CN109968184A - A kind of wafer planarization unit - Google Patents
A kind of wafer planarization unit Download PDFInfo
- Publication number
- CN109968184A CN109968184A CN201910440342.8A CN201910440342A CN109968184A CN 109968184 A CN109968184 A CN 109968184A CN 201910440342 A CN201910440342 A CN 201910440342A CN 109968184 A CN109968184 A CN 109968184A
- Authority
- CN
- China
- Prior art keywords
- wafer
- polishing
- swing arm
- deceleration mechanism
- planarization unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 59
- 238000005498 polishing Methods 0.000 claims abstract description 49
- 239000007921 spray Substances 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims abstract description 3
- 230000005540 biological transmission Effects 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 7
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 210000004907 gland Anatomy 0.000 claims description 5
- 230000033001 locomotion Effects 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 8
- 239000012530 fluid Substances 0.000 abstract description 6
- 238000003754 machining Methods 0.000 abstract description 5
- 238000002955 isolation Methods 0.000 abstract description 2
- IERHLVCPSMICTF-XVFCMESISA-N CMP group Chemical group P(=O)(O)(O)OC[C@@H]1[C@H]([C@H]([C@@H](O1)N1C(=O)N=C(N)C=C1)O)O IERHLVCPSMICTF-XVFCMESISA-N 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007514 turning Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241000233855 Orchidaceae Species 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
Abstract
The invention discloses a kind of wafer planarization units, including polished land chassis and the polished land being positioned above, turntable is polished to be arranged in polished land, polishing swing arm drives rubbing head to swing on polishing turntable, polishing fluid sprays arm, trimmer swing arm, wafer load port shelf and the wafer load platform being positioned above.Only two components of wafer load port shelf and wafer load platform are located at the outside of planarization unit outer cover in above-mentioned component, and remaining part is all located at the inside of planarization unit outer cover.It planarizes unit outer cover and is equipped with mobile door, polishing swing arm drives rubbing head can be by carrying out wafer handling above mobile door to wafer load platform.The driving mechanism of above-mentioned polishing swing arm can be integrally located above or below polished land.The present invention will load and unload wafer device and separate from internal machining area, increase automatic moving door protection isolation in centre, to prevent the liquid of machining area to processing is completed, wafer to be cleaned is being waited to carry out secondary pollution.
Description
Technical field
The invention belongs to the apparatus fields of semiconductor integrated circuit chip manufacture, are related to semiconductor crystal wafer planarization,
More particularly to a kind of wafer planarization unit.
Background technique
Universal and popularization, demand of the chip industry to microchip with mobile technology and intellectual technology constantly expand,
Therefore requirement of the limited and high factory floor space of wafer foundry to equipment capacity is higher and higher.CMP(Chemical
Mechanical Planarization) equipment is key technology on chip manufacturing process.By CMP tool, the system of chip
Making may be implemented from plane to three-dimensional expansion, and the volume of chip can just become small, therefore it is processed in chain in wafer
It is a very critical process.
As the important indicator examined to CMP tool, the productivity of CMP tool is very crucial.Existing CMP tool
Structure be usually by cross header turning tower structure and four station apparatus (three planarization rotary tables and a load station) and
What four rubbing heads on header turning tower structure formed.When work, first passes through rubbing head and take out the wafer in load station, rotation ten
A upper wafer processed is put on loading position vacant at this time by word capstan head, is then mounted with the rubbing head of wafer by work
Sequence is placed on each station, is radially moved linearly back and forth along cross capstan head to realize whole wafer when operation by rubbing head
Covering, wafer is placed into load station is again taken away by manipulator after processing is completed.
The shortcomings that above equipment is that entire mechanism is more huge, and structure is complicated.Since cross capstan head need to frequently rotate greatly
Perhaps, angular range, the data line for leading to be loaded in sensor above and then rotate wide-angle, are easy to influence the measurement of sensor
Stability.Just complete machine is needed to stop working when the one of component of equipment needs repairing, is greatly lowered making for equipment in this way
With rate, and the technology stability that will lead to when wafer processing is poor.
Summary of the invention
The present invention proposes a kind of wafer planarization unit of modularized design regarding to the issue above, this modularized design
Planarization unit can be defined required element number by customer process demand.This unit is divided to two regions, and a part exists
Be known as planarization unit inside unit, inside containing polished land, polishing turntable, rubbing head, polishing swing arm, trimmer swing arm,
Polishing fluid sprays arm, and another region is the effect that loading stage undertakes wafer handling.
The technical scheme is that a kind of wafer planarization unit, comprising: polished land chassis and be positioned above
Polished land, polishing turntable are arranged in polished land, and polishing swing arm drives rubbing head to swing on polishing turntable, polishing fluid spray
Spread arm, trimmer swing arm, wafer load port shelf and the wafer load platform being positioned above.Only wafer loads and unloads in above-mentioned component
Two components of rack and wafer load platform are located at the outside of planarization unit outer cover, and remaining part is all located at outside planarization unit
The inside of cover.It planarizes unit outer cover and is equipped with mobile door, polishing swing arm drives rubbing head can be by mobile door to wafer load
Wafer handling are carried out above platform.
Mobile door is in off state when polishing operation, and when wafer handling operation, mobile door was in an open state, and is completed polishing and is made
After industry, inside and outside gas circulation is cut off by the switch of mobile door.
The driving method of mobile door can drive for motor driven or cylinder.
As one of technical characteristics of the invention, it is flat that the driving mechanism of above-mentioned polishing swing arm can be integrally located at polishing
Above or below platform.
When the driving mechanism for polishing swing arm is integrally located at the top of polished land, above-mentioned driving mechanism includes motor, subtracts
Fast mechanism, deceleration mechanism flange, the shell of the stator connection deceleration mechanism of motor, the shell of deceleration mechanism pass through deceleration institutionalization
Orchid connection polishing swing arm.
Preferably, the stator of motor passes through the shell of itself flange and screw connection deceleration mechanism.
When the driving mechanism for polishing swing arm is integrally located at the lower section of polished land, the driving mechanism includes motor, subtracts
Fast mechanism, deceleration mechanism flange, on the shell of motor and the shell of deceleration mechanism, machine shaft transmission input deceleration mechanism subtracts
Fast mechanism is installed to transmission axle housing lower end surface by retarder flange.
The output shaft of above-mentioned deceleration mechanism is transmitted on transmission shaft by shaft coupling, then passes through swing arm gland for torque transfer
Onto polishing swing arm.
Compared with the polishing structure of cross header turning tower structure, present invention has an advantage that
1, independent functional structure and machining area are contained in unit, ensure that the stability of technique, and this unit by
In using modularized design, it is possible to which by client, customized quantity defines CMP group quantity freely to meet difference on demand
Processing technology requirement.
2, in internal mechanism operation, external wafer load mechanism can be with separate operaton, therefore reduces because loading wafer
And stop operation the problem of influencing processing efficiency.Just being met by the structure of a swing arm can polish but also fill originally
The requirement for unloading wafer simplifies original cross capstan head and adds linear motion to be just able to satisfy its processing and load the complicated knot of wafer demand
Structure.
3, handling wafer device is separated from internal machining area, increases automatic moving door protection isolation in centre, to prevent adding
The liquid in work area domain is to being completed processing, wafer to be cleaned is being waited to carry out secondary pollution.
4, because structure optimization occupied area is small, therefore the output capacity in average every square metre of the occupied area in cleaning shop is big
It is big to increase.In group's operation if there is wherein unit module break down the state for entering maintenance when, other lists in CMP group
Member is without stopping operation.
5, the cable torsion angle of the upper related electric original part of swing arm rotation is less than 180 degree, construction torsion angle before being
Half, therefore reduce cable because of accident rate caused by torsional fatigue.
Detailed description of the invention
Fig. 1 is that the axial view of relevant device of the present invention is intended to；
Fig. 2 is the half-section diagram that embodiment 1 polishes swing arm structure；
Fig. 3 is the half-section diagram that embodiment 2 polishes swing arm structure；
The meaning of appended drawing reference in figure: 1. wafer load port shelfs, 2. wafer load platforms, 3. polishing swing arms, 4. mobile doors,
5. planarizing unit outer cover, 6. polishing fluids spray arm, 7. rubbing heads, 8. trimmer swing arms, 9. polished lands, 10. polished lands
Chassis, 11. polishing turntables, 12. deceleration mechanisms, 13. deceleration mechanism flanges, 14. deceleration mechanism shaft couplings, 15. bearing inner races lock
Mother, 16. lower bearings, 17. upper bearing (metal) glands, 18. top bearings, 19. keys, 20. motors, 21. lower axle bearing outer-ring pressure rings, 22. is solid
Dead axle, 23. swing arm glands, matched bearings inner ring locknut on 24., 25. transmission shafts, 26. matched bearings, 27. transmission axle housings, 28.
Lower matched bearings locknut, 29 bearing spacers, 30. lower axle pressure caps, 31. retarder flanges.
Specific embodiment
The invention will now be described in further detail with reference to the accompanying drawings.
The axial schematic diagram of wafer planarization unit of the present invention is as shown in Figure 1, include wafer load port shelf 1, wafer dress
Microscope carrier 2, polishing swing arm 3, mobile door 4, planarization unit outer cover 5, polishing fluid spray arm 6, rubbing head 7, trimmer swing arm 8, throw
Optical platform 9, polished land chassis 10 form.When polishing, polishing swing arm 3 is with rubbing head 7 and polishing fluid is cooperated to spray arm 6 and repair
Stock removal polishing operation is completed in whole device swing arm 8 jointly.After mobile door 4 is opened, polishing swing arm 3 is with rubbing head 7 and the crystalline substance loaded
Circle, which is swung to above wafer load platform 2, to be unloaded.Inside is swung to after completion of discharge, while mobile door 4 is closed, and is then carried out
Second of polishing operation.
To implement the present invention convenient for those skilled in the art, following two embodiment is now provided.
Embodiment 1: as shown in Fig. 2, all mechanisms of polishing swing arm 3 are placed on the top of polished land 9, mechanism is formed such as
Under: the shell of the stator connection deceleration mechanism 12 of motor 20, the shell of deceleration mechanism 12 are thrown by the connection of deceleration mechanism flange 13
Light swing arm 3, polishing swing arm 3 are equipped with rubbing head 7 on one side, and the another side inner upper end of swing arm 3 contains top bearing 18, and lower end contains
There is lower bearing 16 to guarantee that the rotating accuracy of swing arm 3, the Internal and external cycle of top bearing 10 pass through included flange screw hole and fixation
Axis 4 and polishing swing arm 3 connect, and the axial float of bearing 16 is stopped by nut 15 and the shaft shoulder of swing arm 3.20 rotor of motor
By connecting deceleration mechanism 12, the output shaft of deceleration mechanism 12 connects lower section fixing axle 22 by shaft coupling 14.
When work, the rotor of motor 20 is rotated, and is exported by deceleration mechanism 12, and the output shaft of deceleration mechanism 12 passes through shaft coupling
Device 14 and fixing axle 4 are connected by key 19, since fixing axle 4 can not rotate, the output shaft of deceleration mechanism 2 are caused also to be fixed
It can not rotate, while therefore the rotor of motor 20 can not also rotate.But the shell of deceleration mechanism 12 is due to fixing,
Entire drive connection is that the shell of motor 20 is rotated together with the shell and swing arm 3 of deceleration mechanism 12, to realize mechanism
Polishing when swing and handling wafer when swing position two movement.All movements are in planarization unit outer cover 5
It carries out, and wafer load platform 2 can carry out wafer loading and unloading with external agency at any time, have no effect on the fortune of internal polishing mechanism
Row.
Embodiment 2: as shown in figure 3, the lower section that all mechanisms of swing arm 3 are placed on polished land 9 is polished, mechanism connection relationship
As follows: the shell of motor 20 is connected with screw with the shell of deceleration mechanism 12, and 20 rotating shaft transmission of motor inputs deceleration mechanism 12,
Deceleration mechanism 12 is installed to transmission 27 lower end surface of axle housing by retarder flange 31.
When work, the torque of motor 20 is exported by the output shaft of deceleration mechanism 12, is then transmitted to by shaft coupling 14
On transmission shaft 25, while transmission shaft 25 is radial and axial fixed by two groups of bearings 26, and the play between two groups of bearings 26 is logical
Axle sleeve 29 is crossed to stop, and play passes through upper matched bearings locknut 24 and lower matched bearings locknut to two groups of bearing inner races respectively up and down
28 stop, and the outside play of two groups of bearing outer rings then prevented by upper bearing (metal) gland 17 and lower axle pressure cap 30.Transmission shaft
25 are transmitted torque in polishing swing arm 3 by flange 23, realize the swing that the device polishes wafer on polishing turntable 11
With positioning when handling wafer.All movements are to carry out in planarization unit outer cover 5, and wafer load platform 2 can be at any time
Wafer loading and unloading is carried out with external agency, has no effect on the operation of internal polishing mechanism.
The present invention provides it is a kind of can separate operaton can group operation CMP tool unit (chemical-mechanical planarization list
Member).Contain independent functional structure and machining area in unit, it is ensured that the stability of technique.And this unit is due to using
Modularized design can freely define CMP group quantity, by client's customized quantity on demand to meet different processing technologys
It is required that.
The description of the above specific embodiment is not intended to limit the invention, all within the spirits and principles of the present invention institute
Any modification, equivalent substitution, improvement and etc. of work, should all be included in the protection scope of the present invention.
Claims (8)
1. a kind of wafer planarization unit, comprising: polished land chassis (10) and the polished land (9) being positioned above, polishing
Turntable (11) is arranged on polished land (9), and polishing swing arm (3) drives rubbing head (7) to swing in polishing turntable (11), polishes
Liquid sprays arm (6), trimmer swing arm (8), wafer load port shelf (1) and the wafer load platform (2) being positioned above, special
Sign is that wafer load port shelf (1) and wafer load platform (2) are located at the outside of planarization unit outer cover (5) in above-mentioned component,
It planarizes unit outer cover (5) to be equipped with mobile door (4), polishing swing arm (3) drives rubbing head (7) can be by mobile door (4) to crystalline substance
Wafer handling are carried out above circle loading stage (2).
2. wafer planarization unit as described in claim 1, it is characterised in that mobile door is in off state when polishing operation, brilliant
Mobile door is in an open state when circle handling operation.
3. wafer planarization unit as described in claim 1, it is characterised in that the driving method of the movement door is motor drive
The driving of dynamic or cylinder.
4. wafer planarization unit as described in claim 1, it is characterised in that the driving mechanism of polishing swing arm (3) is whole
Above or below polished land.
5. wafer planarization unit as claimed in claim 4, it is characterised in that the driving mechanism includes motor (20), slows down
Mechanism (12), deceleration mechanism flange (13), the shell of stator connection deceleration mechanism (12) of motor (20), deceleration mechanism (12)
Shell passes through deceleration mechanism flange (13) connection polishing swing arm (3).
6. wafer planarization unit as claimed in claim 5, it is characterised in that the stator of the motor by itself flange and
The shell of screw connection deceleration mechanism.
7. wafer planarization unit as claimed in claim 4, it is characterised in that the driving mechanism includes motor (20), slows down
Mechanism (12), deceleration mechanism flange (13), on the shell of motor (20) and the shell of deceleration mechanism, motor (20) rotating shaft transmission is defeated
Enter mechanism of slowing down (12), deceleration mechanism is installed to transmission axle housing (27) lower end surface by retarder flange (31).
8. wafer planarization unit as claimed in claim 7, it is characterised in that the output shaft of the deceleration mechanism (12) passes through
Shaft coupling (14) is transmitted on transmission shaft (25), then is transmitted torque in polishing swing arm (3) by swing arm gland (23).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811466539.0A CN109262444A (en) | 2018-12-03 | 2018-12-03 | Wafer planarization unit |
| CN2018114665390 | 2018-12-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109968184A true CN109968184A (en) | 2019-07-05 |
Family
ID=65187333
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811466539.0A Pending CN109262444A (en) | 2018-09-07 | 2018-12-03 | Wafer planarization unit |
| CN201910440342.8A Pending CN109968184A (en) | 2018-12-03 | 2019-05-24 | A kind of wafer planarization unit |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811466539.0A Pending CN109262444A (en) | 2018-09-07 | 2018-12-03 | Wafer planarization unit |
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| CN (2) | CN109262444A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110815035A (en) * | 2019-11-14 | 2020-02-21 | 杭州众硅电子科技有限公司 | Chemical mechanical planarization equipment combining grinding and single-wafer cleaning module |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG11202103477TA (en) * | 2018-09-07 | 2021-05-28 | Hangzhou Zhonggui Electronic Technology Co Ltd | Chemical-mechanical planarization device, wafer transfer method and wafer planarization unit |
| CN110246781B (en) * | 2019-05-29 | 2021-06-22 | 桂林立德智兴电子科技有限公司 | Semiconductor wafer flattening equipment |
| CN110170916A (en) * | 2019-06-25 | 2019-08-27 | 吉姆西半导体科技（无锡）有限公司 | Wafer planarization equipment grinding head rotating mechanism |
| CN110125794A (en) * | 2019-06-25 | 2019-08-16 | 吉姆西半导体科技（无锡）有限公司 | Wafer planarization equipment |
| CN110682204A (en) * | 2019-11-20 | 2020-01-14 | 上海超硅半导体有限公司 | Unloading device and chemical mechanical polishing auxiliary equipment |
| CN114147611B (en) * | 2021-09-07 | 2022-10-04 | 杭州众硅电子科技有限公司 | Wafer polishing system |
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|---|---|---|---|---|
| JPS5748472A (en) * | 1980-09-04 | 1982-03-19 | Mitsubishi Metal Corp | Polishing apparatus |
| CN103522191A (en) * | 2013-09-26 | 2014-01-22 | 中国电子科技集团公司第四十五研究所 | Polishing pad dressing device applied to wafer chemical-mechanical planarization equipment |
| CN104617025A (en) * | 2015-01-12 | 2015-05-13 | 北京七星华创电子股份有限公司 | Multi-cavity stack wafer processing apparatus and wafer processing method |
| CN206105586U (en) * | 2016-09-26 | 2017-04-19 | 天津华海清科机电科技有限公司 | Polishing machine |
| CN106737055A (en) * | 2016-12-01 | 2017-05-31 | 天津华海清科机电科技有限公司 | Chemical-mechanical polishing mathing and the polishing assembly for it |
| CN106952804A (en) * | 2015-12-18 | 2017-07-14 | 格罗方德半导体公司 | Wafer polishing is cleaned afterwards |
| CN108541334A (en) * | 2015-11-13 | 2018-09-14 | 胜高股份有限公司 | Polishing wafer method and device |
-
2018
- 2018-12-03 CN CN201811466539.0A patent/CN109262444A/en active Pending
-
2019
- 2019-05-24 CN CN201910440342.8A patent/CN109968184A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5748472A (en) * | 1980-09-04 | 1982-03-19 | Mitsubishi Metal Corp | Polishing apparatus |
| CN103522191A (en) * | 2013-09-26 | 2014-01-22 | 中国电子科技集团公司第四十五研究所 | Polishing pad dressing device applied to wafer chemical-mechanical planarization equipment |
| CN104617025A (en) * | 2015-01-12 | 2015-05-13 | 北京七星华创电子股份有限公司 | Multi-cavity stack wafer processing apparatus and wafer processing method |
| CN108541334A (en) * | 2015-11-13 | 2018-09-14 | 胜高股份有限公司 | Polishing wafer method and device |
| CN106952804A (en) * | 2015-12-18 | 2017-07-14 | 格罗方德半导体公司 | Wafer polishing is cleaned afterwards |
| CN206105586U (en) * | 2016-09-26 | 2017-04-19 | 天津华海清科机电科技有限公司 | Polishing machine |
| CN106737055A (en) * | 2016-12-01 | 2017-05-31 | 天津华海清科机电科技有限公司 | Chemical-mechanical polishing mathing and the polishing assembly for it |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110815035A (en) * | 2019-11-14 | 2020-02-21 | 杭州众硅电子科技有限公司 | Chemical mechanical planarization equipment combining grinding and single-wafer cleaning module |
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| CN109262444A (en) | 2019-01-25 |
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Application publication date: 20190705 |