the self-packaging micro-fluid technology is fused, and the miniaturization design of a high-power microwave device can be realized.

In the present invention, a self-assembled microfluidic channel from a packaged platform is implemented using a stack of dielectric plates with a slot pattern. Wherein, a channel is preset in the processing process of each layer of dielectric plate, and the self-assembly microfluidic channel is realized by the direct assembly process of the self-assembly platform. The design realization process of the microchannel of the structure does not need special moulds and filling and sealing processes, avoids complex processing links caused by adopting mould filling and processing in the traditional microchannel processing, and particularly can be combined with a self-packaging platform realized based on a stacking method.

As shown in fig. 1, a serpentine liquid circulation path may be formed by machining a semicircular groove 2 on the surface of a dielectric layer of a dielectric plate 1 for microwave characteristic control through a milling operation. Wherein the semicircular channel starting point is maintained flush with the media edge for external fluid access to the circulation path.

As shown in fig. 2, the closed circular microchannel 3 is formed by reversely fastening the medium plates having the semicircular grooves in fig. 1.

As shown in fig. 3, a functional dielectric plate 4 with a closed circular micro-channel 3 is combined with functional circuit traces 5 and functional ground traces 6 through a stacking process to form a microwave self-packaging platform with a self-assembled micro-channel structure, the micro-channel dielectric plate is attached between the functional circuit traces 5 and the functional ground traces 6, and the micro-channel forms a heat dissipation cycle especially for the heat of the functional circuit traces.

It should be noted that, the implementation of the microfluidic channel in the transverse plane may depend on the stacking of the double-sided groove channels on the dielectric plate to form the microchannel, or the implementation of the longitudinal microfluidic channel may be implemented by stacking the dielectric plates with multiple layers of through holes. The process is assisted by PDMS material as adhesive to realize the close fit between the multi-layer dielectric plate and the metal plate.

In addition, it should be noted that the microfluidic channel may exist between the ground plane of the microwave transmission line and the signal trace, between the ground plane and the package structure, or both.

As shown in fig. 4, the thermal circulation channels of the upper and lower layers can be realized by implanting functional medium plates with closed circular microchannels 3 into the upper and lower layers of functional wiring. The communication of upper and lower two-layer circulation microchannel is realized through external switching pipeline 7, the whole closed circular microchannel is connected with fluid circulating pump 9 through fluid external circulation pipeline 8, circulating pump liquid storage tank 11 is connected behind fluid circulating pump 9, circulating pump liquid storage tank is additionally provided with circulating pump radiator 10 for heat dissipation of circulating fluid.

Through the technical scheme, circulation of fluid in the whole upper and lower pipelines is realized, so that heat balance between the self-packaging platform and the radiator is realized, and further, the temperature stability of the self-packaging platform is ensured, and the thermal reliability and the power capacity are improved.

It should be noted that, in the present invention, for adjusting the electromagnetic property of the self-packaging platform portion, liquid metal may also be used as an electrical signal transmission medium, and the characteristics of the device are changed by the flow of the liquid metal, so as to realize the adjustable self-packaging platform device.

The invention realizes the fluid pipeline by the design realization method combined with the self-packaging platform and the stacking of the multilayer groove-shaped medium plate and the metal plate of the self-packaging platform, overcomes the design realization defects that the traditional microwave device micro-channel design must lay a special fluid pipeline, and particularly overcomes the defect that the micro-channel design is complex.

The realization method of the invention is compatible with the realization method of the self-packaging platform, and can realize the self-packaging platform and simultaneously implant the micro-channel into the device at the beginning of the design, thereby simplifying the design process and realizing the improvement of the thermal reliability of the high-power microwave device.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims

1. A design and implementation method of a self-assembly micro flow channel for a microwave self-assembly platform is characterized in that a plurality of layers of preprocessed dielectric plates are stacked to realize the formation of a micro flow channel for fluid circulation and heat dissipation, groove-shaped channels for fluid circulation are preprocessed on the surfaces of the dielectric plates, and the micro flow channel is formed by the buckled groove-shaped channels after the two dielectric plates are buckled; the micro-channel medium plate with the closed circular micro-channel is attached between the functional circuit wiring and the functional ground wiring, and the micro-channel is arranged in a transverse plane.

2. The method of claim 1 wherein the microfluidic channel is filled with a liquid and the heat exchange inside the microwave self-contained platform is performed by a pump-around heat dissipation system to improve the power capacity of the microwave self-contained platform.

3. The method of claim 2 wherein the microfluidic channel is connected to the pump-around heat removal system via an external adapter channel and an external fluid circulation channel.