CN109930026A - A kind of high-strength high conductivity, proof stress relaxation Copper Alloys for Lead Frame and preparation method thereof - Google Patents
A kind of high-strength high conductivity, proof stress relaxation Copper Alloys for Lead Frame and preparation method thereof Download PDFInfo
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Abstract
The present invention relates to a kind of high-strength high conductivities, proof stress relaxation Copper Alloys for Lead Frame and preparation method thereof, belong to non-ferrous metals processing field.The weight percent of the material forms are as follows: Ni 3.0~4.0%, P 0.3~0.5%, Si 0.2~0.4%, Sn 0.03~0.1%, Fe 0.5~1%, Co 0.05~0.2%, remaining is Cu.By melting and casting, hot rolling, roughing, intermediate annealing, pickling, in roll, solution treatment, pickling, finish rolling obtains after the working processes such as ageing treatment.The tensile strength of blaster fuse frame material of the invention is 700~850MPa, conductivity is 40~50%IACS, elongation percentage is 6~10%, stress relaxation resistance is 88~92%, with high-strength high conductivity, high resistance to stress relaxation property, large scale integrated circuit can satisfy to the requirement of middle and high end blaster fuse frame material.
Description
Technical field
The present invention relates to a kind of high-strength high conductivity, proof stress relaxation Copper Alloys for Lead Frame and preparation method thereof,
Belong to non-ferrous metals processing field.
Background technique
Hyundai electronics information technology core component is integrated circuit, is mainly formed by chip and lead frame are encapsulated,
Wherein lead frame mainly plays support chip, protection internal element, connection external circuit and the work for distributing elements heat outward
With being the critical material in integrated circuit.With the rapid development of electronic information new and high technology, product is to micro-, thin, light, more function
Energy and intelligent development, promote integrated circuit to develop to extensive, super large and great scale direction.Therefore, blaster fuse frame material
Develop therewith towards the direction of the miniaturization of lead pitch, multiway.This not only proposes the intensity of blaster fuse frame material and electric conductivity
Go out higher requirement, and the processing performance of material has been put forward higher requirements, especially more pays close attention to the anti-softening temperature of material
Degree and stress relaxation-resistant characteristic.
Copper-based lead frame mainly has several alloys such as C19210, C19400 and C70250 on domestic market, due to
C19210 and C19400 alloy strength and electric conductivity are not unable to satisfy the intensity and multiway of super large-scale integration
Growth requirement, which are mainly applied to low and middle-end blaster fuse frame materials.C70250 alloy is a kind of high-end integrated circuit lead
Frame material, conductivity is about 45%IACS, tensile strength is greater than 600MPa；But this alloy is in process of production, needs
Special quenching aging sequence and equipment, production technology is complex, and production cost is higher, and product domestic at present can only
Meet low and middle-end client's requirement, affects the industrialization and application of alloy.
Summary of the invention
The main object of the present invention is to make up the deficiency of existing copper alloy property, develops a kind of high-strength high conductivity, resistance to
Stress relaxation-resistant type Cu alloy material and a kind of simple production process, easy to operate preparation method are provided, met ultra-large
Or great scale integrated circuit is to the requirement of blaster fuse frame material.
In order to achieve the above object, the present invention is implemented as follows:
A kind of high-strength high conductivity, the Copper Alloys for Lead Frame of resistance to stress relaxation-resistant, its weight percent composition are as follows:
Ni 3.0~4.0%, P 0.3~0.5%, Si 0.2~0.4%, Sn 0.03~0.1%, Fe 0.5~1%, Co 0.05~
0.2%, remaining is Cu.
Preferably, the weight percent of the high-strength high conductivity, the Copper Alloys for Lead Frame of resistance to stress relaxation-resistant
Composition are as follows: Ni 3.3~3.7%, P 0.4~0.5%, Si 0.2~0.3%, Sn 0.05~0.08%, Fe 0.8~1%,
Co 0.1~0.15%, remaining is Cu.
Added alloys producing:
Nickel: nickel element mainly forms nickel phosphorus precipitated phase, nisiloy precipitated phase and nickel tin precipitated phase with phosphorus, tin, element silicon, significantly
Improve intensity, conduction and the stress relaxation resistance of alloy.
Tin: the addition of tin element can form nickel tin precipitated phase with nickel element.Additionally, due to tin atom and copper atom radius
It differs larger, a small amount of tin element is added in copper alloy, biggish distortion of lattice can be caused, the effective movement for hindering dislocation,
Especially in alloy stress relaxation, dislocation can be effectively pulled, improves alloy stress relaxation-resistant.
Phosphorus: phosphorus is combined with nickel element, is formed nickel phosphorus compound, can effectively be hindered the movement of dislocation, improve alloy
Stress relaxation resistance.It can react simultaneously with oxygen, play the role of deoxygenation
Silicon: element silicon adds the precipitation that can promote alloying element, while can inhibit growing up for precipitated phase, improves alloy
Intensity and stress relaxation resistance.
Iron: ferro element can form iron phosphorus precipitated phase with phosphorus, improve the intensity and conductivity of alloy, while can promote other analysis
The precipitation of phase out, and improve the anticorrosion stress-resistant sensibility of alloy.
Cobalt: the addition of cobalt element can promote nickel element precipitation in Copper substrate, can effective Collaborative Control precipitated phase analysis
Out and grow up.
It is a further object of the present invention to provide above-mentioned high-strength high conductivities, the Copper Alloys for Lead Frame of resistance to stress relaxation-resistant
Preparation processing method.
The preparation processing method of a kind of high-strength high conductivity, the copper alloy leads of resistance to stress relaxation-resistant material, including following work
Skill process: a. carries out ingredient according to mass percent, feeds intake, melting and casting, b. hot rolling, c. roughing, d. trimming, moves back among e.
Fire, f. pickling are rolled in g., h. solution treatment, i. finish rolling, j. ageing treatment, k. white picking, l. stretch-bending straightening, and m. sub-cut enters
Library.
In step a, founding is carried out under non-vacuum environment using power frequency induction furnace, the temperature of the melting is 1250~
1300 DEG C, the temperature of the casting is controlled at 1200~1250 DEG C.
Before melting, cathode copper is added in induction furnace, electrolytic nickel, pure tin, copper phosphorus intermediate alloy, pure cobalt, closes among copper and iron
Temperature is risen to 1250~1300 DEG C by gold and copper silicon intermediate alloy, and after copper fusing to be electrolysed, the charcoal for adding calcination is covered
Lid after being sufficiently stirred, stands 15min, and casting temperature is 1200~1250 DEG C, carries out semi-continuous casting.
In step b, semi-continuous casting ingot casting is subjected to hot rolling, 850~950 DEG C of hot-rolled temperature, keeps the temperature 1~3h, deflection
It is 80~90%.
In step c, the ingot blank after hot rolling is subjected to roughing, deflection is 60~80%.
In step e, the cold-reduced sheet after trimming is placed in bell-type annealing furnace and carries out intermediate annealing, annealing temperature 550
~600 DEG C, annealing time is 4~6h.
In step g, it will be rolled in the plate progress after pickling, deflection is 60~80%.
In step h, the Strip after rolling by carries out solution treatment, and solid solubility temperature is 800~850 DEG C, annealing time 4
~6h.
In step i, the band after pickling is subjected to finish rolling, deflection is 30~60%, preferably 40~50%.
In step j, the band after finish rolling is placed in bell-type annealing furnace and carries out ageing treatment, aging temperature is
400~500 DEG C, annealing time is 3~8h.
Advantages of the present invention: the present invention is by carrying out ingredient design and optimization to copper alloy, relative to high-end C7025 lead
It is a kind of high-strength high conductivity, the Copper Alloys for Lead Frame of resistance to stress relaxation-resistant, chemical component for frame material are as follows:
Nickel content is 3.0~4.0%, and phosphorus content is 0.3~0.5%, and silicone content is 0.2~0.4%, and iron content is 0.5~1%, cobalt
Content is 0.05~0.2%, remaining is copper.In addition, the present invention has developed a kind of preparation processing suitable for above-mentioned copper alloy
Method, high-strength high conductivity, proof stress relaxed type Copper Alloys for Lead Frame tensile strength after processed heat treatment are 700
~850MPa, conductivity are 40~50%IACS, and elongation percentage is 6~10%, and stress relaxation resistance (works at 120 DEG C
1000h) it is 88~92%, for high-end lead frame C7025 alloy, there is high-strength high conductivity, high resistance to stress pine
Relaxation characteristic can satisfy large scale integrated circuit to the requirement of middle and high end blaster fuse frame material completely.
Below by specific embodiment, the present invention will be further described, but is not meant to the scope of the present invention
Limitation.
Specific embodiment
High-strength high conductivity of the invention, proof stress relaxation Copper Alloys for Lead Frame, it contains following weight percent
Several chemical components: Ni 3.0~4.0%, P 0.3~0.5%, Si 0.2~0.4%, Sn 0.03~0.1%, Fe 0.5~
1%, Co 0.05~0.2%, remaining is Cu.
The preparation and processing method of above-mentioned high-strength high conductivity, the Copper Alloys for Lead Frame of resistance to stress relaxation-resistant, including
Following process flow: including following process flow:
A. carry out ingredient according to mass percent, feed intake, melting and casting, before melting, be added in induction furnace cathode copper,
Electrolytic nickel, pure tin, copper phosphorus intermediate alloy, pure cobalt, copper and iron and copper silicon intermediate alloy, rise to 1250~1300 DEG C for temperature, to electricity
After solving copper fusing, the charcoal for adding calcination is covered, and after being sufficiently stirred, is stood 15min, is carried out semi-continuous casting；
Semi-continuous casting ingot casting is carried out hot rolling, 850~950 DEG C of hot-rolled temperature, keeps the temperature 1~3h, deflection is by b. hot rolling
80~90%；
Ingot blank after hot rolling is carried out roughing by c. roughing, and deflection is 60~80%；
D. trimming；
Cold-reduced sheet after trimming is placed in bell-type annealing furnace and carries out intermediate annealing by e. intermediate annealing, and annealing temperature is
550~600 DEG C, annealing time is 4~6h；
F. pickling；
G. it rolls, will be rolled in the plate progress after pickling, deflection is 60~80% in；
H. solution treatment, the Strip after rolling by carry out solution treatment, and solid solubility temperature is 800~850 DEG C, annealing time
For 4~6h；
Band after pickling is carried out finish rolling by i. finish rolling, and deflection is 30~50%；
Band after finish rolling is placed in bell-jar annealing and carries out ageing treatment by j. ageing treatment, and aging temperature is
400~500 DEG C, annealing time is 3~8h；
K. pickling；
L. stretch-bending straightening；
M. sub-cut is put in storage.
Embodiment 1
Alloy of the invention uses following raw material melting: cathode copper, electrolytic nickel, pure tin, copper phosphorus intermediate alloy, pure cobalt, copper
Iron and copper silicon intermediate alloy, the ingredient of alloy are shown in Table 1 embodiment 1.
1. melting: cathode copper, electrolytic nickel, pure tin, copper phosphorus intermediate alloy, pure cobalt, copper and iron and copper silicon being added in induction furnace
Temperature is risen to 1250 DEG C by intermediate alloy, and after copper fusing to be electrolysed, the charcoal for adding calcination is covered, quiet after being sufficiently stirred
15min is set, casting temperature is 1250 DEG C, carries out semi-continuous casting.
2. hot rolling: semi-continuous casting ingot casting being carried out hot rolling, 900 DEG C of hot-rolled temperature, keeps the temperature 2h, deflection 85%.
3. roughing: the ingot blank after hot rolling is carried out roughing, deflection 80%.
4. intermediate annealing: the cold-reduced sheet after trimming being placed in bell-type annealing furnace and carries out intermediate annealing, annealing temperature is
600 DEG C, annealing time 4h.
It rolls: will be rolled in the plate progress after pickling, deflection 60% in 5..
6. solution treatment: the Strip after rolling by carries out solution treatment, and solid solubility temperature is 850 DEG C, annealing time 4h.
7. finish rolling: the band after pickling is carried out finish rolling, deflection 50%.
8. ageing treatment: the band after finish rolling being placed in bell-type annealing furnace and carries out ageing treatment, aging temperature
It is 500 DEG C, annealing time 3h.
By the above melting and casting, hot rolling, breaking down, intermediate annealing, in roll, solution treatment, finish rolling, ageing treatment etc. add
After work processing, performance is shown in Table the embodiment 1 in 2.
Embodiment 2
Alloy of the invention uses following raw material melting: cathode copper, electrolytic nickel, pure tin, copper phosphorus intermediate alloy, pure cobalt, copper
Iron and copper silicon intermediate alloy, the ingredient of alloy are shown in Table 1 embodiment 2.
1. melting: cathode copper, electrolytic nickel, pure tin, copper phosphorus intermediate alloy, pure cobalt, copper and iron and copper silicon being added in induction furnace
Temperature is risen to 1300 DEG C by intermediate alloy, and after copper fusing to be electrolysed, the charcoal for adding calcination is covered, quiet after being sufficiently stirred
15min is set, casting temperature is 1200 DEG C, carries out semi-continuous casting.
2. hot rolling: semi-continuous casting ingot casting being carried out hot rolling, 850 DEG C of hot-rolled temperature, keeps the temperature 1h, deflection 80%.
3. roughing: the ingot blank after hot rolling is carried out roughing, deflection 60%.
4. intermediate annealing: the cold-reduced sheet after trimming being placed in bell-type annealing furnace and carries out intermediate annealing, annealing temperature is
550 DEG C, annealing time 6h.
It rolls: will be rolled in the plate progress after pickling, deflection 80% in 5..
6. solution treatment: the Strip after rolling by carries out solution treatment, and solid solubility temperature is 800 DEG C, annealing time 6h.
7. finish rolling: the band after pickling is carried out finish rolling, deflection 30%.
8. ageing treatment: the band after finish rolling being placed in bell-type annealing furnace and carries out ageing treatment, aging temperature
It is 400 DEG C, annealing time 8h.
By the above melting and casting, hot rolling, breaking down, intermediate annealing, in roll, solution treatment, finish rolling, ageing treatment etc. add
After work processing, performance is shown in Table the embodiment 2 in 2.
Embodiment 3
Alloy of the invention uses following raw material melting: cathode copper, electrolytic nickel, pure tin, copper phosphorus intermediate alloy, pure cobalt, copper
Iron and copper silicon intermediate alloy, the ingredient of alloy are shown in Table 1 embodiment 3.
1. melting: cathode copper, electrolytic nickel, pure tin, copper phosphorus intermediate alloy, pure cobalt, copper and iron and copper silicon being added in induction furnace
Temperature is risen to 1275 DEG C by intermediate alloy, and after copper fusing to be electrolysed, the charcoal for adding calcination is covered, quiet after being sufficiently stirred
15min is set, casting temperature is 1225 DEG C, carries out semi-continuous casting.
2. hot rolling: semi-continuous casting ingot casting being carried out hot rolling, 950 DEG C of hot-rolled temperature, keeps the temperature 3h, deflection 90%.
3. roughing: the ingot blank after hot rolling is carried out roughing, deflection 70%.
4. intermediate annealing: the cold-reduced sheet after trimming being placed in bell-type annealing furnace and carries out intermediate annealing, annealing temperature is
570 DEG C, annealing time 5h.
It rolls: will be rolled in the plate progress after pickling, deflection 70% in 5..
6. solution treatment: the Strip after rolling by carries out solution treatment, and solid solubility temperature is 825 DEG C, annealing time 5h.
7. finish rolling: the band after pickling is carried out finish rolling, deflection 40%.
8. ageing treatment: the band after finish rolling being placed in bell-type annealing furnace and carries out ageing treatment, aging temperature
It is 450 DEG C, annealing time 5h.
By the above melting and casting, hot rolling, breaking down, intermediate annealing, in roll, solution treatment, finish rolling, ageing treatment etc. add
After work processing, performance is shown in Table the embodiment 3 in 2.
The alloy property table of 1 embodiment 1-3 of table
| Alloy | Ni | P | Si | Sn | Fe | Co | Cu |
| Embodiment 1 | 3 | 0.5 | 0.2 | 0.03 | 0.5 | 0.2 | Surplus |
| Embodiment 2 | 3.5 | 0.4 | 0.3 | 0.07 | 0.7 | 0.14 | Surplus |
| Embodiment 3 | 4 | 0.3 | 0.4 | 0.1 | 1 | 0.05 | Surplus |
The alloy property table of 2 embodiment 1-3 of table
The tensile strength of blaster fuse frame material of the invention is 700~850MPa, and conductivity is 40~50%IACS, is extended
Rate is 6~10%, and stress relaxation resistance (work 1000h at 120 DEG C) is 88~92%, relative to high-end lead frame
For C7025 alloy, there is high-strength high conductivity, high resistance to stress relaxation property.
Claims (10)
1. a kind of high-strength high conductivity, the Copper Alloys for Lead Frame of resistance to stress relaxation-resistant, it is characterised in that: its weight percent
Than composition are as follows: Ni 3.0~4.0%, P 0.3~0.5%, Si 0.2~0.4%, Sn 0.03~0.1%, Fe 0.5~1%,
Co 0.05~0.2%, remaining is Cu.
2. high-strength high conductivity according to claim 1, the Copper Alloys for Lead Frame of resistance to stress relaxation-resistant, feature exist
In: the weight percent composition of the material are as follows: Ni 3.3~3.7%, P 0.4~0.5%, Si 0.2~0.3%, Sn 0.05
~0.08%, Fe 0.8~1%, Co 0.1~0.15%, remaining is Cu.
3. the preparation of high-strength high conductivity according to claim 1 or 2, the Copper Alloys for Lead Frame of resistance to stress relaxation-resistant
Method, it is characterised in that: the following steps are included: a. carries out ingredient according to mass percent, feeds intake, melting and casting, b. hot rolling,
C. roughing, d. trimming, e. intermediate annealing, f. pickling are rolled in g., h. solution treatment, i. finish rolling, j. ageing treatment, k. quadratic acid
It washes, l. stretch-bending straightening, m. sub-cut storage.
4. the preparation side of high-strength high conductivity according to claim 3, the Copper Alloys for Lead Frame of resistance to stress relaxation-resistant
Method, it is characterised in that: founding is carried out using power frequency induction furnace, the temperature of the melting is 1250~1300 DEG C, the casting
Temperature is 1200~1250 DEG C.
5. the preparation side of high-strength high conductivity according to claim 3, the Copper Alloys for Lead Frame of resistance to stress relaxation-resistant
Method, it is characterised in that: semi-continuous casting ingot casting is subjected to hot rolling, 850~950 DEG C of hot-rolled temperature, keeps the temperature 1~3h, deflection is
80~90%.
6. the preparation side of high-strength high conductivity according to claim 3, the Copper Alloys for Lead Frame of resistance to stress relaxation-resistant
Method, it is characterised in that: the ingot blank after hot rolling is subjected to roughing, deflection is 60~80%.
7. the preparation side of high-strength high conductivity according to claim 3, the Copper Alloys for Lead Frame of resistance to stress relaxation-resistant
Method, it is characterised in that: cold-reduced sheet after trimming to be placed and carries out intermediate annealing in bell-type annealing furnace, annealing temperature is 550~
600 DEG C, annealing time is 4~6h.
8. the preparation side of high-strength high conductivity according to claim 3, the Copper Alloys for Lead Frame of resistance to stress relaxation-resistant
Method, it is characterised in that: Strip after rolling by carries out solution treatment, and solid solubility temperature is 800~850 DEG C, and annealing time is 4~
6h。
9. the preparation side of high-strength high conductivity according to claim 3, the Copper Alloys for Lead Frame of resistance to stress relaxation-resistant
Method, it is characterised in that: the deflection rolled in described is 60~80%；The deflection of the finish rolling is 30~60%.
10. the preparation side of high-strength high conductivity according to claim 3, the Copper Alloys for Lead Frame of resistance to stress relaxation-resistant
Method, it is characterised in that: the band after finish rolling is placed in bell-type annealing furnace and carries out ageing treatment, aging temperature 400
~500 DEG C, annealing time is 3~8h.
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| CN111020277A (en) * | 2019-12-11 | 2020-04-17 | 江西理工大学 | Cu-Fe-Co-Ti alloy with high-strength conductivity, softening resistance and stress relaxation resistance |
| CN111575531A (en) * | 2020-06-28 | 2020-08-25 | 杭州铜信科技有限公司 | High-conductivity copper alloy plate and manufacturing method thereof |
| CN112170484A (en) * | 2020-08-26 | 2021-01-05 | 宁波兴业鑫泰新型电子材料有限公司 | Preparation method of copper-magnesium alloy strip for automobile relay |
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| CN115537692A (en) * | 2022-10-13 | 2022-12-30 | 安徽绿能技术研究院有限公司 | Method for improving internal stress uniformity of copper alloy strip |
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| CN113862511B (en) * | 2021-10-09 | 2022-07-12 | 浙江惟精新材料股份有限公司 | Cu-Ni-Mn-P alloy and preparation method thereof |
| CN115537692A (en) * | 2022-10-13 | 2022-12-30 | 安徽绿能技术研究院有限公司 | Method for improving internal stress uniformity of copper alloy strip |
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