CN105088006A - Low-cost and stress-relaxation-resistant copper alloy lead frame material and preparation method thereof - Google Patents
Low-cost and stress-relaxation-resistant copper alloy lead frame material and preparation method thereof Download PDFInfo
- Publication number
- CN105088006A CN105088006A CN201510552644.6A CN201510552644A CN105088006A CN 105088006 A CN105088006 A CN 105088006A CN 201510552644 A CN201510552644 A CN 201510552644A CN 105088006 A CN105088006 A CN 105088006A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- temperature
- annealing
- low cost
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Conductive Materials (AREA)
Abstract
The invention relates to a low-cost and stress-relaxation-resistant copper alloy lead frame material and a preparation method thereof, and belongs to the field of nonferrous metal machining. The material comprises, by weight, 1.3-1.7% of Sn, 0.75-0.9% of Ni, 0.2-0.6% of Zn, 0.03-0.08% of P and the balance Cu. The material is obtained after machining treatment such as smelting and casting, rough rolling, primary intermediate annealing, acid pickling, intermediate rolling, secondary intermediate rolling, acid pickling, finish rolling and low-temperature annealing. According to the lead frame material, the tensile strength is 570-670 MPa, the electric conductivity is 35-40% IACS, and the elongation is 10-14%, and the stress relaxation resistant performance is 85-90% when the material works at the temperature of 120 DEG C for 1000 h. The low-cost and stress-relaxation-resistant copper alloy lead frame material has the beneficial effects of being low in cost and high in stress relaxation resistance, and can meet the using requirement for high-grade and middle-grade lead frame materials of large scale integrated circuits.
Description
Technical field
The present invention relates to a kind of low cost, proof stress relaxes Copper Alloys for Lead Frame and preparation method thereof, belong to non-ferrous metals processing field.
Background technology
Hyundai electronics information technology core component is unicircuit; it forms through encapsulation primarily of chip and lead frame; wherein lead frame mainly plays a part supporting chip, protection inner member, connects external circuit and outwards distribute elements heat, is the critical material in unicircuit.Along with developing rapidly of electronic information new and high technology, product, to micro-, thin, light, multi-functional and intelligent development, impels unicircuit to extensive, super large and great scale future development.Therefore, blaster fuse frame material is thereupon towards the future development of the miniaturization of lead-in wire pitch, multiway.This not only has higher requirement to the intensity of blaster fuse frame material and electroconductibility, and proposes higher requirement to Drawing abillity, especially more pays close attention to anti-softening temperature and the stress relaxation-resistant characteristic of material.
On domestic market, copper-based lead frame mainly contains several alloy such as C19210, C19400 and C70250, wherein C19210 alloy conductive rate is greater than 80%IACS, but intensity only has about 400MPa, can not meet the requirement of large-scale integrated circuit to intensity, limit it and use further; And C19400 alloy conductive rate is greater than 60%IACS, tensile strength reaches 450 ~ 600MPa, still can not meet the intensity of super large-scale integration and the growth requirement of multiway, it is mainly used in low and middle-end blaster fuse frame material.C70250 alloy is a kind of high-end unicircuit blaster fuse frame material, and its electric conductivity is about 45%IACS, tensile strength is greater than 600MPa; But this alloy in process of production, need special quench aging operation and equipment, production technique is comparatively complicated, and production cost is higher, and product domestic at present can only meet low and middle-end client service requirements, affects industrialization and the application of alloy.Continued downturn is there is in global economy, when manufacture processing enterprise is faced with the severe market competitive pressure, the high performance Novel lead frame material of developing low-cost, not only can promote the development of China's blaster fuse frame material, enrich the kind series of China's copper alloy for lead-wire frame band, and technical renovation and the model change of down-stream enterprise can be promoted.
Summary of the invention
Main purpose of the present invention is the deficiency making up existing copper alloy property, develops a kind of low cost, the type of resistance to stress relaxation-resistant Cu alloy material, meets ultra-large or great scale integrated circuit to the service requirements of blaster fuse frame material.
In order to achieve the above object, the present invention is achieved in that
A kind of low cost, proof stress relax Copper Alloys for Lead Frame, and its weight percent consists of: Sn1.3 ~ 1.7%, Ni0.75 ~ 0.9%, Zn0.2 ~ 0.6%, P0.03 ~ 0.08%, and surplus is Cu.
Wherein, described low cost, proof stress relax in Copper Alloys for Lead Frame and also comprise at least one be selected from B and mishmetal, mishmetal is La, Gd and Y, can mix by arbitrary proportion, mass ratio between La, Gd and Y tri-kinds of elements is preferably 1:2:3, its mass percentage content is B0.005 ~ 0.01%, mishmetal 0.001 ~ 0.005%.
Add alloys producing:
Nickel: nickel element can play solution strengthening effect, the interpolation of nickel element can also increase the wettability of alloy in addition, improves the weldability of blaster fuse frame material.
Tin: because tin atom differs comparatively large with copper atom radius, add a small amount of tin element in copper alloy, larger lattice distortion can be caused, the motion of effective obstruction dislocation, especially in alloy stress relaxation, effectively can pull dislocation, improve Alloy Anti stress relaxation.In addition, the interpolation of tin element also can significantly improve the heat-resisting stripping performance of alloy.
Phosphorus: phosphorus combines with nickel element, forms nickel phosphorus compound, effectively can hinder the motion of dislocation, carry heavy alloyed stress relaxation resistance.
Zinc: zinc element mainly carries heavy alloyed wear resisting property and softening resistant performance in the alloy.
Boron and mishmetal: boron and mishmetal can effectively adjust alloy grain and organize size, improve the homogeneity of tissue, improve the anticorrosion stress-resistant susceptibility of alloy.
Another object of the present invention is to provide the preparation working method of above-mentioned low cost, the Copper Alloys for Lead Frame of resistance to stress relaxation-resistant, and the method production technique is simple, easy to operate.
Low cost, proof stress relax the preparation working method of copper alloy leads material, comprise following technical process: a. carries out preparing burden according to mass percent, feed intake, melting and casting, b. milling face, c. roughing, d. trimming, an e. process annealing, f. pickling, rolls in g., h. bis-process annealing, i. pickling, j. finish rolling, k. low-temperature annealing, l. pickling, m. stretch-bending straightening, n. sub-cut is put in storage.
In step a, adopt line frequency induction furnace to carry out founding under non-vacuum environment, the temperature of described melting is 1200 ~ 1250 DEG C, and the temperature of described casting controls at 1150 ~ 1200 DEG C.
Before melting, QSn6.5-0.1 tin-phosphor bronze scrap stock and virgin material (scrap stock and virgin material mass ratio are 3:2) is added in induction furnace, wherein virgin material comprises electrolytic copper, electrolytic nickel, pure zinc, copper boron and Cu-La, Cu-Gd and Cu-Y master alloy, temperature is risen to 1200 ~ 1250 DEG C, after copper fusing to be electrolysed, the charcoal adding calcination covers, after fully stirring, leave standstill 15 ~ 25min, carry out horizontal casting casting.
In step b, horizontal continuous casting blank is carried out the process of milling face, about 1mm is measured in upper and lower milling face, mainly removes surface imperfection.
In step c, the ingot blank behind milling face is carried out roughing, the deflection of cold rolling cogging is 60 ~ 80%.
In step e, placed in bell-type annealing furnace by the cold-reduced sheet after trimming and carry out a process annealing thermal treatment, annealing temperature is 500 ~ 550 DEG C, and annealing time is 4 ~ 6h.
In step g, roll in being carried out by the sheet material after pickling, deflection is 60 ~ 80%.
In step h, by roll after Strip carry out secondary process annealing process, annealing temperature is 400 ~ 450 DEG C, and annealing time is 4 ~ 6h.
In step j, the band after pickling is carried out finish rolling, deflection is 40 ~ 60%.
In step k, placed by the band after finish rolling in bell-jar annealing and carry out low-temperature annealing, annealing temperature is 200 ~ 250 DEG C, and annealing time is 3 ~ 5h.
Advantage of the present invention: the present invention is by carrying out Composition Design and optimization to copper alloy, obtain a kind of novel copper alloy for lead-wire frame Strip, compared with high-end C7025 blaster fuse frame material, strength of alloy is slightly low, but the electric conductivity of alloy, production cost and resistance to stress relaxation resistance all can compare favourably with it, even surmount.Its chemical composition is: Theil indices is 1.3 ~ 1.7%, nickel content is 0.75 ~ 0.9%, Zn content is 0.2 ~ 0.6%, phosphorus content is 0.03 ~ 0.08%, also at least comprise the one in boron and mishmetal (La, Gd and Y), Boron contents is 0.005 ~ 0.01%, and mishmetal content is 0.001 ~ 0.005%, and all the other are copper.In addition, the present invention have developed a kind of preparation working method being applicable to above-mentioned copper alloy, proof stress relaxed type Copper Alloys for Lead Frame tensile strength after processing and heat treatment is 570 ~ 670MPa, specific conductivity is 35 ~ 40%IACS, unit elongation is 10 ~ 14%, stress relaxation resistance (work 1000h at 120 DEG C) is 85 ~ 90%, can meet the service requirements of large-scale integrated circuit to middle and high end blaster fuse frame material completely.
Below by embodiment, the present invention will be further described, but and do not mean that limiting the scope of the invention.
Embodiment
Low cost of the present invention, proof stress relax Copper Alloys for Lead Frame, it is containing, for example the chemical composition of lower weight percentage: Sn1.3 ~ 1.7%, Ni0.75 ~ 0.9%, Zn0.2 ~ 0.6%, P0.03 ~ 0.08%, also at least comprise in B and mishmetal a kind of, B0.005 ~ 0.01%, mishmetal 0.001 ~ 0.005%, mishmetal is La, Gd and Y, can mix by arbitrary proportion, the weight ratio between three elements is preferably 1:2:3, and all the other are Cu.The preparation of above-mentioned low cost, the Copper Alloys for Lead Frame of resistance to stress relaxation-resistant and working method, comprise following technical process: a. carries out preparing burden according to mass percent, feed intake, melting and casting, b. milling face, c. roughing, d. trimming, an e. process annealing, f. pickling, rolls in g., h. bis-process annealing, i. pickling, j. finish rolling, k. low-temperature annealing, l. pickling, m. stretch-bending straightening, n. sub-cut is put in storage.Wherein, concrete feeding sequence is: in line frequency induction furnace, put into QSn6.5-0.1 tin-phosphor bronze scrap stock and virgin material (scrap stock and virgin material mass ratio are 3:2) carries out non-vacuum melting.Wherein virgin material comprises electrolytic copper, electrolytic nickel, pure zinc, copper boron and Cu-La, Cu-Gd and Cu-Y master alloy, temperature is risen to 1200 ~ 1250 DEG C, after copper fusing to be electrolysed, the charcoal adding calcination covers, after abundant stirring, leave standstill 15 ~ 25min, carry out horizontal casting casting, the temperature of casting controls at 1150 ~ 1200 DEG C.Milling face processes, and about 1mm is measured in upper and lower milling face, mainly removes surface imperfection.Cold rolling cogging, deflection is 60 ~ 80%.A process annealing, annealing temperature is 500 ~ 550 DEG C, and annealing time is 4 ~ 6h.In to roll deflection be 60 ~ 80%.Secondary process annealing process, annealing temperature is 400 ~ 450 DEG C, and annealing time is 4 ~ 6h.Finish rolling deflection is 40 ~ 60%.Low-temperature annealing, annealing temperature is 200 ~ 250 DEG C, and annealing time is 3 ~ 5h.
Embodiment 1
Alloy of the present invention adopts following raw material melting: the old material of QSn6.5-0.1 tin-phosphor bronze, electrolytic copper, electrolytic nickel, pure zinc, copper boron, Cu-La, Cu-Gd and Cu-Y master alloy.The composition of alloy is in the embodiment 1 of table 1.
1. melting: add QSn6.5-0.1 tin-phosphor bronze scrap stock and virgin material (scrap stock and virgin material mass ratio are 3:2) in line frequency induction furnace, wherein virgin material comprises electrolytic copper, electrolytic nickel, pure zinc, copper boron and Cu-La, Cu-Gd and Cu-Y master alloy, temperature is risen to 1200 DEG C, after copper fusing to be electrolysed, the charcoal adding calcination covers, and after fully stirring, leaves standstill 15min, carry out horizontal casting casting, the temperature of casting controls at 1150 DEG C.
2. roughing: carry out cold rolling cogging to the alloy behind milling face, amount of finish is 60%.
3. a process annealing thermal treatment: carry out process annealing process to slab after roughing, annealing temperature is 550 DEG C, and annealing time is 4h.
4. roll in: roll in carrying out the Strip after a process annealing process, pickling, amount of finish is 80%.
5. two process annealing thermal treatment: centering roll after strip carry out process annealing process, annealing temperature is 400 DEG C, and annealing time is 6h.
6. finish rolling: carry out finish rolling to the band after secondary process annealing process, pickling, amount of finish is 40%.
7. low-temperature annealing process: carry out low-temperature annealing process to band after finish rolling, annealing temperature is 200 DEG C, and annealing time is 5h.
Through above melting and casting, roughing, a process annealing process, pickling, in roll, secondary process annealing process, pickling, finish rolling, after the processing treatment such as low-temperature annealing, its performance is in the embodiment 1 in table 2.
Embodiment 2
Alloy of the present invention adopts following raw material melting: the old material of QSn6.5-0.1 tin-phosphor bronze, electrolytic copper, electrolytic nickel, pure zinc and copper boron master alloy.The composition of alloy is in the embodiment 2 of table 1.
1. melting: add QSn6.5-0.1 tin-phosphor bronze scrap stock and virgin material (scrap stock and virgin material mass ratio are 3:2) in line frequency induction furnace, wherein virgin material comprises electrolytic copper, electrolytic nickel, pure zinc, Cu-La, Cu-Gd and Cu-Y master alloy, temperature is risen to 1250 DEG C, after copper fusing to be electrolysed, the charcoal adding calcination covers, and after fully stirring, leaves standstill 25min, carry out horizontal casting casting, the temperature of casting controls at 1175 DEG C.
2. roughing: carry out cold rolling cogging to the alloy behind milling face, amount of finish is 80%.
3. a process annealing thermal treatment: carry out process annealing process to slab after roughing, annealing temperature is 500 DEG C, and annealing time is 6h.
4. roll in: roll in carrying out the Strip after a process annealing process, pickling, amount of finish is 60%.
5. two process annealing thermal treatment: centering roll after strip carry out process annealing process, annealing temperature is 450 DEG C, and annealing time is 4h.
6. finish rolling: carry out finish rolling to the band after secondary process annealing process, pickling, amount of finish is 60%.
7. low-temperature annealing process: carry out low-temperature annealing process to band after finish rolling, annealing temperature is 250 DEG C, and annealing time is 3h.
Through above melting and casting, roughing, a process annealing process, pickling, in roll, secondary process annealing process, pickling, finish rolling, after the processing treatment such as low-temperature annealing, its performance is in the embodiment 2 in table 2.
Embodiment 3
Alloy of the present invention adopts following raw material melting: the old material of QSn6.5-0.1 tin-phosphor bronze, electrolytic copper, electrolytic nickel, pure zinc and copper boron master alloy.The composition of alloy is in the embodiment 3 of table 1.
1. melting: add QSn6.5-0.1 tin-phosphor bronze scrap stock and virgin material (scrap stock and virgin material mass ratio are 3:2) in line frequency induction furnace, wherein virgin material comprises electrolytic copper, electrolytic nickel, pure zinc, copper boron master alloy, temperature is risen to 1225 DEG C, after copper fusing to be electrolysed, the charcoal adding calcination covers, and after fully stirring, leaves standstill 20min, carry out horizontal casting casting, the temperature of casting controls at 1200 DEG C.
2. roughing: carry out cold rolling cogging to the alloy behind milling face, amount of finish is 70%.
3. a process annealing thermal treatment: carry out process annealing process to slab after roughing, annealing temperature is 525 DEG C, and annealing time is 5h.
4. roll in: roll in carrying out the Strip after a process annealing process, pickling, amount of finish is 70%.
5. two process annealing thermal treatment: centering roll after strip carry out process annealing process, annealing temperature is 425 DEG C, and annealing time is 5h.
6. finish rolling: carry out finish rolling to the band after secondary process annealing process, pickling, amount of finish is 50%.
7. low-temperature annealing process: carry out low-temperature annealing process to band after finish rolling, annealing temperature is 225 DEG C, and annealing time is 4h.
Through above melting and casting, roughing, a process annealing process, pickling, in roll, secondary process annealing process, pickling, finish rolling, after the processing treatment such as low-temperature annealing, its performance is in the embodiment 3 in table 2.
Embodiment 4
Alloy of the present invention adopts following raw material melting: the old material of QSn6.5-0.1 tin-phosphor bronze, electrolytic copper, electrolytic nickel, pure zinc and copper boron master alloy.The composition of alloy is in the embodiment 4 of table 1.
1. melting: add QSn6.5-0.1 tin-phosphor bronze scrap stock and virgin material (scrap stock and virgin material mass ratio are 3:2) in line frequency induction furnace, wherein virgin material comprises electrolytic copper, electrolytic nickel, pure zinc, copper boron, Cu-La, Cu-Gd and Cu-Y master alloy, temperature is risen to 1200 DEG C, after copper fusing to be electrolysed, the charcoal adding calcination covers, and after fully stirring, leaves standstill 20min, carry out horizontal casting casting, the temperature of casting controls at 1170 DEG C.
2. roughing: carry out cold rolling cogging to the alloy behind milling face, amount of finish is 60%.
3. a process annealing thermal treatment: carry out process annealing process to slab after roughing, annealing temperature is 525 DEG C, and annealing time is 4h.
4. roll in: roll in carrying out the Strip after a process annealing process, pickling, amount of finish is 70%.
5. two process annealing thermal treatment: centering roll after strip carry out process annealing process, annealing temperature is 425 DEG C, and annealing time is 4h.
6. finish rolling: carry out finish rolling to the band after secondary process annealing process, pickling, amount of finish is 50%.
7. low-temperature annealing process: carry out low-temperature annealing process to band after finish rolling, annealing temperature is 200 DEG C, and annealing time is 3h.
Through above melting and casting, roughing, a process annealing process, pickling, in roll, secondary process annealing process, pickling, finish rolling, after the processing treatment such as low-temperature annealing, its performance is in the embodiment 4 in table 2.
Alloying element composition table (wt%) of table 1 embodiment 1-4
The alloy property table of table 2 embodiment 1-4
Can be seen by above embodiment, blaster fuse frame material of the present invention, tensile strength is 570 ~ 670MPa, specific conductivity is 35 ~ 40%IACS, unit elongation is 10 ~ 14%, and stress relaxation resistance (work 1000h at 120 DEG C) is 85% ~ 90%, for high-end lead frame C7025 alloy, there is low cost, high resistance to stress relaxation property, the service requirements of large-scale integrated circuit to middle and high end blaster fuse frame material can be met.
Claims (10)
1. low cost, proof stress relax a Copper Alloys for Lead Frame, and it is characterized in that: its weight percent consists of: Sn1.3 ~ 1.7%, Ni0.75 ~ 0.9%, Zn0.2 ~ 0.6%, P0.03 ~ 0.08%, all the other are Cu.
2. low cost according to claim 1, proof stress relax Copper Alloys for Lead Frame, it is characterized in that: also comprise at least one in B and mishmetal, mass percentage content is: B0.005 ~ 0.01%, mishmetal 0.001 ~ 0.005%, and mishmetal is La, Gd and Y.
3. low cost according to claim 2, proof stress relax Copper Alloys for Lead Frame, it is characterized in that: the mass ratio of La, Gd and Y element is 1:2:3.
4. low cost according to claim 1, proof stress relax the preparation method of Copper Alloys for Lead Frame, comprise the following steps: a. carries out preparing burden according to mass percent, feed intake, melting and casting, b. milling face, c. roughing, d. trimming, an e. process annealing, f. pickling, rolls in g., h. bis-process annealing, i. pickling, j. finish rolling, k. low-temperature annealing, l. pickling, m. stretch-bending straightening, n. sub-cut is put in storage.
5. low cost according to claim 4, proof stress relax the preparation method of Copper Alloys for Lead Frame, it is characterized in that: adopt line frequency induction furnace to carry out antivacuum founding, the temperature of described melting is 1200 ~ 1250 DEG C, and the temperature of described casting is 1150 ~ 1200 DEG C.
6. low cost according to claim 4, proof stress relax the preparation method of Copper Alloys for Lead Frame, it is characterized in that: in line frequency induction furnace, add QSn6.5-0.1 tin-phosphor bronze scrap stock and virgin material carries out non-vacuum melting, scrap stock and virgin material mass ratio are 3:2, virgin material comprises electrolytic copper, electrolytic nickel, pure zinc, copper boron, Cu-La, Cu-Gd and/or Cu-Y master alloy, temperature is risen to 1200 ~ 1250 DEG C, after copper fusing to be electrolysed, the charcoal adding calcination covers, after abundant stirring, leave standstill 15 ~ 25min, carry out horizontal casting casting.
7. low cost according to claim 4, proof stress relax the preparation method of Copper Alloys for Lead Frame, it is characterized in that: the deflection of described roughing is 60 ~ 80%; The deflection rolled in described is 60 ~ 80%; The deflection of described finish rolling is 40 ~ 60%.
8. low cost according to claim 4, proof stress relax the preparation method of Copper Alloys for Lead Frame, it is characterized in that: the temperature of a described process annealing is 500 ~ 550 DEG C, and soaking time is 4 ~ 6h.
9. low cost according to claim 4, proof stress relax the preparation method of Copper Alloys for Lead Frame, it is characterized in that: the temperature of described secondary process annealing is 400 ~ 450 DEG C, and soaking time is 4 ~ 6h.
10. low cost according to claim 4, proof stress relax the preparation method of Copper Alloys for Lead Frame, and it is characterized in that: described stress relief annealed temperature is 200 ~ 250 DEG C, soaking time is 3 ~ 5h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510552644.6A CN105088006A (en) | 2015-09-02 | 2015-09-02 | Low-cost and stress-relaxation-resistant copper alloy lead frame material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510552644.6A CN105088006A (en) | 2015-09-02 | 2015-09-02 | Low-cost and stress-relaxation-resistant copper alloy lead frame material and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105088006A true CN105088006A (en) | 2015-11-25 |
Family
ID=54569326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510552644.6A Pending CN105088006A (en) | 2015-09-02 | 2015-09-02 | Low-cost and stress-relaxation-resistant copper alloy lead frame material and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105088006A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105369057A (en) * | 2015-12-21 | 2016-03-02 | 宁波兴业盛泰集团有限公司 | Corrosion-resistant abrasion-resistant multi-component nickel brass alloy and preparation method thereof |
| CN107034381A (en) * | 2017-04-26 | 2017-08-11 | 江西理工大学 | A kind of Cu Ni Co Sn P copper alloys and preparation method thereof |
| CN109355529A (en) * | 2018-12-08 | 2019-02-19 | 雷纳德流体智能科技江苏股份有限公司 | One Albatra metal |
| CN109930026A (en) * | 2017-12-18 | 2019-06-25 | 北京有色金属研究总院 | A kind of high-strength high conductivity, proof stress relaxation Copper Alloys for Lead Frame and preparation method thereof |
| CN113981267A (en) * | 2021-12-28 | 2022-01-28 | 宁波兴业盛泰集团有限公司 | Copper alloy lead frame material |
| CN114525390A (en) * | 2022-02-21 | 2022-05-24 | 江西省科学院应用物理研究所 | Production method of copper-tin alloy strip |
| CN115747560A (en) * | 2022-11-18 | 2023-03-07 | 中色奥博特铜铝业有限公司 | Low-roughness copper-nickel-tin-phosphorus alloy foil and preparation method thereof |
| CN116197235A (en) * | 2023-04-28 | 2023-06-02 | 太原晋西春雷铜业有限公司 | Mixed hot rolling method for C19400 and C19210 cast ingots |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6260838A (en) * | 1985-09-10 | 1987-03-17 | Nippon Mining Co Ltd | Copper alloy for lead frame |
| JP2000256814A (en) * | 1999-03-03 | 2000-09-19 | Sumitomo Metal Mining Co Ltd | Manufacture of copper-based alloy bar for terminal |
| JP2001262297A (en) * | 2000-03-17 | 2001-09-26 | Sumitomo Metal Mining Co Ltd | Copper-base alloy bar for terminal, and its manufacturing method |
| CN1624177A (en) * | 2004-12-08 | 2005-06-08 | 昆明贵金属研究所 | High compact, non-segregation wear-resisting copper alloy and its preparation process |
| JP2006083420A (en) * | 2004-09-15 | 2006-03-30 | Dowa Mining Co Ltd | Copper alloy with improved electric conductivity, and its manufacturing method |
| CN1800426A (en) * | 2004-07-01 | 2006-07-12 | 同和矿业株式会社 | Copper-based alloy and manufacturing method therefor |
| CN101077510A (en) * | 2007-06-08 | 2007-11-28 | 广州铜材厂有限公司 | Process for manufactruing blaster fuse frame copper alloy strip steel rolled stock used for integrate circuit |
| JP2008231492A (en) * | 2007-03-20 | 2008-10-02 | Dowa Metaltech Kk | Cu-Ni-Sn-P BASED COPPER ALLOY SHEET AND ITS MANUFACTURING METHOD |
| CN101525704A (en) * | 2008-03-07 | 2009-09-09 | 杭州钱王机械配件有限公司 | Alloy for manufacturing bush and method for manufacturing bush thereof |
| CN101906553A (en) * | 2010-08-26 | 2010-12-08 | 中铝华中铜业有限公司 | Lead frame material and processing method thereof |
| CN101914701A (en) * | 2010-08-26 | 2010-12-15 | 中铝华中铜业有限公司 | Lead frame material and method for processing strip made of same |
| CN101969055A (en) * | 2010-08-13 | 2011-02-09 | 大连交通大学 | KFC copper alloy lead frame material produced by continuous extrusion rolling method |
| CN103602851A (en) * | 2013-11-08 | 2014-02-26 | 浙江八达铜业有限公司 | Copper alloy and manufacturing method thereof |
| CN103667775A (en) * | 2013-11-27 | 2014-03-26 | 余姚市士森铜材厂 | Copper alloy semiconductor lead frame |
| CN103667774A (en) * | 2013-11-27 | 2014-03-26 | 余姚市士森铜材厂 | Preparation method of copper alloy semiconductor lead frame |
| CN104046836A (en) * | 2005-12-22 | 2014-09-17 | 株式会社神户制钢所 | Copper alloy having excellent stress relaxation property |
-
2015
- 2015-09-02 CN CN201510552644.6A patent/CN105088006A/en active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6260838A (en) * | 1985-09-10 | 1987-03-17 | Nippon Mining Co Ltd | Copper alloy for lead frame |
| JP2000256814A (en) * | 1999-03-03 | 2000-09-19 | Sumitomo Metal Mining Co Ltd | Manufacture of copper-based alloy bar for terminal |
| JP2001262297A (en) * | 2000-03-17 | 2001-09-26 | Sumitomo Metal Mining Co Ltd | Copper-base alloy bar for terminal, and its manufacturing method |
| CN1800426A (en) * | 2004-07-01 | 2006-07-12 | 同和矿业株式会社 | Copper-based alloy and manufacturing method therefor |
| JP2006083420A (en) * | 2004-09-15 | 2006-03-30 | Dowa Mining Co Ltd | Copper alloy with improved electric conductivity, and its manufacturing method |
| CN1624177A (en) * | 2004-12-08 | 2005-06-08 | 昆明贵金属研究所 | High compact, non-segregation wear-resisting copper alloy and its preparation process |
| CN104046836A (en) * | 2005-12-22 | 2014-09-17 | 株式会社神户制钢所 | Copper alloy having excellent stress relaxation property |
| JP2008231492A (en) * | 2007-03-20 | 2008-10-02 | Dowa Metaltech Kk | Cu-Ni-Sn-P BASED COPPER ALLOY SHEET AND ITS MANUFACTURING METHOD |
| CN101077510A (en) * | 2007-06-08 | 2007-11-28 | 广州铜材厂有限公司 | Process for manufactruing blaster fuse frame copper alloy strip steel rolled stock used for integrate circuit |
| CN101525704A (en) * | 2008-03-07 | 2009-09-09 | 杭州钱王机械配件有限公司 | Alloy for manufacturing bush and method for manufacturing bush thereof |
| CN101969055A (en) * | 2010-08-13 | 2011-02-09 | 大连交通大学 | KFC copper alloy lead frame material produced by continuous extrusion rolling method |
| CN101914701A (en) * | 2010-08-26 | 2010-12-15 | 中铝华中铜业有限公司 | Lead frame material and method for processing strip made of same |
| CN101906553A (en) * | 2010-08-26 | 2010-12-08 | 中铝华中铜业有限公司 | Lead frame material and processing method thereof |
| CN103602851A (en) * | 2013-11-08 | 2014-02-26 | 浙江八达铜业有限公司 | Copper alloy and manufacturing method thereof |
| CN103667775A (en) * | 2013-11-27 | 2014-03-26 | 余姚市士森铜材厂 | Copper alloy semiconductor lead frame |
| CN103667774A (en) * | 2013-11-27 | 2014-03-26 | 余姚市士森铜材厂 | Preparation method of copper alloy semiconductor lead frame |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105369057A (en) * | 2015-12-21 | 2016-03-02 | 宁波兴业盛泰集团有限公司 | Corrosion-resistant abrasion-resistant multi-component nickel brass alloy and preparation method thereof |
| CN105369057B (en) * | 2015-12-21 | 2017-03-08 | 宁波兴业盛泰集团有限公司 | Polynary Benedict metal of a kind of corrosion-proof wear and preparation method thereof |
| CN107034381A (en) * | 2017-04-26 | 2017-08-11 | 江西理工大学 | A kind of Cu Ni Co Sn P copper alloys and preparation method thereof |
| CN107034381B (en) * | 2017-04-26 | 2019-03-19 | 江西理工大学 | A kind of Cu-Ni-Co-Sn-P copper alloy and preparation method thereof |
| CN109930026A (en) * | 2017-12-18 | 2019-06-25 | 北京有色金属研究总院 | A kind of high-strength high conductivity, proof stress relaxation Copper Alloys for Lead Frame and preparation method thereof |
| CN109355529A (en) * | 2018-12-08 | 2019-02-19 | 雷纳德流体智能科技江苏股份有限公司 | One Albatra metal |
| CN113981267A (en) * | 2021-12-28 | 2022-01-28 | 宁波兴业盛泰集团有限公司 | Copper alloy lead frame material |
| CN113981267B (en) * | 2021-12-28 | 2022-04-19 | 宁波兴业盛泰集团有限公司 | Copper alloy lead frame material |
| CN114525390A (en) * | 2022-02-21 | 2022-05-24 | 江西省科学院应用物理研究所 | Production method of copper-tin alloy strip |
| CN115747560A (en) * | 2022-11-18 | 2023-03-07 | 中色奥博特铜铝业有限公司 | Low-roughness copper-nickel-tin-phosphorus alloy foil and preparation method thereof |
| CN116197235A (en) * | 2023-04-28 | 2023-06-02 | 太原晋西春雷铜业有限公司 | Mixed hot rolling method for C19400 and C19210 cast ingots |
| CN116197235B (en) * | 2023-04-28 | 2023-06-30 | 太原晋西春雷铜业有限公司 | Mixed hot rolling method for C19400 and C19210 cast ingots |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105088006A (en) | Low-cost and stress-relaxation-resistant copper alloy lead frame material and preparation method thereof | |
| CN109355525B (en) | Multi-scale multi-element high-strength high-conductivity copper chromium zirconium alloy material and preparation method thereof | |
| CN110284018B (en) | Environment-friendly high-missile-resistance corrosion-resistant copper alloy and production method of plate and strip thereof | |
| CN103088229B (en) | Low-cost copper alloy for socket connectors and processing method thereof | |
| CN105274386B (en) | High-performance complex multi-element phosphor bronze alloy material and preparation method thereof | |
| CN106756202A (en) | A kind of blaster fuse frame material complicated pluralism Cu alloy material and preparation method thereof | |
| CN105568039A (en) | High-strength high-conductivity copper-chromium-zirconium alloy and preparation method of plate/strip thereof | |
| CN109930026B (en) | High-strength high-conductivity stress relaxation-resistant copper alloy lead frame material and preparation method thereof | |
| CN102912178B (en) | A kind of high-strength highly-conductive rare-earth copper alloy and preparation method thereof | |
| CN107034381B (en) | A kind of Cu-Ni-Co-Sn-P copper alloy and preparation method thereof | |
| CN106636729A (en) | Polybasic copper alloy plate and strip for power battery connector and preparation method thereof | |
| CN102851527B (en) | Copper-silver-magnesium alloy contact wire and preparation method thereof | |
| CN106399748A (en) | Novel copper-nickel-silicon system alloy material for lead frame and preparation method of novel copper-nickel-silicon system alloy material | |
| CN108193080A (en) | High intensity, highly conductive proof stress relaxation corson alloy material and preparation method thereof | |
| CN103572091A (en) | Copper alloy material, preparation method thereof and copper lead prepared thereby | |
| CN104263992B (en) | Motor commutator Kufil material and preparation method thereof | |
| CN103898353A (en) | Copper alloy with high strength and high conductivity and preparation method thereof | |
| CN115652132B (en) | Copper alloy material and application and preparation method thereof | |
| CN110093536A (en) | A kind of battery guide plate 6101-T63 state aluminium alloy coiled material and preparation method thereof | |
| CN109295346B (en) | High-conductivity soft aluminum alloy and preparation method and application thereof | |
| CN113564413B (en) | High-conductivity corrosion-resistant high-nickel aluminum-containing copper alloy and preparation method thereof | |
| CN106435260A (en) | High-strength high-flexibility CuNiSn alloy material and preparation method thereof | |
| CN107974574B (en) | Stress relaxation-resistant complex brass alloy and preparation method thereof | |
| CN106399751A (en) | Preparing method for high-strength and high-conductivity copper alloy | |
| CN104232987B (en) | A kind of elasticity tin-brass alloy material and preparation working method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151125 |
|
| RJ01 | Rejection of invention patent application after publication |