CN116939949A - Circuit board assembly and manufacturing method thereof - Google Patents
Circuit board assembly and manufacturing method thereof Download PDFInfo
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- CN116939949A CN116939949A CN202210351249.1A CN202210351249A CN116939949A CN 116939949 A CN116939949 A CN 116939949A CN 202210351249 A CN202210351249 A CN 202210351249A CN 116939949 A CN116939949 A CN 116939949A
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- Prior art keywords
- layer
- circuit
- substrate
- heat
- circuit board
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000000110 cooling liquid Substances 0.000 claims abstract description 30
- 238000012546 transfer Methods 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims description 105
- 239000002184 metal Substances 0.000 claims description 47
- 229910052751 metal Inorganic materials 0.000 claims description 47
- 239000000463 material Substances 0.000 claims description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 14
- 239000003292 glue Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 4
- 239000000084 colloidal system Substances 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000012809 cooling fluid Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 229910021529 ammonia Inorganic materials 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 6
- 230000008859 change Effects 0.000 abstract description 5
- 230000003014 reinforcing effect Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 192
- 239000004642 Polyimide Substances 0.000 description 10
- 229920001721 polyimide Polymers 0.000 description 10
- 238000013461 design Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 229920000106 Liquid crystal polymer Polymers 0.000 description 6
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- -1 Polypropylene Polymers 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000003405 preventing effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The application provides a manufacturing method of a circuit board assembly, which adopts a heat conduction assembly to be directly connected with a first outer circuit layer and an electronic element, shortens the heat transfer distance and improves the heat transfer efficiency; the first outer layer circuit layer seals the cooling liquid in the slot, the area of the surface of the heat conducting block in the heat conducting component, which is connected with the electronic element, is maximized, the contact area between the electronic element and the heat conducting block is increased to the greatest extent, and the heat conducting efficiency is further improved; in addition, the liquid cooling liquid is used for conducting heat, and the principle that the phase change of the liquid absorbs heat and the temperature cannot rise is utilized, so that the existing heat conduction mode of utilizing the circuit board assembly or the reinforcing plate is fundamentally replaced. The application also provides a circuit board assembly.
Description
Technical Field
The present application relates to the field of circuit board assemblies, and in particular, to a circuit board assembly and a method for manufacturing the same.
Background
With the increasing demands of people on various electronic products such as computers, consumer electronics and communication, along with the diversification of functions of the electronic products, electronic elements in the electronic products are more and more centralized. The circuit board assembly is used as a support and a carrier for electric connection of electronic elements, so that heat dissipation becomes a great problem facing the industry of the circuit board assembly.
The heat dissipation of electronic components on conventional circuit board assemblies is typically conducted by heat conduction through the circuit board assembly itself or through a metal stiffener. However, the circuit board assembly itself or the metal reinforcing plate has large thermal resistance and small contact area with the electronic component, thereby resulting in poor heat dissipation performance. Once the temperature of the circuit board assembly is too high, the circuit board assembly may be deformed, electronic components on the circuit board assembly may not work normally, and even chips in the electronic components may be damaged.
Disclosure of Invention
In view of the foregoing, it is desirable to provide a circuit board assembly with good heat dissipation performance and a method for manufacturing the circuit board assembly to solve the above-mentioned problems.
In a first aspect, the present application provides a method for manufacturing a circuit board assembly, including the steps of:
providing a core part, wherein the core part comprises a middle substrate layer and middle circuit layers positioned on two opposite surfaces of the middle substrate layer, the core part comprises a first surface, a second surface and a perforation, the first surface and the second surface are arranged opposite to each other, and the perforation penetrates through the middle substrate layer and the middle circuit layers;
forming a heat conduction block with a slot in the perforation, wherein the slot is concavely formed along the direction of the first surface towards the second surface, and cooling liquid is injected into the slot;
providing a first substrate layer and a first metal layer, wherein the first substrate layer is positioned on the first surface, the first metal layer is positioned on the surface of the first substrate layer, which is away from the middle circuit layer, and the first substrate layer is provided with a first opening;
providing a second substrate layer and a second metal layer;
the method comprises the steps of laminating according to the sequence of a first metal layer, a first substrate layer, a core part with a heat conducting block containing cooling liquid, a second substrate layer and a second metal layer, wherein the surface of the heat conducting block with a groove penetrates through a first opening and is connected with the first metal layer, the first metal layer is connected with the heat conducting block and seals the opening of the groove, and the sealed heat conducting block and the cooling liquid form a heat conducting component;
carrying out circuit manufacture on the first metal layer to form a first outer circuit layer, sealing the opening of the slot by the first outer circuit layer, and carrying out circuit manufacture on the second metal layer to form a second outer circuit layer;
forming a second opening penetrating the second outer circuit layer and the second substrate layer, wherein the surface of the heat conducting block, which is away from the slot, is exposed to the second opening; and
and placing an electronic element on the surface of the heat conduction assembly exposed to the second opening, wherein the electronic element penetrates through the second outer circuit layer and the second substrate layer to obtain the circuit board assembly with the heat conduction assembly.
In one possible design, the circuit board assembly further comprises, prior to the lamination step:
and filling colloid between the heat conducting block and the core part, wherein the colloid is filled in the through holes.
In one possible design, the step of forming the first outer wiring layer and the second outer wiring layer includes:
electroplating to form a first copper layer on the surface of the first metal layer and a second copper layer on the surface of the second metal layer; and
the circuit is manufactured to form a first outer circuit layer and a second outer circuit layer, wherein the first outer circuit layer is connected with the heat conducting block.
In one possible design, the second metal layer and the second copper layer corresponding to the heat conductive block are removed during the process of forming the second outer circuit layer.
In one possible design, the step of connecting the electronic component with the thermally conductive assembly includes:
placing the electronic element in the second opening, and connecting the electronic element with the heat conduction assembly through the heat conduction adhesive; and
the electronic component is electrically connected with the second substrate.
In a second aspect, the present application provides a circuit board assembly including a core, a first substrate, a second substrate, a thermally conductive assembly, and an electronic component. The core comprises a middle substrate layer and middle circuit layers positioned on two opposite surfaces of the middle substrate layer; the first substrate comprises a first base material layer and a first outer circuit layer, the first base material layer is positioned on the surface of the middle circuit layer, and the first outer circuit layer is positioned on the surface of the first base material layer, which is away from the middle circuit layer; the second substrate comprises a second base material layer and a second outer circuit layer, the second base material layer is positioned on the surface of the middle circuit layer, which is away from the first substrate, and the second outer circuit layer is positioned on the surface of the second base material layer, which is away from the first substrate; the heat conduction assembly penetrates through the middle substrate layer, the middle circuit layer and the first substrate layer, and comprises a heat conduction block and cooling liquid, wherein the heat conduction block is provided with a slot, the opening direction of the slot faces the first outer circuit layer, and the first outer circuit layer seals the cooling liquid in the slot; the electronic component penetrates through the second substrate layer and the second outer circuit layer and is connected with the heat conduction assembly, wherein the electronic component is located on the surface, which is away from the heat conduction block and is provided with a groove.
In one possible design, the circuit board assembly further includes a gel surrounding the heat conductive assembly, and the gel is further bonded to the first outer circuit layer, the first substrate layer, the intermediate circuit layer, the intermediate substrate layer, and the second substrate layer.
In one possible design, the circuit board assembly further includes a connector between the first outer circuit layer and the thermally conductive assembly, the connector connecting the first outer circuit layer and the thermally conductive assembly.
In one possible design, a heat-conducting glue is further provided between the electronic component and the heat-conducting component, the heat-conducting glue connecting the electronic component and the heat-conducting component.
In one possible design, the cooling fluid is selected from at least one of heat transfer oil, ammonia, and water.
The circuit board assembly manufactured by the manufacturing method has the advantages that the heat conduction assembly is directly connected with the first outer circuit layer and the electronic element, so that the heat transfer distance is shortened, and the heat transfer efficiency is improved; meanwhile, the first outer circuit layer seals the cooling liquid in the slot, the electronic element is positioned on the surface deviating from the heat conducting block and deviating from the slot, the area of the surface connected with the electronic element is maximized, the contact area between the electronic element and the heat conducting block is increased to the greatest extent, and the heat conduction efficiency is further improved; in addition, the liquid cooling liquid is used for conducting heat, and the principle that the phase change of the liquid absorbs heat and the temperature cannot be increased is utilized, so that the heat generated by the electronic element is absorbed and stored, the whole temperature of the circuit board assembly cannot be influenced, and the existing heat conducting mode by utilizing the circuit board assembly or the reinforcing plate is fundamentally replaced.
Drawings
Fig. 1 is a schematic cross-sectional view of a perforated core provided in an embodiment of the present application.
Fig. 2 is a schematic cross-sectional view of the core shown in fig. 1 with an insulating layer and a peelable layer coated on the surface.
Fig. 3 is a schematic cross-sectional view of the core of fig. 2 after forming a heat-conducting block with slots in the perforations and injecting a cooling fluid into the slots.
FIG. 4 is a schematic cross-sectional view of providing a first substrate layer, a first metal layer, the core portion shown in FIG. 3, a second substrate layer, and a second metal layer.
Fig. 5 is a schematic cross-sectional view of a first intermediate and a second intermediate laminated in the order shown in fig. 4 to opposite surfaces of a core.
Fig. 6 is a schematic cross-sectional view of forming a first copper layer on the surface of the first metal layer shown in fig. 5 and forming a second copper layer on the surface of the second metal layer.
Fig. 7 is a schematic cross-sectional view of the circuit of fig. 6 formed into a first substrate and a second substrate.
Fig. 8 is a schematic cross-sectional view illustrating formation of solder resist layers on surfaces of the first and second substrates shown in fig. 7.
Fig. 9 is a schematic cross-sectional view illustrating a second opening formed in the second substrate shown in fig. 8 to expose the heat conductive block.
Fig. 10 is a schematic cross-sectional view of the first outer circuit layer, the second outer circuit layer, and the heat conductive block shown in fig. 9 subjected to surface treatment to form a protective layer.
Fig. 11 is a schematic cross-sectional view of a circuit board assembly obtained by mounting an electronic component in the second opening shown in fig. 10.
Description of the main reference signs
The application will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
In order that the above-recited objects, features and advantages of the present application will be more clearly understood, a more particular description of the application will be rendered by reference to the appended drawings and appended detailed description. The embodiments of the present application and the features in the embodiments may be combined with each other without collision. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, and the described embodiments are merely some, rather than all, embodiments of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes all and any combination of one or more of the associated listed items.
In various embodiments of the present application, for convenience of description and not limitation, the term "coupled" as used in the specification and claims of the present application is not limited to physical or mechanical coupling, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which change accordingly when the absolute position of the object to be described changes.
Referring to fig. 1 to 11, a method for manufacturing a circuit board assembly 100 according to an embodiment of the present application may include the following steps:
step S1: referring to fig. 1, a core 10 is provided, a first surface 11, a second surface 12 and a through hole 13 of the core 10 are disposed opposite to the first surface 11 and the second surface 12, and the through hole 13 penetrates through the first surface 11 and the second surface 12.
The core 10 includes an intermediate base layer 15 and an intermediate wiring layer 16, and the intermediate base layer 15 and the intermediate wiring layer 16 are stacked on each other. The number of intermediate wiring layers 16 may be one or more, and when the number of intermediate wiring layers 16 is plural, plural intermediate wiring layers 16 are electrically connected to each other.
In this embodiment, the core 10 includes a middle substrate layer 15 and middle wiring layers 16 on opposite surfaces of the middle substrate layer 15, and the two middle wiring layers 16 are electrically connected. The first surface 11 and the second surface 12 are two surfaces of the two middle circuit layers 16 facing away from the middle substrate layer 15, respectively.
The core 10 may be a soft or hard plate. The material of the intermediate substrate layer 15 may be one selected from flexible materials such as Polyimide (PI), liquid crystal polymer (liquid crystal polymer, LCP) and modified polyimide (modified polyimide, MPI), and hard materials such as Polypropylene (PP) and Polytetrafluoroethylene (PTFE). In the present embodiment, the core 10 is a flexible board, and the material of the intermediate base material layer 15 is Polyimide (PI).
Step S2: referring to fig. 2, the insulation layer 22 and the peelable layer 25 are covered on two opposite surfaces of a partial region of the core 10, and the peelable layer 25 is located on a surface of the insulation layer 22 facing away from the core 10. The region covering the insulating layer 22 and the peelable layer 25 is used to form a flex region a (see fig. 11) in a subsequent process, so that the circuit board assembly 100 is a flexible-rigid printed circuit board.
In some embodiments, step S2 may be omitted.
Step S3: referring to fig. 3, a heat conducting block 32 having a slot 34 is formed in the through hole 13, the slot 34 is recessed along the first surface 11 toward the second surface 12, and a cooling liquid 35 is injected into the slot 34.
The material of the heat conducting block 32 is selected from materials with high thermal conductivity, including but not limited to metal blocks. In the present embodiment, the heat conductive block 32 is a copper block.
The heat conducting block 32 has grooves 34 formed on its surface, and the grooves 34 may be one or more grooves 34 or may be a plurality of grooves 34 communicating with each other. The manner in which the slot 34 is formed is not limited. In the present embodiment, the number of the slots 34 is plural, and the plurality of slots 34 are spaced apart on the heat conducting block 32, so that the heat conducting block 32 forms a plurality of copper pillars 320 between the slots 34. The thermally conductive mass 32 includes a third surface 322 and a fourth surface 324 disposed opposite the third surface 322. The slot 34 is formed from the third surface 322 toward the fourth surface 324, and a slot opening 342 is formed in the third surface 322, that is, the third surface 322 is on the same side as the first surface 11, and the fourth surface 324 is on the same side as the second surface 12.
In the present embodiment, the heat conductive block 32 (copper block) is formed into a groove structure having a plurality of copper pillars 320, and the copper pillars 320 may be square, round, diamond, or the like.
The cooling liquid 35 may be selected from at least one of heat transfer oil, ammonia water, and water. The cooling liquid 35 can absorb and store a certain amount of heat during the heat conduction process, so that a phase change can be generated.
The height of the cooling liquid 35 in the groove 34 does not exceed the depth of the groove 34, preventing the cooling liquid 35 from overflowing.
Step S4: referring to fig. 4 and 5, a first intermediate body 40 is formed on the first surface 11, and a second intermediate body 50 is formed on the second surface 12, wherein the first intermediate body 40 is connected to the third surface 322 of the heat conducting block 32 and covers the slot opening 342 of the sealing slot 34, so as to seal the slot 34, and the sealed heat conducting block 32 and the cooling liquid 35 form the heat conducting assembly 30. The first intermediate body 40 is also connected to the second surface 12 of the core 10.
In some embodiments, the step of step S4 may specifically include the steps of:
step S401: referring to fig. 4, a first substrate layer 42 and a first metal layer 44 are provided, wherein the first substrate layer 42 has a first opening 46.
In some embodiments, the surface of the first metal layer 44 is provided with a connector 48, and the connector 48 is used to connect the first metal layer 44 with the heat conducting block 32.
The material of the connector 48 is selected from materials with high heat conduction efficiency and adhesive effect, such as metal adhesive.
Step S402: referring to fig. 4, a second substrate layer 52 and a second metal layer 54 are provided.
Step S403: referring to fig. 5, the first metal layer 44, the first base material layer 42, the core 10 having the heat conducting block 32 containing the cooling liquid 35, the second base material layer 52 and the second metal layer 54 are laminated in this order.
Wherein, prior to lamination, the first opening 46 communicates with the perforation 13; during the lamination process, the connecting body 48 is exposed to the first opening 46, the surface of the heat conducting block 32 with the slot 34 passes through the first opening 46, the connecting body 48 is connected with the copper pillar 320 surrounding the slot 34, and the first metal layer 44 seals the cooling liquid 35 in the slot 34, so that the heat conducting block 32 sealed with the cooling liquid 35 forms the heat conducting assembly 30. It can be appreciated that, after lamination, the heat conducting component 30 is directly connected with the first metal layer 44, so that the heat transfer distance can be shortened, and the heat transfer efficiency can be improved.
In some embodiments, the heat conducting block 32 is spaced from the core 10, and a glue 33 is filled between the heat conducting block 32 and the core 10 before the lamination step, and after the lamination step, the glue 33 is used to bond the heat conducting block 32 to the circuit substrate.
Step S5: referring to fig. 6 and 7, the first intermediate 40 is routed to form a first substrate 60, and the second intermediate 50 is routed to form a second substrate 70.
The first metal layer 44 is routed to form a first outer layer of routing circuitry 64 and the second metal layer 54 is routed to form a second outer layer of routing circuitry 74. The first substrate 60 and the second substrate 70 are electrically connected to the core 10, the opening direction of the slot 34 faces the first substrate 60, and the first substrate 60 seals the slot 34.
The first outer circuit layer 64 is directly connected to the heat conducting component 30, so that the heat transfer distance is shortened and the heat transfer efficiency is improved in the subsequently formed circuit board component 100.
In some embodiments, step S5 may include the steps of:
step S501: the first intermediate body 40 is etched to form a first blind via (not shown) and the second intermediate body 50 is etched to form a second blind via (not shown).
It will be appreciated that the intermediate circuit layer 16 is exposed to the first blind via and the second blind via.
Step S502: referring to fig. 6, the electroplating process is performed to form a first copper layer 62 on the surface of the first metal layer 44 and a second copper layer 72 on the surface of the second metal layer 54.
During the electroplating process, the first copper layer 62 also fills the first blind via, and the second copper layer 72 also fills the second blind via to electrically connect the intermediate circuit layer 16.
Step S503: referring to fig. 7, the circuit is fabricated to form a first outer circuit layer 64 and a second outer circuit layer 74, wherein the first outer circuit layer 64 is connected to the heat conducting block 32.
In the process of forming the second outer circuit layer 74, the second metal layer 54 and the second copper layer 72 corresponding to the heat conducting block 32 are removed, so that the second substrate layer 52 corresponding to the removed area is etched in the subsequent process without damaging the second outer circuit layer 74.
Step S6: referring to fig. 8, a solder mask 82 is formed on the surfaces of the first substrate 60 and the second substrate 70.
The solder masks 82 are respectively located on the surfaces of the first substrate 60 and the second substrate 70 facing away from the core 10, so as to protect the first outer circuit layer 64 and the second outer circuit layer 74.
Step S7: referring to fig. 9, a second opening 76 is formed in the second substrate 70, and a surface of the heat conducting block 32 facing away from the slot 34 is exposed to the second opening 76.
Specifically, the second substrate layer 52 corresponding to the heat conductive component 30 is removed, thereby forming a second opening 76.
In some embodiments, when the second substrate layer 52 is removed, a portion of the heat conducting block 32 may also be removed as needed, reducing the thickness of the heat conducting block 32.
In some embodiments, forming the second opening 76 may further include removing the second substrate 70 corresponding to the peelable layer 25 and the peelable layer 25, exposing the insulating layer 22, thereby forming a flex region.
Step S8: referring to fig. 10, a protective layer 85 is formed on the exposed surfaces of the first outer circuit layer 64, the second outer circuit layer 74 and the heat conducting block 32 to prevent oxidation of metal; the protective layer 85 on the surface of the heat conducting block 32 also has a corrosion preventing effect.
Step S9: referring to fig. 11, an electronic component 90 is disposed on the surface of the heat conductive member 30 exposed at the second opening 76 to obtain a circuit board assembly 100 having the heat conductive member 30.
Specifically, the electronic component 90 is placed in the second opening 76, the electronic component 90 is connected to the heat conductive member 30 through the heat conductive paste 36, and in addition, the electronic component 90 is electrically connected to the second substrate 70.
Referring to fig. 11, the present application further provides a circuit board assembly 100, which includes a core 10, a first substrate 60, a second substrate 70, a heat conducting assembly 30, and an electronic component 90. The core 10 is located between the first substrate 60 and the second substrate 70, the first substrate 60, the second substrate 70 and the core 10 are electrically connected, the heat conductive member 30 penetrates the core 10 and is connected with the first substrate 60, and the electronic component 90 penetrates the second substrate 70 and is electrically connected with the second substrate 70.
The core 10 includes an intermediate base layer 15 and an intermediate wiring layer 16, and the intermediate base layer 15 and the intermediate wiring layer 16 are stacked on each other. The number of intermediate wiring layers 16 may be one or more, and when the number of intermediate wiring layers 16 is plural, plural intermediate wiring layers 16 are electrically connected to each other.
The core 10 may be a soft or hard plate. The material of the intermediate substrate layer 15 may be one selected from flexible materials such as Polyimide (PI), liquid crystal polymer (liquid crystal polymer, LCP) and modified polyimide (modified polyimide, MPI), and hard materials such as Polypropylene (PP) and Polytetrafluoroethylene (PTFE).
The first substrate 60 includes a first substrate layer 42 and a first outer circuit layer 64; the second substrate 70 includes a second base material layer 52 and a second outer circuit layer 74 stacked. The number of layers of the first outer wiring layer 64 and the second outer wiring layer 74 may be set as required.
The heat conducting component 30 includes a heat conducting block 32 having a slot 34 and a cooling liquid 35, the slot 34 is opened toward the first substrate 60, the heat conducting component 30 penetrates through the intermediate substrate layer 15, the intermediate circuit layer 16 and the first substrate layer 42 and is connected with the first outer circuit layer 64, the first outer circuit layer 64 seals the cooling liquid 35 in the slot 34, and the cooling liquid 35 can be in direct contact with the first outer circuit layer 64. The cooling liquid 35 is selected from at least one of heat transfer oil, ammonia water, and water.
The surface of the thermally conductive block 32 having the slot 34 is directly connected to the first outer wiring layer 64, and the first outer wiring layer 64 seals the slot 34. The first outer circuit layer 64 directly seals the cooling liquid 35 in the slot 34, so that the heat transfer distance can be shortened, and the heat transfer efficiency can be improved.
In some embodiments, the surface of the first outer circuit layer 64 facing the heat conducting block 32 is provided with a connector 48, and the connector 48 connects the first outer circuit layer 64 and the heat conducting block 32. The material of the connector 48 is selected from materials with high heat conduction efficiency and adhesive effect, such as metal adhesive.
The electronic component 90 is located on the surface of the heat conducting component 30 facing the second substrate 70, i.e. the electronic component 90 is located on the surface facing away from the heat conducting component 30 and having the slot 34, so that the contact area between the heat conducting component 30 and the heat conducting block 32 can be increased to the greatest extent, and the heat conducting efficiency is improved.
In some embodiments, the electronic component 90 is connected to the heat conducting block 32 through the heat conducting glue 36, the heat conducting glue 36 is located on the surface of the heat conducting block 32 where the slot 34 is formed, and the heat conducting glue 36 plays a role in bonding the electronic component 90 and the heat conducting block 32 and also plays a role in rapidly conducting heat generated by the electronic component 90.
In some embodiments, the circuit board assembly further includes a glue 33, the glue 33 surrounds the heat conducting block 32 in the heat conducting assembly 30, and along the stacking direction of the circuit board assembly 100, the glue 33 is further bonded to the first outer circuit layer 64, the first substrate layer 42, the intermediate circuit layer 16, the intermediate substrate layer 15, and the second substrate layer 52 in sequence, and the glue 33 plays a role in both bonding and buffering between the heat conducting assembly 30 and the intermediate circuit layer 16.
In some embodiments, the circuit board assembly 100 further includes a solder mask layer 82, where the solder mask layer 82 is located on the surfaces of the first substrate 60 and the second substrate 70 to prevent oxidation of the first outer circuit layer 64 and the second outer circuit layer 74.
In some embodiments, the circuit board assembly 100 further includes a protective layer 85, where the protective layer 85 is located on the first outer circuit layer 64, the second outer circuit layer 74, and the surface of the heat conducting block 32 not covered by the substrate layer for oxidation resistance.
The circuit board assembly 100 may be a flexible board, a rigid board, or a rigid-flex board. In this embodiment, the circuit board assembly 100 is a rigid-flex board, the circuit board assembly 100 includes a bending region a, the core 10 located in the bending region a is exposed to the first substrate 60 and the second substrate 70, and the surface of the core 10 located in the bending region a is covered with the insulating layer 22.
According to the circuit board assembly 100 manufactured by the manufacturing method, the two opposite surfaces of the heat conduction assembly 30 are respectively and directly connected with the first outer circuit layer 64 and the electronic element 90, so that the heat transfer distance is shortened, and the heat transfer efficiency is improved; meanwhile, the electronic element 90 is positioned on the surface, deviating from the heat conducting block 32 and deviating from the slot 34, the first outer circuit layer 64 seals the cooling liquid 35 in the slot 34, the area of the surface, connected with the electronic element 90, of the heat conducting block 32 is maximized, the contact area between the electronic element 90 and the heat conducting block 32 is increased to the greatest extent, and the heat conduction efficiency is further improved; in addition, the liquid cooling liquid 35 is used for conducting heat, and the principle that the phase change of the liquid absorbs heat and the temperature is not increased is utilized, so that the heat generated by the electronic element 90 is absorbed and stored, but the whole temperature of the circuit board assembly 100 is not affected, and the existing heat conducting mode by utilizing the circuit board assembly or the reinforcing plate is fundamentally replaced.
The above embodiments are only for illustrating the technical solution of the present application and not for limiting the same, and although the present application has been described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the technical solution of the present application.
Claims (10)
1. The manufacturing method of the circuit board assembly is characterized by comprising the following steps of:
providing a core part, which comprises a middle substrate layer and middle circuit layers positioned on two opposite surfaces of the middle substrate layer, wherein the core part comprises a first surface, a second surface and a perforation, the first surface and the second surface are arranged opposite to each other, and the perforation penetrates through the middle substrate layer and the middle circuit layers;
forming a heat conduction block with a slot in the perforation, wherein the slot is concavely formed along the direction of the first surface towards the second surface, and cooling liquid is injected into the slot;
providing a first substrate layer and a first metal layer, wherein the first substrate layer is positioned on the first surface, the first metal layer is positioned on the surface of the first substrate layer, which is away from the middle circuit layer, and the first substrate layer is provided with a first opening;
providing a second substrate layer and a second metal layer;
pressing the first metal layer, the first base material layer, the core part with the heat conducting block containing the cooling liquid, the second base material layer and the second metal layer in sequence, wherein the heat conducting block is provided with a grooved surface which penetrates through the first opening and is connected with the first metal layer, the first metal layer is connected with the heat conducting block and seals the grooved opening, and the sealed heat conducting block and the cooling liquid form a heat conducting assembly;
performing circuit fabrication on the first metal layer to form a first outer layer circuit layer, sealing the opening of the slot by the first outer layer circuit layer, and performing circuit fabrication on the second metal layer to form a second outer layer circuit layer;
forming a second opening penetrating through the second outer circuit layer and the second substrate layer, wherein the surface of the heat conducting block, which faces away from the slot, is exposed to the second opening; and
and placing an electronic element on the surface of the heat conduction assembly exposed to the second opening, wherein the electronic element penetrates through the second outer circuit layer and the second substrate layer to obtain the circuit board assembly with the heat conduction assembly.
2. The method of manufacturing a circuit board assembly of claim 1, further comprising, prior to the step of laminating:
and filling colloid between the heat conducting block and the core part, wherein the colloid is filled in the through holes.
3. The method of manufacturing a circuit board assembly according to claim 1, wherein the step of forming the first outer layer wiring layer and the second outer layer wiring layer comprises:
electroplating to form a first copper layer on the surface of the first metal layer and a second copper layer on the surface of the second metal layer; and
and the circuit is manufactured to form the first outer circuit layer and the second outer circuit layer, wherein the first outer circuit layer is connected with the heat conducting block.
4. The method of claim 3, wherein the second metal layer and the second copper layer corresponding to the heat conductive block are removed during the forming of the second outer circuit layer.
5. The method of manufacturing a circuit board assembly according to claim 1, wherein the step of connecting the electronic component to the thermally conductive assembly comprises:
placing the electronic element in the second opening, and connecting the electronic element with the heat conduction assembly through heat conduction glue; and
and electrically connecting the electronic element with the second substrate.
6. A circuit board assembly, the circuit board assembly comprising:
the core part comprises an intermediate substrate layer and intermediate circuit layers positioned on two opposite surfaces of the intermediate substrate layer;
the first substrate comprises a first base material layer and a first outer circuit layer, wherein the first base material layer is positioned on the surface of the middle circuit layer, and the first outer circuit layer is positioned on the surface of the first base material layer, which is away from the middle circuit layer;
the second substrate comprises a second base material layer and a second outer circuit layer, the second base material layer is positioned on the surface of the middle circuit layer, which is away from the first substrate, and the second outer circuit layer is positioned on the surface of the second base material layer, which is away from the first substrate;
the heat conduction assembly penetrates through the middle substrate layer, the middle circuit layer and the first substrate layer and comprises a heat conduction block and cooling liquid, the heat conduction block is provided with a groove, the opening direction of the groove faces the first outer circuit layer, and the first outer circuit layer seals the cooling liquid in the groove; and
and the electronic element penetrates through the second substrate layer and the second outer circuit layer and is connected with the heat conduction assembly, wherein the electronic element is positioned on the surface which is away from the heat conduction block and is provided with the grooves.
7. The circuit board assembly of claim 6, further comprising a gel surrounding the thermally conductive assembly, the gel further bonded to the first outer circuit layer, the first substrate layer, the intermediate circuit layer, the intermediate substrate layer, and the second substrate layer.
8. The circuit board assembly of claim 6, further comprising a connector between the first outer circuit layer and the thermally conductive assembly, the connector connecting the first outer circuit layer and the thermally conductive assembly.
9. The circuit board assembly of claim 6, wherein a thermal adhesive is further disposed between the electronic component and the thermal assembly, the thermal adhesive connecting the electronic component and the thermal assembly.
10. The circuit board assembly of claim 6, wherein the cooling fluid is selected from at least one of heat transfer oil, ammonia, and water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210351249.1A CN116939949A (en) | 2022-04-02 | 2022-04-02 | Circuit board assembly and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210351249.1A CN116939949A (en) | 2022-04-02 | 2022-04-02 | Circuit board assembly and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116939949A true CN116939949A (en) | 2023-10-24 |
Family
ID=88377836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210351249.1A Pending CN116939949A (en) | 2022-04-02 | 2022-04-02 | Circuit board assembly and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116939949A (en) |
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2022
- 2022-04-02 CN CN202210351249.1A patent/CN116939949A/en active Pending
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