CN110078963A - 导热抗菌抗指纹盖板及其制备方法 - Google Patents

导热抗菌抗指纹盖板及其制备方法 Download PDF

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CN110078963A
CN110078963A CN201910393133.2A CN201910393133A CN110078963A CN 110078963 A CN110078963 A CN 110078963A CN 201910393133 A CN201910393133 A CN 201910393133A CN 110078963 A CN110078963 A CN 110078963A
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陈小霞
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Everything Industrial Co ltd
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Abstract

本发明公开了一种导热抗菌抗指纹盖板及其制备方法，该盖板包括盖板本体，所述盖板本体的外侧涂覆有抗菌抗指纹涂层，内侧涂覆有导热涂层。本发明既能抗菌抗指纹，又能导热，解决了现有技术中的电子产品盖板功能单一，影响产品散热及外观，用户体验不佳的技术问题，提升了用户体验。

Description

导热抗菌抗指纹盖板及其制备方法
技术领域
本发明涉及电子产品盖板技术领域，尤其涉及一种导热抗菌抗指纹盖板及其制备方法。
背景技术
目前，市场上的电子产品，如手机、平板等的后盖都没有做导热涂层，也没有做抗菌抗指纹处理，或者有些只有抗指纹功能，功能性单一，影响产品散热及外观，用户体验不佳。
发明内容
本发明的主要目的在于提出一种导热抗菌抗指纹盖板及其制备方法，旨在解决现有技术中的电子产品盖板功能单一，影响产品散热及外观，用户体验不佳的技术问题。
为实现上述目的，本发明提出一种导热抗菌抗指纹盖板，包括盖板本体，所述盖板本体的外侧涂覆有抗菌抗指纹涂层，内侧涂覆有导热涂层。
本发明的进一步的技术方案是，所述抗菌抗指纹涂层包括丙烯酸系共聚物、氟类助剂、以及银离子化合物。
本发明的进一步的技术方案是，所述导热涂层的填料为粘接树脂，以及金属氧化物、和/或氮化物。
本发明的进一步的技术方案是，所述粘接树脂为聚氨酯，或者环氧树脂，或者硅树脂中的一种。
本发明的进一步的技术方案是，所述金属氧化物为氧化铝，或者氧化锌中的一种。
本发明的进一步的技术方案是，所述氮化物为氮化铝，或者氮化硼中的一种。
本发明的进一步的技术方案是，所述盖板本体为塑料板、或玻璃板、或陶瓷板。
本发明的进一步的技术方案是，所述抗菌抗指纹涂层的涂层水滴角大于或等于110°，二碘甲烷角度大于或等于85°，铅笔硬度大于或等于4H；所述导热涂层的厚度为1-5um，导热系大于或等于2W/K。
为实现上述目的，本发明还提出一种导热抗菌抗指纹盖板的制备方法，所述方法应用于如上所述的导热抗菌抗指纹盖板，所述方法包括以下步骤：
在盖板本体外侧涂覆抗菌抗指纹涂层；
在盖板本体内侧涂覆导热涂层。
本发明的进一步的技术方案是，所述抗菌抗指纹涂层包括丙烯酸系共聚物、氟类助剂、以及银离子化合物，所述导热涂层的填料为粘接树脂，以及金属氧化物、和/或氮化物；
所述在盖板本体外侧涂覆抗菌抗指纹涂层的步骤包括：
对盖板本体外侧进行等离子清洗；
将所述丙烯酸系共聚物、氟类助剂、以及银离子化合物混合，涂覆在清洗后的盖板本体外侧；
将涂覆有丙烯酸系共聚物、氟类助剂、以及银离子化合物混合的盖板本体放入烘箱烘干，其中，烘干温度在55-65℃，烘干时间为1-3min；
将烘干后的盖板本体通过UV紫外固化，其中，固化时间为3-5min；
所述在盖板本体内侧涂覆导热涂层的步骤包括：
对盖板本体内侧进行等离子清洗；
将所述粘接树脂，以及金属氧化物、和/或氮化物混合，涂覆在清洗后的盖板本体内侧；
将涂覆有粘接树脂，以及金属氧化物、和/或氮化物的盖板本体放入烘箱烘干，其中，烘干温度在80-120℃，烘干时间为5-10min。
本发明的有益效果是：本发明通过上述技术方案，在盖板本体的外侧涂覆抗菌抗指纹涂层，在盖板本体的内侧涂覆导热涂层，既能抗菌抗指纹，又能导热，解决了现有技术中的电子产品盖板功能单一，影响产品散热及外观，用户体验不佳的技术问题，提升了用户体验。
附图说明
图1是本发明导热抗菌抗指纹盖板较佳实施例的结构示意图。
具体实施方式
应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
考虑到目前的电子产品的后盖都没有做导热涂层，也没有做抗菌抗指纹处理，或者有些只有抗指纹功能，功能性单一，影响产品散热及外观，用户体验不佳。由此，本发明提出一种导热抗菌抗指纹盖板及其制备方法。
具体的，请参照图1，图1是本发明导热抗菌抗指纹盖板较佳实施例的结构示意图。
如图1所示，本实施例提出的导热抗菌抗指纹盖板包括盖板本体，所述盖板本体的外侧涂覆有抗菌抗指纹涂层，内侧涂覆有导热涂层。
该导热涂层能将电子产品产生的热量散发出去，降低产品温度，提高产品寿命。抗菌抗指纹涂层，杀菌耐脏，能提高电子产品的美观度，提升用户体验。
其中，所述抗菌抗指纹涂层包括丙烯酸系共聚物、氟类助剂、以及银离子化合物。
可以理解的是，所述丙烯酸系共聚物具有成膜作用，所述氟类助剂具有抗指纹作用，所述银离子化合物具有抗菌作用。本实施例将氟类助剂与银离子化合物相混合，使得所述盖板本体在具备抗指纹作用的同时，还具备有抗菌作用，从而提升用户体验。
进一步的，作为一种实施方式，所述导热涂层的填料为粘接树脂，以及金属氧化物、和/或氮化物。
其中，所述粘接树脂可以采用聚氨酯，或者环氧树脂，或者硅树脂中的一种。
所述金属氧化物可以采用氧化铝，或者氧化锌中的一种。
所述氮化物可以采用氮化铝，或者氮化硼中的一种。
更进一步的，本实施例中，所述盖板本体为塑料板、或玻璃板、或陶瓷板。
本实施例中，所述抗菌抗指纹涂层的涂层水滴角大于或等于110°，二碘甲烷角度大于或等于85°，铅笔硬度大于或等于4H；所述导热涂层的厚度为1-5um，例如1um、或者3um、或者5um，导热系大于或等于2W/K。
需要说明的是，水滴角的定义为在固、液、气三相交界面处，气-液相界面与固-液相界面之间的夹角，水滴角是显示固体表面湿度的尺度，利用大部分固着物液滴进行测定，低接触角表示湿度高(亲水性)表面易粘贴。高接触水滴角表示表面显示疏水性，表面有机污染较重或表面附着力差。与平坦的固体表面像接触的液体的接触角，通过液体-固体-气体接合点中水珠曲线的终点和固体表面的接触点测定出来分析表面洁净度，接触角是显示固体表面湿度的尺度，利用大部分固着物液滴进行测定，低接触角表示湿度高(亲水性、疏水性)，表面能量低。
二碘甲烷角度为油性角，即将上述水滴角中的水换成二碘甲烷。
铅笔硬度为通过铅笔(硬度为6B、5B、4B、3B、2B、B、HB、F、H、2H、3H、4H、5H、6H、7H、8H、9H等级)在盖板表面划痕，以判断盖板硬度等级。
本发明导热抗菌抗指纹盖板的有益效果是：本发明通过上述技术方案，在盖板本体的外侧涂覆抗菌抗指纹涂层，在盖板本体的内侧涂覆导热涂层，既能抗菌抗指纹，又能导热，解决了现有技术中的电子产品盖板功能单一，影响产品散热及外观，用户体验不佳的技术问题，提升了用户体验。
对应的，为解决上述技术问题，本发明还提出一种导热抗菌抗指纹盖板的制备方法，所述方法应用于如上实施例所述的导热抗菌抗指纹盖板，所述方法包括以下步骤：
步骤S10，在盖板本体外侧涂覆抗菌抗指纹涂层。
步骤S20，在盖板本体内侧涂覆导热涂层。
具体的，所述抗菌抗指纹涂层包括丙烯酸系共聚物、氟类助剂、以及银离子化合物，所述导热涂层的填料为粘接树脂，以及金属氧化物、和/或氮化物。
上述步骤S10，在盖板本体外侧涂覆抗菌抗指纹涂层的步骤包括：
步骤S101，对盖板本体外侧进行等离子清洗。
步骤S102，将所述丙烯酸系共聚物、氟类助剂、以及银离子化合物混合，涂覆在清洗后的盖板本体外侧。
其中，涂覆方式可以为喷涂、浸涂、或者淋涂。
步骤S103，将涂覆有丙烯酸系共聚物、氟类助剂、以及银离子化合物混合的盖板本体放入烘箱烘干，其中，烘干温度在55-65℃，烘干时间为1-3min。
其中，烘干温度例如可以为55℃、或者60℃、或者65℃，烘干时间例如可以为1min、或者2min、或者3min。
步骤S104，将烘干后的盖板本体通过UV紫外固化，其中，固化时间为3-5min。
其中，所述固化时间例如可以为3min、或者4min、或者5min。
上述步骤S20，在盖板本体内侧涂覆导热涂层的步骤包括：
S201，对盖板本体内侧进行等离子清洗；
S202，将所述粘接树脂，以及金属氧化物、和/或氮化物混合，涂覆在清洗后的盖板本体内侧；
S203，将涂覆有粘接树脂，以及金属氧化物、和/或氮化物的盖板本体放入烘箱烘干，其中，烘干温度在80-120℃，烘干时间为5-10min。
其中，所述烘干温度例如可以为80℃、或者100℃、或者120℃，所述烘干时间例如可以为5min、或者7.5min、或者10min。
本发明导热抗菌抗指纹盖板方法的有益效果是：本发明通过上述技术方案，在盖板本体的外侧涂覆抗菌抗指纹涂层，在盖板本体的内侧涂覆导热涂层，既能抗菌抗指纹，又能导热，解决了现有技术中的电子产品盖板功能单一，影响产品散热及外观，用户体验不佳的技术问题，提升了用户体验。
以上仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (10)

1.一种导热抗菌抗指纹盖板，其特征在于，包括盖板本体，所述盖板本体的外侧涂覆有抗菌抗指纹涂层，内侧涂覆有导热涂层。
2.根据权利要求1所述的导热抗菌抗指纹盖板，其特征在于，所述抗菌抗指纹涂层包括丙烯酸系共聚物、氟类助剂、以及银离子化合物。
3.根据权利要求2所述的导热抗菌抗指纹盖板，其特征在于，所述导热涂层的填料为粘接树脂，以及金属氧化物、和/或氮化物。
4.根据权利要求3所述的导热抗菌抗指纹盖板，其特征在于，所述粘接树脂为聚氨酯，或者环氧树脂，或者硅树脂中的一种。
5.根据权利要求3所述的导热抗菌抗指纹盖板，其特征在于，所述金属氧化物为氧化铝，或者氧化锌中的一种。
6.根据权利要求3所述的导热抗菌抗指纹盖板，其特征在于，所述氮化物为氮化铝，或者氮化硼中的一种。
7.根据权利要求1所述的导热抗菌抗指纹盖板，其特征在于，所述盖板本体为塑料板、或玻璃板、或陶瓷板。
8.根据权利要求1所述的导热抗菌抗指纹盖板，其特征在于，所述抗菌抗指纹涂层的涂层水滴角大于或等于110°，二碘甲烷角度大于或等于85°，铅笔硬度大于或等于4H；所述导热涂层的厚度为1-5um，导热系大于或等于2W/K。
9.一种导热抗菌抗指纹盖板的制备方法，其特征在于，所述方法应用于如权利要求3所述的导热抗菌抗指纹盖板，所述方法包括以下步骤：
在盖板本体外侧涂覆抗菌抗指纹涂层；
在盖板本体内侧涂覆导热涂层。
10.根据权利要求9所述的导热抗菌抗指纹盖板的制备方法，其特征在于，所述抗菌抗指纹涂层包括丙烯酸系共聚物、氟类助剂、以及银离子化合物，所述导热涂层的填料为粘接树脂，以及金属氧化物、和/或氮化物；
所述在盖板本体外侧涂覆抗菌抗指纹涂层的步骤包括：
对盖板本体外侧进行等离子清洗；
将所述丙烯酸系共聚物、氟类助剂、以及银离子化合物混合，涂覆在清洗后的盖板本体外侧；
将涂覆有丙烯酸系共聚物、氟类助剂、以及银离子化合物混合的盖板本体放入烘箱烘干，其中，烘干温度在55-65℃，烘干时间为1-3min；
将烘干后的盖板本体通过UV紫外固化，其中，固化时间为3-5min；
所述在盖板本体内侧涂覆导热涂层的步骤包括：
对盖板本体内侧进行等离子清洗；
将所述粘接树脂，以及金属氧化物、和/或氮化物混合，涂覆在清洗后的盖板本体内侧；
将涂覆有粘接树脂，以及金属氧化物、和/或氮化物的盖板本体放入烘箱烘干，其中，烘干温度在80-120℃，烘干时间为5-10min。
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