CN110015588A - Lace conveying device - Google Patents
Lace conveying device Download PDFInfo
- Publication number
- CN110015588A CN110015588A CN201811455452.3A CN201811455452A CN110015588A CN 110015588 A CN110015588 A CN 110015588A CN 201811455452 A CN201811455452 A CN 201811455452A CN 110015588 A CN110015588 A CN 110015588A
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- CN
- China
- Prior art keywords
- band
- conveying device
- substrate
- delivery section
- break
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G21/00—Supporting or protective framework or housings for endless load-carriers or traction elements of belt or chain conveyors
- B65G21/10—Supporting or protective framework or housings for endless load-carriers or traction elements of belt or chain conveyors movable, or having interchangeable or relatively movable parts; Devices for moving framework or parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H23/00—Registering, tensioning, smoothing or guiding webs
- B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
- B65H23/06—Registering, tensioning, smoothing or guiding webs longitudinally by retarding devices, e.g. acting on web-roll spindle
- B65H23/10—Registering, tensioning, smoothing or guiding webs longitudinally by retarding devices, e.g. acting on web-roll spindle acting on running web
- B65H23/14—Tensioning rollers applying braking forces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H23/00—Registering, tensioning, smoothing or guiding webs
- B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
- B65H23/26—Registering, tensioning, smoothing or guiding webs longitudinally by transverse stationary or adjustable bars or rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
- B65H35/04—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators
- B65H35/06—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators from or with blade, e.g. shear-blade, cutters or perforators
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2812/00—Indexing codes relating to the kind or type of conveyors
- B65G2812/02—Belt or chain conveyors
- B65G2812/02009—Common features for belt or chain conveyors
- B65G2812/02019—Supporting or guiding frames
- B65G2812/02029—Transportable conveyor frames
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Framework For Endless Conveyors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Technical problem: multiple support members suitably upside delivery section of supporting part from below can utilized using in the lace conveying device for bringing conveying substrate and being processed on tape using processing unit (plant) to substrate.Solution: lace conveying device (43) is that can have cricoid second band (43a), the first break-up device (7), multiple support members (201) using the device for bringing conveying substrate and being processed on tape using processing unit (plant) to substrate.First break-up device (7) is able to maintain a part of the upside delivery section of the second band (43a) and moves along conveying direction.Multiple support members (201) can be moved with the movement of upside delivery section (43a1) along conveying direction for the component of the upside delivery section (43a1) of the second band (43a) of support from below.
Description
Technical field
The present invention relates to a kind of lace conveying devices.
Background technique
Lace conveying device generally has cricoid band, the multiple belt wheels for being wound with band and driving pulley and then utilizes
Driving portion (such as motor) with conveying article.
In lace conveying device, it is known that one kind can change the scalable of the length of the upside delivery section of belt conveyor
Structure (referring for example to patent document 1).
Lace conveying device documented by patent document 1 has strip length telescopic device 13.Strip length telescopic device 13 has
There is the reciprocal band support roller 8,9 moved freely.
Existing technical literature
Patent document
Patent document 1: Japanese Patent Publication 2000-16555 bulletin
Summary of the invention
(1) technical problems to be solved
In recent years, it is known to a kind of to utilize the device for bringing conveying substrate and being processed on tape to substrate.In the dress
In the case where setting, considers not making the upside delivery section of belt conveyor flexible but it is made to move (displacement) along conveying direction.But
In the prior art, do not provide by support member from below be suitable for structure as described above when specific problem and
Solution.
It is an object of the present invention to can utilize bring conveying substrate and can on tape using processing unit (plant) to base
In the lace conveying device that plate is processed, multiple support members suitably upside delivery section of supporting part from below is utilized.
(2) technical solution
In the following, illustrating multiple modes as the means for solving above-mentioned technical problem.These modes can be according to need
Want any combination.
The lace conveying device of one aspect of the present invention is can be added using bringing conveying substrate and utilizing on tape
Tooling sets the device processed to substrate, has cricoid band, driving portion, moving portion, multiple support members.
Driving portion drives to the band.
Moving portion is able to maintain a part of the upside delivery section of band and moves along conveying direction.
Multiple support members are the components for supporting upside delivery section from below, can be with the shifting of upside delivery section
It moves and is moved along conveying direction.
In the apparatus, when moving portion keeps a part of the upside delivery section of band and moves along conveying direction, band
Upside delivery section is moved along conveying direction.At this point, multiple support members are moved with the movement of upside delivery section along conveying direction
It is dynamic.Thus, the upside delivery section of band is suitably supported from below by multiple support members.That is, being not likely to produce wriggling for band
Yan (Japanese: snake).
Moving portion is also possible to the break-up device of the substrate-cutting loaded in the upside delivery section of band.
In the apparatus, the mobile one side disjunction substrate of one edge conveying direction of break-up device.At this point, the upside delivery section of band
It moves along conveying direction, but is also suitably supported from below by multiple support members therebetween.That is, being not likely to produce wriggling for band
Yan.
Multiple support members are also possible to the multiple plate-shaped members for the side that in upside there is the width direction along band to extend.
In the apparatus, since multiple plate-shaped members are short in the conveying direction, the upside of band is made in specified interval
In the case that delivery section reduces, the length of upside delivery section can be made sufficiently short.
Lace conveying device can also have the multiple companies for the plate-shaped member connection that will become a pair in multiple plate-shaped members
Knot part.
In the apparatus, interconnected by connecting member due to a pair of plate-shaped component, each plate-shaped member is not easy
Topple over along conveying direction.
Connecting member can also connect a pair of plate-shaped component in a manner of it only can approach within the specified scope/separate
Knot.
In the apparatus, since a pair of plate-shaped component only can be within the specified scope close to/separation, each plate-shaped member exists
Range appropriate is moved relative to each other.
Connecting member can also have the first component and second component, wherein the first component is fixed on the plate of a side
Shape component, the second component are fixed on the plate-shaped member of another party, and are rotated certainly centered on the axis vertically extended
Such as it is linked to the first component.
In the apparatus, turned freely centered on the axis vertically extended due to the first component and second component
It is dynamic, therefore realize smoothly act in simple structure.
Lace conveying device can also have force application part, and the force application part, which generates direction, keeps a pair of plate-shaped component mutual
The active force in the direction for approaching and being separated from each other.
In the apparatus, when the upside delivery section of band broadens in specified interval, make a pair of plate-shaped using force application part
Component is separated from each other, therefore in all pairs, plate-shaped member is separated from each other simultaneously.Thus, the upside delivery section of band is by multiple
Support part part equably supports from below on the whole.
(3) beneficial effect
In lace conveying device of the invention, the upside delivery section of band can suitably be propped up from below by multiple support members
Support.
Detailed description of the invention
Fig. 1 is the schematic plan of the base plate processing device of first embodiment of the invention.
Fig. 2 is the schematic perspective view of substrate breaking apparatus.
Fig. 3 is the schematic side elevation of substrate breaking apparatus.
Fig. 4 is the block diagram for indicating the control structure of base plate processing device.
Fig. 5 is the schematic side elevation for indicating the substrate breaking apparatus of a state of substrate-cutting movement.
Fig. 6 is the top view with supporting mechanism.
Fig. 7 is the side view with supporting mechanism.
Fig. 8 is the schematic diagram for indicating a state of the movement with supporting mechanism.
Fig. 9 is the schematic diagram for indicating a state of the movement with supporting mechanism.
Figure 10 is the schematic diagram for indicating a state of the movement with supporting mechanism.
Description of symbols
1- base plate processing device；3- crosses to form device；5- substrate breaking apparatus；The first break-up device of 7-；9- second divides
Disconnected device；11- pick device；29- conveying device；The first tension adjustment unit of 35-；The second tension adjustment unit of 37-；41-
One conveying device；51- scribing unit；100- adhesive substrates；111- strip substrate；113- unit substrate；200- band supporting mechanism；
201- support member；202- guide rail；203- connecting member；The 205- first component；207- second component；209- axis；211- force
Component.
Specific embodiment
1. first embodiment
(1) summary description of base plate processing device
Base plate processing device 1 is illustrated using FIG. 1 to FIG. 3.Fig. 1 is the substrate processing of first embodiment of the invention
The schematic plan of device.Fig. 2 is the schematic perspective view of substrate breaking apparatus.Fig. 3 is the side view of substrate breaking apparatus.
In Fig. 1, the up and down direction of figure is first direction (arrow X), and the left and right directions of figure is second direction (arrow Y).
Base plate processing device 1 is the device that multiple unit substrates 113 are formed from adhesive substrates 100.In Fig. 1, next
The multiple devices illustrated arrange from left to right in a second direction.That is, being processed the conveying direction of the substrate of object is
Second direction, substrate are processed while conveying from left to right in a second direction.It therefore, is defeated on the left of the second direction of Fig. 1
Direction upstream side is sent, is conveyance direction downstream side on the right side of the second direction of Fig. 1.
There is base plate processing device 1 scribing line to form device 3.Scribing line formed device 3 formed on the surface of adhesive substrates 100 it is more
A first scribing line S1 and multiple second scribing line S2.First scribing line S1 and the second scribing line S2 are mutually orthogonal.In addition, by after scribing line processing
Substrate as adhesive substrates 100A.
Specifically, scribing line forms device 3 and includes scribing unit 51；Conveying device 53, it is defeated to conveyance direction downstream side
Send adhesive substrates 100；And clamp system 55, it keeps adhesive substrates 100 and keeps it mobile to conveying direction two sides.Scribing line is single
Member 51 includes scribing line beam 51a extended in a first direction, can move in a first direction along scribing line beam 51a
Scribe head 51b (Fig. 4) and scribing line head moving device 51c (Fig. 4).Conveying device 53 is belt conveyor.Clamp system 55
It includes the clamped beam 55a being arranged in a manner of it can move forwards, backwards along second direction in the top of conveying device 53, clamp
It beam mobile device 55b (Fig. 4) and is formed in the unilateral side of clamped beam 55a and holds the clamping element 55c of adhesive substrates 100.Pass through
Clamped beam 55a is mobile towards scribing unit 51 to first direction two sides, thus the adhesive substrates 100 1 that clamping element 55c is held
Side is scribed on one side by the lower section of scribe head 51b (Fig. 4).
Base plate processing device 1 has substrate breaking apparatus 5.Substrate breaking apparatus 5 by along it is multiple first scribing line S1 and
Multiple second scribing line S2 disjunction adhesive substrates 100A are to form unit substrate 113.Substrate breaking apparatus 5 is configured at scribing line and is formed
The conveyance direction downstream side of device 3.
Substrate breaking apparatus 5 has the first break-up device 7 (an example of moving portion).
First break-up device 7 is by crossing S1 disjunction adhesive substrates 100A along multiple first to form multiple strip bases
Plate 111.First break-up device 7 is extended in the mode parallel with first direction, and multiple first scribing line with adhesive substrates 100A
S1 accordingly moves repeatedly/disjunction in the conveying direction.First break-up device 7 is able to maintain the second upside delivery section with 43a
A part of 43a1 simultaneously moves in the conveying direction.
Substrate breaking apparatus 5 has the second break-up device 9.
Second break-up device 9 is configured at the conveyance direction downstream side of the first break-up device 7, and by along the second scribing line S2
The multiple strip substrates 111 of disjunction, to form multiple unit substrates 113.Second break-up device 9 is with the side parallel with first direction
Formula extends, and accordingly moves repeatedly/disjunction in the conveying direction with multiple second scribing line S2 of multiple strip substrates 111.The
Two break-up devices 9 are able to maintain a part of upside delivery section 45a1 of the third with 45a and move in the conveying direction.
Base plate processing device 1 has pick device 11.Pick device 11 picks up multiple unit substrates 113 and to other device
13 conveyings.
In addition, making beam along conveying whiles supporting trip arm etc. in the first break-up device 7 and the second break-up device 9
The mobile mechanism in direction be it is well known, description will be omitted.
Then, the conveying device 29 for conveying substrate is illustrated.Conveying device 29 forms device 3, the to cross
One break-up device 7, the second break-up device 9, pick device 11 sequentially-fed substrate.
Specifically, conveying device 29 has the first conveying device 41, the second conveying device 43, third conveying device 45.
First conveying device 41 forms between device 3 and the first break-up device 7 in scribing line and extends.Second conveying device 43 is in the first disjunction
Extend between device 7 and the second break-up device 9.Third conveying device 45 is prolonged between the second break-up device 9 and pick device 11
It stretches.
As shown in figure 3, the first conveying device 41 has first band 41a, multiple roller 41b, the first motor 41c (Fig. 4).It is more
The roller of conveying direction upstream side in a roller 41b and the roller of conveyance direction downstream side can be within the specified scope to before conveying directions
After move.
As shown in figure 3, the second conveying device 43 has the second band 43a, multiple roller 43b, the second motor 43c (driving portion
An example) (Fig. 4).The roller of conveying direction upstream side in multiple roller 43b and the roller of conveyance direction downstream side can be in regulation models
It encloses interior to conveying direction back-and-forth motion.
As shown in figure 3, third conveying device 45 has third band 45a, multiple roller 45b, third motor 45c (Fig. 4).It is more
The roller of conveying direction upstream side in a roller 45b and the roller of conveyance direction downstream side can be within the specified scope to before conveying directions
After move.
As shown in figure 3, the conveyance direction downstream side end of the upper surface part of first band 41a and the second upper surface part with 43a
Conveying direction upstream side approached across small gap.The conveyance direction downstream side end of second upper surface part with 43a
The conveying direction upstream side of upper surface part with third with 45a is approached across small gap.
According to above structure, in base plate processing device 1, when the first break-up device 7 segmentation adhesive substrates 100A is to shape
When at multiple strip substrates 111, at the same time, it is multiple so as to be formed that the second break-up device 9 divides multiple strip substrates 111
Unit substrate 113.Thus, the ability of the formation unit substrate 113 of base plate processing device 1 is higher than previous.
As shown in FIG. 1 to 3, first band 41a is provided with the first tension adjustment unit 35.It is configured in the second band 43a
Second tension adjustment unit 37.Third tension adjustment unit 39 is configured in third band 45a.First tension adjustment unit 35,
Two tension adjustment units 37 and third tension adjustment unit 39 by pushing first band 41a, the second band 43a and third respectively
The length of band is adjusted with 45a.The structure and function of these devices be it is well known, description will be omitted.
(2) control structure of base plate processing device
It is illustrated using control structure of the Fig. 4 to base plate processing device 1.Fig. 4 is the control for indicating base plate processing device
The block diagram of structure.
Base plate processing device 1 has controller 50.Controller 50 be with processor (such as CPU), storage device (such as
ROM, RAM, HDD, SSD etc.), the computer systems of various interfaces (such as A/D converter, D/A converter, communication interface etc.).
Controller 50 is stored in the program of storage unit (some or all corresponding with the storage region of storage device) by executing
To carry out various control actions.
Controller 50 can constitute with single processor, or each control of carry out and by independent multiple processing
Device is constituted.
Part or all of the function of each element of controller 50 can also be used as can be in the meter for constituting controller 50
The program that executes in calculation machine system is realized.In addition to this, a part of the function of each element of controller 50 can also be by fixed
IC processed is constituted.
Scribing unit 51 (scribe head 51b, scribing line head moving device 51c), (folder of clamp system 55 are connected in controller 50
Tight beam mobile device 55b, clamping element 55c), the first motor 41c of the first conveying device 41, the second conveying device 43 second
Motor 43c, the third motor 45c of third conveying device 45, the first tension adjustment unit 35, the second tension adjustment unit
37, third tension adjustment unit 39.The first break-up device 7, the second break-up device 9 are also connected in controller 50.
Although not shown, size, shape and the sensor of position for detecting substrate are connected in controller 50, be used for
Detect the sensor and switch and message input device of each unit state.
(3) band supporting mechanism
The structure of (3-1) with supporting mechanism
Using Fig. 3 and Fig. 5~Fig. 7 to the band supporting mechanism used in conveying device 29 (an example of lace conveying device)
200 are illustrated.
Fig. 5 is the schematic side elevation for indicating the substrate breaking apparatus of a state of substrate-cutting movement.Fig. 6 is band branch
The top view of support mechanism.Fig. 7 is the side view with supporting mechanism.
As previously mentioned, when the first break-up device 7 and the second break-up device 9 are moved along conveying direction, accompanying this, the
One band 41a, the second band 43a and third band 45a are moved along conveying direction.
When band is mobile to conveying direction upstream side, the first tension adjustment unit 35 and the second tension adjustment unit 37 it
Between section, the upside delivery section 41a1 of first band 41a shortens, and the second upside delivery section 43a1 with 43a is elongated.Moreover,
Section between second tension adjustment unit 37 and third tension adjustment unit 39, the second upside delivery section 43a1 with 43a become
Short, upside delivery section 45a1 of the third with 45a is elongated.
With the mechanism that supporting mechanism 200 is for suitably supporting band according to each movement when above-mentioned band is mobile.
Band supporting mechanism 200 has multiple support members 201.
It is defeated that multiple support members 201 are respectively arranged at the upside delivery section 41a1 of first band 41a, the second upside with 43a
Send portion 43a1 and third with the lower section of the upside delivery section 45a1 of 45a.More specifically, multiple support members 201 are configured at
Six following positions.
(a) conveying direction upstream side is more leaned on than the first tension adjustment unit 35；
(b) between the first tension adjustment unit 35 and the first break-up device 7；
(c) between the first break-up device 7 and the second tension adjustment unit 37；
(d) between the second tension adjustment unit 37 and the second break-up device 9；
(e) between the second break-up device 9 and third tension adjustment unit 39；
(f) conveyance direction downstream side is more leaned on than third tension adjustment unit 39.
Then, multiple support members 201 in above-mentioned (c) are illustrated as an example.In addition, following the description is also suitable
In multiple support members 201 of other positions.
Multiple support members 201 are the component for supporting the second upside delivery section 43a1 with 43a from below, Neng Gousui
The movement of upside delivery section 43a1 and moved along conveying direction.Specifically, multiple support members 201 are in the first break-up device
7 and second in the conveying direction spaced apart between tension adjustment unit 37 arrange.Specifically, in the first break-up device 7
Seven support members 201 are configured between the second tension adjustment unit 37.
In addition, multiple support members 201 are guided by guide rail 202.Guide rail 202 extends in the conveying direction.
Multiple support members 201 are multiple plate-shaped members, and multiple plate-shaped member has in upside along the second width with 43a
Spend the side that direction (first direction) extends.Guide rail 202 has the two of the width direction two sides for being configured at multiple support members 201
Root guide rail part.Multiple support members 201 are able to maintain that the state being parallel to each other as a result,.
In band supporting mechanism 200, when the first break-up device 7 keeps one of the second upside delivery section 43a1 with 43a
When dividing and being moved along conveying direction, accompanying this, the second upside delivery section 43a1 with 43a is mobile.In addition, first band 41a
Upside delivery section it is also mobile to the same direction.At this point, multiple support members 201 with the movement of the upside delivery section of each band and
It is moved along conveying direction.Thus, the upside delivery section 41a1 and second of first band 41a is with the upside delivery section 43a1 of 43a by more
A support member 201 suitably supports from below.That is, being not likely to produce the wriggling with 43a of first band 41a and second.
As shown in Fig. 3 and Fig. 5~Fig. 7, a pair will be become by also having with supporting mechanism 200 in multiple support members 201
Multiple connecting members 203 of bearing part connection.By utilizing connecting member 203, it is not easy each support member 201 along conveying side
To toppling over.
As shown in FIG. 6 and 7, connecting member 203 includes the first component 205, is fixed on the support member 201 of a side；
And second component 207, it is fixed on the support member 201 of another party, and turn centered on the axis 209 vertically extended
It is dynamic to be linked to the first component 205 freely.So, connecting member 203 is by a pair of of support member 201 can only provide model
The mode for enclosing interior close/separation is linked, therefore each support member 201 is moved relative to each other in appropriate range.And
And it realizes smoothly act in simple structure.
In addition, the first component 205 and second component 207 are closed and state close to each other is known as closed state, by the
The state that one component 205 is opened with second component 207 and is separated from each other is known as opening state.
Specifically, there are four connecting members for setting between the first tension adjustment unit 35 and the first break-up device 7
203.Connecting member 203 closest to the first break-up device 7 is directly fixed on the first break-up device 7.Moreover, being filled in the first disjunction
Set 7 and second setting between tension adjustment unit 37 there are four connecting members 203.Closest to the linking part of the first break-up device 7
Part 203 is directly fixed on the first break-up device 7.
As shown in fig. 6, also there are multiple force application parts 211 with supporting mechanism 200.Force application part 211 is generated towards a pair of
The active force close to each other with the direction being separated from each other of support member 201.
Force application part 211 is such as draft helical spring.But it the type of force application part and is not limited.Alternatively, it is also possible to
It is not provided with force application part.
The movement with supporting mechanism when (3-2) substrate-cutting acts
Substrate-cutting movement is illustrated using Fig. 3 and Fig. 5.
As shown in figure 3, the first stage, the first break-up device 7 is in the first tension adjustment unit 35 and the second tension adjustment list
The position of the second tension adjustment unit 37 is located adjacent between member 37.Thus, the first tension adjustment unit 35 and the first disjunction fill
It sets and broadens between 7, therefore the lower section of the first band 41a in the first conveying device 41, multiple support portions are configured with opening state
Part 201 (explanation of above-mentioned (b)).In addition, narrowing between the first break-up device 7 and the second tension adjustment unit 37, therefore
Second lower section with 43a of two conveying devices 43 is configured with multiple support members 201 (explanation of above-mentioned (c)) with closed state.
Further, since multiple support members 201 are short in the conveying direction, therefore in the like this second upside delivery section 43a1 with 43a
In the case where shortening in specified interval, the length of upside delivery section 43a1 in the area can be made sufficiently short.
As shown in figure 5, the first break-up device 7 is while disjunction adhesive substrates 100A to conveying direction in second stage
Upstream side is mobile.At this point, the first break-up device 7 keeps conveyance direction downstream side end and the second conveying with 43a of first band 41a
Direction upstream side.Thus, narrow between the first tension adjustment unit 35 and the first break-up device 7, therefore in the first conveying dress
The lower section of 41 first band 41a is set, multiple support members 201 become closed state (explanation of above-mentioned (b)).In addition, first point
It broadens between disconnected device 7 and the second tension adjustment unit 37, therefore in the second lower section with 43a of the second conveying device 43, it is more
A support member 201 becomes opening state (explanation of above-mentioned (c)).In addition, being formed by multiple strip substrates 111 is placed in
The two upside delivery sections with 43a.
In addition, as shown in figure 5, in second stage, the second break-up device 9 is on one side disjunction strip substrate 111 while to conveying
Direction upstream side is mobile.At this point, the second break-up device 9 keeps the second conveyance direction downstream side end with 43a and third with 45a's
Conveying direction upstream side.Thus, narrow between the second tension adjustment unit 37 and the second break-up device 9, therefore defeated in third
Send the third of device 45 with the lower section of 45a, multiple support members 201 become closed state (explanation of above-mentioned (d)).
Though it is broadened between the second break-up device 9 and third tension adjustment unit 39 in addition, not shown in FIG. 5, therefore
Lower section of the third of third conveying device 45 with 45a, multiple support members 201 become opening state (explanation of above-mentioned (e)).Separately
Outside, though not shown in FIG. 5, multiple unit substrates 113 are placed in upside delivery section 45a1 of the third with 45a.
The upside delivery section of band is changed in specified interval from deflated state to expansion state using Fig. 8~Figure 10 dynamic
It is illustrated.Fig. 8~Figure 10 is the schematic diagram for indicating a state of the movement with supporting mechanism.
In fig. 8, the first break-up device 7 is configured close to the first tension adjustment unit 35, is matched in-between with closed state
It is equipped with multiple support members 201.
In Fig. 9, the first break-up device 7 is mobile therefore more from the first tension adjustment unit 35 to conveyance direction downstream side
A support member 201 changes to opening state.That is, when the upside delivery section 41a1 of first band 41a is in the first tension tune
When saving the interval extension between unit 35 and the second tension adjustment unit 37, a pair of of support member 201 passes through force application part 211
It is separated from each other, therefore in all pairs, support member 201 is separated from each other simultaneously.Thus, the upside delivery section of first band 41a
41a1 is supported from below on the whole by multiple support members 201.
In Figure 10, the first break-up device 7 is moved to conveyance direction downstream side farthest away from the first tension adjustment unit 35
Position, therefore multiple support members 201 become opening state.
2. other embodiment
An embodiment of the invention is illustrated above, but the present invention is not limited to the above embodiments, it can be with
It makes various changes without departing from the spirit of the invention.Especially multiple embodiments and deformation documented by this specification
Example, which can according to need, arbitrarily to be combined.
(1) variation of substrate
In the fitting brittle material substrate made of being bonded two brittle material substrates, comprising: be bonded glass substrate
The panel display boards such as liquid crystal display panel, Plasmia indicating panel, organic EL display panel；By silicon substrate, sapphire substrate etc.
Semiconductor substrate made of being bonded with glass substrate.
The type of substrate is not particularly limited.Substrate includes the glass, semiconductor wafer, ceramic substrate of veneer.
(2) variation of various devices
Shape, the quantity of support member are not particularly limited.
Industrial applicibility
The present invention can be widely used in lace conveying device.
Claims (7)
1. a kind of lace conveying device can utilize and bring conveying substrate and on the belt using processing unit (plant) to described
Substrate is processed, and the lace conveying device has:
Cricoid band；
Driving portion drives the band；
Moving portion is able to maintain a part of the upside delivery section of the band and moves along conveying direction；And
Multiple support members are the components for supporting the upside delivery section from below, can be conveyed with the upside
The movement in portion and moved along conveying direction.
2. lace conveying device according to claim 1, which is characterized in that
The moving portion is by the break-up device of the substrate-cutting loaded in the upside delivery section of the band.
3. lace conveying device according to claim 1 or 2, which is characterized in that
The multiple support member is the multiple plate-shaped members for the side that in upside there is the width direction along the band to extend.
4. lace conveying device according to claim 3, which is characterized in that
The lace conveying device, which is also equipped with, will become multiple companies of a pair of plate-shaped member connection in the multiple plate-shaped member
Knot part.
5. lace conveying device according to claim 4, which is characterized in that
The connecting member connects the pair of plate-shaped member in a manner of it only can approach within the specified scope/separate
Knot.
6. lace conveying device according to claim 5, which is characterized in that
The connecting member has the first component and second component, wherein and the first component is fixed on the plate-shaped member of a side,
The second component is fixed on the plate-shaped member of another party, and is rotatably linked centered on the axis vertically extended
In the first component.
7. lace conveying device according to claim 5 or 6, which is characterized in that
The lace conveying device is also equipped with force application part, and the force application part, which generates direction, makes the pair of plate-shaped member phase
The active force in the direction for mutually approaching and being separated from each other.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-230255 | 2017-11-30 | ||
| JP2017230255A JP7054170B2 (en) | 2017-11-30 | 2017-11-30 | Belt conveyor equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110015588A true CN110015588A (en) | 2019-07-16 |
| CN110015588B CN110015588B (en) | 2022-07-26 |
Family
ID=66848524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811455452.3A Active CN110015588B (en) | 2017-11-30 | 2018-11-30 | Belt type conveying device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7054170B2 (en) |
| KR (1) | KR20190064464A (en) |
| CN (1) | CN110015588B (en) |
| TW (1) | TW201932389A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102260040A (en) * | 2010-05-25 | 2011-11-30 | 白井科技股份有限公司 | Panel cutting device |
| CN103717052A (en) * | 2012-10-05 | 2014-04-09 | 雅马哈发动机株式会社 | Circuit board transportation device, circuit board working apparatus, and conveyor belt |
| CN103832798A (en) * | 2012-11-21 | 2014-06-04 | 雅马哈发动机株式会社 | Substrate processing line and substrate processing method |
| CN103958424A (en) * | 2011-12-28 | 2014-07-30 | 日本电气硝子株式会社 | Glass plate working device and glass plate working method |
| CN104150758A (en) * | 2008-08-22 | 2014-11-19 | 坂东机工株式会社 | Method and apparatus for working glass plate |
| CN104150756A (en) * | 2012-06-01 | 2014-11-19 | 三星钻石工业股份有限公司 | Substrate breaking device and substrate transportation method of substrate breaking device |
| CN106044220A (en) * | 2015-04-13 | 2016-10-26 | 三星钻石工业股份有限公司 | Substrate conveying apparatus |
| CN107382048A (en) * | 2013-08-28 | 2017-11-24 | 日本电气硝子株式会社 | Glass-film band manufacture method and glass-film band manufacture device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3903820A1 (en) * | 1989-02-09 | 1990-08-23 | Ostma Maschinenbau Gmbh | TRANSFER DEVICE, ESPECIALLY FOR PACKAGING PLANTS FOR PAPER PACKS IN THE PAPER INDUSTRY |
| JP2984924B1 (en) | 1998-06-26 | 1999-11-29 | タグチ工業株式会社 | Telescopic belt conveyor device |
| JP4141720B2 (en) * | 2002-03-29 | 2008-08-27 | 株式会社アマダ | Thermal cutting machine |
| EP1741525A1 (en) | 2005-07-06 | 2007-01-10 | Trumpf Werkzeugmaschinen GmbH + Co. KG | Device for supporting plate materials |
-
2017
- 2017-11-30 JP JP2017230255A patent/JP7054170B2/en active Active
-
2018
- 2018-11-26 KR KR1020180147793A patent/KR20190064464A/en active Search and Examination
- 2018-11-29 TW TW107142630A patent/TW201932389A/en unknown
- 2018-11-30 CN CN201811455452.3A patent/CN110015588B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104150758A (en) * | 2008-08-22 | 2014-11-19 | 坂东机工株式会社 | Method and apparatus for working glass plate |
| CN102260040A (en) * | 2010-05-25 | 2011-11-30 | 白井科技股份有限公司 | Panel cutting device |
| CN103958424A (en) * | 2011-12-28 | 2014-07-30 | 日本电气硝子株式会社 | Glass plate working device and glass plate working method |
| CN104150756A (en) * | 2012-06-01 | 2014-11-19 | 三星钻石工业股份有限公司 | Substrate breaking device and substrate transportation method of substrate breaking device |
| CN103717052A (en) * | 2012-10-05 | 2014-04-09 | 雅马哈发动机株式会社 | Circuit board transportation device, circuit board working apparatus, and conveyor belt |
| CN103832798A (en) * | 2012-11-21 | 2014-06-04 | 雅马哈发动机株式会社 | Substrate processing line and substrate processing method |
| CN107382048A (en) * | 2013-08-28 | 2017-11-24 | 日本电气硝子株式会社 | Glass-film band manufacture method and glass-film band manufacture device |
| CN106044220A (en) * | 2015-04-13 | 2016-10-26 | 三星钻石工业股份有限公司 | Substrate conveying apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190064464A (en) | 2019-06-10 |
| TW201932389A (en) | 2019-08-16 |
| CN110015588B (en) | 2022-07-26 |
| JP2019099302A (en) | 2019-06-24 |
| JP7054170B2 (en) | 2022-04-13 |
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