CN113347779B - Method for preparing micro-channel embedded printed circuit board compatible with vertical transmission structure - Google Patents
Method for preparing micro-channel embedded printed circuit board compatible with vertical transmission structure Download PDFInfo
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- CN113347779B CN113347779B CN202110601090.XA CN202110601090A CN113347779B CN 113347779 B CN113347779 B CN 113347779B CN 202110601090 A CN202110601090 A CN 202110601090A CN 113347779 B CN113347779 B CN 113347779B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention discloses a method for preparing a micro-channel embedded printed circuit board compatible with a vertical transmission structure, which comprises a top multilayer wiring layer, a metal core plate and a bottom multilayer wiring layer which are sequentially arranged from top to bottom, wherein an embedded micro-channel for heat dissipation is arranged in the metal core plate, a protection through hole is arranged in the region of the metal core plate not provided with the embedded micro-channel, an insulation protection ring is arranged in the protection through hole, an interconnection inner hole is arranged in the insulation protection ring, and the interconnection inner hole penetrates through the top multilayer wiring layer and the bottom multilayer wiring layer to form a vertical transmission channel for transmitting signals at two sides; the interconnection and intercommunication of electric signals on the front side and the back side of the metal core micro-channel can be realized without connectors, cables, insulators and the like while realizing high-efficiency heat dissipation.
Description
Technical Field
The invention relates to the technical field of microelectronic heat dissipation, in particular to a method for preparing a printed circuit board with embedded micro-channels and compatible with a vertical transmission structure.
Background
The printed circuit board is a general electronic system substrate and an important carrier for high-density integration of components. The traditional printed circuit board mainly comprises organic materials and copper wiring layer materials, and the application requirements of high-density integrated high-power electronic devices are difficult to meet due to the low thermal conductivity of the organic materials (generally less than 1W/m.K).
The method for constructing the printed circuit board with the embedded micro-channel can be realized by combining the micro-channel heat dissipation technology with the high-density integration technology of the printed circuit board, and the metal core board with the embedded micro-channel is integrated in the printed circuit board, so that the following technical advantages are realized: (1) the heat dissipation of high heat flux density in a local area is realized by a micro-channel heat dissipation technology taking liquid as a cooling medium; (2) by integrating the micro-channel in the printed circuit board, the integration method of an external metal micro-channel cold plate is replaced, and the integration density is obviously improved. Therefore, the embedded micro-channel printed circuit board has wide application prospect in the field of high-power electronic device system integration. However, after the printed circuit board is embedded with the all-metal structure, the vertical transmission of the electrical signals on the front side and the back side of the printed circuit board is isolated, so that the design of a circuit system is difficult.
The chinese patent 202110118888.9 of the invention proposes a printed circuit board embedded with micro channels, which utilizes the enhanced heat dissipation effect of the micro-scale fluid to realize high heat flux density heat dissipation. However, the patent does not relate to the interconnection method of the electrical signals on the front side and the back side of the metal core micro flow channel. Therefore, there is a need for a method for manufacturing a micro-channel embedded printed circuit board compatible with a vertical transmission structure.
Disclosure of Invention
The invention aims to provide a method for preparing a micro-channel embedded printed circuit board compatible with a vertical transmission structure, wherein a metal core micro-channel is embedded in the printed circuit board and the vertical transmission structure penetrating through a metal core is prepared, so that the interconnection and intercommunication of electric signals on the front side and the back side of the metal core micro-channel can be realized without connectors, cables, insulators and the like while the high-efficiency heat dissipation is realized, and the application requirement of a high-density integrated high-power electronic device is met.
The technical scheme of the invention is as follows:
the utility model provides a compatible perpendicular transmission structure's embedded miniflow way printed circuit board, includes top multilayer wiring layer, metal core and bottom multilayer wiring layer that top-down arranged in proper order, the inside embedded miniflow way that is used for the heat dissipation that is provided with of metal core, the region that the metal core did not set up embedded miniflow way is provided with the protection perforation, be provided with insulating guard circle in the protection perforation, be provided with the interconnection hole in the insulating guard circle, the interconnection hole runs through top multilayer wiring layer and bottom multilayer wiring layer, forms the perpendicular transmission passageway that is used for transmitting both sides signal.
The metal core plate material is copper, aluminum, molybdenum-copper alloy and the like. Preferably, the metal core material is copper.
The width of the embedded micro-channel is 100 mu m-3 mm. Preferably, the embedded fluidic channels have a width of 500 μm.
The thickness of the insulating protective ring is not less than 0.2 mm. Preferably, the thickness of the insulating protective ring is 0.3 mm.
The minimum distance between the wall of the protective perforated hole and the side wall of the embedded micro-flow channel is not less than 1 mm. Preferably, the minimum spacing is 2 mm. The position of the vertical transmission structure penetrating through the metal core micro-channel through reasonable layout is reserved with certain width of the side wall of the channel, so that the cooling working medium only contacts the metal structure in the embedded micro-channel printed circuit board, the structural strength of the channel is ensured, and the structural damage of the channel caused by the pressure of the cooling working medium is avoided. The welding defects of mutual communication between the flow channel and the vertical transmission structure are avoided, the cooling working medium is prevented from leaking outwards through the defects, the filled insulating material is prevented from permeating into the flow channel through the defects, and after the cooling working medium is injected into a micro-channel region, the cooling working medium is prevented from contacting with organic materials in a printed circuit board through the side wall of the flow channel to generate moisture absorption and denaturation phenomena, so that the reliability risks of layer rising, bulging, liquid leakage and the like are caused.
The top multilayer wiring layer comprises a top organic substrate layer and a top copper wiring layer arranged on the top organic substrate layer, preferably, the number of layers of the top organic substrate layer and the top copper wiring layer is n, and n is more than or equal to 10 and is more than or equal to 1.
The bottom multilayer wiring layer comprises a bottom organic base material layer and a bottom copper wiring layer arranged on the bottom organic base material layer, preferably, the number of layers of the bottom organic base material layer and the bottom copper wiring layer is m, and m is more than or equal to 10 and is more than or equal to 1.
The invention also provides a preparation method of the micro-channel embedded printed circuit board compatible with the vertical transmission structure, which comprises the following steps:
s1: selecting a metal core plate with embedded micro-channels;
s2: machining a protection through hole on a metal core plate embedded with a micro-channel by adopting a printed circuit board machining process;
s3: performing surface treatment on the side wall of the protection perforation;
s4: filling insulating materials in the protective through holes by adopting a hole plugging process, and carrying out surface treatment on the metal core plate;
s5: providing a top multilayer wiring layer and a bottom multilayer wiring layer, the top multilayer wiring layer being prepared by a printed circuit board lamination process and the bottom multilayer wiring layer being prepared by a printed circuit board lamination process;
s6: laminating the top multilayer wiring layer, the metal core plate embedded with the micro-channel and the bottom multilayer wiring layer into a printed circuit board embedded with the micro-channel, wherein the laminating method is a laminating process method of the printed circuit board;
S7: machining an interconnection inner hole on the printed circuit board internally embedded with the micro-channel by adopting a printed circuit board machining process and a hole metallization process, wherein the interconnection inner hole penetrates through the top multilayer wiring layer and the bottom multilayer wiring layer to form a vertical transmission channel for transmitting signals on two sides;
s8: and (3) finishing the processing of the embedded micro-channel printed circuit board compatible with the vertical transmission structure by adopting the conventional process of other printed circuit boards.
Preferably, the surface treatment process in steps S3 and S4 is blackening or browning.
Preferably, the hole plugging process in step S4 is screen printing hole plugging resin or prepreg vacuum pressing underfill.
Preferably, in step S1, the overall size of the metal core plate with embedded micro-channels is also finely controlled by using size compensation and/or micro-channel processing control. The problem of dislocation of a vertical transmission structure caused by the size expansion and contraction of the metal core micro-channel is prevented, and the damage of the channel structure caused by the small minimum distance between the wall of the protective through hole and the side wall of the channel is effectively avoided. The embedded micro-channel is prepared by a precision machining method, a chemical corrosion method, an electric spark machining method or a metal micro-electroforming method; the metal core plate is prepared by a vacuum diffusion welding method, a vacuum brazing method or a solder welding method, and after high-temperature welding, the metal core plate can expand and contract to a certain extent; it is therefore desirable to use this method to control dimensional errors.
Preferably, in step S6, measures such as size compensation and printed board processing control are further adopted to compensate for the size expansion and contraction of the organic wiring layer material after lamination, so as to perform fine control on the overall size of the top multilayer wiring layer and the bottom multilayer wiring layer. The problem of dislocation of a vertical transmission structure caused by expansion and contraction of the material size of the organic wiring layer is prevented, and the risk of short circuit of electrical signals caused by the dislocation is effectively avoided.
Due to the adoption of the technical scheme, the invention has the beneficial effects that:
(1) the metal core micro-channel is embedded in the printed circuit board, the vertical transmission structure penetrating through the metal core is prepared, and the interconnection and intercommunication of electric signals on the front side and the back side of the metal core micro-channel can be realized without connectors, cables, insulators and the like while the efficient heat dissipation is realized.
(2) The position of the vertical transmission structure of the metal core micro-channel is penetrated through a reasonable layout, certain width of the side wall of the channel is reserved, and the cooling working medium is only contacted with the metal structure in the embedded micro-channel printed circuit board: the structural strength of the flow channel is ensured, and the structural damage of the flow channel caused by the pressure of the cooling working medium is avoided; the welding defects of mutual communication between the flow channel and the vertical transmission structure are avoided, the cooling working medium is prevented from leaking outwards through the defects, and the filled insulating material is prevented from permeating into the flow channel through the defects; the problem that in the use process of the printed circuit board, after cooling working media are injected into the micro-channel area, the cooling working media are in contact with organic materials in the printed circuit board through the side wall of the channel to generate moisture absorption and denaturation phenomena, and therefore reliability risks such as layer rising, bulging and liquid leakage are caused is avoided.
(3) By comprehensively utilizing the measures of size compensation, fine control of a micro-channel processing technology, control of a printed board processing technology and the like, the problems of dislocation of a vertical transmission structure and the like caused by the expansion and shrinkage of the sizes of materials of the metal core micro-channel and the organic wiring layer are prevented, and the risks of channel structure damage, electric signal short circuit, open circuit and the like caused by the dimension expansion and shrinkage are effectively avoided.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic cross-sectional view of a micro flow channel embedded metal core plate according to the present invention;
FIG. 2 is a schematic cross-sectional view of a top multilayer wiring layer of the present invention;
FIG. 3 is a schematic cross-sectional view of a bottom multilayer wiring layer of the present invention;
FIG. 4 is a schematic cross-sectional view of a vertical transport structure of the present invention;
FIG. 5 is a schematic top view of the vertical transport structure of the present invention;
FIG. 6 is a schematic cross-sectional view of an embedded micro-channel PCB compatible with vertical transmission structures according to the present invention;
FIG. 7 is a process flow diagram of a manufacturing method of the present invention.
Description of specific element symbols: 1, a metal core plate; 2 embedding a micro flow channel; 3 a top multilayer wiring layer; 4 a top organic substrate layer; 5 a top copper wiring layer; 6 bottom multilayer wiring layer; 7 a bottom organic substrate layer; 8 a bottom copper wiring layer; 9 vertical transmission structure; 10 protecting the perforation; 11 interconnecting the inner bores; 12 insulating protective rings; 13 an embedded micro-channel printed circuit board compatible with a vertical transmission structure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Referring to fig. 1 to 7, an embedded micro channel printed circuit board 13 compatible with a vertical transmission structure according to the present embodiment includes a top multilayer wiring layer 3, a metal core board 1 and a bottom multilayer wiring layer 6, which are sequentially arranged from top to bottom, wherein the embedded micro channel 2 for heat dissipation is disposed inside the metal core board 1, a protection through hole 10 is disposed in a region of the metal core board 1 where the embedded micro channel 2 is not disposed, an insulating protection ring 12 is disposed in the protection through hole 10, an interconnection inner hole 11 is disposed in the insulating protection ring 12, and the interconnection inner hole 11 penetrates through the top multilayer wiring layer 3 and the bottom multilayer wiring layer 6 to form a vertical transmission channel for transmitting signals on two sides.
The metal core plate 1 embedded with the micro-flow channels 2 is made of copper. The width of the embedded micro flow channel 2 is 500 μm. The distance between the protective perforation 10 and the wall of the interconnecting bore 11, i.e. the thickness of the insulating protective ring 12, is 0.3 mm. The minimum distance between the hole wall of the protection perforation 10 and the side wall of the embedded micro-flow channel 2 is 2 mm. The structure strength of the flow channel is ensured, and meanwhile, the phenomenon that the flow channel and the vertical transmission structure are communicated with each other and welding defects are avoided. The metal core plate 1 top multilayer wiring layer 3 comprises a top organic substrate layer 4 and a top copper wiring layer 5, and the number of layers of the top organic substrate layer 4 and the top copper wiring layer 5 is 2. The metal core plate 1 bottom multilayer wiring layer 6 comprises a bottom organic substrate layer 7 and a bottom copper wiring layer 8, and the number of layers of the bottom organic substrate layer 7 and the bottom copper wiring layer 8 is 2.
The preparation method of this embodiment comprises the following steps:
step (1): the micro-channel is prepared by a precision machining method, and the copper core plate embedded with the micro-channel 2 is obtained by a vacuum diffusion welding method. After high temperature welding, the metal core plate 1 will have a certain degree of size expansion and contraction, so the overall size of the metal core plate 1 embedded with the micro flow channels 2 needs to be finely controlled by means of size compensation, micro flow channel processing technology control and the like. The problem of dislocation of a vertical transmission structure caused by the size expansion and contraction of the metal core micro-channel is prevented, and the damage of the channel structure caused by the small minimum distance between the hole wall of the protection perforation 10 and the side wall of the channel is effectively avoided.
Step (2): a printed circuit board machining process is adopted, and a protection through hole 10 is machined in a metal core plate 1 embedded with a micro-channel 2.
And (3): and (3) carrying out surface blackening treatment on the side wall of the protective through hole 10 in the step (2).
And (4): and (4) filling an insulating material into the protective through hole 10 subjected to surface treatment in the step (3) by adopting a screen printing hole plugging resin process, and the step (5): and (5) carrying out surface blackening treatment on the metal core plate 1 embedded with the micro flow channel 2 after the treatment of the step (4).
And (6): the top multilayer wiring layer 3 is prepared using a printed circuit board lamination process.
And (7): the bottom multilayer wiring layer 6 is prepared by a printed circuit board lamination process.
And (8): and laminating the multilayer wiring layers 3 on the top of the metal core plate 1, the metal core plate 1 embedded with the micro-channels 2 and the multilayer wiring layers 6 on the bottom of the metal core plate 1 into the printed circuit board embedded with the micro-channels 2 by adopting a printed circuit board laminating process method. After lamination, the organic wiring layer material may have a certain degree of dimensional expansion and contraction, and therefore, the overall dimensions of the top multilayer wiring layer 3 and the bottom multilayer wiring layer 6 need to be finely controlled by using means such as dimensional compensation and printed board processing control. The problem of dislocation of a vertical transmission structure caused by the expansion and contraction of the material size of the organic wiring layer is prevented, and the risk of short circuit of electrical signals caused by the dislocation is effectively avoided.
And (9): and (5) machining an interconnection inner hole 11 on the printed circuit board embedded with the micro-channel 2 in the step (8) by adopting a printed circuit board machining process and a hole metallization process to realize a vertical transmission structure 9 penetrating through a metal core of the micro-channel.
Step (10): and finishing the processing of the micro-channel embedded printed circuit board 13 compatible with the vertical transmission structure by adopting other conventional processes of the printed circuit board.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (1)
1. A method for preparing a printed circuit board with embedded micro-channels compatible with a vertical transmission structure is characterized in that the printed circuit board is prepared and comprises a top multilayer wiring layer, a metal core plate and a bottom multilayer wiring layer which are sequentially arranged from top to bottom, the embedded micro-channels for heat dissipation are arranged in the metal core plate, protection through holes are arranged in regions of the metal core plate where the embedded micro-channels are not arranged, insulation protection rings are arranged in the protection through holes, interconnection inner holes are arranged in the insulation protection rings, and the interconnection inner holes penetrate through the top multilayer wiring layer and the bottom multilayer wiring layer to form vertical transmission channels for transmitting signals on two sides; the width of the embedded micro-channel is 100 mu m-3mm, the thickness of the insulating protection ring is not less than 0.2mm, the minimum distance between the wall of the protection perforation hole and the side wall of the embedded micro-channel is not less than 1mm, the top multilayer wiring layer comprises a top organic base material layer and a top copper wiring layer arranged on the top organic base material layer, the number of layers of the top organic base material layer and the top copper wiring layer is n, n is more than or equal to 10, the number of layers of the bottom multilayer wiring layer comprises a bottom organic base material layer and a bottom copper wiring layer arranged on the bottom organic base material layer, the number of layers of the bottom organic base material layer and the bottom copper wiring layer is m, and m is more than or equal to 10, the number of layers of m is more than or equal to 1;
The method comprises the following steps:
s1: selecting a metal core plate with embedded micro-channels, wherein the micro-channels are prepared by a precise mechanical processing method, a chemical corrosion method, an electric spark processing method or a metal micro-electroforming method, the metal core plate with the embedded micro-channels is obtained by a vacuum diffusion welding method, a vacuum brazing method or a solder welding method, and the overall size of the metal core plate with the embedded micro-channels is finely controlled by adopting a size compensation method and/or a micro-channel processing process control method;
s2: machining a protection perforation on a metal core plate with an embedded micro-channel by adopting a printed circuit board machining process, wherein the minimum distance between the wall of the protection perforation and the side wall of the embedded micro-channel is not less than 1 mm;
s3: performing surface treatment on the side wall of the protection perforation;
s4: filling insulating materials in the protective through holes by adopting a hole plugging process, and carrying out surface treatment on the metal core plate;
s5: providing a top multilayer wiring layer and a bottom multilayer wiring layer;
s6: laminating a top multilayer wiring layer, a metal core plate embedded with a micro-channel and a bottom multilayer wiring layer into a printed circuit board embedded with the micro-channel, and finely controlling the overall size of the top multilayer wiring layer and the bottom multilayer wiring layer by adopting a size compensation and/or printed circuit board processing technology;
S7: machining an interconnection inner hole on the printed circuit board internally embedded with the micro-channel by adopting a printed circuit board machining process and a hole metallization process, wherein the interconnection inner hole penetrates through the top multilayer wiring layer and the bottom multilayer wiring layer to form a vertical transmission channel for transmitting signals on two sides;
s8: processing the embedded micro-channel printed circuit board compatible with the vertical transmission structure by adopting other conventional processes of the printed circuit board;
the surface treatment process in steps S3 and S4 is blackening or browning;
the hole plugging process in step S4 is screen printing hole plugging resin or prepreg vacuum pressing glue filling.
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| CN113891546B (en) * | 2021-11-02 | 2023-05-16 | 中国电子科技集团公司第二十九研究所 | Printed circuit board embedded with micro-channels with reinforced structures and preparation method thereof |
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| US4522667A (en) * | 1980-06-25 | 1985-06-11 | General Electric Company | Method for making multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2014167053A (en) * | 2013-02-28 | 2014-09-11 | 3M Innovative Properties Co | High thermal conductivity prepreg, printed wiring board and multilayer printed wiring board using prepreg, and semiconductor device using multilayer printed wiring board |
| CN103987211B (en) * | 2014-05-23 | 2017-12-01 | 景旺电子科技(龙川)有限公司 | A kind of high-efficiency heat-radiating aluminum plate based on increase aluminium base face and preparation method thereof |
| CN105430865B (en) * | 2014-09-19 | 2018-09-04 | 深南电路有限公司 | A kind of manufacturing method and printed circuit board of printed circuit board radiator structure |
| CN105188260B (en) * | 2015-11-02 | 2018-11-06 | 中国电子科技集团公司第二十六研究所 | Printed circuit board embeds runner liquid cooling heat-exchanger rig |
| CN105636345A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Multilayer PCB core material expansion and shrinkage matching method |
| CN207625867U (en) * | 2017-12-05 | 2018-07-17 | 广东全宝科技股份有限公司 | A kind of good copper base of heat dissipation |
| CN110740564B (en) * | 2019-10-28 | 2021-09-24 | 珠海杰赛科技有限公司 | Processing method of dense network multilayer printed circuit board |
| CN111653488A (en) * | 2020-06-15 | 2020-09-11 | 上海先方半导体有限公司 | Micro-channel heat dissipation system and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4522667A (en) * | 1980-06-25 | 1985-06-11 | General Electric Company | Method for making multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion |
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