CN110077055A - 一种聚四氟乙烯玻璃布陶瓷覆膜铜箔板 - Google Patents
一种聚四氟乙烯玻璃布陶瓷覆膜铜箔板 Download PDFInfo
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Abstract
本发明涉及覆铜箔板技术领域,且公开了一种聚四氟乙烯玻璃布陶瓷覆膜铜箔板。该聚四氟乙烯玻璃布陶瓷覆膜铜箔板,通过研发的“聚四氟乙烯玻璃布陶瓷膜覆铜箔板F4BM‑2‑A”,强度高,吸水性低,有效保障了Z方向膨胀系数,其抗热、防火、耐化学性、防潮、热稳定性、绝缘性能极佳。本产品经江苏省电子信息产品质量监督检验研究院(江苏省信息安全测评中心)检测,介电常数:2.65‑2.67,表面电阻率≥3.2×106(MΩ),体积电阻率≥3.0×107(MΩ.cm),介质损耗≤1.2×10‑3,击穿电压22(KV),剥离强度:热应力后(1.55‑1.62)、150℃下(1.40‑1.47)、暴露于工艺溶液后(1.51‑1.56),不分层、不起泡,弯曲强度:纵向(120.3MPa)、横向(114.9MPa),吸水率≤0.07%。
Description
技术领域
本发明涉及覆铜箔板技术领域,具体为一种聚四氟乙烯玻璃布陶瓷覆膜铜箔板。
背景技术
随着社会的进步,电子通信产业在迅速发展,因此对电子产品、电子服务的需求越来越高,覆铜箔板是所有电子整机,包括航空、航天、遥感、遥测、遥控、通讯、计算机、工业控制、家用电器等一切电子产品都不可缺少的重要电子材料,由于电子产品的小型、轻量及薄型化,迫使印制电路板必须具备各种高质量、高技术特性,因此覆铜箔板在电子信息产业中的地位越来越重要,目前市场上现有技术生产的覆铜箔板易产生翘曲,有些产品整张板平整度显得很好,但切成小板时,则部分小板明显翘曲,造成印制板出现局部图形尺寸变化,同时市场上现有覆铜箔板玻璃结构易疏松,导致电导和介质损耗上升、弹性横量硬度、化学稳定性、热膨胀系数等一系列变化,耐用性下降,表面电阻及体积电阻值小,现有技术已不能满足市场的要求。
发明内容
(一)解决的技术问题
针对现有技术的不足,本发明提供了一种聚四氟乙烯玻璃布陶瓷覆膜铜箔板,具备强度高,吸水性低,有效保障了Z方向膨胀系数,其抗热、防火、耐化学性、防潮、热稳定性、绝缘性能极佳等优点,解决了覆铜箔板抗弯曲强度、抗剥强度低,化学、物理电气稳定性不稳定的问题。
(二)技术方案
本发明解决其技术问题所采用的技术方案是:一种聚四氟乙烯玻璃布陶瓷覆膜铜箔板,所述包括绝缘介质层、聚四氟乙烯膜、纳米陶瓷聚四氟乙烯薄膜、带无源互调指标铜箔,所述聚四氟乙烯膜覆于绝缘介质层上下两侧,所述纳米陶瓷聚四氟乙烯薄膜覆于聚四氟乙烯膜上,所述带无源互调指标铜箔覆于纳米陶瓷聚四氟乙烯薄膜上。
进一步的,所述绝缘介质层、聚四氟乙烯膜、纳米陶瓷聚四氟乙烯薄膜、带无源互调指标铜箔配比为55%:10%:15%:20%。
进一步的,所述绝缘介质层由云母玻璃布、聚四氟乙烯分散乳液、金红石粉和陶瓷微粉制成。
进一步的,所述纳米陶瓷聚四氟乙烯薄膜厚度为0.025mm-0.07mm。
进一步的,所述带无源互调指标铜箔为1/3oz-4oz。
进一步的,所述玻纤布在生产过程中涂覆着为纺织需要而施加的浸润剂和浆料,这些有机物质的存在会妨碍玻璃纤维与树脂的粘接,需要进行表面处理,本项目使用高温炉进行热处理,根据材料的厚度,控制车速、温度、时间。
进一步的,所述绝缘介质层是由聚四氟乙烯分散乳液和增强材料(无碱玻纤布)制成半固化片,然后覆上纳米陶瓷PTFE膜组成,产品用无碱玻纤布浸渍所选树脂,通过立式浸胶机浸渍、烘干及高温烧结,重复2-4次。
进一步的,所述半固化片上,用0.03mm—0.08mm的纳米陶瓷PTFE膜,同时覆上铜箔,经真空液压机高温、高压,复合制成,在热压过程中控制如下工艺参数:
a.真空度:0.02-0.04Mpa;
b.升温速度:10℃/min;
c.成型温度:90-240℃;
d.接触压力:50-80psi;
e.成型压力:135-600psi;
f.成型压制时间:40-60分钟。
进一步的,a.产品系列化和质量一致性研究;
b.解决原材料预处理技术;
c.提高表面电阻,体积电阻的技术研究;
d.提升半固化片成型工艺技术水平;
e.解决板材翘曲的技术研究。
工作原理:本产品“聚四氟乙烯玻璃布陶瓷膜覆铜箔板F4BM-2-A”通过将无碱玻璃纤维布浸渍聚四氟乙烯分散乳液后,经烘烧及高温烧结而成聚四氟乙烯玻璃布,将制备的聚四氟乙烯玻璃布、纳米陶瓷PTFE膜、铜箔按比例,经真空高温液压机、加温、加压、复合,制成本产品。本产品首先对原材料玻纤布进行表面高温预处理,去除浸润剂和浆料等有机物,然后根据性能、用途及规格要求,对所需的浸渍材料按一定比例进行混合,经过立式浸胶机多次浸渍烘干及高温处理,再按比例进行配料敷上铜箔,经过真空液压机高温、高压、复合,最后制成覆铜箔板。
本发明的有益效果是:
1、该聚四氟乙烯玻璃布陶瓷覆膜铜箔板,通过研发的“聚四氟乙烯玻璃布陶瓷膜覆铜箔板F4BM-2-A”,强度高,吸水性低,有效保障了Z方向膨胀系数,其抗热、防火、耐化学性、防潮、热稳定性、绝缘性能极佳。本产品经江苏省电子信息产品质量监督检验研究院(江苏省信息安全测评中心)检测,介电常数:2.65-2.67,表面电阻率≥3.2×106(MΩ),体积电阻率≥3.0×107(MΩ.cm),介质损耗≤1.2×10-3,击穿电压22(KV),剥离强度:热应力后(1.55-1.62)、150℃下(1.40-1.47)、暴露于工艺溶液后(1.51-1.56),不分层、不起泡,弯曲强度:纵向(120.3MPa)、横向(114.9MPa),吸水率≤0.07%。
附图说明
图1为本发明结构示意图;
图2为本发明工艺流程图;
其中:1带无源互调指标铜箔、2纳米陶瓷聚四氟乙烯薄膜、3聚四氟乙烯膜、4绝缘介质层。
具体实施方式
现在结合附图对本发明作进一步详细的说明。这些附图均为简化的示意图,仅以示意方式说明本发明的基本结构,因此其仅显示与本发明有关的构成。
请参阅图1-2,一种聚四氟乙烯玻璃布陶瓷覆膜铜箔板,所述包括绝缘介质层4、聚四氟乙烯膜3、纳米陶瓷聚四氟乙烯薄膜2、带无源互调指标铜箔1,所述聚四氟乙烯膜3覆于绝缘介质层4上下两侧,所述纳米陶瓷聚四氟乙烯薄膜2覆于聚四氟乙烯膜3上,所述带无源互调指标铜箔1覆于纳米陶瓷聚四氟乙烯薄膜2上,绝缘介质层4、聚四氟乙烯膜3、纳米陶瓷聚四氟乙烯薄膜2、带无源互调指标铜箔1配比为55%:10%:15%:20%,绝缘介质层4由云母玻璃布、聚四氟乙烯分散乳液、金红石粉和陶瓷微粉制成,纳米陶瓷聚四氟乙烯薄膜2厚度为0.025mm-0.07mm,带无源互调指标铜箔1为1/3oz-4oz,玻纤布在生产过程中涂覆着为纺织需要而施加的浸润剂和浆料,这些有机物质的存在会妨碍玻璃纤维与树脂的粘接,需要进行表面处理,绝缘介质层4是由聚四氟乙烯分散乳液和增强材料(无碱玻纤布)制成半固化片,然后覆上纳米陶瓷PTFE膜组成,产品用无碱玻纤布浸渍所选树脂,通过立式浸胶机浸渍、烘干及高温烧结,重复2-4次,本产品制得的半固化片采用热辐射式烘箱,横向分为三个温区进行烘干,通过调节左、中、右区温度,消除半固化片左、中、右各部位固化程度不一致或纵向固化程度不一致问题,解决板材翘曲难题。所述参数控制如下:a.浸胶温度:上部:260℃—300℃;中部:150℃—190℃;下部:80℃—105℃;b.车速:0.95米/分钟—1.2米/分钟,聚四氟乙烯树脂作为基体树脂,其介电性能、耐热性能优良,按配比在搅拌槽内依次加入二丙二醇甲醚、硅烷,开启搅拌器,转速800-1600转/分钟,保持持续搅拌并控制槽体温度在25-50℃,持续搅拌10-20分钟,再加入配方量的硅微粉,添加完毕后再持续搅拌15-55分钟,再在搅拌槽内按配方量依次加入聚四氟乙烯树脂、二氨基二苯砜固化剂,添加完毕后开启高效剪切及乳化1.2-4.8小时,同时进行冷却水循环,保持槽体温度在25-50℃,制得A组份;按配方量称取2-乙基咪唑,并加入二丙二醇甲醚,使2-乙基咪唑完全溶解,制得B组份;将A组份和B组份均匀混合,加入搅拌槽内,并持续保持800-1600转/分钟的转速搅拌4-10小时,调胶完成,本项目使用高温炉进行热处理,根据材料的厚度,控制车速、温度、时间,绝缘介质层4是由聚四氟乙烯分散乳液和增强材料(无碱玻纤布)制成半固化片,然后覆上纳米陶瓷PTFE膜组成,产品用无碱玻纤布浸渍所选树脂,通过立式浸胶机浸渍、烘干及高温烧结,重复2-4次,半固化片上,用0.03mm—0.08mm的纳米陶瓷PTFE膜,同时覆上铜箔,经真空液压机高温、高压,复合制成,在热压过程中控制如下工艺参数:a.真空度:0.02-0.04Mpa;b.升温速度:10℃/min;c.成型温度:90-240℃;d.接触压力:50-80psi;e.成型压力:135-600psi;f.成型压制时间:40-60分钟,a.产品系列化和质量一致性研究;b.解决原材料预处理技术;c.提高表面电阻,体积电阻的技术研究;d.提升半固化片成型工艺技术水平;e.解决板材翘曲的技术研究,本产品“聚四氟乙烯玻璃布陶瓷膜覆铜箔板F4BM-2-A”通过将无碱玻璃纤维布浸渍聚四氟乙烯分散乳液后,经烘烧及高温烧结而成聚四氟乙烯玻璃布,将制备的聚四氟乙烯玻璃布、纳米陶瓷PTFE膜、铜箔按比例,经真空高温液压机、加温、加压、复合,制成本产品。本产品首先对原材料玻纤布进行表面高温预处理,去除浸润剂和浆料等有机物,然后根据性能、用途及规格要求,对所需的浸渍材料按一定比例进行混合,经过立式浸胶机多次浸渍烘干及高温处理,再按比例进行配料敷上铜箔,经过真空液压机高温、高压、复合,最后制成覆铜箔板,使用高温炉进行高温热处理,根据材料的厚度、控制车速、温度和时间,清除玻纤布上的有机物,提高玻璃结构的电导、介质损耗、弹性横量硬度、化学稳定性以及热膨胀系数等性能,其抗弯曲强度≥120.3MPa,抗剥强度≥15N/cm,采用半固化片温区分区烘干技术,将烘箱横向分成三个温区,通过调节左、中、右区温度,使半固化片横向左、中、右各部位或纵向固化程度一致,消除半固化片因固化程度不一致而出现的翘曲变形问题,过增加树脂基体、增强浸入程度以及表面预浸系统,同时使用真空液压机减少成型压力,减少玻纤布上胶的张力,使热膨胀系数横向、纵向≤10-6/℃,将翘曲度控制在0.5%以内,使用经高温处理的无碱玻纤布,浸渍制得的聚四氟乙烯分散乳液,通过立式浸胶机浸渍、重复烘干2-4次制成半固化片,在半固化片上覆上纳米陶瓷聚四氟乙烯薄膜2,提高了覆铜箔板的物理电气性能,介电常数:2.65-2.67,表面电阻率≥3.2×106(MΩ),体积电阻率≥3.0×107(MΩ.cm),介质损耗≤1.2×10-3。
综上,本项目研发的“聚四氟乙烯玻璃布陶瓷膜覆铜箔板F4BM-2-A”,强度高,吸水性低,有效保障了Z方向膨胀系数,其抗热、防火、耐化学性、防潮、热稳定性、绝缘性能极佳。本产品经江苏省电子信息产品质量监督检验研究院(江苏省信息安全测评中心)检测,介电常数:2.65-2.67,表面电阻率≥3.2×106(MΩ),体积电阻率≥3.0×107(MΩ.cm),介质损耗≤1.2×10-3,击穿电压22(KV),剥离强度:热应力后(1.55-1.62)、150℃下(1.40-1.47)、暴露于工艺溶液后(1.51-1.56),不分层、不起泡,弯曲强度:纵向(120.3MPa)、横向(114.9MPa),吸水率≤0.07%,所检项目全部合格。
以上述依据本发明的理想实施例为启示,通过上述的说明内容,相关工作人员完全可以在不偏离本项发明技术思想的范围内,进行多样的变更以及修改。本项发明的技术性范围并不局限于说明书上的内容,必须要根据权利要求范围来确定其技术性范围。
Claims (9)
1.一种聚四氟乙烯玻璃布陶瓷覆膜铜箔板,其特征在于:所述包括绝缘介质层(4)、聚四氟乙烯膜(3)、纳米陶瓷聚四氟乙烯薄膜(2)、带无源互调指标铜箔(1),所述聚四氟乙烯膜(3)覆于绝缘介质层(4)上下两侧,所述纳米陶瓷聚四氟乙烯薄膜(2)覆于聚四氟乙烯膜(3)上,所述带无源互调指标铜箔(1)覆于纳米陶瓷聚四氟乙烯薄膜(2)上。
2.根据权利要求1所述的聚四氟乙烯玻璃布陶瓷覆膜铜箔板,其特征在于:所述绝缘介质层(4)、聚四氟乙烯膜(3)、纳米陶瓷聚四氟乙烯薄膜(2)、带无源互调指标铜箔(1)配比为55%:10%:15%:20%。
3.根据权利要求1所述的聚四氟乙烯玻璃布陶瓷覆膜铜箔板,其特征在于:所述绝缘介质层(4)由云母玻璃布、聚四氟乙烯分散乳液、金红石粉和陶瓷微粉制成。
4.根据权利要求1所述的聚四氟乙烯玻璃布陶瓷覆膜铜箔板,其特征在于:所述纳米陶瓷聚四氟乙烯薄膜(2)厚度为0.025mm-0.07mm。
5.根据权利要求1所述的聚四氟乙烯玻璃布陶瓷覆膜铜箔板,其特征在于:所述带无源互调指标铜箔(1)为1/3oz-4oz。
6.根据权利要求1所述的聚四氟乙烯玻璃布陶瓷覆膜铜箔板,其特征在于:所述玻纤布在生产过程中涂覆着为纺织需要而施加的浸润剂和浆料,这些有机物质的存在会妨碍玻璃纤维与树脂的粘接,需要进行表面处理,本项目使用高温炉进行热处理,根据材料的厚度,控制车速、温度、时间。
7.根据权利要求1所述的聚四氟乙烯玻璃布陶瓷覆膜铜箔板,其特征在于:所述绝缘介质层(4)是由聚四氟乙烯分散乳液和增强材料(无碱玻纤布)制成半固化片,然后覆上纳米陶瓷PTFE膜组成,产品用无碱玻纤布浸渍所选树脂,通过立式浸胶机浸渍、烘干及高温烧结,重复2-4次。
8.根据权利要求1所述的聚四氟乙烯玻璃布陶瓷覆膜铜箔板,其特征在于:所述半固化片上,用0.03mm—0.08mm的纳米陶瓷PTFE膜,同时覆上铜箔,经真空液压机高温、高压,复合制成,在热压过程中控制如下工艺参数:
a.真空度:0.02-0.04Mpa;
b.升温速度:10℃/min;
c.成型温度:90-240℃;
d.接触压力:50-80psi;
e.成型压力:135-600psi;
f.成型压制时间:40-60分钟。
9.根据权利要求1所述的聚四氟乙烯玻璃布陶瓷覆膜铜箔板,其特征在于:a.产品系列化和质量一致性研究;
b.解决原材料预处理技术;
c.提高表面电阻,体积电阻的技术研究;
d.提升半固化片成型工艺技术水平;
e.解决板材翘曲的技术研究。
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