CN203456443U - Lead frame assembly and lead frame thereof - Google Patents
Lead frame assembly and lead frame thereof Download PDFInfo
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- CN203456443U CN203456443U CN201320254410.XU CN201320254410U CN203456443U CN 203456443 U CN203456443 U CN 203456443U CN 201320254410 U CN201320254410 U CN 201320254410U CN 203456443 U CN203456443 U CN 203456443U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to a lead frame sub-assembly and lead frame thereof. The lead frame comprises a plurality of electric connection parts, a frame part and a plurality of connection parts. The frame portion includes a section and at least one aperture defining the section. Each joint connects at least one electrical connection, wherein the joints are aligned in a direction extending through the at least one aperture and the segment, and the segment has a dimension in the direction of less than 2.7 millimeters.
Description
Technical field
The utility model relates to a kind of lead frame sub-assembly and lead frame thereof.
Background technology
Light-emitting diode assembly comprises light-emitting diode and lead frame conventionally.Lead frame can comprise two electrodes, and light-emitting diode can be arranged on an electrode, and is electrically connected to described two electrodes.Light-emitting diode assembly can comprise a reflector in addition, around light-emitting diode, forms.Reflector can be by the lateral light of light-emitting diode to external reflectance.
First the making of general light-emitting diode assembly is to prepare lead frame tablet, and wherein lead frame tablet can comprise the lead frame of a plurality of arrayed.Then, reflector accordingly molded (mo1ding) on lead frame tablet.Then, light-emitting diode is fixed on to corresponding lead frame, and via routing, is electrically connected to the electrode of lead frame.Afterwards, then with resin-encapsulated light-emitting diode.
In the technique of some light-emitting diode assemblies, can use highdensity lead frame tablet.In highdensity lead frame tablet, lead frame is with closely-spaced mode dense arrangement.When molded reflector on highdensity lead frame tablet, reflector can be connected.
After resin-encapsulated light-emitting diode, can cut.During cutting, cutter cut to the reflector being connected from the metal edge frame of lead frame tablet.Lead frame tablet is that metal is made, and the reflector being connected is to be made by macromolecular material.Because metal is different from material or the hardness of macromolecular material, therefore conventionally need to use different cutting methods.Using under identical cutting method, while cutting macromolecular material again after one section of metal of cutter cutting, the reflector being easily connected is heaved or is produced large cull or the problem such as break.
Utility model content
Because foregoing problems, the utility model discloses a kind of new lead frame and lead frame sub-assembly.
An embodiment of the present utility model discloses a kind of lead frame.Described lead frame comprises a plurality of electrical connection sections, a frame portion, and a plurality of linking part.Described frame portion comprises a section and defines at least one perforate of described section.Each linking part connects at least one electrical connection section, and wherein said linking part is arranged in the direction that extends through described at least one perforate and described section, and the size of described section in described direction is less than 2.7 millimeters.In one embodiment, the described size of described section in described direction is less than 2 millimeters.In one embodiment, the described size of described section in described direction is less than 1 millimeter.In one embodiment, the described size of described section in described direction is not less than the thickness of described frame portion.In one embodiment, described section is close to outward flange or the inward flange of described frame portion, and some of electrical connection sections connect described inward flange.In one embodiment, described at least one perforate comprises the slotted hole longitudinally extending along described direction.In one embodiment, described at least one perforate comprises the frame hole of extending along the longitudinally of described frame portion.In one embodiment, described at least one perforate comprises a plurality of perforates of arranging along described direction.
An embodiment of the present utility model discloses a kind of lead frame sub-assembly.Described lead frame sub-assembly comprises above-mentioned lead frame and colloid, and wherein colloid and described lead frame are affixed.
Another embodiment of the present utility model discloses a kind of lead frame.Described lead frame comprises a frame portion.Described frame portion comprises at least one perforate and a section that can pass through along cut direction, and described section is defined in wherein said at least one perforate, and described section is less than 2.7 millimeters in the size along in described cut direction.In one embodiment, the described size of described section in described cut direction is less than 2.5 millimeters.In one embodiment, the described size of described section in described cut direction is less than 2 millimeters.In one embodiment, the described size of described section in described cut direction is less than 1 millimeter.In one embodiment, the described size of described section in described cut direction is not less than the thickness of described frame portion.In one embodiment, described section is close to outward flange or the inward flange of described frame portion, and a plurality of electrical connection sections of wherein said lead frame connect described inward flange.In one embodiment, described at least one perforate comprises the slotted hole longitudinally extending along described cut direction.In one embodiment, described at least one perforate comprises the frame hole of extending along the longitudinally of described frame portion.In one embodiment, described at least one perforate comprises a plurality of perforates of arranging along described cut direction.
Another embodiment of the present utility model discloses a kind of lead frame sub-assembly.Described lead frame sub-assembly comprises above-mentioned another lead frame and colloid, and wherein said colloid and described another lead frame are affixed.
Because the size of above-mentioned section is little, make perforate and gel phase apart from shorter, thereby can avoid occurring colloid when cutting, heave or produce the problems such as large cull.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the lead frame of an embodiment of the present utility model;
Fig. 2 is the partial enlarged drawing of the lead frame of Fig. 1;
Fig. 3 is the schematic diagram of the lead frame sub-assembly of an embodiment of the present utility model;
The back side of the lead frame sub-assembly of Fig. 4 illustration Fig. 3;
Fig. 5 is the schematic diagram of the lead frame of another embodiment of the present utility model;
Fig. 6 is the partial enlarged drawing of the lead frame of Fig. 5;
Fig. 7 is the schematic diagram of the lead frame sub-assembly of another embodiment of the present utility model;
The back side of the lead frame sub-assembly of Fig. 8 illustration Fig. 7;
Fig. 9 is the schematic diagram of the lead frame of another embodiment of the present utility model;
Figure 10 is the partial enlarged drawing of the lead frame of Fig. 9; And
Figure 11 is the schematic diagram of the lead frame of another embodiment of the present utility model.
Embodiment
Below coordinate graphic detailed description embodiment of the present utility model.
Fig. 1 is the schematic diagram of the lead frame 1 of an embodiment of the present utility model.Fig. 2 is the partial enlarged drawing of the lead frame 1 of Fig. 1.As shown in Figures 1 and 2, lead frame 1 can comprise a frame portion 11, a plurality of electrical connection section (12a and 12b), and a plurality of linking part 13.A plurality of electrical connection sections (12a and 12b) can be regularly arranged.Frame portion 11 can be in the other extension of a plurality of electrical connection sections (12a and 12b).Each linking part 13 can connect at least one electrical connection section (12a or 12b).
In one embodiment, lead frame 1 has a sealing framework, described sealing framework is centered around the periphery of a plurality of electrical connection sections (12a and 12b), part electrical connection section (12a and 12b) connecting sealed framework, and frame portion 11 is the part of described sealing framework or the part of an edge.In one embodiment, frame portion 11 can extend between a plurality of electrical connection sections (12a and 12b).
In one embodiment, lead frame 1 is for making light-emitting diode assembly, and electrical connection section (12a or 12b) is the electrode as light-emitting diode.
In one embodiment, two electrical connection sections (12a and 12b) have Bu Tong size, and have larger area electrical connection section (12a or 12b), can carry light-emitting diode.
Shown in Fig. 2, electrical connection section (12a and 12b) interconnects or is connected to frame portion 11 with linking part 13.Linking part 13 can be arranged in a plurality of row and a plurality of row.Frame portion 11 can comprise a plurality of the first slotted holes 111.A plurality of the first slotted holes 111 arrange corresponding to the linking part 13 of a plurality of row or the linking part of a plurality of row 13.The first slotted hole 111 is a kind of perforates that can be used for cutting (singulation), and, when cutting, cutter enter the first slotted hole 111.The linking part 13 of row or column is extending through arrangement in the direction 4 of corresponding the first slotted hole 111, and the first slotted hole 111 is simultaneously also along described direction 4 longitudinal extensions.Direction 4 can be the cut direction of cutter cutting.
Shown in Fig. 2, each first slotted hole 111 has two minor faces 1111 and 1112, and wherein minor face 1111 is than the more close electrical connection section of another minor face 1112 (12a and 12b).Each minor face 1111 can be defined by a section 112 of frame portion 11.
In one embodiment, the size W of the section 112 that defines each first slotted hole 111 in the orientation 4 of the linking part 13 of corresponding row or column is less than 2.7 millimeters (mm).In one embodiment, the size W of section 112 is less than 2.5 millimeters.In one embodiment, the size W of section 112 is less than 2 millimeters.In one embodiment, the size W of section 112 is less than 1 millimeter.Section 112 has larger size W can allow frame portion 11 have larger rigidity at section 112 places; And section 112 has less size W and can reduce and need the part of cutting in frame portion 11, thereby reduce two kinds of problems that unlike material produces of cutting.
In one embodiment, the size W of section 112 is not less than the thickness (in the size of the drawing upper frame 11 of vertical view 2) of frame portion 11.In one embodiment, the thickness of frame portion 11 is the thickness of measuring on a predetermined point in frame portion 11.In one embodiment, the thickness of frame portion 11 is the mean value of the thickness measured on a plurality of predetermined points in frame portion 11.In one embodiment, the thickness of frame portion 11 is the measured values in thickness in frame portion 11.In one embodiment, the thickness of frame portion 11 is measured values of thinnest part in frame portion 11.In one embodiment, the thickness of frame portion 11 is in frame portion 11 between the measured value of thinnest part and the measured value in thickness.In one embodiment, the thickness of frame portion 11 is between 0.1 to 0.5 millimeter.
Shown in Fig. 2, in one embodiment, in the orientation 4 of linking part 13, the dimension D of the section 117 of an outward flange 114 of next-door neighbour frame portion 11 in direction 4 can be less than 2.7 millimeters.In one embodiment, the dimension D of section 117 in direction 4 can be less than 2.5 millimeters.In one embodiment, the dimension D of section 117 in direction 4 can be less than 2 millimeters.In one embodiment, the dimension D of section 117 in direction 4 can be less than 1 millimeter.In one embodiment, the dimension D of section 117 in direction 4 is not less than the thickness (in the size of the drawing upper frame 11 of vertical view 2) of frame portion 11.Larger distance B can allow frame portion 11 have herein larger rigidity; And there is less distance B, can reduce and in frame portion 11, need the part of cutting, thereby reduce the abrasion of cutting edge.
In one embodiment, the dimension D in direction 4 is not less than the thickness (in the size of the drawing upper frame 11 of vertical view 2) of frame portion 11.
Refer again to shown in Fig. 2, frame portion 11 can comprise a plurality of the second slotted holes 113 in addition.A plurality of the second slotted holes 113 arrange corresponding to a plurality of the first slotted holes 111, and wherein section 112 is between first slotted hole 111 and the second slotted hole 113 of correspondence.
Shown in Fig. 2, frame portion 11 has an inward flange 115, the electrical connection section of inward flange 115 coupling parts (12a and 12b).The inward flange 115 of next-door neighbour frame portion 11 has a section 116.In one embodiment, the size L of section 116 in direction 4 is less than 2.7 millimeters.In one embodiment, the size L of section 116 in direction 4 is less than 2.5 millimeters.In one embodiment, the size L of section 116 in direction 4 is less than 2 millimeters.In one embodiment, the size L of section 116 in direction 4 is less than 1 millimeter.In one embodiment, the size L of section 116 in direction 4 is not less than the thickness (in the size of the drawing upper frame 11 of vertical view 2) of frame portion 11.
In one embodiment, the conductive coefficient of lead frame 1 can be greater than 400W/mK.In one embodiment, the conductive coefficient of lead frame 1 between 300W/mK between 400W/mK.In one embodiment, the conductive coefficient of lead frame 1 can be less than 300W/mK.
In one embodiment, lead frame 1 can be made etching on metal plates.In one embodiment, lead frame 1 can punching press be made and obtain.
Fig. 3 is the schematic diagram of the lead frame sub-assembly 3 of an embodiment of the present utility model.Shown in Fig. 3, lead frame sub-assembly 3 comprises aforesaid lead frame 1 and a colloid 2, and wherein colloid 2 and lead frame 1 are affixed.
In one embodiment, colloid 2 can utilize and embed molded (insert-molded) technique set lead frame 1.In one embodiment, colloid 2 can utilize injection-molded (injection molding) technique set lead frame 1.In one embodiment, colloid 2 can utilize transfer moulding (transfer molding) technique set lead frame 1.In one embodiment, colloid 2 can utilize compression molding (compression molding) technique set lead frame 1.
Shown in Fig. 3, colloid 2 can form next-door neighbour's section 112.Because the size of section 112 is little, make colloid 2 extensible near the first slotted hole 111, therefore when cutting, even if use same cutting method, can there is not colloid 2 yet and heave or produce the problems such as large cull.
In the frame portion of lead frame, can form another kind perforate that is different from aforementioned slotted hole.Fig. 5 be another embodiment of the present utility model lead frame 1 ' schematic diagram.Fig. 6 be Fig. 5 lead frame 1 ' partial enlarged drawing.Fig. 7 be another embodiment of the present utility model lead frame sub-assembly 3 ' schematic diagram.The lead frame sub-assembly 3 of Fig. 8 illustration Fig. 7 ' the back side.Shown in Fig. 5 and Fig. 6, lead frame 1 ' comprise a frame portion 11 ' and a plurality of electrical connection section (12a and 12b), wherein part electrical connection section (12a and 12b) by linking part 13 connection box portions 11 ' inward flange 115.
Frame portion 11 ' the can be part around a part for framework for a plurality of electrical connection sections (12a and 12b) or an edge of an edge of framework or framework.In one embodiment, frame portion 11 ' can extend between a plurality of electrical connection sections (12a and 12b).
Frame portion 11 ' be above formed with a 51，Kuang hole, frame hole 51 can be the frame portion 11 that is parallel to ' outward flange 114 inward flange 115 longitudinal extensions or along frame portion 11 ' longitudinally 10 perforate (Fig. 8) of extending.Frame hole 51 is for cutting.When cutting, cutter are introduced into frame hole 51, then cut along cutting path.
When frame portion 11 ' be an edge of framework, frame portion 11 ' can comprise a frame hole 51, its center hole 51 is extended and is contained cut coverage.In another embodiment, frame portion 11 ' can comprise a plurality of frames hole 51, each frame hole 51 be parallel to frame portion 11 ' outward flange 114 or inward flange 115 longitudinal extensions.The length in a plurality of frames hole 51 can be identical or different.The width in a plurality of frames hole 51 can be identical or different.Can align or not line up in the direction that is parallel to outward flange 114 or inward flange 115 in a plurality of frames hole 51.
Frame portion 11 ' can comprise at least one section (112,116 or 117), its center hole 51 or the second slotted hole 113 define at least one section (112,116 or 117), and a plurality of electrical connection section (12a and 12b) is arranged in a cut direction 7 that extends through frame hole 51, the second slotted hole 113 and at least one section (112,116 or 117).
Shown in Fig. 6, frame hole 51 can near frame portion 11 ' outward flange 114.In one embodiment, frame hole 51 and frame portion 11 ' outward flange 114 between the dimension D of section 117 in direction 4 be less than 2.7 millimeters.In one embodiment, the dimension D of section 117 in direction 4 is less than 2 millimeters.In one embodiment, the dimension D of section 117 in direction 4 is less than 1 millimeter.In one embodiment, the dimension D of section 117 in direction 4 be not less than frame portion 11 ' thickness.
Shown in Fig. 7 and Fig. 8, lead frame sub-assembly 3 ' comprise an above-mentioned lead frame 1 ' and colloid 2, wherein lead frame 1 ' with colloid 2 can be affixed.
Shown in Fig. 7, colloid 2 comprises a main part 21, main part 21 protrusion lead frames 1 ', on main part 21, can be formed with a plurality of grooves 211, groove 211 can be accommodated light-emitting diode.The sidewall that defines groove 211 can be inclined-plane or curved surface, to reflect the luminous of light-emitting diode.
Fig. 9 is the lead frame 1 of another embodiment of the present utility model " schematic diagram.Figure 10 is the lead frame 1 of Fig. 9 " partial enlarged drawing.Shown in Fig. 9 and Figure 10, lead frame 1 " comprises a frame portion 11 ".Frame portion 11 " can comprise at least one perforate 91 and at least one section (112,116 or 117).At least one perforate 91 is for cutting; While cutting, cutter can cut along at least one perforate 91.Along a cut direction 4, can pass through at least one perforate 91 and at least one section (112,116 or 117).In one embodiment, the size (W, L or D) of at least one section (112,116 or 117) in direction 4 is less than 2.7 millimeters.In one embodiment, the size (W, L or D) of at least one section (112,116 or 117) in direction 4 is less than 2.5 millimeters.In one embodiment, the size (W, L or D) of at least one section (112,116 or 117) in direction 4 is less than 2 millimeters.In one embodiment, the size (W, L or D) of at least one section (112,116 or 117) in direction 4 is less than 1 millimeter.In one embodiment, the size (W, L or D) of at least one section (112,116 or 117) in direction 4 is not less than frame portion 11 " thickness (in the size of the drawing upper frame 11 of vertical view 2).
In one embodiment, at least one perforate 91 comprises a plurality of perforates.In one embodiment, at least one perforate 91 comprises a plurality of perforates, and wherein said perforate is arranged along direction 4.In one embodiment, at least one perforate 91 comprises a plurality of perforates, and the perforate of some of perforates and another part varies in size.In one embodiment, at least one perforate 91 comprises a plurality of perforates, and wherein said perforate size is identical.In one embodiment, at least one perforate 91 comprises a plurality of perforates, and wherein said perforate is to equidistantly distribute.In one embodiment, at least one perforate 91 comprises a plurality of perforates, and wherein said perforate is not equidistantly distribute.
At least one perforate 91 comprises a plurality of perforates.In one embodiment, as shown in figure 11, described a plurality of perforates comprise a 93，Kuang hole, frame hole 93 can be the frame portion 11 that is parallel to " outward flange 114 inward flange 115 longitudinal extensions or along frame portion 11 " longitudinally 10 perforate of extending.
In one embodiment, at least one perforate 91 comprises a plurality of perforates, and the size of a section 92 in direction 4 that some of described perforates are defined is less than 2.7 millimeters.In one embodiment, the size of section 92 in direction 4 is less than 2.5 millimeters.In one embodiment, the size of section 92 in direction 4 is less than 2 millimeters.In one embodiment, the size of section 92 in direction 4 is less than 1 millimeter.In one embodiment, the size of section 92 in direction 4 is not less than frame portion 11 " thickness (in the size of the drawing upper frame 11 of vertical view 2).
In one embodiment, at least one section (112,116 or 117) comprises next-door neighbour's frame portion 11 " the section 117 of outward flange 114.
" comprise an inward flange 115, part electrical connection section (12a and 12b) is connected inward flange 115 in frame portion 11.In one embodiment, at least one section (112,116 or 117) comprises next-door neighbour frame portion 11 " the section 116 of inward flange 115.
Shown in Figure 10, lead frame 1 " can be affixed with colloid 2, to form a lead frame sub-assembly 3 ".Colloid 2 can be filled lead frame 1 " goes up the gap between electrical connection section (12a and 12b).In one embodiment, the section 112 that colloid 2 can cover part.
In an embodiment of the present utility model, in the frame portion of lead frame, form at least one perforate, make in a cut direction local frame partly be slit into a plurality of sections, avoid whereby when cutting, there is colloid and heave or produce the problems such as large cull.The size of at least part of section in cut direction is less than a preliminary dimension, for example: 2.7 millimeters or less.
Technology contents of the present utility model and technical characterstic disclose as above, yet those skilled in the art still may be based on teaching of the present utility model and announcement and done all replacement and modifications that does not deviate from spirit of the present utility model.Therefore, protection range of the present utility model should be not limited to those disclosed embodiments, and should comprise various do not deviate from replacement of the present utility model and modifications, and is contained by appending claims.
Claims (37)
1. a lead frame, it comprises:
A plurality of electrical connection sections;
One frame portion, at least one perforate that it comprises a section and defines described section; And
A plurality of linking parts, described in each, linking part connects at least one in described electrical connection section, and wherein said linking part is arranged in the direction that extends through described at least one perforate and described section, and the size of described section in described direction is less than 2.7 millimeters.
2. lead frame according to claim 1, the described size of wherein said section in described direction is less than 2.5 millimeters.
3. lead frame according to claim 1, the described size of wherein said section in described direction is less than 2 millimeters.
4. lead frame according to claim 1, the described size of wherein said section in described direction is less than 1 millimeter.
5. lead frame according to claim 1, the described size of wherein said section in described direction is not less than the thickness of described frame portion.
6. according to the lead frame described in arbitrary claim in claim 1 to 5, wherein said section is close to outward flange or the inward flange of described frame portion, and some of described electrical connection sections connect described inward flange.
7. lead frame according to claim 6, wherein said at least one perforate comprises the slotted hole that longitudinally extends along described direction, the frame hole of extending along the longitudinally of described frame portion or a plurality of perforates of arranging along described direction.
8. lead frame according to claim 1, wherein said at least one perforate comprises the slotted hole that longitudinally extends along described direction, the frame hole of extending along the longitudinally of described frame portion or a plurality of perforates of arranging along described direction.
9. a lead frame sub-assembly, it comprises:
Lead frame, it comprises:
One frame portion, at least one perforate that it comprises a section and defines described section;
A plurality of electrical connection sections; And
A plurality of linking parts, described in each, linking part connects at least one in described electrical connection section, and wherein said linking part is arranged in the direction that extends through described at least one perforate and described section, and the size of described section in described direction is less than 2.7 millimeters; And colloid, itself and described lead frame are affixed.
10. lead frame sub-assembly according to claim 9, the described size of wherein said section in described direction is less than 2.5 millimeters.
11. lead frame sub-assemblies according to claim 9, the described size of wherein said section in described direction is less than 2 millimeters.
12. lead frame sub-assemblies according to claim 9, the described size of wherein said section in described direction is less than 1 millimeter.
13. lead frame sub-assemblies according to claim 9, the described size of wherein said section in described direction is not less than the thickness of described frame portion.
14. according to the lead frame sub-assembly described in arbitrary claim in claim 9 to 13, and wherein said section is close to inward flange or the described colloid of the outward flange of described frame portion, described frame portion, and some of described electrical connection sections connect described inward flange.
15. lead frame sub-assemblies according to claim 14, wherein said at least one perforate comprises the slotted hole that longitudinally extends along described direction, the frame hole of extending along the longitudinally of described frame portion or a plurality of perforates of arranging along described direction.
16. lead frame sub-assemblies according to claim 9, wherein said at least one perforate comprises the slotted hole that longitudinally extends along described direction, the frame hole of extending along the longitudinally of described frame portion or a plurality of perforates of arranging along described direction.
17. lead frame sub-assemblies according to claim 9, wherein said colloid comprises the main part that protrudes described lead frame, and described main part is formed with a plurality of grooves.
18. lead frame sub-assemblies according to claim 9, wherein said colloid comprises silicone or resin.
19. 1 kinds of lead frames, it comprises:
Frame portion, it comprises at least one perforate and a section that can pass through along cut direction, and described section is defined in wherein said at least one perforate, and described section is less than 2.7 millimeters in the size along in described cut direction.
20. lead frames according to claim 19, the described size of wherein said section in described cut direction is less than 2.5 millimeters.
21. lead frames according to claim 19, the described size of wherein said section in described cut direction is less than 2 millimeters.
22. lead frames according to claim 19, the described size of wherein said section in described cut direction is less than 1 millimeter.
23. lead frames according to claim 19, the described size of wherein said section in described cut direction is not less than the thickness of described frame portion.
24. according to the lead frame described in arbitrary claim in claim 19 to 23, and wherein said section is close to outward flange or the inward flange of described frame portion, and a plurality of electrical connection sections of wherein said lead frame connect described inward flange.
25. lead frames according to claim 24, wherein said at least one perforate comprises the slotted hole that longitudinally extends along described cut direction, the frame hole of extending along the longitudinally of described frame portion or a plurality of perforates of arranging along described cut direction.
26. lead frames according to claim 19, wherein said at least one perforate comprises the slotted hole that longitudinally extends along described cut direction, the frame hole of extending along the longitudinally of described frame portion or a plurality of perforates of arranging along described cut direction.
27. 1 kinds of lead frame sub-assemblies, it comprises:
Lead frame, it comprises frame portion, and described frame portion comprises at least one perforate and a section that can pass through along cut direction, and described section is defined in wherein said at least one perforate, and described section is less than 2.7 millimeters in the size along in described cut direction; And colloid, itself and described lead frame are affixed.
28. lead frame sub-assemblies according to claim 27, the described size of wherein said section in described cut direction is less than 2.5 millimeters.
29. lead frame sub-assemblies according to claim 27, the described size of wherein said section in described cut direction is less than 2 millimeters.
30. lead frame sub-assemblies according to claim 27, the described size of wherein said section in described cut direction is less than 1 millimeter.
31. lead frame sub-assemblies according to claim 27, the described size of wherein said section in described cut direction is not less than the thickness of described frame portion.
32. according to the lead frame sub-assembly described in arbitrary claim in claim 27 to 31, and wherein said section is close to inward flange or the described colloid of the outward flange of described frame portion, described frame portion, and a plurality of electrical connection sections of wherein said lead frame connect described inward flange.
33. lead frame sub-assemblies according to claim 32, wherein said at least one perforate comprises the slotted hole that longitudinally extends along described cut direction, the frame hole of extending along the longitudinally of described frame portion or a plurality of perforates of arranging along described cut direction.
34. lead frame sub-assemblies according to claim 27, frame hole or described at least one perforate that wherein said at least one perforate comprises the slotted hole that longitudinally extends along described cut direction, extend along the longitudinally of described frame portion comprise a plurality of perforates of arranging along described cut direction.
35. lead frame sub-assemblies according to claim 27, wherein said colloid comprises the main part that protrudes described lead frame, and described main part is formed with a plurality of grooves.
36. lead frame sub-assemblies according to claim 27, wherein said colloid comprises silicone or resin.
37. according to the lead frame sub-assembly described in arbitrary claim in claim 27 to 30, and the described size of wherein said section in described cut direction is not less than the thickness of described frame portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101218602 | 2012-09-26 | ||
| TW101218602U TWM450063U (en) | 2012-09-26 | 2012-09-26 | Leadframe assembly and leadframe thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203456443U true CN203456443U (en) | 2014-02-26 |
Family
ID=48800432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320254410.XU Expired - Fee Related CN203456443U (en) | 2012-09-26 | 2013-05-10 | Lead frame assembly and lead frame thereof |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3185995U (en) |
| KR (1) | KR20140001960U (en) |
| CN (1) | CN203456443U (en) |
| TW (1) | TWM450063U (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105810656A (en) * | 2014-12-31 | 2016-07-27 | 无锡华润安盛科技有限公司 | Upper lead frame structure |
| TWI619272B (en) * | 2017-02-24 | 2018-03-21 | Ttop Corp | Light source sensor lead frame substrate structure |
| TWD207111S (en) | 2019-10-25 | 2020-09-11 | 順德工業股份有限公司 | Lead frame part |
-
2012
- 2012-09-26 TW TW101218602U patent/TWM450063U/en not_active IP Right Cessation
-
2013
- 2013-05-10 CN CN201320254410.XU patent/CN203456443U/en not_active Expired - Fee Related
- 2013-07-01 KR KR2020130005344U patent/KR20140001960U/en not_active Application Discontinuation
- 2013-07-02 JP JP2013003779U patent/JP3185995U/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140001960U (en) | 2014-04-03 |
| JP3185995U (en) | 2013-09-12 |
| TWM450063U (en) | 2013-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140226 Termination date: 20160510 |