CN109997028B - 调整对检查体的是否良好判定条件的方法及装置 - Google Patents

调整对检查体的是否良好判定条件的方法及装置 Download PDF

Info

Publication number
CN109997028B
CN109997028B CN201780070386.5A CN201780070386A CN109997028B CN 109997028 B CN109997028 B CN 109997028B CN 201780070386 A CN201780070386 A CN 201780070386A CN 109997028 B CN109997028 B CN 109997028B
Authority
CN
China
Prior art keywords
error
good
value
determination
specimens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201780070386.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN109997028A (zh
Inventor
具大成
金龙
朴基源
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gaoying Technology Co ltd
Koh Young Technology Inc
Original Assignee
Gaoying Technology Co ltd
Koh Young Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gaoying Technology Co ltd, Koh Young Technology Inc filed Critical Gaoying Technology Co ltd
Priority to CN202210685954.5A priority Critical patent/CN115112663B/zh
Publication of CN109997028A publication Critical patent/CN109997028A/zh
Application granted granted Critical
Publication of CN109997028B publication Critical patent/CN109997028B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Program-control systems
    • G05B19/02Program-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/1717Systems in which incident light is modified in accordance with the properties of the material investigated with a modulation of one or more physical properties of the sample during the optical investigation, e.g. electro-reflectance
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N2021/1765Method using an image detector and processing of image signal
    • G01N2021/177Detector of the video camera type
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854Grading and classifying of flaws
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854Grading and classifying of flaws
    • G01N2021/8858Flaw counting
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/00584Control arrangements for automatic analysers
    • G01N35/00722Communications; Identification
    • G01N2035/00891Displaying information to the operator
    • G01N2035/0091GUI [graphical user interfaces]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
CN201780070386.5A 2016-11-14 2017-11-03 调整对检查体的是否良好判定条件的方法及装置 Active CN109997028B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210685954.5A CN115112663B (zh) 2016-11-14 2017-11-03 调整对检查体的是否良好判定条件的方法及装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020160151400A KR20180054063A (ko) 2016-11-14 2016-11-14 검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치
KR10-2016-0151400 2016-11-14
PCT/KR2017/012408 WO2018088760A2 (ko) 2016-11-14 2017-11-03 검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202210685954.5A Division CN115112663B (zh) 2016-11-14 2017-11-03 调整对检查体的是否良好判定条件的方法及装置

Publications (2)

Publication Number Publication Date
CN109997028A CN109997028A (zh) 2019-07-09
CN109997028B true CN109997028B (zh) 2022-07-05

Family

ID=62110763

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201780070386.5A Active CN109997028B (zh) 2016-11-14 2017-11-03 调整对检查体的是否良好判定条件的方法及装置
CN202210685954.5A Active CN115112663B (zh) 2016-11-14 2017-11-03 调整对检查体的是否良好判定条件的方法及装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202210685954.5A Active CN115112663B (zh) 2016-11-14 2017-11-03 调整对检查体的是否良好判定条件的方法及装置

Country Status (6)

Country Link
US (1) US11199503B2 (https=)
EP (2) EP3961332B1 (https=)
JP (2) JP2020500308A (https=)
KR (1) KR20180054063A (https=)
CN (2) CN109997028B (https=)
WO (1) WO2018088760A2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180054063A (ko) * 2016-11-14 2018-05-24 주식회사 고영테크놀러지 검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치
US11366068B2 (en) * 2016-11-14 2022-06-21 Koh Young Technology Inc. Inspection apparatus and operating method thereof
US11113140B2 (en) * 2019-05-20 2021-09-07 Alibaba Group Holding Limited Detecting error in executing computation graph on heterogeneous computing devices
JP7204609B2 (ja) * 2019-07-30 2023-01-16 三菱重工エンジニアリング株式会社 検証処理装置、検証方法及びプログラム
JP7771629B2 (ja) * 2021-11-02 2025-11-18 オムロン株式会社 パラメータ調整支援装置及びパラメータ調整支援方法
CN116242830B (zh) * 2021-12-08 2026-02-03 先进半导体材料(深圳)有限公司 引线框架的瑕疵检测方法
WO2024084675A1 (ja) * 2022-10-21 2024-04-25 株式会社 東芝 判定装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006317266A (ja) * 2005-05-12 2006-11-24 Omron Corp 検査基準設定装置及び方法、並びに、工程検査装置

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5555316A (en) * 1992-06-30 1996-09-10 Matsushita Electric Industrial Co., Ltd. Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component
JPH11258180A (ja) 1998-03-11 1999-09-24 Seiko Epson Corp 外観検査方法及びシステム
CN100428277C (zh) * 1999-11-29 2008-10-22 奥林巴斯光学工业株式会社 缺陷检查系统
JP2001183307A (ja) * 1999-12-27 2001-07-06 Nagoya Electric Works Co Ltd 実装済プリント基板検査装置における判定基準自動調整方法およびその装置
ATE303618T1 (de) * 2000-03-10 2005-09-15 Smiths Detection Inc Steuerung für einen industriellen prozes mit einer oder mehreren multidimensionalen variablen
US6825856B1 (en) * 2000-07-26 2004-11-30 Agilent Technologies, Inc. Method and apparatus for extracting measurement information and setting specifications using three dimensional visualization
US6898305B2 (en) 2001-02-22 2005-05-24 Hitachi, Ltd. Circuit pattern inspection method and apparatus
CA2470477A1 (en) * 2001-12-21 2003-07-10 Donald P. Tuchman Systems and methods for automated quantitative analyses of digitized spectra
JP3733094B2 (ja) 2002-08-22 2006-01-11 トヨタ自動車株式会社 良否判定装置、良否判定プログラムおよび良否判定方法
JP2005092466A (ja) 2003-09-16 2005-04-07 Toshiba Corp 診断プロセス支援方法とそのためのプログラム
JP3940718B2 (ja) * 2003-10-30 2007-07-04 株式会社東芝 試験装置、良否判定基準設定装置、試験方法及び試験プログラム
JP3705296B1 (ja) * 2004-04-30 2005-10-12 オムロン株式会社 品質制御装置およびその制御方法、品質制御プログラム、並びに該プログラムを記録した記録媒体
US7729789B2 (en) * 2004-05-04 2010-06-01 Fisher-Rosemount Systems, Inc. Process plant monitoring based on multivariate statistical analysis and on-line process simulation
BRPI0511299A (pt) * 2004-05-21 2007-12-04 Pressco Tech Inc interface de preparação de usuário para re-inspeção gráfica
JP4453503B2 (ja) 2004-09-28 2010-04-21 オムロン株式会社 基板検査装置および基板検査方法並びに基板検査装置の検査ロジック生成装置および検査ロジック生成方法
US7844100B2 (en) * 2004-11-29 2010-11-30 Applied Materials Israel, Ltd. Method for filtering nuisance defects
JP4694272B2 (ja) * 2005-06-07 2011-06-08 アンリツ株式会社 印刷はんだ検査装置及び印刷はんだ検査方法
JP4645422B2 (ja) 2005-11-18 2011-03-09 オムロン株式会社 判定装置、判定装置の制御プログラム、および判定装置の制御プログラムを記録した記録媒体
JP2007322399A (ja) * 2006-06-05 2007-12-13 Omron Corp 基板検査のための基準値設定方法およびこの方法を用いた基板検査装置
US20090073440A1 (en) * 2006-09-30 2009-03-19 Timothy Tiemeyer System and method for detecting surface features on a semiconductor workpiece surface
JP2009267099A (ja) 2008-04-25 2009-11-12 Omron Corp 基板検査方法および自動外観検査の検査結果確認システム
JP5572293B2 (ja) * 2008-07-07 2014-08-13 株式会社日立ハイテクノロジーズ 欠陥検査方法及び欠陥検査装置
JP2010230452A (ja) 2009-03-26 2010-10-14 Panasonic Electric Works Co Ltd 欠陥検査方法および欠陥検査システム
US9124810B2 (en) * 2010-04-14 2015-09-01 Koh Young Technology Inc. Method of checking an inspection apparatus and method of establishing a measurement variable of the inspection apparatus
JP5625935B2 (ja) 2011-01-18 2014-11-19 オムロン株式会社 判定基準値の適否判定方法およびその適正値の特定方法ならびに適正値への変更方法、部品実装基板の検査システム、生産現場におけるシミュレーション方法およびシミュレーションシステム
JP2013108798A (ja) 2011-11-18 2013-06-06 Keyence Corp 画像処理装置及び該画像処理装置で用いる判定閾値設定方法
JP5390652B2 (ja) 2012-03-01 2014-01-15 株式会社明治 検査装置における良品判定基準設定方法及び良品判定基準設定装置
KR101614061B1 (ko) * 2012-03-29 2016-04-20 주식회사 고영테크놀러지 조인트 검사 장치
JP2013221767A (ja) * 2012-04-13 2013-10-28 Panasonic Corp 外観検査装置および外観検査方法
US9715723B2 (en) * 2012-04-19 2017-07-25 Applied Materials Israel Ltd Optimization of unknown defect rejection for automatic defect classification
KR102153149B1 (ko) 2012-10-24 2020-09-07 도쿄엘렉트론가부시키가이샤 보정값 산출 장치, 보정값 산출 방법 및 컴퓨터 프로그램
JP6405124B2 (ja) * 2014-06-09 2018-10-17 株式会社キーエンス 検査装置、検査方法およびプログラム
US20160189055A1 (en) * 2014-12-31 2016-06-30 Applied Materials Israel Ltd. Tuning of parameters for automatic classification
JP6253860B1 (ja) * 2016-03-28 2017-12-27 三菱電機株式会社 品質管理装置、品質管理方法及び品質管理プログラム
WO2017168630A1 (ja) * 2016-03-30 2017-10-05 株式会社日立ハイテクノロジーズ 欠陥検査装置、欠陥検査方法
KR20180054063A (ko) 2016-11-14 2018-05-24 주식회사 고영테크놀러지 검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치
US11366068B2 (en) * 2016-11-14 2022-06-21 Koh Young Technology Inc. Inspection apparatus and operating method thereof
JP7006567B2 (ja) * 2018-11-09 2022-01-24 オムロン株式会社 撮影方法及び撮影装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006317266A (ja) * 2005-05-12 2006-11-24 Omron Corp 検査基準設定装置及び方法、並びに、工程検査装置

Also Published As

Publication number Publication date
JP2021128174A (ja) 2021-09-02
CN115112663B (zh) 2026-01-09
EP3961332C0 (en) 2024-03-13
EP3961332B1 (en) 2024-03-13
WO2018088760A2 (ko) 2018-05-17
WO2018088760A3 (ko) 2018-08-16
JP7302131B2 (ja) 2023-07-04
CN115112663A (zh) 2022-09-27
EP3540412A2 (en) 2019-09-18
US20190376906A1 (en) 2019-12-12
JP2020500308A (ja) 2020-01-09
US11199503B2 (en) 2021-12-14
CN109997028A (zh) 2019-07-09
KR20180054063A (ko) 2018-05-24
EP3540412B1 (en) 2021-11-24
EP3540412A4 (en) 2020-07-15
EP3961332A1 (en) 2022-03-02

Similar Documents

Publication Publication Date Title
CN109997028B (zh) 调整对检查体的是否良好判定条件的方法及装置
US10445875B2 (en) Pattern-measuring apparatus and semiconductor-measuring system
JP5625935B2 (ja) 判定基準値の適否判定方法およびその適正値の特定方法ならびに適正値への変更方法、部品実装基板の検査システム、生産現場におけるシミュレーション方法およびシミュレーションシステム
JP7354421B2 (ja) エラー要因の推定装置及び推定方法
JP6759034B2 (ja) パターン評価装置及びコンピュータープログラム
JP5583766B2 (ja) 時間的に変化する欠陥分類性能の監視のための方法、システムおよびコンピュータ可読媒体
JP6063630B2 (ja) パターン計測装置、及び半導体計測システム
JP6668262B2 (ja) 自動的なレシピ安定性の監視および報告
KR101615843B1 (ko) 반도체 계측 장치 및 기록 매체
JP2020500308A5 (https=)
US11366068B2 (en) Inspection apparatus and operating method thereof
KR102070858B1 (ko) 검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치
US20090041334A1 (en) Pattern inspection method, pattern inspection apparatus and semiconductor device manufacturing method
US20130283227A1 (en) Pattern review tool, recipe making tool, and method of making recipe
KR102167558B1 (ko) 검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치
JP2024056561A (ja) 検査条件決定システム
JP2019139104A (ja) パターン検査方法およびパターン検査装置
CN118043951A (zh) 用于经由缺陷及电性测试数据的相关性自动诊断及监测半导体缺陷裸片筛选性能的系统
TW201521134A (zh) 晶圓偏移預警系統與方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information
CB02 Change of applicant information

Address after: 15 / F, 14 / F, No.53, Jiashan digital 2 Road, Jinchuan District, Seoul, Korea

Applicant after: Gaoying Technology Co.,Ltd.

Address before: 15 / F, 14 / F, No.53, Jiashan digital 2 Road, Jinchuan District, Seoul, Korea

Applicant before: KOH YOUNG TECHNOLOGY Inc.

CB02 Change of applicant information
CB02 Change of applicant information

Address after: Han Guoshouershi

Applicant after: Gaoying Technology Co.,Ltd.

Address before: 15 / F, 14 / F, No.53, Jiashan digital 2 Road, Jinchuan District, Seoul, Korea

Applicant before: Gaoying Technology Co.,Ltd.

GR01 Patent grant
GR01 Patent grant