CN110027268B - 电磁波屏蔽膜 - Google Patents

电磁波屏蔽膜 Download PDF

Info

Publication number
CN110027268B
CN110027268B CN201910028590.1A CN201910028590A CN110027268B CN 110027268 B CN110027268 B CN 110027268B CN 201910028590 A CN201910028590 A CN 201910028590A CN 110027268 B CN110027268 B CN 110027268B
Authority
CN
China
Prior art keywords
layer
insulating protective
protective layer
film
electromagnetic wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201910028590.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN110027268A (zh
Inventor
梅村滋和
渡边正博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Publication of CN110027268A publication Critical patent/CN110027268A/zh
Application granted granted Critical
Publication of CN110027268B publication Critical patent/CN110027268B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/023—Optical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/406—Bright, glossy, shiny surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Structure Of Printed Boards (AREA)
CN201910028590.1A 2018-01-12 2019-01-11 电磁波屏蔽膜 Active CN110027268B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-003474 2018-01-12
JP2018003474A JP6863908B2 (ja) 2018-01-12 2018-01-12 電磁波シールドフィルム

Publications (2)

Publication Number Publication Date
CN110027268A CN110027268A (zh) 2019-07-19
CN110027268B true CN110027268B (zh) 2022-02-01

Family

ID=67235535

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910028590.1A Active CN110027268B (zh) 2018-01-12 2019-01-11 电磁波屏蔽膜

Country Status (4)

Country Link
JP (1) JP6863908B2 (https=)
KR (1) KR102412598B1 (https=)
CN (1) CN110027268B (https=)
TW (1) TWI829647B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI730395B (zh) * 2019-09-04 2021-06-11 同泰電子科技股份有限公司 電磁干擾屏蔽結構、具有電磁干擾屏蔽結構的軟性電路板及其製造方法
JP6956926B1 (ja) * 2020-01-07 2021-11-02 タツタ電線株式会社 電磁波シールドフィルム
TWI844723B (zh) * 2020-01-09 2024-06-11 日商拓自達電線股份有限公司 形狀轉印薄膜
CN111491441B (zh) * 2020-04-23 2021-10-26 京东方科技集团股份有限公司 电路板结构和显示设备
CN114641125B (zh) * 2021-02-09 2025-03-11 广州方邦电子股份有限公司 电磁屏蔽膜及线路板
TWI869660B (zh) * 2021-06-18 2025-01-11 日商拓自達電線股份有限公司 電磁波屏蔽膜

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104797420A (zh) * 2012-11-19 2015-07-22 大自达电线股份有限公司 层叠膜和屏蔽印刷布线板
CN105120643A (zh) * 2015-06-30 2015-12-02 保定乐凯新材料股份有限公司 一种用于快速加工的热塑性电磁波屏蔽膜
CN105451529A (zh) * 2014-09-19 2016-03-30 信越聚合物株式会社 电磁波屏蔽膜、柔性印刷布线板以及它们的制造方法
WO2017138638A1 (ja) * 2016-02-12 2017-08-17 タツタ電線株式会社 電磁波シールドフィルム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4135096A1 (de) * 1991-10-24 1993-04-29 Hoechst Ag Siegelbare, matte biaxial orientierte polyolefin-mehrschichtfolie, verfahren zu ihrer herstellung und ihre verwendung
JP4330320B2 (ja) * 2002-09-27 2009-09-16 大日本印刷株式会社 マット層形成用組成物およびそれを用いた離型シート
JP6229409B2 (ja) * 2013-09-30 2017-11-15 東レ株式会社 離型用二軸配向ポリエステルフィルム
JP5796690B1 (ja) * 2015-02-02 2015-10-21 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104797420A (zh) * 2012-11-19 2015-07-22 大自达电线股份有限公司 层叠膜和屏蔽印刷布线板
CN105451529A (zh) * 2014-09-19 2016-03-30 信越聚合物株式会社 电磁波屏蔽膜、柔性印刷布线板以及它们的制造方法
CN105120643A (zh) * 2015-06-30 2015-12-02 保定乐凯新材料股份有限公司 一种用于快速加工的热塑性电磁波屏蔽膜
WO2017138638A1 (ja) * 2016-02-12 2017-08-17 タツタ電線株式会社 電磁波シールドフィルム

Also Published As

Publication number Publication date
JP6863908B2 (ja) 2021-04-21
TWI829647B (zh) 2024-01-21
KR20190086391A (ko) 2019-07-22
JP2019125618A (ja) 2019-07-25
TW201930513A (zh) 2019-08-01
CN110027268A (zh) 2019-07-19
KR102412598B1 (ko) 2022-06-22

Similar Documents

Publication Publication Date Title
CN110027268B (zh) 电磁波屏蔽膜
CN112586096B (zh) 印制线路基材用贴附膜
KR102475690B1 (ko) 프린트 배선 기판용 접착 필름
TWI728302B (zh) 電磁波屏蔽膜
CN110305603B (zh) 导电性胶粘剂层
KR102386508B1 (ko) 전자파 차폐 필름
CN109819583B (zh) 电磁波屏蔽膜
HK40036487A (en) Adhesive film for printed wiring board
HK40044327A (en) Affixation film for printed wiring board
HK40031733A (en) Electromagnetic wave shielding film
CN117280881A (zh) 电磁波屏蔽薄膜
HK40031733B (en) Electromagnetic wave shielding film
HK40004744A (en) Electromagnetic wave shielding film
HK40044815A (en) Electromagnetic shielding film, method for producing shielded printed wiring board, and shielded printed wiring board

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant