CN105720035A - Lead frame and packaging body employing same - Google Patents
Lead frame and packaging body employing same Download PDFInfo
- Publication number
- CN105720035A CN105720035A CN201610176491.4A CN201610176491A CN105720035A CN 105720035 A CN105720035 A CN 105720035A CN 201610176491 A CN201610176491 A CN 201610176491A CN 105720035 A CN105720035 A CN 105720035A
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- China
- Prior art keywords
- metal
- lead frame
- packaging body
- muscle
- connects
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention provides a lead frame and a packaging body employing the same. The lead frame comprises a plurality of frame units, wherein each frame unit forms an independent packaging body after being packaged and cut; a saw lane is formed between a packaging line of each frame unit and the packaging line of the adjacent frame unit; and at least one metal connecting rib of each frame unit is located at the connected position of each packaging line and the corresponding saw lane and has an half-etched structure. The lead frame has the advantages that the at least one metal connecting rib of each frame unit is located at the connected position of each packaging line and the corresponding saw lane and has the half-etched structure; the thickness of metal at the to-be-cut position is reduced under the condition of ensuring the fixed appearance of a pin, so that metal burrs of the pin in the cutting process are reduced; and the product yield is improved.
Description
Technical field
The present invention relates to field of semiconductor package, particularly relate to a kind of lead frame for semiconductor packages and adopt the packaging body of this lead frame.
Background technology
Existing semiconductor package requires that package body sizes is little, takes up room little, and can include multiple chip in a package, and therefore, encapsulated space needs to be fully utilized.Fig. 1 is the structural representation of existing a kind of lead frame for flat no-lead packages.Referring to Fig. 1, described lead frame includes multiple frame unit 11, and each frame unit 11 forms independent encapsulation unit after follow-up encapsulation cutting, and in Fig. 1, employing dotted line schematically indicates the position of the packaging line 10 of subsequent encapsulating process.Each frame unit 11 includes the chip attachment portion 12 of two chip placements and multiple pin 14 being connected in framework 13.Pin 14 (as shown by arrows in FIG.) in packaging line corner has outside two adjacent faces are exposed to described packaging line.
This kind of lead frame has a disadvantage in that
(1) owing to pin 14 adopts metal to be connected with framework 13, when being packaged body cutting, metallic bur power is there will be in the metal fracture face of pin 14, particularly on the metal fracture face of the pin 14 of packaging line corner, metallic bur power is particularly evident, and metallic bur power can cause short circuit in terminal use applies.
(2) in order to ensure cutting quality, framework 13 is half-etching (half-etched regions adopts shadow line label to illustrate).Thus can cause that framework 13 intensity is more weak, when bonding wire it is possible that bonding wire is unstable or the situations such as (NSOL/NSOP) that ruptures.
Therefore, a kind of lead frame overcoming the problems referred to above is needed badly.
Summary of the invention
The technical problem to be solved is to provide a kind of lead frame and adopts the packaging body of this lead frame, and it can decrease the metallic bur power of pin during cutting, improves product yield.
In order to solve the problems referred to above, the invention provides a kind of lead frame, including multiple frame units, each frame unit can form independent packaging body after encapsulation cutting, it it is Cutting Road between the packaging line of each frame unit with the packaging line of adjacent frame unit, at least one metal of each frame unit connects the position that muscle connects with Cutting Road at packaging line, has half-etching structure.
Further, described half-etching structure adopts half-etching structure below lead frame, connects the muscle metal in packaging line position reducing metal.
Further, described half-etching structure adopts half-etching structure above lead frame, connects the muscle metal in packaging line position reducing metal.
Further, described metal connects muscle and is positioned at the corner of two adjacent described packaging lines, and described metal connects muscle and includes one first connecting portion and one second connecting portion.
Further, described first connecting portion and the second connecting portion etching direction are different.
Further, described lead frame unit also includes multiple all-metal portion, and each described metal connects muscle and is at least connected with an all-metal portion, and described all-metal portion is for electrically connecting with chip.
Further, being connected by framework between each lead frame unit, described framework is all-metal construction.
Further, the packaging line of each described frame unit is 0.075mm～0.12mm to the distance range of described framework.
Further, the width range of described framework is 0.06mm～0.18mm.
The present invention also provides for a kind of packaging body, in described packaging body, at least includes a metal and connects muscle: has half-etching structure connecting muscle with metal described in the position of packaging body side edge.
Further, in described packaging body, all described metals connect muscle and all have half-etching structure in the position with packaging body side edge.
Further, described metal connects half-etching above muscle employing lead frame.
Further, described metal connects half-etching below muscle employing lead frame.
Further, described metal connects muscle and is positioned at the corner of the adjacent both sides of described packaging body, and described metal connects muscle and includes one first connecting portion and one second connecting portion.
Further, described first connecting portion and the second connecting portion adopt different directions etching.
Further, in described packaging body, at least including an all-metal portion, metal described in connects all-metal portion described in muscle and and connects, and described all-metal portion is for electrically connecting with chip.
It is an advantage of the current invention that, at least one metal of each frame unit connects the position that muscle connects with Cutting Road at packaging line, there is half-etching structure, the metal thickness making the cut place of Cutting Road with external structure when the outward appearance that the metal that guarantee needs contact connects muscle is constant is thinning, decrease cut place tenor, and then the metallic bur power of the pin produced when decreasing cutting, improve product yield.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing lead frame；
Fig. 2 is the structural representation of lead frame of the present invention；
Fig. 3 is the schematic bottom view of packaging body of the present invention；
Fig. 4 is the schematic top plan view of packaging body of the present invention；
Schematic diagram is looked on the right side that Fig. 5 is packaging body of the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, the detailed description of the invention of lead frame provided by the invention and the packaging body adopting this lead frame is elaborated.
Referring to Fig. 2, lead frame of the present invention includes multiple frame unit 21, and each frame unit 21 can form independent packaging body after encapsulation cutting.It is Cutting Road 31 between the packaging line 20 of each frame unit 21 with the packaging line 20 of adjacent frame unit 21.Employing dotted line schematically indicates the position of the packaging line 20 of subsequent encapsulating process in fig. 2.In subsequent technique, cutter sweep can comprise the encapsulating structure of described lead frame along the cutting of described Cutting Road 31, thus forming packaging body.
At least one metal of each frame unit 21 connects the position that muscle 32 connects with Cutting Road 31 at packaging line 20 and has half-etching structure.In this embodiment, described metal connects muscle 32 for pin.Such as, described metal connects muscle 32 and includes at least one and be arranged at encapsulation first pin 22 of corner and at least one is arranged at the second pin 23 encapsulating non-corner.
Described half-etching structure adopts below lead frame half-etching structure above half-etching structure or lead frame, connects the muscle 32 metal in packaging line 20 position reducing metal.Below described framework, half-etching metal refers to from lead frame bottom etching lead frame, retain and remain non-etching part, to form half-etching metal below framework, above described framework, half-etching metal refers to from lead frame top lead frame, retain non-etching part, to form half-etching metal above framework.
Each frame unit 21 also includes at least one chip attachment portion 28.In this embodiment, each described frame unit 21 includes two chip attachment portions 28, is respectively provided with first pin 22 on two relative encapsulation corners of each described frame unit 21, has six the second pins 23 encapsulating on non-corner.
Described first pin 22 includes one first connecting portion 221 and one second connecting portion 222.One end of described first connecting portion 221 and one end of the second connecting portion 222 are respectively connecting to two adjacent edges of the framework 29 of described lead frame.Described first connecting portion 221 and the second connecting portion 222 are independent individuality, and it is not directly coupled each other.The first pin 22 being arranged at encapsulation corner adopts the first connecting portion 221 and the second connecting portion 222 to be connected on two adjacent edges of framework 29, can be prevented effectively from the generation of metallic bur power, improves product yield.
The structure of described first connecting portion 221 and the second connecting portion 222 is half-etching metal above half-etching metal or framework below framework, in fig. 2, below framework, half-etching metal adopts hacures schematically to indicate, and above framework, half-etching metal adopts round dot schematic indication to go out.The etching direction of described first connecting portion 221 and the second connecting portion 222 can be identical, it is also possible to different, in this embodiment, described first connecting portion 221 is half-etching metal below framework, and described second connecting portion 222 is half-etching metal above framework.
Described lead frame unit also includes multiple all-metal portion (not indicating in accompanying drawing), and each described metal connects muscle 32 and is at least connected with an all-metal portion, and described all-metal portion is for electrically connecting with the chip (not indicating in accompanying drawing) of follow-up attachment.Such as, described all-metal portion includes the first pin all-metal portion 223 and the second pin all-metal portion 231.The other end of described first connecting portion 221 and the other end of one second connecting portion 222 are connected with the first pin all-metal portion 223 respectively, described first pin all-metal portion 223 is for electrically connecting with the chip of follow-up attachment in chip attachment portion 28, such as, by the mode of routing, metal lead wire is adopted to be electrically connected with chip in described first pin all-metal portion 223.
One end of described second pin 23 is directly connected with framework 29, and the structure of described second pin 23 can be half-etching metal above half-etching metal or framework below framework.In this embodiment, the structure of described second pin 23 is half-etching metal below framework.The other end and the one second pin all-metal portion 231 of described second pin 23 connect, described second pin all-metal portion 231 is for electrically connecting with the chip of follow-up attachment in chip attachment portion 28, such as, by the mode of routing, metal lead wire is adopted to be electrically connected with chip in described second pin all-metal portion 231.
Lead frame of the present invention is by half-etching metal above framework or the method for half-etching metal below framework, ensure that the metal that the needs in packaging line 20 position are connected with external structure connect the outward appearance of muscle 32 constant, reduce the tenor of Cutting Road 31, reduce the generation of metallic bur power during follow-up cutting further.The metal of described lead frame is connected muscle 32 adopts the method for half-etching above framework can ensure after follow-up being packaged, it is identical with the shape that the metal not adopting half-etching to process of the prior art connects muscle that the exposed metal of package bottom connects muscle 32, and the metal exposed without influence on packaging body connects the outward appearance of muscle.
Shown in Fig. 2, the width A of described Cutting Road 31 is the distance between the packaging line 20 of adjacent two frame units 21.Described metal connects muscle 32 and adopts half-etching structure, without adopting all-metal construction, reduces the amount of metal at Cutting Road 31 internal cutting place, further reduces the generation of metallic bur power.
Further, the structure of the framework 29 of described lead frame is all-metal, and it is not etched.All-metal framework 29 can further enhance the intensity of described lead frame, improves the stability of lead frame.The width B of described framework 29 ranges for 0.06mm～0.18mm, for instance: 0.07mm, 0.08mm, 0.09mm, 0.10mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, 0.16mm, 0.17mm.In the prior art, the width of framework 29 is greater than 0.18mm, and therefore, the width of the framework 29 of lead frame of the present invention is less than the width of the framework of existing lead frame.Although framework 29 of the present invention adopts all-metal construction, but its width B reduces, therefore, the impact of cutting is only small, the stability of lead frame can be greatly enhanced simultaneously, make to be formed similar all-metal frame and connect each frame unit 21, and then make when sealing wire the warning almost without routing fault.
The reduction of the width of the framework 29 of described lead frame further increases metal and connects the distance that muscle 32 is connected with framework 29, and then reduces the amount of metal in Cutting Road, decreases the generation of metallic bur power.The packaging line 20 of each described frame unit 21 is 0.075mm～0.12mm to the distance range of described framework 29.Such as: 0.08mm, 0.09mm, 0.10mm, 0.11mm.
Referring to Fig. 3, Fig. 4 and Fig. 5, a kind of packaging body of the present invention adopts above-mentioned lead frame, and the structure of described lead frame is referring to Fig. 2.
Described packaging body at least includes a metal and connects muscle 32, connecting muscle 32 with metal described in the position of packaging body side edge, there is half-etching structure.Described half-etching structure adopts below lead frame half-etching structure above half-etching structure or lead frame, connects the muscle 32 metal in packaging line 20 position reducing metal.Below described framework, half-etching metal refers to from lead frame bottom etching lead frame, retain and remain non-etching part, to form half-etching metal below framework, above described framework, half-etching metal refers to from lead frame top lead frame, retain non-etching part, to form half-etching metal above framework.
Connecting muscle 32 with metal described in the position of packaging body side edge, there is the first metal thickness, described first metal thickness less than in packaging body away from the thickness of at least one metal of packaging body marginal position, thus reducing the tenor at Cutting Road 31 internal cutting place, reduce the generation of metallic bur power during cutting packaging body further.In this embodiment, described metal connects muscle 32 for pin, and described metal connects muscle 32 and includes at least one first pin 22 being arranged at encapsulation corner and at least one is arranged at the second pin 23 encapsulating non-corner.For the second pin 23, with the second pin 23 described in the position of packaging body side edge, there is the first metal thickness, and away from packaging body marginal position in packaging body, described second pin 23 is connected with the second pin all-metal portion 231, owing to there is half-etching structure with the second pin 23 described in the position of packaging body side edge, and in package interior away from packaging body marginal position, described second pin all-metal portion 231 is not etched, so, described first metal thickness is less than the metal thickness in described second pin all-metal portion 231, thus reducing the tenor at Cutting Road 31 internal cutting place, reduce the generation of metallic bur power during cutting packaging body further.
Described first pin 22 includes one first connecting portion 221 and one second connecting portion 222.Described first connecting portion the 221, second connecting portion 222 and the second pin 23 are exposed to two sides that described packaging body 30 is adjacent respectively.In this embodiment, described first connecting portion 221 is half-etching metal below framework, and described second connecting portion 222 is half-etching metal above framework, and the structure of described second pin 23 is half-etching metal below framework.Therefore, referring to Fig. 3, in the bottom surface of described packaging body 30, the second connecting portion 222 of described first pin 22 all-metal portion 223 and the second pin all-metal portion 231 and the first pin is exposed to packaging body 30 bottom surface；Referring to Fig. 4 and Fig. 5, the first connecting portion 221 of described second pin 23 and the first pin is exposed to a side of described packaging body 30, and the second connecting portion 222 of described second pin 23 and the first pin is exposed to another adjacent side of described packaging body 30.The exposed metal in packaging body ground and side connects muscle 32 metal exposed with the packaging body not adopting half-etching to process of the prior art, and to connect position and the quantity etc. of muscle identical, the metal exposed without influence on packaging body connects the outward appearance of muscle, thus without influence on packaging body subsequent use.
One group data of the packaging body that adopt of the present invention lead frame make are set forth below, to further illustrate advantages of the present invention.
Table 1 show employing lead frame bonding wire of the present invention, tests 10,000 products, and routing abnormal alarm (NSOP/NSOL) does not occur one, and lead frame intensity obtains very big improvement.
Table 1
| Packaging body type (Package) | Input (input) | Output (Output) | Yield (Yeild) | Routing abnormal alarm |
| DFN0806 | 10382 | 10382 | 100% | 0 |
That the burr of the packaging body adopting lead frame of the present invention is measured shown in table 2, burr average value measured at 18 μm～19 μm, simultaneously from the appearance burr almost without.
Table 2
The above is only the preferred embodiment of the present invention; it should be pointed out that, for those skilled in the art, under the premise without departing from the principles of the invention; can also making some improvements and modifications, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (16)
1. a lead frame, including multiple frame units, each frame unit can form independent packaging body after encapsulation cutting, it it is Cutting Road between the packaging line of each frame unit with the packaging line of adjacent frame unit, it is characterized in that, at least one metal of each frame unit connects the position that muscle connects with Cutting Road at packaging line, has half-etching structure.
2. lead frame according to claim 1, it is characterised in that described half-etching structure adopts half-etching structure below lead frame, connects the muscle metal in packaging line position reducing metal.
3. lead frame according to claim 1, it is characterised in that described half-etching structure adopts half-etching structure above lead frame, connects the muscle metal in packaging line position reducing metal.
4. lead frame according to claim 1, it is characterised in that described metal connects muscle and is positioned at the corner of two adjacent described packaging lines, and described metal connects muscle and includes one first connecting portion and one second connecting portion.
5. lead frame according to claim 4, it is characterised in that described first connecting portion and the second connecting portion etching direction are different.
6. lead frame according to claim 1, it is characterised in that described lead frame unit also includes multiple all-metal portion, and each described metal connects muscle and is at least connected with an all-metal portion, described all-metal portion is for electrically connecting with chip.
7. lead frame according to claim 1, it is characterised in that connected by framework between each lead frame unit, described framework is all-metal construction.
8. lead frame according to claim 7, it is characterised in that the packaging line of each described frame unit is 0.075mm～0.12mm to the distance range of described framework.
9. lead frame according to claim 7, it is characterised in that the width range of described framework is 0.06mm～0.18mm.
10. a packaging body, it is characterised in that in described packaging body, at least includes a metal and connects muscle: have half-etching structure connecting muscle with metal described in the position of packaging body side edge.
11. packaging body according to claim 10, it is characterised in that in described packaging body, all described metals connect muscle and all have half-etching structure in the position with packaging body side edge.
12. packaging body according to claim 10, it is characterised in that described metal connects muscle and adopts half-etching above lead frame.
13. packaging body according to claim 10, it is characterised in that described metal connects muscle and adopts half-etching below lead frame.
14. packaging body according to claim 10, it is characterised in that described metal connects muscle and is positioned at the corner of the adjacent both sides of described packaging body, described metal connects muscle and includes one first connecting portion and one second connecting portion.
15. packaging body according to claim 14, it is characterised in that described first connecting portion and the second connecting portion adopt different directions etching.
16. packaging body according to claim 10, it is characterised in that in described packaging body, at least including an all-metal portion, metal described in connects all-metal portion described in muscle and and connects, and described all-metal portion is for electrically connecting with chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610176491.4A CN105720035A (en) | 2016-03-25 | 2016-03-25 | Lead frame and packaging body employing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610176491.4A CN105720035A (en) | 2016-03-25 | 2016-03-25 | Lead frame and packaging body employing same |
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| CN105720035A true CN105720035A (en) | 2016-06-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610176491.4A Pending CN105720035A (en) | 2016-03-25 | 2016-03-25 | Lead frame and packaging body employing same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107195611A (en) * | 2017-05-27 | 2017-09-22 | 中国电子科技集团公司第十三研究所 | The preparation method of lead frame and shell assembly |
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| US20140319663A1 (en) * | 2013-04-18 | 2014-10-30 | Dai Nippon Printing Co., Ltd. | Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device |
| CN205488116U (en) * | 2016-03-25 | 2016-08-17 | 上海凯虹科技电子有限公司 | Lead frame and adopt packaging body of this lead frame |
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| CN1490870A (en) * | 2002-09-17 | 2004-04-21 | �¹������ҵ��ʽ���� | Lead frame and producing method thereof, semiconductor device therefrom |
| CN102844860A (en) * | 2010-04-12 | 2012-12-26 | 德克萨斯仪器股份有限公司 | Ball-grid array device having chip assembled on half-etched metal leadframe |
| US20140319663A1 (en) * | 2013-04-18 | 2014-10-30 | Dai Nippon Printing Co., Ltd. | Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device |
| CN103928353A (en) * | 2014-04-14 | 2014-07-16 | 矽力杰半导体技术(杭州)有限公司 | Non-outer-pin packaging structure and manufacturing method and wire frame of non-outer-pin packaging structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107195611A (en) * | 2017-05-27 | 2017-09-22 | 中国电子科技集团公司第十三研究所 | The preparation method of lead frame and shell assembly |
| CN107195611B (en) * | 2017-05-27 | 2023-06-16 | 中国电子科技集团公司第十三研究所 | Lead frame and manufacturing method of shell assembly |
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