CN110110405B - Method and device for reducing power supply voltage difference of energy consumption chip through PCB wiring - Google Patents
Method and device for reducing power supply voltage difference of energy consumption chip through PCB wiring Download PDFInfo
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- CN110110405B CN110110405B CN201910332170.2A CN201910332170A CN110110405B CN 110110405 B CN110110405 B CN 110110405B CN 201910332170 A CN201910332170 A CN 201910332170A CN 110110405 B CN110110405 B CN 110110405B
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- 238000000034 method Methods 0.000 title claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 92
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- 239000010949 copper Substances 0.000 claims abstract description 92
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Abstract
The invention provides a method for reducing power supply voltage difference of an energy consumption chip by PCB wiring in order to solve the problems in the prior art, which comprises the following steps: connecting a power output end of the power chip to a first end of the energy consumption chip through a first copper sheet, wherein the first copper sheet is used for supplying power to the energy consumption chip; the power output end of the power chip is connected to the second end of the energy consumption chip through the second copper sheet, wherein the second copper sheet is used for reducing the power supply voltage difference of the energy consumption chip, the copper sheet occupying a large area is not needed, and only a proper wiring layer is needed to be found, and the copper sheet can be pulled from the source end of the power supply to the far end of the chip; the instability caused by the influence of the copper-paved tail end of the power chip on the feedback line can be reduced as much as possible, and the stability of the system is effectively improved.
Description
Technical Field
The invention relates to the field of PCB system design, in particular to a method and a device for reducing power supply voltage difference of an energy consumption chip by PCB wiring.
Background
With the continuous development of electronic information technology, more and more chips are used, and the chips are larger and larger, the design time is longer and longer, the design of the PCB is an important part of the function realization and performance stability of the whole product, which makes hardware engineers and PCB engineers feel the most troublesome that in the Layout process, the use of large-current and low-voltage power chips occurs, for example: the CPU of X86, the CPU of openpower, and the CORE power supply of the switching chip of Broadcom corporation are large current and low voltage, and it is very difficult for engineers to reduce the voltage difference of the chip power supply.
The existing technical schemes for reducing the differential pressure generally have two types, one is that the current of a power supply can be increased by increasing the copper-laying area of the power supply, and the problem brought by increasing the copper sheet area of the power supply is that the power supply occupies other wiring positions, so that wiring is very difficult, and the differential pressure of the power supply is not improved possibly;
another way is to increase the current of the power supply by using remote feedback of the power supply, but the problem with using remote feedback is that it is possible to increase the current of the power supply by increasing the voltage value output by the power supply output terminal of the power supply, if the power supply chip is distributed around the energy consumption chip, the power supply PIN close to the power supply output end of the power supply can meet the requirement, but the other side of the energy consumption chip opposite to the energy consumption chip still has a voltage difference which does not meet the requirement, and the output voltage of the power supply output end of the power supply chip can not be increased all the time, because if the voltage value of the power supply output end of the power supply chip is increased all the time, the tail end of the energy consumption chip meets the condition that the side close to the power supply output end of the power supply chip possibly exceeds the normal voltage range a lot, so that the power supply cannot be well balanced, and far-end feedback which is too dependent on a power supply may bring instability to the power supply output of the power supply chip, because the copper-laid end of the power supply chip may cause interference to the feedback line.
Disclosure of Invention
The invention aims to solve the problems in the prior art, innovatively provides a method and a device for reducing the power supply voltage difference of an energy consumption chip through PCB wiring, effectively solves the problem that the voltage difference at the farthest end of the energy consumption chip is large due to large area and large current consumption of the energy consumption chip and low power supply voltage, and effectively improves the stability of a system.
The invention provides a method for reducing power supply voltage difference of an energy-consuming chip by PCB wiring, which comprises the following steps:
connecting a power output end of the power supply chip to a first end of the energy consumption chip through a first copper sheet, wherein the first copper sheet is used for supplying power to the energy consumption chip;
and connecting the power output end of the power supply chip to the second end of the energy consumption chip through a second copper sheet, wherein the second copper sheet is used for reducing the power supply voltage difference of the energy consumption chip.
With reference to the first aspect, in a first possible implementation manner of the first aspect, the first copper sheet is located on a first power layer of the PCB, and the first power layer is any one of the power layers of the PCB.
With reference to the first aspect, in a second possible implementation manner of the first aspect, a thickness of the first copper sheet is the same as a thickness of the first power layer.
With reference to the first aspect, in a third possible implementation manner of the first aspect, the width of the first copper sheet is obtained by a PCB Trace Calculator.
With reference to the first aspect, in a fourth possible implementation manner of the first aspect, the second copper sheet is located on any one of a second power layer, a signal layer, a TOP layer, and a BOTTOM layer of the PCB, where the second power layer is any one of the power layers of the PCB except the first power layer.
With reference to the first aspect, in a fifth possible implementation manner of the first aspect, the thickness of the second copper sheet is the same as that of the layer where the second copper sheet is located.
With reference to the first aspect, in a sixth possible implementation manner of the first aspect, the width of the second copper sheet is obtained by a PCB Trace Calculator.
With reference to the first aspect, in a seventh possible implementation manner of the first aspect, the method further includes: and the feedback end of the power supply chip is connected with the geometric center part of the energy consumption chip through a third copper sheet.
The invention provides a device for reducing power supply voltage difference of an energy consumption chip in PCB wiring, which is characterized by comprising:
the first connecting module is used for connecting the power output end of the power chip to the first end of the energy consumption chip through a first copper sheet, wherein the first copper sheet is used for supplying power to the energy consumption chip;
and the second connecting module is used for connecting the power output end of the power chip to the second end of the energy consumption chip through a second copper sheet, wherein the second copper sheet is used for reducing the power voltage difference of the energy consumption chip.
With reference to the second aspect, in a first possible implementation manner of the second aspect, the apparatus further includes: and the feedback end of the power supply chip is connected with the geometric center part of the energy consumption chip through a third copper sheet.
The technical scheme adopted by the invention comprises the following technical effects:
1. according to the invention, a large area of copper sheet is not required to be occupied, only a proper wiring layer is required to be found, and the copper sheet can be pulled from the source end of the power supply to the far end of the energy consumption chip, so that more wiring layers are not occupied, the power supply layer can be used for laying the copper sheet for other power supplies, and the problem of large voltage difference at the far end of the chip caused by large area, large consumption current and low power supply voltage of the energy consumption chip is effectively solved.
2. The voltage difference of the farthest side of the energy consumption chip from the power supply output end of the power supply can be reduced, and the condition that the voltage of the energy consumption chip close to the power supply chip exceeds the upper limit of the required range of the power supply of the energy consumption chip and the other side of the energy consumption chip does not reach the lower limit of the required range due to the fact that the output of the power supply is adjusted can be avoided.
3. The influence of the copper-paved tail end of the power chip on the feedback line is prevented from causing instability as much as possible without excessively relying on the feedback line to adjust the power voltage, and the stability of the system is effectively improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without any creative effort.
FIG. 1 is a schematic flow chart illustrating a method for reducing power supply voltage difference of an energy-consuming chip by PCB wiring according to an embodiment of the present invention;
fig. 2 is a schematic flowchart of a method for reducing power supply voltage difference of an energy consumption chip by PCB wiring according to a second embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a device for reducing power supply voltage difference of an energy-consuming chip in PCB wiring according to a third embodiment of the present invention;
fig. 4 is a schematic structural diagram of a device for reducing power supply voltage difference of an energy consuming chip through PCB wiring according to a fourth embodiment of the present invention.
Detailed Description
In order to clearly explain the technical features of the present invention, the following detailed description of the present invention is provided with reference to the accompanying drawings. The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. It should be noted that the components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and procedures are omitted so as to not unnecessarily limit the invention.
Example one
As shown in fig. 1, the present invention provides a method for reducing power supply voltage difference of an energy consuming chip by PCB wiring, comprising the following steps:
s1, connecting a power output end of the power chip to a first end of the energy consumption chip through a first copper sheet, wherein the first copper sheet is used for supplying power to the energy consumption chip;
and S2, connecting the power output end of the power supply chip to the second end of the energy consumption chip through a second copper sheet, wherein the second copper sheet is used for reducing the power supply voltage difference of the energy consumption chip.
In step S1, the first copper sheet is located on a first power plane of the PCB, and the first power plane is any one of the power planes of the PCB. The thickness of the first copper sheet is the same as that of the first power supply layer, and the width of the first copper sheet is obtained by a PCB TraceCalculator which is a PCB current calculating tool. The specific internal layered structure of the PCB is shown in the following table:
for example, the first power layer is the L5 layer in the power layer of the PCB board. The thickness of the first copper sheet is the same as that of the L5 layer of the first power supply layer, namely 2OZ, the width of the first copper sheet is obtained by a PCB Trace Calculator, the Max.Temp.Rise is set to be 20 ℃, the corresponding copper thickness of 2OZ is selected, the maximum current of the energy consumption chip is input, the width of the first copper sheet can be calculated to be 30mm, the current condition required by the energy consumption chip is met according to the actual current of the power supply chip, and the power supply PIN of the energy consumption chip is distributed on the left side and the right side of the energy consumption chip, and the power supply chip is arranged on the right side (left) of the energy consumption chip, so that the pressure difference can appear on the left side (right) of the energy consumption chip. The first end of the energy consumption chip is the end close to the power supply chip, and in order to meet the requirement of the energy consumption chip, some copper sheets are additionally added to meet the problem of pressure difference.
In step S2, the second copper sheet is located on any one of a second power layer, a signal layer, a TOP layer and a BOTTOM layer of the PCB, wherein the second power layer is any one of the power layers of the PCB except the first power layer. The thickness of the second copper sheet is the same as that of the second power supply layer, and the width of the second copper sheet is obtained by a PCB TraceCalculator which is a PCB current calculation tool. For example, the first power layer is the L5 layer in the power layer of the PCB board. The thickness of the first copper sheet is the same as that of the first power supply layer L5 layer, namely 2OZ, the width of the first copper sheet is 30mm, and the thickness of the second copper sheet is the same as that of the layer where the second copper sheet is located. For example, the second copper sheet is located on the layer L11, the thickness of the second copper sheet is 2OZ, the width of the second copper sheet is obtained by a PCB Trace Calculator, the Max.Temp.Rise is set to 20 ℃, the corresponding copper thickness of 2OZ is selected, the maximum current of the energy consumption chip is input, the width of the second copper sheet can be calculated to be 2mm, the adjustment can be carried out according to the actual current of the energy consumption chip and other conditions in actual conditions, and the second end of the energy consumption chip is one end far away from the power supply chip.
The second copper sheet is positioned on any one of a second power layer, a signal layer, a TOP layer and a BOTTOM layer of the PCB, wherein the second power layer is any one of the power layers of the PCB except the first power layer, and the second power layer is mainly used for preventing current from flowing through a via hole closest to the power chip and converging with the first copper sheet because the current can find a path with the minimum impedance, so that the effect of providing current for the tail end cannot be achieved, and the tail end of the energy consumption chip can be connected with the first copper sheet only by the tail end of the energy consumption chip.
The second copper sheet is mainly used for meeting the voltage difference of power supply voltage at the tail end of the energy consumption chip, the part does not need to carry too much copper sheet, the part does not need to bear too much current, the part cannot be used for supplying power to the PIN of the energy consumption chip on the path in the whole wiring process, and only can be pulled to the tail end of the energy consumption chip, so that the problem that the current is terminated when the current does not reach the tail end of the energy consumption chip can be avoided. The input value of the power supply chip is adjusted to be within the satisfying condition range of the power supply voltage of the energy consumption chip, so that the requirements of the power supply voltage at the near end and the far end of the energy consumption chip can be met, the range of the requirements of the energy consumption chip cannot be exceeded, on one hand, a large area of copper sheet is not required to be occupied, and only a proper routing layer is required to be found, the copper sheet can be pulled from the source end of the power supply to the far end of the chip, so that more routing layers cannot be occupied, the power supply layer can also be used for laying the copper sheet for other power supplies, and the problem that the voltage difference at the far end of the chip is large due to large chip area, large consumption current and low power supply voltage is effectively solved; on the other hand, the voltage difference of the farthest side of the energy consumption chip from the power supply output end of the power supply can be reduced, and the condition that the voltage of the energy consumption chip close to the power supply chip exceeds the upper limit of the required range of the power supply of the energy consumption chip and the other side of the energy consumption chip does not reach the lower limit of the required range due to the fact that the output of the power supply is adjusted can be avoided.
Example two
As shown in fig. 1, the present invention provides a method for reducing power supply voltage difference of an energy consuming chip by PCB wiring, comprising the following steps:
s1, connecting a power output end of the power supply chip to a first end of the energy consumption chip through a first copper sheet, wherein the first copper sheet is used for supplying power to the energy consumption chip;
s2, connecting the power output end of the power chip to the second end of the energy consumption chip through a second copper sheet, wherein the second copper sheet is used for reducing the power pressure difference of the energy consumption chip;
and S3, connecting the feedback end of the power supply chip with the geometric center part of the energy consumption chip through a third copper sheet.
In step S3, the feedback line of the power chip is not wired to the farthest end of the power supply copper, and is connected to the geometric center of the energy consuming chip through the third copper sheet, so that the feedback line is not excessively relied on to adjust the power voltage, and the instability caused by the influence of the copper-laid end of the power chip on the feedback line can be reduced as much as possible, thereby effectively improving the stability of the system.
EXAMPLE III
As shown in fig. 3, the technical solution of the present invention further provides a device for reducing power supply voltage difference of an energy consuming chip by PCB wiring, including:
the first connecting module 101 is used for connecting a power output end of the power chip to a first end of the energy consumption chip through a first copper sheet, wherein the first copper sheet is used for supplying power to the energy consumption chip;
and the second connection module 102 is used for connecting the power output end of the power supply chip to the second end of the energy consumption chip through a second copper sheet, wherein the second copper sheet is used for reducing the power supply voltage difference of the energy consumption chip.
Example four
As shown in fig. 4, the technical solution of the present invention further provides a device for reducing power supply voltage difference of an energy consuming chip by PCB wiring, including:
the first connecting module 101 is used for connecting a power output end of the power chip to a first end of the energy consumption chip through a first copper sheet, wherein the first copper sheet is used for supplying power to the energy consumption chip;
the second connection module 102 is used for connecting the power output end of the power supply chip to the second end of the energy consumption chip through a second copper sheet, wherein the second copper sheet is used for reducing the power supply voltage difference of the energy consumption chip;
and the feedback end of the power supply chip is connected with the geometric center part of the energy consumption chip through a third copper sheet by a third connection module 103.
In order to verify the correctness of the method for reducing the power supply voltage difference of the energy consumption chip by wiring in the technical scheme of the invention, power supply simulation can be carried out, the second copper sheet is removed, power supply voltage difference simulation is carried out, and the second copper sheet is used for carrying out power supply voltage difference simulation, so that verification can be carried out.
The technical scheme of the invention mainly reduces the voltage difference of the power supply voltage by using the energy consumption chip with large area, large current and low power supply voltage, and has certain reference significance for other chips or single boards.
Although the embodiments of the present invention have been described with reference to the accompanying drawings, it is not intended to limit the scope of the invention, and it should be understood by those skilled in the art that various modifications and variations can be made without inventive changes in the technical solutions of the present invention.
Claims (6)
1. A method for reducing power supply voltage difference of an energy consumption chip by PCB wiring is characterized by comprising the following steps:
connecting a power output end of a power supply chip to a first end of an energy consumption chip through a first copper sheet, wherein the first copper sheet is used for supplying power to the energy consumption chip and is positioned on a first power supply layer of the PCB, and the first power supply layer is any one of the power supply layers of the PCB; the first end of the energy consumption chip is one end close to the power supply chip;
connecting a power output end of the power chip to a second end of the energy consumption chip through a second copper sheet, wherein the second copper sheet is used for reducing power supply voltage difference of the energy consumption chip and is positioned on any one of a second power layer, a signal layer, a TOP layer and a BOTTOM layer of the PCB, and the second power layer is any one of the power layers of the PCB except the first power layer; the second end of the energy consumption chip is one end far away from the power supply chip;
and the feedback end of the power supply chip is connected with the geometric center part of the energy consumption chip through a third copper sheet.
2. The method for reducing power supply voltage difference of the energy-consuming chip by PCB wiring according to claim 1, wherein the thickness of the first copper sheet is the same as that of the first power layer.
3. The method for reducing power supply voltage difference of the energy consumption chip through the PCB wiring according to claim 1, wherein the width of the first copper sheet is obtained by a PCB Trace Calculator.
4. The method for reducing power supply voltage difference of an energy-consuming chip through PCB wiring according to claim 1, wherein the thickness of the second copper sheet is the same as the thickness of a layer on which the second copper sheet is arranged.
5. The method for reducing power supply voltage difference of the energy-consuming chip through PCB wiring according to claim 1, wherein the width of the second copper sheet is obtained by a PCB Trace Calculator.
6. The utility model provides a PCB wiring reduces device of power consumption chip power pressure differential which characterized by includes:
the first connecting module is used for connecting the power output end of the power supply chip to the first end of the energy consumption chip through a first copper sheet, wherein the first copper sheet is used for supplying power for the energy consumption chip and is positioned on a first power supply layer of the PCB, and the first power supply layer is any one layer of the power supply layers of the PCB; the first end of the energy consumption chip is one end close to the power supply chip;
the second connecting module is used for connecting the power output end of the power supply chip to the second end of the energy consumption chip through a second copper sheet, wherein the second copper sheet is used for reducing the power supply voltage difference of the energy consumption chip and is positioned on any one of a second power supply layer, a signal layer, a TOP layer and a BOTTOM layer of the PCB, and the second power supply layer is any one of the power supply layers of the PCB except the first power supply layer; the second end of the energy consumption chip is one end far away from the power supply chip;
and the feedback end of the power supply chip is connected with the geometric center part of the energy consumption chip through a third copper sheet.
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| CN201910332170.2A CN110110405B (en) | 2019-04-24 | 2019-04-24 | Method and device for reducing power supply voltage difference of energy consumption chip through PCB wiring |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103650136A (en) * | 2012-05-10 | 2014-03-19 | 松下电器产业株式会社 | Three-dimensional integrated circuit having stabilization structure for power supply voltage, and method for manufacturing same |
| CN108874021A (en) * | 2018-09-04 | 2018-11-23 | 广东小天才科技有限公司 | A kind of dynamics compensation circuits of line drop |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103650136A (en) * | 2012-05-10 | 2014-03-19 | 松下电器产业株式会社 | Three-dimensional integrated circuit having stabilization structure for power supply voltage, and method for manufacturing same |
| CN108874021A (en) * | 2018-09-04 | 2018-11-23 | 广东小天才科技有限公司 | A kind of dynamics compensation circuits of line drop |
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