CN110112650B - 一种高功率半导体芯片及其制备方法 - Google Patents
一种高功率半导体芯片及其制备方法 Download PDFInfo
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- CN110112650B CN110112650B CN201910395812.3A CN201910395812A CN110112650B CN 110112650 B CN110112650 B CN 110112650B CN 201910395812 A CN201910395812 A CN 201910395812A CN 110112650 B CN110112650 B CN 110112650B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 37
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 238000002955 isolation Methods 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 230000003287 optical effect Effects 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 239000010410 layer Substances 0.000 claims description 120
- 238000002347 injection Methods 0.000 claims description 12
- 239000007924 injection Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 230000005855 radiation Effects 0.000 claims description 7
- 239000011247 coating layer Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 230000000750 progressive effect Effects 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 11
- 230000002401 inhibitory effect Effects 0.000 abstract description 10
- 230000010355 oscillation Effects 0.000 abstract description 9
- 230000000737 periodic effect Effects 0.000 abstract description 7
- 239000000463 material Substances 0.000 description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
- H01S5/1206—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers having a non constant or multiplicity of periods
- H01S5/1215—Multiplicity of periods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
- H01S5/1225—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers with a varying coupling constant along the optical axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
- H01S5/1237—Lateral grating, i.e. grating only adjacent ridge or mesa
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
- H01S5/2018—Optical confinement, e.g. absorbing-, reflecting- or waveguide-layers
- H01S5/2027—Reflecting region or layer, parallel to the active layer, e.g. to modify propagation of the mode in the laser or to influence transverse modes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/16—Semiconductor lasers with special structural design to influence the modes, e.g. specific multimode
- H01S2301/166—Single transverse or lateral mode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0287—Facet reflectivity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
- H01S5/1231—Grating growth or overgrowth details
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910395812.3A CN110112650B (zh) | 2019-05-13 | 2019-05-13 | 一种高功率半导体芯片及其制备方法 |
| JP2021546860A JP7223866B2 (ja) | 2019-05-13 | 2019-10-12 | ハイパワー半導体チップ及びその製造方法 |
| US17/426,463 US20220166190A1 (en) | 2019-05-13 | 2019-10-12 | High-power semiconductor chip and preparation method therefor |
| PCT/CN2019/110897 WO2020228233A1 (zh) | 2019-05-13 | 2019-10-12 | 一种高功率半导体芯片及其制备方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910395812.3A CN110112650B (zh) | 2019-05-13 | 2019-05-13 | 一种高功率半导体芯片及其制备方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110112650A CN110112650A (zh) | 2019-08-09 |
| CN110112650B true CN110112650B (zh) | 2020-06-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910395812.3A Active CN110112650B (zh) | 2019-05-13 | 2019-05-13 | 一种高功率半导体芯片及其制备方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20220166190A1 (https=) |
| JP (1) | JP7223866B2 (https=) |
| CN (1) | CN110112650B (https=) |
| WO (1) | WO2020228233A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110112650B (zh) * | 2019-05-13 | 2020-06-02 | 苏州长光华芯半导体激光创新研究院有限公司 | 一种高功率半导体芯片及其制备方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2203891A (en) * | 1987-04-21 | 1988-10-26 | Plessey Co Plc | Semiconductor diode laser array |
| KR100674836B1 (ko) * | 2005-02-28 | 2007-01-26 | 삼성전기주식회사 | 고출력 단일모드 반도체 레이저소자 및 그 제조방법 |
| JP2007243019A (ja) * | 2006-03-10 | 2007-09-20 | Fujitsu Ltd | 光半導体素子 |
| JP4312239B2 (ja) * | 2007-02-16 | 2009-08-12 | 富士通株式会社 | 光素子及びその製造方法 |
| JP2009194290A (ja) * | 2008-02-18 | 2009-08-27 | Nippon Telegr & Teleph Corp <Ntt> | 半導体レーザの作製方法及び半導体レーザ |
| JP2010034408A (ja) * | 2008-07-30 | 2010-02-12 | Sony Corp | 半導体発光素子 |
| CN101908715A (zh) * | 2010-08-03 | 2010-12-08 | 中国科学院长春光学精密机械与物理研究所 | 利用光栅实现锁相的半导体激光器 |
| CN102142657B (zh) * | 2011-03-02 | 2012-12-12 | 中国科学院半导体研究所 | 用于改善条形激光器侧向远场的光子晶体波导的制作方法 |
| CN104917052B (zh) * | 2015-07-06 | 2017-10-24 | 中国科学院半导体研究所 | 变周期倾斜光栅激光器及制备方法 |
| KR102475891B1 (ko) * | 2015-10-08 | 2022-12-12 | 삼성전자주식회사 | 측면 발광 레이저 광원, 및 이를 포함한 3차원 영상 획득 장치 |
| CN105914580B (zh) * | 2016-07-07 | 2019-01-29 | 北京工业大学 | 具有侧向光栅和纵向布喇格反射镜结构的半导体激光器 |
| CN110112650B (zh) * | 2019-05-13 | 2020-06-02 | 苏州长光华芯半导体激光创新研究院有限公司 | 一种高功率半导体芯片及其制备方法 |
-
2019
- 2019-05-13 CN CN201910395812.3A patent/CN110112650B/zh active Active
- 2019-10-12 WO PCT/CN2019/110897 patent/WO2020228233A1/zh not_active Ceased
- 2019-10-12 US US17/426,463 patent/US20220166190A1/en not_active Abandoned
- 2019-10-12 JP JP2021546860A patent/JP7223866B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020228233A1 (zh) | 2020-11-19 |
| US20220166190A1 (en) | 2022-05-26 |
| JP2022521688A (ja) | 2022-04-12 |
| JP7223866B2 (ja) | 2023-02-16 |
| CN110112650A (zh) | 2019-08-09 |
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Address after: 215011 Building 2, No. 189, Kunlunshan Road, high tech Zone, Suzhou City, Jiangsu Province Patentee after: SUZHOU EVERBRIGHT SEMICONDUCTOR LASER INNOVATION RESEARCH INSTITUTE Co.,Ltd. Patentee after: Suzhou Changguang Huaxin Optoelectronic Technology Co.,Ltd. Address before: 215011 Building 2, No. 189, Kunlunshan Road, high tech Zone, Suzhou City, Jiangsu Province Patentee before: SUZHOU EVERBRIGHT SEMICONDUCTOR LASER INNOVATION RESEARCH INSTITUTE Co.,Ltd. Patentee before: SUZHOU EVERBRIGHT PHOTONICS TECHNOLOGY Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |