CN109926298A - One mode converts ultrasonic transducer and its manufacturing method - Google Patents
One mode converts ultrasonic transducer and its manufacturing method Download PDFInfo
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- CN109926298A CN109926298A CN201711364450.9A CN201711364450A CN109926298A CN 109926298 A CN109926298 A CN 109926298A CN 201711364450 A CN201711364450 A CN 201711364450A CN 109926298 A CN109926298 A CN 109926298A
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Abstract
The present invention is suitable for ultrasonic transduction technical field, discloses one mode conversion ultrasonic transducer and its manufacturing method.Mode conversion ultrasonic transducer includes shell, mode conversion piezoelectric patches and circuit board, and the mode conversion piezoelectric patches is set in the shell, and the circuit board is connected to the mode conversion piezoelectric patches；The mode conversion piezoelectric patches includes multiple piezoelectric blocks, the mode conversion piezoelectric patches is provided on one side for the slot for circuit board insertion, the two sides of the slot are the electrode of the piezoelectric blocks, and the circuit board inserts in the slot and connects with the electrode.Manufacturing method is for manufacturing above-mentioned mode conversion ultrasonic transducer.One mode conversion ultrasonic transducer provided by the present invention and its manufacturing method, the electrode of piezoelectric blocks are drawn using circuit board, guarantee the consistency of each piezoelectric blocks impedance, in the way of mode conversion, graing lobe do not occur, to obtain good sound field focusing performance.
Description
Technical field
The invention belongs to ultrasonic transduction technical field more particularly to one mode conversion ultrasonic transducer and its manufacturers
Method.
Background technique
The core of ultrasonic plane array system is two-dimensional array ultrasonic transducer, current extensive two-dimensional array ultrasonic transducer
Problem is how to guarantee that simple array element vibration mode, each array element consistency, array element lead method be simple and reliable, energy converter sound
Field focus deflection does not generate serious secondary lobe and graing lobe.One two-dimensional array probe is usually by one to thousands of individual piezoelectricity
Array element composition, and the length and width dimensions of each array element are very small, how to guarantee the consistency of each array element and make each piezoelectricity battle array
The electrode extraction of member is a problem.Traditional scheme is then that the positive and negative anodes of piezoelectricity array element are directly connected to external cable, when super
When the array element number of sonic transducer is more huge, it is each array element independent patch according to the full mode of connection, makes each array element
Independent pulse signal is generated, the unreliable of welding is led to since the electrode of piezoelectric patches is unreliable, and directly welding can not be protected
Demonstrate,prove the consistency of each array element lead.And traditional preparation method is it is difficult to ensure that array element interval is less than does not generate needed for secondary lobe
Minimum interval cannot also guarantee the focus deflection sound field that ultrasonic transducer can obtain.
Summary of the invention
It is an object of the invention to overcome above-mentioned the deficiencies in the prior art, provide one mode conversion ultrasonic transducer and
Its manufacturing method, the focus deflection sound field that ultrasonic transducer can obtain.
The technical scheme is that one mode converts ultrasonic transducer, including shell, mode convert piezoelectric patches, electricity
Road plate, the mode conversion piezoelectric patches are set in the shell, and the circuit board is connected to the mode conversion piezoelectric patches；Institute
Stating mode conversion piezoelectric patches includes multiple piezoelectric blocks, and the mode conversion piezoelectric patches is provided on one side for supplying the circuit board
The slot of insertion, the two sides of the slot are the electrode of the piezoelectric blocks, the circuit board insert in the slot and with the electricity
Pole connects.
Optionally, the circuit board is provided with positive wire on one side, and the another side of the circuit board is provided with cathode and draws
Line, the circuit board are connected with cable or cylinder manifold.
Optionally, the slot is provided at least two, and each slot is arranged in parallel and separates each piezoelectric blocks
It is at least three rows, the two sides of the slot are respectively positive electrode conducting layer and negative conducting layer, the positive electrode conducting layer and a line institute
The one side for stating piezoelectric blocks connects, and the negative conducting layer connects with piezoelectric blocks one side described in adjacent another row, and same
The row piezoelectric blocks, two opposite sides are respectively positive electrode conducting layer and negative conducting layer.
Optionally, the bottom surface of the mode conversion piezoelectric patches is provided with matching layer.
Optionally, the piezoelectric blocks are provided with multiple lines and multiple rows, and the piezoelectric blocks between adjacent column are connected by insulant.
Optionally, the circuit board is flexible circuit board, and/or, the shell is made of magnetic compatible material.
Optionally, the shell includes shell and the top cover for being connected to the shell, the mode conversion piezoelectric patches setting
In in the flat bottom surface of the shell, vertically the mode conversion piezoelectric patches inserts in the slot circuit board, the line
Cable is arranged in the top cover and is connected to the positive wire and negative wire of the circuit board two sides.
The embodiment of the invention also provides the manufacturing methods of one mode conversion ultrasonic transducer, comprising the following steps:
Prepare shell, circuit board and with slot and the slot two sides are that the mode of piezoelectric blocks electrode converts piezoelectric patches；
Mode conversion piezoelectric patches is placed in the shell；
Circuit board is inserted in the slot of the mode conversion piezoelectric patches, connects the electrode of circuit board and the piezoelectric blocks
It connects.
Optionally, prepare mode conversion piezoelectric patches the following steps are included:
Piezoelectric patches is prepared, the first separate slot is opened up along first direction in the front of the piezoelectric patches, in the first separate slot of Yu Suoshu
Fill conductive material；The second separate slot intersected with first separate slot is opened up in a second direction in the front of the piezoelectric patches, in institute
It states and fills insulant in the second separate slot；
By the material removal of the setting thickness at the piezoelectric patches back side, matching layer is set at the piezoelectric patches back side；
Slot is set on the conductive material along first separate slot, is divided into the conductive material by the slot and is attached at
The positive electrode conducting layer and negative conducting layer of the piezoelectric blocks side of adjacent rows.
Optionally, the two sides of the circuit board is respectively arranged with more positive wires and Duo Gen negative wire, by the electricity
When road plate inserts in the slot, each positive wire passes through conductive material and respectively with the piezoelectric blocks side each in a line
The positive electrode conducting layer connects, and each negative wire passes through each piezoelectric blocks side in conductive material and another row respectively
The negative conducting layer connects；Cable is connected to the circuit board.
Optionally, the circuit board is flexible circuit board.
Optionally, mode conversion piezoelectric patches is placed in bottom with flattening in the shell of plane, circuit board is in the mould
Formula conversion piezoelectric patches is packed into before shell or inserts in slot after being packed into shell.
One mode conversion ultrasonic transducer provided by the present invention and its manufacturing method, the electrode of piezoelectric blocks use circuit
Plate (double-sided flexible circuit board) is drawn in the direction of the width, guarantees the consistency of each piezoelectric blocks impedance, utilizes mode conversion
There is not graing lobe in mode, to obtain good sound field focusing performance.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to needed in the embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for ability
For the those of ordinary skill of domain, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is the three-dimensional assembling schematic diagram of one mode conversion ultrasonic transducer provided in an embodiment of the present invention；
Fig. 2 is the perspective exploded view of one mode conversion ultrasonic transducer provided in an embodiment of the present invention；
Fig. 3 is the stereo decomposing partial sectional view of one mode conversion ultrasonic transducer provided in an embodiment of the present invention；
Fig. 4 is the solid of piezoelectric patches in the manufacturing method of one mode conversion ultrasonic transducer provided in an embodiment of the present invention
Schematic diagram；
Fig. 5 is the stereoscopic schematic diagram that piezoelectric patches opens up after the first separate slot in Fig. 4；
Fig. 6 is that piezoelectric patches fills the stereoscopic schematic diagram after conductive material in the first separate slot in Fig. 5；
Fig. 7 is the stereoscopic schematic diagram that piezoelectric patches opens up after the second separate slot in Fig. 6；
Fig. 8 is that piezoelectric patches fills the stereoscopic schematic diagram after insulant in the second separate slot in Fig. 7；
Fig. 9 is the stereoscopic schematic diagram in Fig. 8 after piezoelectric patches removal back side setting thickness material；
Figure 10 is the stereoscopic schematic diagram in Fig. 9 after piezoelectric patches back side setting matching layer；
Figure 11 is the stereoscopic schematic diagram of formation mode conversion piezoelectric patches after piezoelectric patches front setting slot in Figure 10；
Figure 12 is the stereoscopic schematic diagram of circuit board in the present embodiment；
Figure 13 is the stereoscopic schematic diagram of circuit board in the present embodiment；
Figure 14 is the stereoscopic schematic diagram that circuit board inserts in when mode converts the slot of piezoelectric patches in the present embodiment.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or it may be simultaneously present centering elements.When an element is known as " being connected to " another element, it can
To be directly to another element or may be simultaneously present centering elements.
It is only relative concept each other it should also be noted that, the positional terms such as left and right, upper and lower in the embodiment of the present invention
It or is to refer to, and should not be regarded as restrictive with the normal operating condition of product.
As shown in Figure 1 to Figure 3, one mode provided in an embodiment of the present invention converts ultrasonic transducer, including shell 1, mould
Formula converts piezoelectric patches 2, circuit board 3 and cable 4, and mode conversion piezoelectric patches 2 is set in shell 1, and circuit board 3 is connected to mode and turns
Piezoelectric patches 2 is changed, cable 4 can be indirectly coupled to circuit board 3 directly or by confluence circuit board (junction station) etc..Mode conversion pressure
Electric piece 2 may include the piezoelectric blocks 20 that multiple matrixes are intervally arranged, and mode conversion piezoelectric patches 2 is provided on one side for power circuit board
The slot 201 of 3 insertions, the two sides of slot 201 are the electrode of piezoelectric blocks 20, and the two sides of circuit board 3 is provided with contact conductor, circuit
Plate 3 inserts in slot 201 and connects with the electrode of piezoelectric blocks 20.Mode conversion piezoelectric patches 2 can be made of piezoelectric ceramics, be utilized
Piezoelectric ceramics has the characteristic of many mode of oscillations, designs two-dimensional array ultrasonic transduction by the mode conversion of piezoelectric ceramics
The electrode of device, each array element (piezoelectric blocks 20) is drawn in the direction of the width using circuit board 3 (double-sided flexible circuit board), is guaranteed every
The electrode of piezo-electricity composite material is arranged in width in the way of mode conversion in the consistency of a array element (piezoelectric blocks 20) impedance
(width in this direction can be set to be less than and not generate within the width of parameters,acoustic requirement of graing lobe, specifically can be on direction
It is set according to actual conditions), but the acoustic radiation direction that we pay close attention to is the thickness direction of piezoelectric material, ensures that do not occur in this way
Graing lobe, the sound field focusing performance then obtained.
Optionally, the side of same slot 201 is the positive electrode conducting layer 211 with a line piezoelectric blocks 20, same slot 201
The other side is the negative conducting layer 212 of adjacent a line piezoelectric blocks 20.Circuit board 3 is provided with the anode of multiple groups uniformly at intervals on one side
Lead 31, the another side of circuit board 3 are provided with the negative wire 32 of multiple groups uniformly at intervals.Each group of positive wire 31 is direct or logical
Conductive connection object (such as conducting resinl) is crossed to connect with the positive electrode conducting layer 211 of wherein 20 one side of a piezoelectric blocks.Each group of cathode
Lead 32 is connect with the negative conducting layer 212 of 20 one side of a piezoelectric blocks directly or by object (such as conducting resinl) is conductively connected.
Circuit board 3 can convert piezoelectric patches 2 perpendicular to mode and insert in slot 201.With adj acent piezoelectric block 20, positive electrode conducting layer in a line
211 and negative conducting layer 212 separated by insulant 220, multiple row has can be set in insulant 220.Insulant 220 can be absolutely
Edge polymer or air.It should be noted that row, column is only relative concept in the present embodiment, not answering cleavage is to make with limitation
With.
Optionally, slot 201 is provided at least two, each slot 201 be arranged in parallel and by each piezoelectric blocks 20 be divided into
Few three rows, the two sides of slot 201 are respectively positive electrode conducting layer 211 and negative conducting layer 212 spaced apart from each other, 201 side of slot
Positive electrode conducting layer 211 be affixed and contact with the one side of a line piezoelectric blocks 20, the negative conducting layer 212 of 201 other side of slot with
Adjacent another 20 one side of row piezoelectric blocks is affixed contact.In addition to the piezoelectric blocks 200 at edge, with a line piezoelectric blocks 20, two-phase
Pair side have positive electrode conducting layer 211 and negative conducting layer 212 respectively, each piezoelectric blocks 20 can matrix arrangement, the direction being expert at by
Slot 201 and electrode conducting layer separate, and are separated and are connected by insulant 220 in the direction of column.
Optionally, the bottom surface of mode conversion piezoelectric patches 2 is provided with matching layer 5.The thickness of matching layer 5, which meets acoustical behavior, to be wanted
The thickness asked.On the one hand the effect of matching layer 5 is to guarantee that acoustic energy significantly more efficient can export；It on the other hand is as compound
The substrate of material (mode converts piezoelectric patches 2) divides the rear support composite material of electrode in separate slot.Optionally, in matching layer 5
Acoustic lens has also can be set in surface, and acoustic lens can increase the focusing effect of probe.
In the present embodiment, it can be in rectangle that mode, which converts piezoelectric patches 2, and piezoelectric blocks 20 be provided with multiple lines and multiple rows, between adjacent column
Piezoelectric blocks 20 connected and separated by insulant 220.
Optionally, circuit board 3 can be flexible circuit board or common PCB in the present embodiment.
Optionally, shell 1 can be used magnetic compatible material and be made, such as plastics, bakelite etc..
Optionally, shell 1 includes shell 11 and the top cover 12 for being connected to shell 11, has flat bottom surface, mould in shell 11
Formula conversion piezoelectric patches 2 is set in the flat bottom surface of shell 11, and 3 vertical mode of circuit board conversion piezoelectric patches 2 inserts in slot 201
Interior, cable 4 is arranged in top cover 12 and is connected to the positive wire 31 and negative wire 32 of 3 two sides of circuit board, arranges regular.Shell
Body 1 can in a rectangular parallelepiped shape, cylinder column etc..
As shown in Figure 1 to Figure 3, the embodiment of the invention also provides one mode conversion ultrasonic transducer manufacturing method,
It can be used for manufacturing above-mentioned mode conversion ultrasonic transducer, comprising the following steps:
Prepare shell 1, circuit board 3, cable 4 and with slot 201 and 201 two sides of slot are the mode of 20 electrode of piezoelectric blocks
Convert piezoelectric patches 2；
Mode conversion piezoelectric patches 2 is placed in shell 1；
Circuit board 3 is inserted in the slot 201 of mode conversion piezoelectric patches 2, connects the electrode of circuit board 3 and piezoelectric blocks 20
It connects；
Cable 4 is connected to circuit board 3.
Optionally, preparation mode conversion piezoelectric patches 2 the following steps are included:
With reference to shown in Fig. 3 to Fig. 8, piezoelectric patches 210 is prepared, opens up multiple the along first direction in the front of piezoelectric patches 210
One separate slot 231, the interval of the first separate slot 231 and depth can determine by the acoustic characteristic of energy converter, the M row piezoelectric ceramics being cut into
Column is determined by the array element matrix set, in filling conductive material 230 (conducting polymer) in the first separate slot 231；Conducting polymer one
Aspect can connect M row ceramics pole, on the other hand can be used for preparing electrode (positive electrode conducting layer 211 and the cathode of piezoelectric material
Conductive layer 212).It can be applied to piezoelectric material by this electrode (positive electrode conducting layer 211 and negative conducting layer 212) and be motivated,
Piezoelectric patches 210 is stimulated to generate ultrasonic radiation force.It opens up in the front of piezoelectric patches 210 and intersects with the first separate slot 231 in a second direction
Multiple second separate slots 241, the interval of the second separate slot 241 and depth can determine by the acoustic characteristic of energy converter, the N column being cut into
Piezoelectric ceramics column is determined by the array element matrix set, in filling insulant 220 (insulating polymer) in the second separate slot 241；Insulation
On the one hand polymer can connect N column ceramics pole, be on the other hand used to inhibit the string acoustic jamming between array element (piezoelectric blocks 20), then
On the one hand for demarcating N column electrode (conductive material 230), guarantee each array element (piezoelectric blocks of the piezoelectric ceramics column matrix of M*N
20) possess independent positive and negative anodes electrode surface (positive electrode conducting layer 211 and negative conducting layer 212).Pass through this electrode (positive and negative anodes electricity
Pole-face) excitation can be applied to piezoelectric material (piezoelectric blocks 20), stimulation piezoelectric patches 210 generates ultrasonic radiation force.First separate slot
231, the depth of the second separate slot 241 can be equal.
Refering to what is shown in Fig. 9, the material of the setting thickness at 210 back side of piezoelectric patches is removed, piezoelectric patches 210 is at least ground to
The bottom surface of first separate slot 231, the second separate slot 241, as shown in Figure 10, then in 210 back side of piezoelectric patches setting matching layer 5, matching layer 5
Effect on the one hand be guarantee acoustic energy significantly more efficient can export；It on the other hand is as composite material (mode conversion pressure
Electric piece 2) substrate, separate slot divide electrode rear support composite material；
As shown in figure 11, slot 201 is set on conductive material 230 along the first separate slot 231, makes conductive material 230 by slot 201
It is divided into the positive electrode conducting layer 211 and negative conducting layer 212 for being attached at 20 side of piezoelectric blocks of adjacent rows.
Optionally, setting slot 201 can comprise the following steps that the conducting polymer that will be filled in the first separate slot 231 along it
Middle line is split to form slot 201, and 201 to the first separate slot 231 of slot of cutting is narrow and depth direction cuts through the first separate slot
The conducting polymer of 231 fillings.Thus the conducting polymer that the first separate slot 231 is filled can be divided into two parts, made respectively
For the electrode (positive electrode conducting layer 211 and negative conducting layer 212) of the piezoelectric blocks 20 of adjacent contact.
Optionally, as shown in Figure 12 to 14, the two sides of circuit board 3 is respectively arranged with more positive wires 31 and Duo Gen cathode
Lead 32, circuit board 3 are double-sided PCB, and when circuit board 3 is inserted in slot 201, each positive wire 31 passes through conduction material respectively
Material directly connects with the positive electrode conducting layer 211 of 20 side of piezoelectric blocks each in same a line, and each negative wire 32 passes through conduction respectively
Material directly connects with the negative conducting layer 212 of 20 side of piezoelectric blocks each in another row.Conductive material can be conducting resinl etc..
Optionally, circuit board 3 can be double-sided flexible circuit board 3 or common double-sided PCB board.It will be pressed using double-sided PCB 3
The positive and negative electrode lead of electric piece 210, there is corresponding contact conductor on 3 two sides of circuit board, if the electrode of one side is defined as anode,
The electrode in corresponding face is defined as cathode.By each 3 once mounting of double-sided PCB in the card slot that M row is cut, circuit board 3 and card
Cooperate or be interference fitted for small―gap suture between slot, there is certain Mechanical Contact, then uses conductive material by the electrode of circuit board 3
Lead and the electrode conducting layer (positive electrode conducting layer 211 and negative conducting layer 212) of array element bonding.It is fixed on the one hand can to play in this way
Position effect, on the one hand can guarantee the conduction of contact conductor and electrode conducting layer.The electrode of each array element may finally be led
Electric layer lead in this way, applying positive and negative electric signal on 3 two sides of circuit board can be to motivating each array element work.
Optionally, mode can be converted to piezoelectric patches 2 and be placed in bottom with flattening in the shell 1 of plane, circuit board 3 is in mould
Formula conversion piezoelectric patches 2 is packed into before shell 1 or inserts in slot 201, the contact conductor and slot of 3 two sides of circuit board after being packed into shell 1
The electrode conducting layer of 201 two sides connects, and connects positive and negative anodes signal wire on 3 two sides of circuit board.Of course, it is possible to use additional line
Road plate (cylinder manifold) is connected to each circuit board 3, and cable 4 can connect in flexible circuit board 3.In the present embodiment, electricity will be installed
Mode conversion piezoelectric patches 2 (piezoelectric ceramics) of the M*N array of road plate 3 is mounted in shell 11, by the bottom surface of matching layer 5 and shell
11 bottom surface is mounted on same plane pressing, on the one hand can guarantee the flatness of energy converter, to guarantee that a batch of preparation is visited
The consistency of head；On the other hand it can protect probe array element to be unlikely to deform and be hardly damaged with inside.11 envelope of shell will be carried out above
Dress and circuit lead are prepared as final mode conversion two-dimensional array ultrasonic transducer.
One mode provided by the embodiment of the present invention converts ultrasonic transducer and its manufacturing method, has using piezoelectric ceramics
There is the characteristic of many mode of oscillations, select the mode of oscillation in the acoustic radiation direction needed, designs choosing in the acoustic radiation direction of needs
Pure mode of oscillation is selected, acoustic radiation direction A is the thickness direction that mode converts piezoelectric patches 2, and electrode applies direction B and acoustic radiation
Direction A is vertical, and the electrode of each array element, which is drawn, uses flexible circuit board 3, solves the problems, such as that welding is unreliable and guarantees each array element
The consistency of impedance.In the way of mode conversion, piezo-electricity composite material can be prepared as ceramics pole interval less than certain value, protect
There is not graing lobe in card, so that it may the focusing performance obtained.Moreover, passing through preparation mode transfer electron face (positive electrode conducting layer 211
With negative conducting layer 212), 3 lead of card slot and double-sided PCB, full wiring can be carried out to two-dimensional array, solved traditional super
The problem that sonic soldering connects is unreliable, time-consuming, at high cost, is more suitable for the batch production of more array element two-dimensional array ultrasonic transducers.
The above is merely preferred embodiments of the present invention, be not intended to limit the invention, it is all in spirit of the invention and
Made any modification, equivalent replacement or improvement etc., should all be included in the protection scope of the present invention within principle.
Claims (12)
1. one mode converts ultrasonic transducer, which is characterized in that convert piezoelectric patches, circuit board, the mould including shell, mode
Formula conversion piezoelectric patches is set in the shell, and the circuit board is connected to the mode conversion piezoelectric patches；The mode conversion
Piezoelectric patches includes multiple piezoelectric blocks, and the mode conversion piezoelectric patches is provided on one side for inserting for circuit board insertion
Slot, the two sides of the slot are the electrode of the piezoelectric blocks, and the circuit board inserts in the slot and connects with the electrode.
2. one mode as described in claim 1 converts ultrasonic transducer, which is characterized in that the one side of the circuit board is arranged
There is positive wire, the another side of the circuit board is provided with negative wire, and the circuit board is connected with cable or cylinder manifold.
3. one mode as described in claim 1 converts ultrasonic transducer, which is characterized in that the slot is provided at least two
Item, each slot are arranged in parallel and each piezoelectric blocks are divided at least three rows, and the two sides of the slot are respectively anode
Conductive layer and negative conducting layer, the positive electrode conducting layer connect with the one side of piezoelectric blocks described in a line, the negative conducting layer
Connect with piezoelectric blocks one side described in adjacent another row, and with piezoelectric blocks described in a line, two opposite sides are positive respectively
Pole conductive layer and negative conducting layer.
4. one mode as described in claim 1 converts ultrasonic transducer, which is characterized in that the mode conversion piezoelectric patches
Bottom surface is provided with matching layer.
5. one mode as described in claim 1 converts ultrasonic transducer, which is characterized in that the piezoelectric blocks are provided with multirow
Multiple row, the piezoelectric blocks between adjacent column are connected by insulant.
6. one mode as described in claim 1 converts ultrasonic transducer, which is characterized in that the circuit board is flexible circuit
Plate, and/or, the shell is made of magnetic compatible material.
7. one mode as claimed in claim 2 converts ultrasonic transducer, which is characterized in that the shell includes shell and company
It is connected to the top cover of the shell, the mode conversion piezoelectric patches is set in the flat bottom surface of the shell, and the circuit board hangs down
The straight mode conversion piezoelectric patches inserts in the slot, and the cable is arranged in the top cover and is connected to the circuit board two
The positive wire and negative wire of side.
8. the manufacturing method of one mode conversion ultrasonic transducer, which comprises the following steps:
Prepare shell, circuit board and with slot and the slot two sides are that the mode of piezoelectric blocks electrode converts piezoelectric patches；
Mode conversion piezoelectric patches is placed in the shell；
Circuit board is inserted in the slot of the mode conversion piezoelectric patches, connect circuit board and the electrode of the piezoelectric blocks.
9. the manufacturing method of one mode conversion ultrasonic transducer as claimed in claim 8, which is characterized in that prepare the mould
Formula convert piezoelectric patches the following steps are included:
Piezoelectric patches is prepared, opens up the first separate slot, filling in the first separate slot of Yu Suoshu along first direction in the front of the piezoelectric patches
Conductive material；The second separate slot intersected with first separate slot is opened up in a second direction in the front of the piezoelectric patches, Yu Suoshu the
Insulant is filled in two separate slots；
By the material removal of the setting thickness at the piezoelectric patches back side, matching layer is set at the piezoelectric patches back side；
Slot is set on the conductive material along first separate slot, make the conductive material be divided by the slot be attached at it is adjacent
The positive electrode conducting layer and negative conducting layer of capable piezoelectric blocks side.
10. the manufacturing method of one mode conversion ultrasonic transducer as claimed in claim 9, which is characterized in that the circuit
The two sides of plate is respectively arranged with more positive wires and Duo Gen negative wire, when the circuit board is inserted in the slot, each institute
It states positive wire and passes through conductive material respectively and connect with the positive electrode conducting layer of the piezoelectric blocks side each in same a line, each institute
It states negative wire and passes through conductive material respectively and connect with the negative conducting layer of the piezoelectric blocks side each in another row；By line
Cable is connected to the circuit board.
11. the manufacturing method of one mode conversion ultrasonic transducer as claimed in claim 10, which is characterized in that the circuit
Plate is flexible circuit board.
12. the manufacturing method of one mode conversion ultrasonic transducer as claimed in claim 10, which is characterized in that turn mode
Change piezoelectric patches be placed in bottom with plane shell in flatten, circuit board in the mode conversion piezoelectric patches be packed into shell before or
Slot is inserted in after being packed into shell.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110337056A (en) * | 2019-08-06 | 2019-10-15 | 常州元晶电子科技有限公司 | A kind of production method of high density directive property piezo-electric electro-acoustic transducer array |
| CN112885954A (en) * | 2021-01-11 | 2021-06-01 | 中国科学院声学研究所 | Piezoelectric interlayer |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0553804A2 (en) * | 1992-01-31 | 1993-08-04 | Acoustic Imaging Technologies Corporation | Apparatus for and method of cooling ultrasonic medical transducers by conductive heat transfer |
| US6020820A (en) * | 1997-10-28 | 2000-02-01 | Micro-Star International Co., Ltd. | CPU over-heat protection detection device |
| CN101405090A (en) * | 2005-11-02 | 2009-04-08 | 视声公司 | Arrayed ultrasonic transducer |
| CN101755365A (en) * | 2007-07-24 | 2010-06-23 | 索尼爱立信移动通讯有限公司 | Antenna assembly |
| CN104586430A (en) * | 2015-01-19 | 2015-05-06 | 深圳市理邦精密仪器股份有限公司 | Ultrasonic probe and manufacturing method for ultrasonic probe |
| WO2015077593A1 (en) * | 2013-11-22 | 2015-05-28 | Covarx Corporation | 2d matrix array backing interconnect assembly, 2d ultrasonic transducer array, and method of manufacture |
| TWM509967U (en) * | 2015-02-16 | 2015-10-01 | Chicony Power Tech Co Ltd | Integrated power converting device |
| CN105170435A (en) * | 2015-09-23 | 2015-12-23 | 深圳先进技术研究院 | High-frequency ultrasonic transducer and preparing method thereof |
| CN105596027A (en) * | 2014-11-05 | 2016-05-25 | 香港理工大学深圳研究院 | Two-dimensional array ultrasonic transducer based on three-dimensional ultrasonic imaging and preparation method for same |
| CN105784095A (en) * | 2014-12-24 | 2016-07-20 | 中国船舶重工集团公司第七〇五研究所 | High-sensitivity and high-frequency broadband receiving cylindrical array implementation method |
| CN106111510A (en) * | 2016-06-27 | 2016-11-16 | 深圳先进技术研究院 | A kind of full Wiring type two dimensional surface battle array ultrasonic transducer and manufacture method thereof |
| CN106361373A (en) * | 2016-09-23 | 2017-02-01 | 深圳先进技术研究院 | Two-dimensional planar array ultrasonic transducer and manufacturing method thereof |
| EP2216104B1 (en) * | 2009-02-10 | 2017-02-01 | Humanscan Co., Ltd. | Ultrasonic probe, ultrasonic imaging apparatus and fabricating method thereof |
| CN106805994A (en) * | 2015-11-27 | 2017-06-09 | 中国科学院深圳先进技术研究院 | ultrasonic probe and preparation method thereof |
| CN106975590A (en) * | 2017-03-09 | 2017-07-25 | 中国科学院深圳先进技术研究院 | A kind of empty backing two-dimensional array ultrasonic transducer |
| CN107135616A (en) * | 2016-02-29 | 2017-09-05 | At&S奥地利科技与系统技术股份公司 | Printed circuit panel products and its production method with antenna structure |
-
2017
- 2017-12-18 CN CN201711364450.9A patent/CN109926298B/en active Active
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0553804A2 (en) * | 1992-01-31 | 1993-08-04 | Acoustic Imaging Technologies Corporation | Apparatus for and method of cooling ultrasonic medical transducers by conductive heat transfer |
| US6020820A (en) * | 1997-10-28 | 2000-02-01 | Micro-Star International Co., Ltd. | CPU over-heat protection detection device |
| CN101405090A (en) * | 2005-11-02 | 2009-04-08 | 视声公司 | Arrayed ultrasonic transducer |
| CN101755365A (en) * | 2007-07-24 | 2010-06-23 | 索尼爱立信移动通讯有限公司 | Antenna assembly |
| EP2216104B1 (en) * | 2009-02-10 | 2017-02-01 | Humanscan Co., Ltd. | Ultrasonic probe, ultrasonic imaging apparatus and fabricating method thereof |
| WO2015077593A1 (en) * | 2013-11-22 | 2015-05-28 | Covarx Corporation | 2d matrix array backing interconnect assembly, 2d ultrasonic transducer array, and method of manufacture |
| CN105596027A (en) * | 2014-11-05 | 2016-05-25 | 香港理工大学深圳研究院 | Two-dimensional array ultrasonic transducer based on three-dimensional ultrasonic imaging and preparation method for same |
| CN105784095A (en) * | 2014-12-24 | 2016-07-20 | 中国船舶重工集团公司第七〇五研究所 | High-sensitivity and high-frequency broadband receiving cylindrical array implementation method |
| CN104586430A (en) * | 2015-01-19 | 2015-05-06 | 深圳市理邦精密仪器股份有限公司 | Ultrasonic probe and manufacturing method for ultrasonic probe |
| TWM509967U (en) * | 2015-02-16 | 2015-10-01 | Chicony Power Tech Co Ltd | Integrated power converting device |
| CN105170435A (en) * | 2015-09-23 | 2015-12-23 | 深圳先进技术研究院 | High-frequency ultrasonic transducer and preparing method thereof |
| CN106805994A (en) * | 2015-11-27 | 2017-06-09 | 中国科学院深圳先进技术研究院 | ultrasonic probe and preparation method thereof |
| CN107135616A (en) * | 2016-02-29 | 2017-09-05 | At&S奥地利科技与系统技术股份公司 | Printed circuit panel products and its production method with antenna structure |
| CN106111510A (en) * | 2016-06-27 | 2016-11-16 | 深圳先进技术研究院 | A kind of full Wiring type two dimensional surface battle array ultrasonic transducer and manufacture method thereof |
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