CN110026346A - IC chip test sorting machine feed device and method - Google Patents
IC chip test sorting machine feed device and method Download PDFInfo
- Publication number
- CN110026346A CN110026346A CN201910409942.8A CN201910409942A CN110026346A CN 110026346 A CN110026346 A CN 110026346A CN 201910409942 A CN201910409942 A CN 201910409942A CN 110026346 A CN110026346 A CN 110026346A
- Authority
- CN
- China
- Prior art keywords
- package tube
- feeding guide
- feed chute
- hopper
- chute channel
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to a kind of IC chip test sorting machine feed device and methods, including rack, it is equipped in the rack to the single-row hopper for vertically stacking the package tube equipped with semiconductor devices, for hopper bottom side there are the discharge port passed through for single package tube, hopper lower section, which is provided with, releases pusher from discharge port for the package tube of bottom；Hopper front end side is provided with the swing mechanism that the package tube that will be pushed out is rocked to heeling condition；It is provided with feeding guide in front of the swing mechanism, the feed chute channel to convey semiconductor devices is provided in the feeding guide, feed chute channel rear end is docked with the package tube lower end swung after tilting.IC chip test sorting machine feed device of the present invention can be realized the continuous-stable feeding of semiconductor devices one by one, not easily cause defective semiconductor devices, high-efficient, practical；Staff is only needed to overlay the package tube equipped with semiconductor devices in hopper, it is simple to operate.
Description
Technical field
The present invention relates to a kind of IC chip test sorting machine feed device and methods.
Background technique
Semiconductor devices (i.e. chip) needs to carry out a series of test operation before carrying out braid, at present on the market also
It can be completed at the same time the integration apparatus of test and braid operation, cause the production efficiency of semiconducter device testing braid very
It is low.In addition, it is small in size due to semiconductor devices, it is light-weight, realize that the difficulty of automation feeding is higher, this is also to restrict partly to lead
One big bottleneck of body device detection braid integration apparatus development.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of easy to operate, stable and reliable in work, high-efficient integrated circuits
Chip testing sorting machine feed device and method.
The present invention is realized using following scheme: a kind of IC chip test sorting machine feed device, including rack, institute
It states and is equipped in rack to the single-row hopper for vertically stacking the package tube equipped with semiconductor devices, there are can for hopper bottom side
For the discharge port that single package tube passes through, it is provided with below hopper and the package tube of bottom is released into pusher from discharge port；
Hopper front end side is provided with the swing mechanism that the package tube that will be pushed out is rocked to heeling condition；It is set in front of the swing mechanism
Be equipped with feeding guide, be provided with the feed chute channel to convey semiconductor devices in the feeding guide, feed chute channel rear end with
Package tube lower end docking after swinging inclination.
Further, the feed chute channel includes segmental arc and straightway, and the feed chute channel segmental arc is located at straightway
Rear end；It is offered in the feeding guide on the upside of feed chute channel segmental arc and towards first to be blown in feed chute channel obliquely
Gas hole；A ranking is offered in feeding guide on the downside of feed chute channel straightway and towards the to be blown in feed chute channel diagonally forward
Two gas holes.
Further, the feeding guide is located to be connected with above feed chute channel segmental arc and be connected with the first gas hole
First air inlet pipe；Several are offered in the feeding guide be located at be connected below the second gas hole and with the second gas hole
Distribution elongated slot, feeding guide side are connected with the second air inlet pipe being connected with distribution elongated slot.
Further, the swing mechanism includes the swinging frame that can be swung up and down, and is equipped on the swinging frame by cylinder
The gripping block to clamp package tube front end is driven, is also equipped on swinging frame in front of gripping block to withstand package tube
The limited block of front end offers after swinging frame is swung up to dock feed chute channel rear end and package tube in the limited block
The transition conduit of front end.
Further, the swinging frame is articulated with feeding guide rear end side, and feeding guide rear end face is arc-shaped, and send
The center of circle of material guide rail rear end arcwall face is overlapped with swinging frame oscillation center, arcwall face of the limited block front end face close to feeding guide.
Further, limited block both ends upper side offers the notch communicated with transition conduit, sets above limited block
It is equipped with and is driven by the cylinder up and down limited block, the limited block both ends, which extend downwardly out, stretches to limited block both ends notch
In catch pawl, cylinder driving limited block when moving downward catch pawl protrude into transition conduit and head on transition conduit bottom surface.
Further, the pusher includes the pusher bottom plate that can be moved left and right, and offering on the pusher bottom plate can
For the limiting slot that single package tube is fallen into, hopper rear end side is provided with that pushing tow makes forward by the package tube released by pusher bottom plate
Its front end enters the pushing block of swing mechanism.
A kind of another technical solution of the present invention: work side of IC chip test sorting machine feed device as described above
Method, comprising the following steps: (1) staff overlays the package tube equipped with semiconductor devices on hopper；(2) pusher
Pusher bottom plate releases the package tube for being located at hopper bottom towards swing mechanism direction is mobile；(3) forward movement of control pushing block makes
Package tube front end extend into below gripping block and heads on limited block rear end face, and the gripping block then controlled on swing mechanism clamps envelope
Tubulature front end；(4) control swinging frame, which is swung up certain angle, makes the transition conduit on limited block be directed at sending on feeding guide
Hopper road rear end；(5) semiconductor devices in package tube slides through lead-over groove road into feed chute channel, and feed chute channel passes through first
Gas hole and the second gas hole blow semiconductor devices and are fed forward in feed chute channel.
Compared with prior art, the invention has the following advantages: IC chip test sorting machine of the present invention is sent
Material device can be realized the continuous-stable feeding of semiconductor devices one by one, stable and reliable in work, does not easily cause and partly leads
Body device failure, it is high-efficient, it is practical；Only need staff that the package tube equipped with semiconductor devices is overlayed hopper
In, it is simple to operate.
To make the objectives, technical solutions, and advantages of the present invention more comprehensible, specific embodiment and phase will be passed through below
Attached drawing is closed, invention is further described in detail.
Detailed description of the invention
Fig. 1 is the perspective view at side of embodiment of the present invention visual angle；
Fig. 2 is the perspective view at the other side of embodiment of the present invention visual angle；
Fig. 3 is the installation side view of feeding guide on the rack in the embodiment of the present invention；
Fig. 4 is the installation side view of hopper on the rack in the embodiment of the present invention；
Fig. 5 is the installation side view of swing mechanism on the rack in the embodiment of the present invention；
Fig. 6 is the feeding guide perspective view in the embodiment of the present invention with straightway feed chute channel；
Fig. 7 is the sectional view of Fig. 6；
Fig. 8 is the feeding guide scheme of installation in the embodiment of the present invention with segmental arc feed chute channel；
Fig. 9 is the first gas hole location diagram at feed chute channel segmental arc in the embodiment of the present invention；
Figure 10 is feed chute channel cross-sectional view in the embodiment of the present invention；
Figure 11 is pusher bottom plate perspective view in the embodiment of the present invention；
Figure label explanation: 100- semiconductor devices, 200- package tube, 300- hopper, 310- discharge port, 400- pusher,
410- pusher bottom plate, 420- shake cylinder, 500- swing mechanism, 510- swinging frame, 520- gripping block, 530- limited block, 531-
Transition conduit, 540- limited block, 541- catch pawl, 550- cylinder, 600- feeding guide, 610- feed chute channel, 620- first are blown
Stomata, the second gas hole of 630-, the first air inlet pipe of 640-, 650- distribution elongated slot, the second air inlet pipe of 660-, 670- spacing mandril,
680- first sensor, 700- pushing block, 800- splicing groove, 900- rack.
Specific embodiment
As shown in Fig. 1 ~ 11, a kind of IC chip test sorting machine feed device, including rack 900, the rack
It is equipped on 900 to the single-row hopper 300 for vertically stacking the package tube 200 equipped with semiconductor devices 100, is partly led to accommodate
The package tube of body device is the prior art, is not specifically described again；The inside dimension of package tube is slightly larger than semiconductor devices
Size, semiconductor devices can be free to slide in package tube, and the semiconductor devices in package tube is along package tube length direction
It forms a line；Hopper 300 is two and is erected at the both ends of package tube, and the both ends of package tube stretch in hopper；300 bottom of hopper
Radical side is provided with the package tube of bottom from going out there are the discharge port 310 passed through for single package tube below hopper 300
Material mouth releases pusher 400；Hopper front end side is provided with the oscillating machine that the package tube that will be pushed out is rocked to heeling condition
Structure 500；It is provided with feeding guide 600 in front of the swing mechanism 500, is provided in the feeding guide 600 to convey half
The feed chute channel 610 of conductor device, the sectional dimension of feed chute channel are only sufficient to that a semiconductor devices is allowed to pass through, feed chute channel
610 rear ends are docked with 200 lower end of package tube swung after tilting, and swing mechanism, which swings package tube, makes its rear end be upturned,
So that the semiconductor devices in the package tube is skidded off from package tube front end and is slid into feed chute channel 610, then feed chute channel
610 are fed forward semiconductor devices；IC chip test sorting machine feed device of the present invention can be realized semiconductor device
The continuous-stable feeding of part one by one, it is high-efficient, it is practical；Only need staff that semiconductor devices will be housed
Package tube overlays in hopper, simple to operate.
In the present embodiment, the wherein section approximation "convex" shaped of feed chute channel 610, including semiconductor devices master can be accommodated
The medial launder of body portion and the respectively side channel in medial launder two sides to accommodate semiconductor devices foot portion, two sides side channel
Height is lower than intermediate groove height, and wherein the side channel of side communicates with the outside world, in this way convenient in semiconductor devices feeding appearance
The external world can be by stirring the semiconductor devices at stuck place when stuck.
In the present embodiment, rack installation hopper position is slightly with gradient, so that the height of front end hopper is slightly above
The height of rear end hopper, while pusher bottom plate is also slightly gradient, guarantee package tube in this way is in hopper and by pusher bottom plate
It is able to maintain front end in push and is slightly above rear end, it is sliding from front end to avoid the semiconductor devices in package tube in the process
Out.
In the present embodiment, the feed chute channel 610 includes segmental arc and straightway, and the feed chute channel segmental arc is located at
Straightway rear end；Feed chute channel is offered in the feeding guide 600 positioned at feed chute channel 610 by the way of air-blowing conveying
On the upside of segmental arc and towards the first gas hole 620 blown in feed chute channel obliquely, since the feed chute channel of segmental arc is with oblique
Degree, therefore the quantity of the first gas hole does not need too much, one or two is with regard to much of that；A ranking is offered in feeding guide in feeding
On the downside of conduit straightway and towards the second gas hole 630 blown in feed chute channel diagonally forward；And straightway feed chute channel is due to being
Horizontal, it is therefore desirable to the second more gas hole 630 is distributed to guarantee the conveying of semiconductor devices.
In the present embodiment, the feeding guide 600 is located above feed chute channel segmental arc and is connected with and the first gas hole
The first air inlet pipe 640 being connected；Several are offered in the feeding guide to be located at below the second gas hole and blow with second
The distribution elongated slot 650 that stomata is connected, feeding guide side are connected with the second air inlet pipe 660 being connected with distribution elongated slot.
In the present embodiment, the swing mechanism 500 includes the swinging frame 510 that can swing up and down, on the swinging frame 510
The gripping block 520 being driven by the cylinder to clamp package tube front end is installed, is also equipped on swinging frame 510 positioned at gripping block
520 fronts offer after swinging frame is swung up in the limited block 530 to withstand the limited block 530 of package tube front end
To dock the transition conduit 531 of 200 front end of 610 rear end of feed chute channel and package tube, 520 downside of gripping block offers one section
The trapezoidal locating slot in face is clamped the package tube front opening that block clamps and is narrowly focused towards transition conduit 531；Gripping block 520 is pressed from both sides
Swinging frame is just swung up certain angle behind the front end of package tube, so that transition conduit 531 is directed at feed chute channel, transition conduit
531 structure is consistent with feed chute channel, and the semiconductor devices in package tube slides through lead-over groove road 531 into feed chute channel, by
In transition conduit 531 with it is gradient and be it is straight, therefore semiconductor devices can by self weight slide pass through transition conduit.
In the present embodiment, the swinging frame 510 is articulated with 600 rear end side of feeding guide, and swinging frame is by being located under it
The driving of cylinder 550 of side is swung up and down, and feeding guide rear end side is provided with the limit to limit swinging frame swing up position
Position mandril 670, when swinging frame top is to spacing mandril 670, transition track is then narrowly focused towards feed chute channel；Feeding guide discharge end
It is additionally provided with the first sensor 680 to incude semiconductor devices, when first sensor 680 senses no semiconductor devices
By when, then illustrate that blanking finishes the semiconductor devices in package tube, system then controls swinging frame to lower swing, gripping block
It unclamps while controlling pusher work；The feeding guide rear end face is arc-shaped, and the circle of feeding guide rear end arcwall face
The heart is overlapped with swinging frame oscillation center, arcwall face of the limited block front end face close to feeding guide.
In the present embodiment, the 530 both ends upper side of limited block offers the notch 531 communicated with transition conduit, limit
It is provided with above the block of position and is driven by the cylinder up and down limited block 540, the limited block both ends, which extend downwardly out, to be stretched to
Catch pawl 541 in the notch of limited block both ends, catch pawl 541 is protruded into transition conduit and is pushed up when cylinder driving limited block moves downward
Transition conduit bottom surface；In order to avoid thering is semiconductor devices to be stuck in lead-over groove road when swinging frame is swung and replaces package tube
Between feed chute channel and between package tube and transition conduit, therefore two catch pawls are set to seal the transition conduit of limited block
Both ends；In addition, system first controls driving limited block when first sensor 680 senses that no semiconductor devices passes through
Cylinder frequent operation, so that the touching limited block of the catch pawl high frequency of limited block shakes limited block, to avoid there is conductor to block,
It is packaged the replacement operation of pipe again when guaranteeing in transition conduit really without semiconductor devices.
In the present embodiment, the pusher 400 includes the pusher bottom plate 410 that can be moved left and right, the pusher bottom plate
Offer the limiting slot 411 fallen into for single package tube on 410, hopper rear end side, which is provided with, to be released by pusher bottom plate
Pushing tow makes its front end enter the pushing block 700 of swing mechanism to package tube forward, and the pushing block 700 is also to be driven by the cylinder front and back to move
It is dynamic；Empty package tube is also released into realization from gripping block while the pusher bottom plate of pusher releases next package tube
The blanking of empty package tube.Swing mechanism rear is provided with the shake cylinder 420 right above the package tube clamped positioned at it, shake
420 major function of cylinder is to beat package tube to make its shake, and semiconductor devices is prevented to be stuck in package tube.
In the present embodiment, swing mechanism is located in the rack 900 to be provided with far from hopper side to accept empty envelope
The splicing groove 800 of tubulature, the empty package tube released by pusher bottom plate are fallen in splicing groove 800.
A kind of working method of IC chip test sorting machine feed device as described above, comprising the following steps: (1)
Staff overlays the package tube equipped with semiconductor devices on hopper；(2) the pusher bottom plate of pusher is towards swing mechanism
Direction is mobile to release the package tube for being located at hopper bottom；(3) forward movement of control pushing block makes package tube front end extend into folder
Below tight block and limited block rear end face is headed on, the gripping block then controlled on swing mechanism clamps package tube front end；(4) control pendulum
Moving frame, which is swung up certain angle, makes the transition conduit on limited block be directed at the feed chute channel rear end on feeding guide；(5) it encapsulates
Semiconductor devices in pipe slides through lead-over groove road into feed chute channel, and feed chute channel passes through the first gas hole and the second gas hole
Semiconductor devices is blown to be fed forward in feed chute channel.
Any technical solution disclosed in aforementioned present invention unless otherwise stated, if it discloses numberical range,
Disclosed numberical range is preferred numberical range, and any it should be appreciated by those skilled in the art preferred numberical ranges
The only obvious or representative numerical value of technical effect in many enforceable numerical value.It, can not since numerical value is more
Exhaustion, so the present invention just discloses technical solution of the component values to illustrate the present invention, also, the above-mentioned numerical value enumerated is not
The limitation to the invention protection scope should be constituted.
If the present invention is open or relates to the components or structural member of connection fastened to each other, unless otherwise stated,
It is fixedly connected it is to be understood that connection (such as connecting using bolt or screw) can be removedly fixed, it is understood that are as follows:
It is non-removable to be fixedly connected with (such as riveting, welding), certainly, connection fastened to each other or integral structure (such as make
Manufactured with casting technique is integrally formed) replaced (obviously can not be using except integrally formed technique).
In addition, for indicating the art of positional relationship or shape applied in any technical solution disclosed in aforementioned present invention
Its meaning includes approximate with its, similar or close state or shape to language unless otherwise stated.
Either component provided by the invention by multiple individual component parts either assembled, or one
The separate part that forming technology manufactures.
Finally it should be noted that: the above embodiments are merely illustrative of the technical scheme of the present invention and are not intended to be limiting thereof；To the greatest extent
The present invention is described in detail with reference to preferred embodiments for pipe, it should be understood by those ordinary skilled in the art that: still
It can modify to a specific embodiment of the invention or some technical features can be equivalently replaced；Without departing from this hair
The spirit of bright technical solution should all cover within the scope of the technical scheme claimed by the invention.
Claims (8)
1. a kind of IC chip test sorting machine feed device, it is characterised in that: including rack, be equipped in the rack
To the single-row hopper for vertically stacking the package tube equipped with semiconductor devices, there are logical for single package tube for hopper bottom side
The discharge port crossed, hopper lower section, which is provided with, releases pusher from discharge port for the package tube of bottom；Hopper front end side is set
It is equipped with the swing mechanism that the package tube that will be pushed out is rocked to heeling condition；It is provided with feeding guide in front of the swing mechanism,
The feed chute channel to convey semiconductor devices, the envelope behind feed chute channel rear end and swing inclination are provided in the feeding guide
The docking of tubulature lower end.
2. IC chip test sorting machine feed device according to claim 1, it is characterised in that: the chute feeder
Road includes segmental arc and straightway, and the feed chute channel segmental arc is located at straightway rear end；Position is offered in the feeding guide
On the upside of feed chute channel segmental arc and towards the first gas hole blown in feed chute channel obliquely；A row is offered in feeding guide
On the downside of feed chute channel straightway and towards the second gas hole blown in feed chute channel diagonally forward.
3. IC chip test sorting machine feed device according to claim 2, it is characterised in that: the feeding is led
Rail, which is located above feed chute channel segmental arc, is connected with the first air inlet pipe being connected with the first gas hole；It is opened in the feeding guide
It is located at the distribution elongated slot being connected below the second gas hole and with the second gas hole equipped with several, feeding guide side is connected with
The second air inlet pipe being connected with distribution elongated slot.
4. IC chip test sorting machine feed device according to claim 1, it is characterised in that: the oscillating machine
Structure includes the swinging frame that can be swung up and down, and the folder being driven by the cylinder to clamp package tube front end is equipped on the swinging frame
Tight block is also equipped on swinging frame in front of gripping block to the limited block for withstanding package tube front end, is opened in the limited block
Equipped with the transition conduit after swinging frame is swung up to dock feed chute channel rear end and package tube front end.
5. IC chip test sorting machine feed device according to claim 4, it is characterised in that: the swinging frame
It is articulated with feeding guide rear end side, feeding guide rear end face is arc-shaped, and the center of circle of feeding guide rear end arcwall face and pendulum
Moving frame oscillation center is overlapped, arcwall face of the limited block front end face close to feeding guide.
6. IC chip test sorting machine feed device according to claim 4, it is characterised in that: the limited block
Both ends upper side offers the notch communicated with transition conduit, is provided with above limited block and is driven by the cylinder up and down limiting block
Block, the limited block both ends extend downwardly out the catch pawl stretched in the notch of limited block both ends, cylinder drive limited block to
Catch pawl protrudes into transition conduit and heads on transition conduit bottom surface when lower movement.
7. IC chip test sorting machine feed device according to claim 1, it is characterised in that: the pusher
Structure includes the pusher bottom plate that can be moved left and right, and the limiting slot fallen into for single package tube is offered on the pusher bottom plate, material
Slot rear end side is provided with the package tube released by the pusher bottom plate pushing block that pushing tow makes its front end enter swing mechanism forward.
8. a kind of working method of IC chip test sorting machine feed device as claimed in claim 4, it is characterised in that:
The following steps are included: (1) staff overlays the package tube equipped with semiconductor devices on hopper；(2) pusher is by position
It is released in the package tube of hopper bottom；(3) gripping block controlled on swing mechanism clamps package tube front end；(4) control is swung
Frame, which is swung up certain angle, makes the transition conduit on limited block be directed at the feed chute channel rear end on feeding guide；(5) package tube
Interior semiconductor devices slides through lead-over groove road and is fed forward into feed chute channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910409942.8A CN110026346A (en) | 2019-05-17 | 2019-05-17 | IC chip test sorting machine feed device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910409942.8A CN110026346A (en) | 2019-05-17 | 2019-05-17 | IC chip test sorting machine feed device and method |
Publications (1)
| Publication Number | Publication Date |
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| CN110026346A true CN110026346A (en) | 2019-07-19 |
Family
ID=67242408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910409942.8A Pending CN110026346A (en) | 2019-05-17 | 2019-05-17 | IC chip test sorting machine feed device and method |
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| CN (1) | CN110026346A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110026825A (en) * | 2019-05-20 | 2019-07-19 | 福州派利德电子科技有限公司 | IC chip test sorting machine feeding device and control method |
| CN110456253A (en) * | 2019-08-12 | 2019-11-15 | 安徽龙芯微科技有限公司 | A kind of test of collection and the integrated chip manufacture device of sorting function |
| CN112775035A (en) * | 2021-01-22 | 2021-05-11 | 福州派利德电子科技有限公司 | High-voltage testing device of optocoupler testing separator and working method thereof |
| CN115092647A (en) * | 2022-07-26 | 2022-09-23 | 深圳市良机自动化设备有限公司 | High-voltage and low-voltage testing device and testing system |
| CN117206214A (en) * | 2023-11-08 | 2023-12-12 | 镇江矽佳测试技术有限公司 | Automatic chip testing and sorting device and system |
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| CN117206214B (en) * | 2023-11-08 | 2024-01-05 | 镇江矽佳测试技术有限公司 | Automatic chip testing and sorting device and system |
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