CN110137307A - 一种低压环境下的高均匀性浅结扩散工艺 - Google Patents

一种低压环境下的高均匀性浅结扩散工艺 Download PDF

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CN110137307A
CN110137307A CN201910396644.XA CN201910396644A CN110137307A CN 110137307 A CN110137307 A CN 110137307A CN 201910396644 A CN201910396644 A CN 201910396644A CN 110137307 A CN110137307 A CN 110137307A
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何一峰
赵庆国
吕文辉
姚春梅
汪燕萍
张宇辉
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Zhejiang Beisheng Green Energy Technology Co ltd
Zhejiang Beyondsun Pv Co ltd
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Abstract

本发明公开的一种低压环境下的高均匀性浅结扩散工艺,包括以下步骤:(1)将硅片导入石英舟,石英舟恒温常压导入已净化炉管;(2)抽真空至炉体压力为50‑100mbar,对炉体分段扩散加热、恒温沉积、恒温分段推进加热;(3)在50‑100mbar下,对炉体降温并退火;(4)充氮恢复常压并导出石英舟,与现有技术相比,本发明可通过调整电池片PN的均匀性而降低表面扩散浓度,并且均匀性较好的结能更好的匹配烧结,从而提高表面欧姆接触品质,结合退火工艺提高少子寿命,有效提高电池片的电性能参数,并最终提高转换效率。

Description

一种低压环境下的高均匀性浅结扩散工艺
技术领域
本发明涉及太阳能电池技术领域,具体涉及一种低压环境下的高均匀性浅结扩散工艺。
背景技术
P型多晶硅片在扩散工序需在其表面进行磷沉积从而形成一层N型硅层,组成PN结结构,在生产过程中表面结的深度及均匀性会直接影响电池片的品质,较浅的N型层将大大减少表面死层的出现,减少对体材料掺杂影响,提高少子寿命,从而提高电池片的转换效率;更加均匀的PN结将有助于与后端烧结的匹配情况,减少因方阻均匀性较差造成的局部烧结不良的情况。
实际生产中由于无法实时扩散深度,而采用监控电池片表面各区域方块电阻,行业现有工艺是将方阻控制在100-110,单片方阻不均匀性控制在8%以内,整管方阻不均匀性控制在6%以内,均匀度不够,方阻的控制区间小,进而单片及整管的不均匀性的控制范围小,电池片效率低。
发明内容
为解决上述问题,本发明提供一种低压环境下的高均匀性浅结扩散工艺,提高了电池片PN表面结的均匀度,方阻控制区间范围大,少子寿命长,电池片效率高。
本发明解决的技术方案是,提供一种低压环境下的高均匀性浅结扩散工艺,包括以下步骤:(1)将硅片导入石英舟,石英舟恒温常压导入已净化炉管;(2)抽真空至炉体压力为50-100mbar,对炉体分段扩散加热、恒温沉积、恒温分段推进加热;(3)在50-100mbar下,对炉体降温并退火;(4)充氮恢复常压并导出石英舟。
优选地,所述步骤(2)中,分段扩散加热包括恒温扩散、变温扩散。
优选地,所述步骤(2)中,所述恒温分段推进加热包括3段恒温推进加热。
优选地,所述恒温温度为780℃。
优选地,所述变温扩散温度为800℃。
优选地,所述步骤(3)中,炉体降温至750℃并退火。
优选地,所述步骤(2)、步骤(3)中,还包括提供气体环境。
优选地,所述气体包括氧气、氮气中的一种或两种。
优选地,所述氧气质量流量为200-900 SCCM,氮气质量流量为500-1000 SCCM。
本方案中,通过低压环境下的高均匀性浅结扩散,随着反应管真空度的提升,分子平均自由行程加大,增强分子的穿透力,使源掺杂均匀性更好,消减了传统扩散的光环效应(即硅片中间方阻值高,而四周方阻值低),从而提升掺杂均匀性;同时,降低管内的压力可减少湍流产生,利于气流的稳定,提高气氛均匀性,从而提高扩散的均匀性;使用低压扩散炉,可以实现快速排空,减少残留源对结的影响,利于形成浅结,减少表面复合,此外,在低压扩散环境中,掺杂原子分压比大,降低掺杂源耗,降低成本。
与现有技术相比,经本方案处理的多晶硅片扩散结均匀性的提升,大幅降低现有扩散表面的结深,同时不出现过品质异常的扩散结,由于扩散结均匀性的提升,有利于烧结工艺的优化,减少局部烧结不良的情况,由于显现浅结的优势,提高电池片转换效率,低压环境分子平均自由行程加大,可降低80-90%的化学品用量降低生产成本,且将现有400-500片一管的扩散模式改为800-1200片一管,降低单位能耗,提高生产效率,降低生产成本。
本发明可通过调整电池片PN的均匀性而降低表面扩散浓度,并且均匀性较好的结能更好的匹配烧结,从而提高表面欧姆接触品质,结合退火工艺提高少子寿命,有效提高电池片的电性能参数,并最终提高转换效率。
具体实施方式
以下是本发明的具体实施例,对本发明的技术方案作进一步的描述,但本发明并不限于这些实施例。
本方案中所述的扩散时要通入大量纯氮气作为稀释气体,故称大氮,同时还有一路量比较小的氮气要通过磷源瓶携带磷源进入管体,故称小氮。
实施例1
按照以下工艺进行电池片扩散:
统一收集传统酸制绒后的硅片;
将硅片导入低压工艺专用石英舟;
净化炉管,时间20s,温度780℃,炉体压力为常压,气体介质为氮气,大氮质量流量为3000SCCM;
进舟,时间1000s,温度780℃,炉体压力为常压,气体介质为氮气,大氮质量流量为3000SCCM;
恒温扩散,时间400s,温度780℃,炉体压力为常压,气体介质为氧气与氮气,质量流量氧气为500SCCM,大氮为500SCCM,打开通源管路,源瓶压力500mba,小氮800SCCM。
恒温沉积,时间200s,温度800℃,炉体压力为常压,气体介质为氮气,大氮800SCCM,打开通源管路,源瓶压力500mba,小氮800SCCM。
恒温推进,时间1000s,温度800℃,炉体压力为常压,气体介质为氧气与氮气,质量流量氧气为200SCCM,大氮900SCCM,打开通源管路,源瓶压力500mba,小氮730SCCM。
降温,时间400s,温度750℃,炉体压力为常压,气体介质为氧气与氮气,质量流量氧气为900SCCM,大氮1000SCCM。
退火,时间600s,温度750℃,炉体压力为常压,气体介质为氮气,大氮1000SCCM。
检测,炉体压力为常压。
出舟,时间1000s,温度780℃,炉体压力为常压,气体介质为氮气,大氮3000SCCM。
保温待用,温度780℃,炉体压力为常压,气体介质为氮气,大氮3000SCCM。
如下表所示,为酸制绒后扩散120方阻不均匀性:
使用实施例1工艺,方阻控制到120均匀性就会有较大的偏差,中心与四周的方阻会有20-30的差别,以此状态至印刷烧结,必须降低烧结温度,否则会有部分区域烧穿,造成不良片,但由于被动地降低烧结温度且各区域烧结效果有较大差别,极易造成效率的损失。
实施例2
按照以下工艺进行电池片扩散:
统一收集传统酸制绒后的硅片;
将硅片导入低压工艺专用石英舟;
净化炉管,时间20s,温度780℃,炉体压力为常压,气体介质为氮气,大氮质量流量为3000SCCM;
进舟,时间1000s,温度780℃,炉体压力为常压,气体介质为氮气,大氮质量流量为3000SCCM;
主抽真空,时间240s,温度780℃,炉体压力为50mbar;
检漏,时间60s,温度780℃,炉体压力为50mbar;
抽真空,时间40s,温度780℃,炉体压力为50mbar;
恒温扩散,时间400s,温度780℃,炉体压力为50mbar,氧气500SCCM,大氮500SCCM,打开通源管路,源瓶压力500mba,小氮800SCCM;
变温扩散,时间300s,温度800℃,炉体压力为50mbar,氧气200SCCM,大氮900SCCM,打开通源管路,源瓶压力500mba,小氮730SCCM;
恒温沉积,时间200s,温度800℃,炉体压力为50mbar,大氮800SCCM,打开通源管路,源瓶压力500mba,小氮800SCCM;
恒温推进一段,时间300s,温度800℃,炉体压力为50 mba,氧气200SCCM,大氮900SCCM,打开通源管路,源瓶压力500mba,小氮730SCCM;
恒温推进二段,时间500s,温度800℃,炉体压力为50 mba,大氮800SCCM,打开通源管路,源瓶压力500mba,小氮800SCCM;
恒温推进三段,时间200s,温度800℃,炉体压力为50 mba,氧气200SCCM,大氮900SCCM,打开通源管路,源瓶压力500mba,小氮730SCCM;
变温扩散,时间300s,温度830℃,炉体压力为50mbar,大氮800SCCM,打开通源管路,源瓶压力500mba,小氮800SCCM;
恒温推进,时间600s,温度830℃,炉体压力为50mbar,大氮1000SCCM,打开通源管路,源瓶压力500mba,小氮800SCCM。
降温,时间400s,温度750℃,炉体压力为50mbar,氧气900SCCM,大氮1000SCCM。
退火,时间600s,温度750℃,炉体压力为50mbar,大氮1000SCCM;
充氮,炉体压力至常压;
检测,炉体压力为常压;
出舟,时间1000s,温度780℃,炉体压力为常压,大氮3000SCCM;
保温待用,温度780℃,炉体压力为常压,大氮3000SCCM。
如下表所示,为实施例2下的120方阻不均匀性:
根据实验数据,在本发明下,扩散工序可将方阻控制提升至120,其均匀性要好于常规扩散下120方阻,据需要可在本发明下将方阻进一步提升至130。
本方案中,多段推进、多段扩散可减少单次扩散的源量,减少局部掺杂浓度过高,形成死层区域影响电池片转换效率,控制各个扩散层的扩散浓度和深度,形成不同扩散层,并控制各个扩散层的扩散时间、温度,形成更加均匀的PN结。
下表为实施例1与实施例2所制备的电池片参数对比,结果表明由实施例2所制备的电池片PN的均匀性而降低表面扩散浓度,并且均匀性较好的结能更好的匹配烧结,从而提高表面欧姆接触品质,结合退火工艺提高少子寿命,有效提高电池片的电性能参数,并最终提高转换效率。
实施例3
按照以下工艺进行电池片扩散:
统一收集传统酸制绒后的硅片;
将硅片导入低压工艺专用石英舟;
净化炉管,时间20s,温度780℃,炉体压力为常压,气体介质为氮气,大氮质量流量为3000SCCM;
进舟,时间1000s,温度780℃,炉体压力为常压,气体介质为氮气,大氮质量流量为3000SCCM;
主抽真空,时间240s,温度780℃,炉体压力为100mbar;
检漏,时间60s,温度780℃,炉体压力为100mbar;
抽真空,时间40s,温度780℃,炉体压力为100mbar;
恒温扩散,时间400s,温度780℃,炉体压力为100mbar,氧气500SCCM,大氮500SCCM,打开通源管路,源瓶压力500mba,小氮800SCCM;
变温扩散,时间300s,温度800℃,炉体压力为100mbar,氧气200SCCM,大氮900SCCM,打开通源管路,源瓶压力500mba,小氮730SCCM;
恒温沉积,时间200s,温度800℃,炉体压力为100mbar,大氮800SCCM,打开通源管路,源瓶压力500mba,小氮800SCCM;
恒温推进一段,时间300s,温度800℃,炉体压力为100 mba,氧气200SCCM,大氮900SCCM,打开通源管路,源瓶压力500mba,小氮730SCCM;
恒温推进二段,时间500s,温度800℃,炉体压力为100 mba,大氮800SCCM,打开通源管路,源瓶压力500mba,小氮800SCCM;
恒温推进三段,时间200s,温度800℃,炉体压力为100 mba,氧气200SCCM,大氮900SCCM,打开通源管路,源瓶压力500mba,小氮730SCCM;
变温扩散,时间300s,温度830℃,炉体压力为100mbar,大氮800SCCM,打开通源管路,源瓶压力500mba,小氮800SCCM;
恒温推进,时间600s,温度830℃,炉体压力为100mbar,大氮1000SCCM,打开通源管路,源瓶压力500mba,小氮800SCCM。
降温,时间400s,温度750℃,炉体压力为100mbar,氧气900SCCM,大氮1000SCCM。
退火,时间600s,温度750℃,炉体压力为100mbar,大氮1000SCCM;
充氮,炉体压力至常压;
检测,炉体压力为常压;
出舟,时间1000s,温度780℃,炉体压力为常压,大氮3000SCCM;
保温待用,温度780℃,炉体压力为常压,大氮3000SCCM。
实施例4
按照以下工艺进行电池片扩散:
统一收集传统酸制绒后的硅片;
将硅片导入低压工艺专用石英舟;
净化炉管,时间20s,温度780℃,炉体压力为常压,气体介质为氮气,大氮质量流量为3000SCCM;
进舟,时间1000s,温度780℃,炉体压力为常压,气体介质为氮气,大氮质量流量为3000SCCM;
主抽真空,时间240s,温度780℃,炉体压力为80mbar;
检漏,时间60s,温度780℃,炉体压力为80mbar;
抽真空,时间40s,温度780℃,炉体压力为80mbar;
恒温扩散,时间400s,温度780℃,炉体压力为80mbar,氧气500SCCM,大氮500SCCM,打开通源管路,源瓶压力500mba,小氮800SCCM;
变温扩散,时间300s,温度800℃,炉体压力为80mbar,氧气200SCCM,大氮900SCCM,打开通源管路,源瓶压力500mba,小氮730SCCM;
恒温沉积,时间200s,温度800℃,炉体压力为80mbar,大氮800SCCM,打开通源管路,源瓶压力500mba,小氮800SCCM;
恒温推进一段,时间300s,温度800℃,炉体压力为80 mba,氧气200SCCM,大氮900SCCM,打开通源管路,源瓶压力500mba,小氮730SCCM;
恒温推进二段,时间500s,温度800℃,炉体压力为80 mba,大氮800SCCM,打开通源管路,源瓶压力500mba,小氮800SCCM;
恒温推进三段,时间200s,温度800℃,炉体压力为80 mba,氧气200SCCM,大氮900SCCM,打开通源管路,源瓶压力500mba,小氮730SCCM;
变温扩散,时间300s,温度830℃,炉体压力为80mbar,大氮800SCCM,打开通源管路,源瓶压力500mba,小氮800SCCM;
恒温推进,时间600s,温度830℃,炉体压力为80mbar,大氮1000SCCM,打开通源管路,源瓶压力500mba,小氮800SCCM。
降温,时间400s,温度750℃,炉体压力为80mbar,氧气900SCCM,大氮1000SCCM。
退火,时间600s,温度750℃,炉体压力为80mbar,大氮1000SCCM;
充氮,炉体压力至常压;
检测,炉体压力为常压;
出舟,时间1000s,温度780℃,炉体压力为常压,大氮3000SCCM;
保温待用,温度780℃,炉体压力为常压,大氮3000SCCM。
以上未涉及之处,均适用于现有技术。
本文中所描述的具体实施例仅仅是对本发明精神作举例说明。本发明所属技术领域的技术人员可以对所描述的具体实施例做各种各样的修改或补充或采用类似的方式替代,但并不会偏离本发明的精神或者超越所附权利要求书所定义的范围。

Claims (9)

1.一种低压环境下的高均匀性浅结扩散工艺,其特征在于,包括以下步骤:
将硅片导入石英舟,石英舟恒温常压导入已净化炉管;
抽真空至炉体压力为50-100mbar,对炉体分段扩散加热、恒温沉积、恒温分段推进加热;
在50-100mbar下,对炉体降温并退火;
充氮恢复常压并导出石英舟。
2.根据权利要求1所述的一种低压环境下的高均匀性浅结扩散工艺,其特征在于,所述步骤(2)中,分段扩散加热包括恒温扩散、变温扩散。
3.根据权利要求1所述的一种低压环境下的高均匀性浅结扩散工艺,其特征在于,所述步骤(2)中,所述恒温分段推进加热包括3段恒温推进加热。
4.根据权利要求2所述的一种低压环境下的高均匀性浅结扩散工艺,其特征在于,所述恒温温度为780℃。
5.根据权利要求2所述的一种低压环境下的高均匀性浅结扩散工艺,其特征在于,所述变温扩散温度为800℃。
6.根据权利要求1所述的一种低压环境下的高均匀性浅结扩散工艺,其特征在于,所述步骤(3)中,炉体降温至750℃并退火。
7.根据权利要求1所述的一种低压环境下的高均匀性浅结扩散工艺,其特征在于,所述步骤(2)、步骤(3)中,还包括提供气体环境。
8.根据权利要求7所述的一种低压环境下的高均匀性浅结扩散工艺,其特征在于,所述气体包括氧气、氮气中的一种或两种。
9.根据权利要求8所述的一种低压环境下的高均匀性浅结扩散工艺,其特征在于,所述氧气质量流量为200-900 SCCM,氮气质量流量为500-1000 SCCM。
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