CN110131599A - A kind of CSP LED of the reflective white wall of level - Google Patents
A kind of CSP LED of the reflective white wall of level Download PDFInfo
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- CN110131599A CN110131599A CN201910422819.XA CN201910422819A CN110131599A CN 110131599 A CN110131599 A CN 110131599A CN 201910422819 A CN201910422819 A CN 201910422819A CN 110131599 A CN110131599 A CN 110131599A
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- China
- Prior art keywords
- led
- conductive pin
- reflective white
- white wall
- led chip
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
- F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
- F21V7/30—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings the coatings comprising photoluminescent substances
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
- F21V9/32—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
A kind of CSP LED of the reflective white wall of level, LED chip including upside-down mounting is set to LED chip surrounding side, and its top surface is in the reflective white wall of same level with chip light emitting face, is electrically connected respectively with conductive pin set on the fluorescent powder glue-line in LED chip light-emitting surface and reflective white wall top face, with the pad of the bottom of LED chip, the bottom surface of the bottom surface of conductive pin and reflective white wall is same level.This technology progress is that structure is simple, has high luminous efficiency and the encapsulation especially suitable for small size, high-power, high reflecting rate LED.
Description
Technical field
The present invention relates to LED encapsulation technologies, in particular to improve the LED encapsulation technology of the reflective efficiency of LED.
Background technique
LED chip encapsulation, is broadly divided into positive cartridge chip and Flip-Chip Using, more prevalence is flip-chip at present
Encapsulation technology.Its Flip-Chip Using, but dividing has bracket to encapsulate and encapsulate without bracket, and right support encapsulation is mostly formal dress encapsulation；
No bracket encapsulates existing positive cartridge chip, also there is Flip-Chip Using.Flip-Chip Using is to be equipped with electrode in die bottom surface, directly
Upper surface and side package on package colloid in chip, keep the electrode of bottom surface exposed.CSP LED basic technology is to put chip
On counterdie or on package support, after silica gel is mixed with fluorescent powder with chip perfusion, hot pressing, cut.Existing encapsulation
Technology and the structure also promising macula lutea and luminous efficiency for reducing phosphor powder layer, are coated with the skill of reflective layer in the non-luminescent face of LED chip
Art, such as number of patent application are as follows: " CN108682729 ", title are as follows: " encapsulating structure of CSP LED encapsulation method and CSP LED ".
It is exactly that white light blocking layer is set on surface of the flip LED chips far from substrate；This method is only capable of that the LED chip back side is arranged
Light blocking layer, reflector efficiency are relatively low.
Summary of the invention
It is an object of the present invention to provide a kind of structure is simple, LED structure with high luminous efficiency and especially suitable for small size,
The encapsulation technology of high-power, high reflecting rate LED.
The purpose of the present invention can be realized by the following technologies, a kind of CSP LED of the reflective white wall of level, described in
The structure of LED includes the LED chip 1 of upside-down mounting, is set to 1 surrounding side of LED chip, and its top surface is in LED chip light-emitting surface
Reflective white wall 2, the fluorescent powder glue-line 3 and LED core set on 1 light-emitting surface of LED chip and reflective 2 top surface of white wall of same level
The pad 10 of the bottom of piece 1 is electrically connected with conductive pin 41 respectively, and the bottom surface of the bottom surface of conductive pin 41 and reflective white wall 2 is same
One horizontal plane.
A kind of the CSP LED, the CSP LED of the reflective white wall of level include a following step ancient attendants in charge of cart and horses for aristocrats:
1), the copper sheet that will there is heat transfer electric action, i.e. conductive pin convex board 4, through the method at turbid quarter, between certain
Away from, by conductive pin convex board 4 be etched into top surface be arrangement corresponding with the bottom land 10 of LED chip 1 conductive pin 41
Boss, bottom are the conductive pin convex board bottom surface 40 of full wafer joint face；
2), its bottom land 10 is made to correspond to each pair of conductive pin 41 of conductive pin convex board 4 to just flip LED chips 1
Contact；
3), lead to hypereutectic mode, make the bottom land 10 of each LED chip 1, be connected to corresponding conductive pin boss
On the conductive pin 41 of plate 4, conduct it mutually；
4), the bottom gap that reflective white wall glue is poured into 1 side of LED chip and is formed with conductive pin convex board bottom surface 40,
After making reflective white wall adhesive curing, top surface and 1 light-emitting surface of LED chip are in same level；
5) it, heats, makes reflective white wall adhesive curing, become reflective white wall 2；
6) glue of fluorescent powder, i.e. phosphor gel, will be prepared, LED chip 1 and reflective white wall are uniformly poured by certain thickness
2 top surface precipitates its fluorescent powder sufficiently by the method for low-temperature heat, is completed at the same time the solidification of phosphor gel.
7), by the polishing of conductive pin convex board 4, conductive pin convex board bottom surface 40 is removed, the LED board of whole plate is obtained
Material；
8), the LED board material of whole plate is cut by the spacing set before, cuts into single LED illuminating part.
A kind of CSP LED of the reflective white wall of level, the cured solidification temperature of phosphor gel are 50--80 °C, Gu
Changing the time is 3--8 hours.
Technological progress of the invention is that structure is simple, have high luminous efficiency and especially suitable for small size, it is high-power,
The encapsulation of the LED of high reflecting rate.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is conductive pin convex board structural schematic diagram of the invention；
Fig. 3 is the structural schematic diagram that the bottom land of each LED chip of the present invention is connect with conductive pin；
Fig. 4 is the structural schematic diagram that reflective white wall glue of the invention is poured into LED chip side and bottom gap；
Fig. 5 is that phosphor gel of the present invention is uniformly poured into LED chip by certain thickness and the structure of reflective white wall glue top surface is shown
It is intended to；
Fig. 6 is the LED board material structural schematic diagram of the whole plate of the full wafer joint face of present invention removal conductive pin convex board；
Fig. 7 be the present invention by setting spacing, i.e., by the reflective white wall between two LED chips among, by the LED board material of whole plate
Cut into the cutting cable architecture schematic diagram of single LED illuminating part.
Specific embodiment
As shown in Figure 1, a kind of CSP LED of the reflective white wall of level, described in LED structure include upside-down mounting LED core
Piece 1 is set to 1 surrounding side of LED chip, and its top surface is in the reflective white wall 2 of same level with LED chip light-emitting surface, sets
Draw respectively with conduction in the fluorescent powder glue-line 3 of 1 light-emitting surface of LED chip and reflective 2 top surface of white wall, with the bottom land of LED chip 1
Foot 40 is electrically connected, and the bottom surface of the bottom surface of conductive pin 40 and reflective white wall 2 is same level.
A kind of CSP LED of the reflective white wall of level of the invention is by the way that first LED chip 1 is arranged in one whole conduction
On plate, then the processes such as etching, encapsulating, solidification, cutting are completed, and specific method includes a following step ancient attendants in charge of cart and horses for aristocrats:
1), as shown in Fig. 2, the copper sheet that will have heat transfer electric action, i.e. conductive pin convex board 4 are pressed by the method at turbid quarter
Being etched into top according to a fixed spacing is conductive pin 41 corresponding with the bottom land 10 of LED chip 1, and bottom is whole
The conductive pin convex board bottom surface 40 of piece joint face；Wherein, a fixed spacing refers to as needed, selects the thickness of reflective white wall 2,
The thickness of the reflective white wall 2 of one fixed spacing i.e. 2 times；The thickness of its bottom full wafer joint face 41, with not broken.
2), as shown in figure 3, making its bottom land 10 corresponding to every on conductive pin convex board 4 flip LED chips 1
To conductive pin 41, them is made to align contact.
3), lead to hypereutectic mode, make the bottom land 10 of each LED chip 1, be connected to corresponding conductive pin
On 41, conduct it mutually；Its connection type can also pass through the methods of conductive adhesive.
4), as shown in figure 4, by reflective white wall glue be poured into 1 side of LED chip and with conductive pin convex board bottom surface 40
In the gap that top surface is formed, after making reflective white wall adhesive curing, top surface and LED chip light-emitting surface are in same level.
Wherein reflective white wall 2 is glue-like before curing.The characteristic of the reflective white wall of the glue-like can be such as the new virtuous electricity of Dongguan City
The SCT3105 white glue of sub- Materials Technology Ltd.'s production, material property before the adhesive curing: type is modified epoxy, outside
It sees and loses 80@of@for white viscous liquid, specific gravity (25 DEG C, 1.6g/ cm3), 25 DEG C 60000 ± 10% of viscosity, solidification,
TGA,W1%<0.5.The condition of cure of the glue is 75 DEG C × 5-10min.Material property and characteristic are shear strength after the adhesive curing,
ASTM D1002, mpa14.5, solidification cubical contraction 4.3%, solidification linear shrinkage, 1.5%, hardness, ASTM D2240, body
Product resistivity .cm9.1 × 1013 IEC60093. Ω, surface resistivity, C60093. Ω, 2.0 × 1015.This step ancient attendants in charge of cart and horses for aristocrats it is noted that
The shrinking percentage of glue, so before the glue does not solidify, the height of perfusion wants high LED chip to send out in practical operation
It is consistent with the apparent height of LED chip light-emitting surface to grasp the apparent height made it after hardening for the height on smooth surface surface.It is right
In before encapsulating, for the surrounding of the LED chip arranged, surrounding injecting glue can be given in such a way that setting edge frame covers
Limitation.
5) it, heats, makes reflective white wall adhesive curing, become reflective white wall 2；
6) glue of fluorescent powder, i.e. phosphor gel, will be prepared, LED chip 1 and reflective white wall are uniformly poured by certain thickness
2 top surface precipitates its fluorescent powder sufficiently by the method for low-temperature heat, is completed at the same time the solidification of phosphor gel, forms fluorescence
3 structure of arogel.It is to make the glue equipped with fluorescent powder it being uniformly poured into LED chip 1 and reflective white wall 2 in this step ancient attendants in charge of cart and horses for aristocrats
Top surface after, low temperature, the solidification of long period, low temperature, the effect of long period are to keep the fluorescent powder in glue most
It is deposited near LED light-emitting surface, to reach best illumination effect, solidification temperature is 50--80 °C, curing time 3--8
Hour.
In the present embodiment, phosphor gel is glimmering using Zhaoqing Hao Ming organosilicon material Co., Ltd HM-6201A/B produced
Light arogel, the basic technical indicator of the glue are as follows:
(1), the description of product:
HM-6201A/B is made of A agent and B agent, belongs to 1.41 refractive index silica gel, glimmering particularly suitable for mixing in LED integration packaging
The use of light powder, it is strong with PPA, cofferdam glue and metallic support cohesive force；Reflow Soldering (260 DEG C) can be crossed, cooling thermal impact 200 can be passed through
The secondary above test, no disengaging, without dead lamp phenomenon.
(2), technical parameter:
Component: A B；
States of matter: appearance mist white liquid colourless transparent liquid before solidifying；
Viscosity: 5000cps 2000cps；
Mixed proportion: 1:1；
Mix viscosity: 3500cps；
Condition of cure: 80 DEG C/8 hours；
Appearance after solidification: transparent；
Hardness: 50A；
Refractive index: 1.41.
7), by the polishing of conductive pin convex board 4, conductive pin convex board bottom surface 40 is removed, the LED board of whole plate is obtained
Material, LED chip is in a monolith plate under the connection of reflective white wall 2 at this time；
8) it, as shown in fig. 7, the spacing set before cuts the LED board material of whole plate, is cut into single LED and is shone
Part.By the spacing set before, that is, refer to by among the reflective white wall 2 between two LED chips 1, for the LED chip 1 on most side
Side, stay the distance of enough reflective 2 width of white wall, if in Fig. 7 cutting line 5 illustrate, the LED board material of whole plate is cut into individually
LED illuminating part.
Claims (3)
1. a kind of CSP LED of the reflective white wall of level, feature in, the structure of the LED include the LED chip of upside-down mounting (1),
Set on LED chip (1) surrounding side, and its top surface is in the reflective white wall (2) of same level with LED chip light-emitting surface, sets
Fluorescent powder glue-line (3) in LED chip (1) light-emitting surface and reflective white wall (2) top surface, the pad with the bottom of LED chip (1)
(10) it is electrically connected respectively with conductive pin (41), the bottom surface of the bottom surface of conductive pin (41) and reflective white wall (2) is same level
Face.
2. a kind of CSP LED of the reflective white wall of level, feature is in the CSP LED includes a following step ancient attendants in charge of cart and horses for aristocrats:
1), the copper sheet that will there is heat transfer electric action, i.e. conductive pin convex board (4), through the method at turbid quarter, between certain
Away from, by conductive pin convex board (4) be etched into top surface be arrangement corresponding with bottom land (10) of LED chip (1) conduction
Pin (41) boss, bottom are the conductive pin convex board bottom surface (40) of full wafer joint face；
2) flip LED chips (1), are made into each pair of conductive pin of its bottom land (10) corresponding to conductive pin convex board 4
(41) to positive contact；
3), lead to hypereutectic mode, make the bottom land (10) of each LED chip (1), be connected to corresponding conductive pin
On the conductive pin (41) of convex board (4), conduct it mutually；
4), reflective white wall glue is poured between LED chip (1) side and the bottom formed with conductive pin convex board bottom surface (40)
Gap, after making reflective white wall adhesive curing, top surface and LED chip (1) light-emitting surface are in same level；
5) it, heats, makes reflective white wall adhesive curing, become reflective white wall (2)；
6) glue of fluorescent powder, i.e. phosphor gel, will be prepared, LED chip (1) and reflective white is uniformly poured by certain thickness
The top surface of wall (2) precipitates its fluorescent powder sufficiently by the method for low-temperature heat, is completed at the same time the solidification of phosphor gel；
7) conductive pin convex board (4), are used into polishing, removes conductive pin convex board bottom surface (40), obtains the LED board of whole plate
Material；
8), the LED board material of whole plate is cut by the spacing set before, cuts into single LED illuminating part.
3. a kind of CSP LED of the reflective white wall of level according to claim 2, feature is in the phosphor gel is solid
The solidification temperature of change is 50--80 °C, and curing time is 3--8 hours.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910422819.XA CN110131599A (en) | 2019-05-21 | 2019-05-21 | A kind of CSP LED of the reflective white wall of level |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910422819.XA CN110131599A (en) | 2019-05-21 | 2019-05-21 | A kind of CSP LED of the reflective white wall of level |
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| CN110131599A true CN110131599A (en) | 2019-08-16 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021212696A1 (en) * | 2020-04-25 | 2021-10-28 | Wang Dingfeng | Led glue dripping light strip, and manufacturing method therefor |
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| CN101567411A (en) * | 2009-05-26 | 2009-10-28 | 晶科电子（广州）有限公司 | Flip-chip integrated encapsulation structure of LED and method thereof |
| CN105009314A (en) * | 2013-02-27 | 2015-10-28 | 日亚化学工业株式会社 | Light emitting device, method for mounting light emitting element, and mounting device for light emitting elements |
| CN106935694A (en) * | 2017-04-20 | 2017-07-07 | 江苏稳润光电科技有限公司 | A kind of CSP LED encapsulation methods |
| CN107845717A (en) * | 2016-09-21 | 2018-03-27 | 深圳市兆驰节能照明股份有限公司 | CSP light sources and its manufacture method and manufacture mould |
| CN207165612U (en) * | 2017-08-16 | 2018-03-30 | 深圳市兆驰节能照明股份有限公司 | One side CSP LED |
| CN108682729A (en) * | 2018-05-04 | 2018-10-19 | 惠州市华瑞光源科技有限公司 | The packaging method of CSP LED and the encapsulating structure of CSP LED |
-
2019
- 2019-05-21 CN CN201910422819.XA patent/CN110131599A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101567411A (en) * | 2009-05-26 | 2009-10-28 | 晶科电子（广州）有限公司 | Flip-chip integrated encapsulation structure of LED and method thereof |
| CN105009314A (en) * | 2013-02-27 | 2015-10-28 | 日亚化学工业株式会社 | Light emitting device, method for mounting light emitting element, and mounting device for light emitting elements |
| CN107845717A (en) * | 2016-09-21 | 2018-03-27 | 深圳市兆驰节能照明股份有限公司 | CSP light sources and its manufacture method and manufacture mould |
| CN106935694A (en) * | 2017-04-20 | 2017-07-07 | 江苏稳润光电科技有限公司 | A kind of CSP LED encapsulation methods |
| CN207165612U (en) * | 2017-08-16 | 2018-03-30 | 深圳市兆驰节能照明股份有限公司 | One side CSP LED |
| CN108682729A (en) * | 2018-05-04 | 2018-10-19 | 惠州市华瑞光源科技有限公司 | The packaging method of CSP LED and the encapsulating structure of CSP LED |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021212696A1 (en) * | 2020-04-25 | 2021-10-28 | Wang Dingfeng | Led glue dripping light strip, and manufacturing method therefor |
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Application publication date: 20190816 |