TWM450063U - Leadframe assembly and leadframe thereof - Google Patents
Leadframe assembly and leadframe thereof Download PDFInfo
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- TWM450063U TWM450063U TW101218602U TW101218602U TWM450063U TW M450063 U TWM450063 U TW M450063U TW 101218602 U TW101218602 U TW 101218602U TW 101218602 U TW101218602 U TW 101218602U TW M450063 U TWM450063 U TW M450063U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
本創作係關於一種導線架組合及其導線架件。This creation is about a lead frame assembly and its lead frame.
發光二極體裝置通常包含發光二極體及導線架。導線架可包含兩電極,發光二極體可設置於一電極上,並與兩電極電性連接。發光二極體裝置可另包含一反光杯,環繞發光二極體來形成。反光杯可將發光二極體之側向光向外反射。Light-emitting diode devices typically include a light-emitting diode and a lead frame. The lead frame can include two electrodes, and the light emitting diode can be disposed on an electrode and electrically connected to the two electrodes. The light emitting diode device may further comprise a reflective cup formed around the light emitting diode. The reflector can reflect the lateral light of the light-emitting diode outward.
一般發光二極體裝置之製作首先是製備出導線架料片,其中導線架料片可包含複數個陣列排列之導線架。接著,反光杯對應地成型(molding)於導線架料片上。然後,發光二極體固定於對應之導線架,並經由打線,電性連接至導線架之電極。之後,再以樹脂封裝發光二極體。Generally, the fabrication of the LED device is firstly to prepare a lead frame web, wherein the lead frame web can comprise a plurality of arrays of lead frames. The reflector is then correspondingly molded onto the lead frame web. Then, the light emitting diode is fixed to the corresponding lead frame, and is electrically connected to the electrode of the lead frame via a wire. Thereafter, the light-emitting diode is encapsulated in a resin.
在一些發光二極體裝置之製程中,會使用高密度之導線架料片。在高密度之導線架料片,導線架是以小間隔之方式密集排列。當在高密度之導線架料片成型反光杯時,反光杯會連成一體。In some processes of light emitting diode devices, high density lead frame chips are used. In high-density lead frame webs, the lead frames are densely arranged in small intervals. When the reflector is formed in a high-density lead frame, the reflectors are joined together.
在樹脂封裝發光二極體後,會進行切割。切割時,切割刀從導線架料片之金屬邊框向連成一體之反光杯進行切割。導線架料片是金屬製成,而連成一體之反光杯是高分子材料所製作。由於金屬與高分子材料材質或硬度不同,通常需使用不同的切割方法。在使用相同的切割方法下,當切割刀切割一段金屬後再切割高分子材料時,容易發生 連成一體之反光杯鼓起或產生大殘膠或破裂等問題。After the resin is packaged with the light-emitting diode, cutting is performed. When cutting, the cutting blade cuts from the metal frame of the lead frame web to the integrated reflector. The lead frame web is made of metal, and the integrated reflector is made of polymer material. Due to the different materials or hardness of metal and polymer materials, different cutting methods are usually required. Under the same cutting method, when the cutting blade cuts a piece of metal and then cuts the polymer material, it is easy to occur. The integrated reflector is bulging or causing problems such as large residual glue or cracking.
有鑑於前述問題,本創作揭示一種新的導線架件及導線架組合。In view of the foregoing problems, the present disclosure discloses a new combination of lead frame members and lead frames.
本創作一實施例揭示一種導線架件。導線架件包含複數電連接部、一框部,以及複數連結部。框部包含一區段和界定該區段之至少一開孔。各連結部連接至少一電連接部,其中該些連結部在延伸通過該至少一開孔與該區段之一方向上排列,且該區段在該方向上之尺寸小於2.7毫米。在一實施例中,該區段在該方向上之該尺寸小於2毫米。在一實施例中,該區段在該方向上之該尺寸小於1毫米。在一實施例中,該區段在該方向上之該尺寸不小於該框部之厚度。在一實施例中,該區段緊鄰該框部之一外邊緣或一內邊緣,其中部分之電連接部連接該內邊緣。在一實施例中,該至少一開孔包含一縱向沿該方向延伸之長孔。在一實施例中,該至少一開孔包含一沿該框部之縱長方向延伸之框孔。在一實施例中,該至少一開孔包含沿該方向排列之複數開孔。An embodiment of the present invention discloses a lead frame member. The lead frame member includes a plurality of electrical connections, a frame portion, and a plurality of links. The frame portion includes a section and at least one opening defining the section. Each of the connecting portions is connected to at least one electrical connecting portion, wherein the connecting portions are arranged in a direction extending through the at least one opening and one of the segments, and the segment has a dimension in the direction of less than 2.7 mm. In an embodiment, the dimension of the section in the direction is less than 2 mm. In an embodiment, the dimension of the section in the direction is less than 1 mm. In an embodiment, the dimension of the segment in the direction is not less than the thickness of the frame portion. In one embodiment, the section is adjacent an outer edge or an inner edge of the frame portion, and a portion of the electrical connection connects the inner edge. In one embodiment, the at least one opening includes a longitudinal hole extending longitudinally in the direction. In one embodiment, the at least one opening includes a frame aperture extending along a longitudinal direction of the frame portion. In an embodiment, the at least one opening comprises a plurality of openings arranged in the direction.
本創作一實施例揭示一種導線架組合。導線架組合包含上述之導線架件及一膠體,其中膠體與該導線架件固接。An embodiment of the present invention discloses a leadframe assembly. The lead frame assembly includes the lead frame member and a colloid as described above, wherein the colloid is fixed to the lead frame member.
本創作另一實施例揭示一種導線架件。該導線架件包含一框部。框部包含沿一切割方向可經過之至少一開孔和一區段,其中該至少一開孔界定該區段,且該區段在沿該 切割方向上之尺寸小於2.7毫米。在一實施例中,該區段在該切割方向上之該尺寸小於2.5毫米。在一實施例中,該區段在該切割方向上之該尺寸小於2毫米。在一實施例中,該區段在該切割方向上之該尺寸小於1毫米。在一實施例中,該區段在該切割方向上之該尺寸不小於該框部之厚度。在一實施例中,該區段緊鄰該框部之一外邊緣或一內邊緣,其中該導線架件之複數電連接部連接該內邊緣。在一實施例中,該至少一開孔包含一縱向沿該切割方向延伸之長孔。在一實施例中,該至少一開孔包含一沿該框部之縱長方向延伸之框孔。在一實施例中,該至少一開孔包含沿該切割方向排列之複數開孔。Another embodiment of the present disclosure discloses a lead frame member. The lead frame member includes a frame portion. The frame portion includes at least one opening and a section passable along a cutting direction, wherein the at least one opening defines the section, and the section is along the The size in the cutting direction is less than 2.7 mm. In an embodiment, the section has a dimension of less than 2.5 mm in the cutting direction. In an embodiment, the section has a dimension of less than 2 mm in the cutting direction. In an embodiment, the section has a dimension of less than 1 mm in the cutting direction. In an embodiment, the dimension of the section in the cutting direction is not less than the thickness of the frame. In one embodiment, the section is adjacent an outer edge or an inner edge of the frame portion, wherein the plurality of electrical connections of the leadframe member connect the inner edge. In one embodiment, the at least one opening includes a long hole extending longitudinally along the cutting direction. In one embodiment, the at least one opening includes a frame aperture extending along a longitudinal direction of the frame portion. In one embodiment, the at least one opening comprises a plurality of openings aligned along the cutting direction.
本創作另一實施例揭示一種導線架組合。導線架組合包含上述另一導線架件及一膠體,其中該膠體與該另一導線架件固接。Another embodiment of the present disclosure discloses a leadframe assembly. The lead frame assembly includes the other lead frame member and a colloid, wherein the colloid is fixed to the other lead frame member.
由於上述區段之尺寸小,使得開孔與膠體相距較短,而可避免在進行切割時,發生膠體鼓起或產生大殘膠等問題。Since the size of the above-mentioned section is small, the distance between the opening and the colloid is short, and problems such as colloid bulging or large residual glue may occur during cutting.
以下配合圖式詳述本創作之實施例。The embodiments of the present creation are detailed below in conjunction with the drawings.
圖1為本創作一實施例之導線架件1之示意圖。圖2為圖1之導線架件1之局部放大圖。如圖1與圖2所示,導線架件1可包含一框部11、複數電連接部(12a和12b),以及複數連結部13。複數電連接部(12a和12b)可呈規則排列。框部11可在複數電連接部(12a和12b)旁延伸。各連結部13可連接至少一 電連接部(12a或12b)。FIG. 1 is a schematic view of a lead frame member 1 according to an embodiment of the present invention. 2 is a partial enlarged view of the lead frame member 1 of FIG. 1. As shown in FIGS. 1 and 2, the lead frame member 1 may include a frame portion 11, a plurality of electrical connecting portions (12a and 12b), and a plurality of connecting portions 13. The plurality of electrical connections (12a and 12b) may be arranged in a regular manner. The frame portion 11 can extend beside the plurality of electrical connections (12a and 12b). Each of the connecting portions 13 can be connected to at least one Electrical connection (12a or 12b).
在一實施例中,導線架件1具有一封閉框體,封閉框體圍繞在複數電連接部(12a和12b)之外圍,部分電連接部(12a和12b)連接封閉框體,而框部11為該封閉框體之部分或一框邊或一框邊之部分。在一實施例中,框部11可於複數電連接部(12a和12b)之間延伸。In an embodiment, the lead frame member 1 has a closed frame, the closed frame surrounds the periphery of the plurality of electrical connecting portions (12a and 12b), and the partial electrical connecting portions (12a and 12b) are connected to the closed frame, and the frame portion 11 is a portion of the closed frame or a frame edge or a frame edge portion. In an embodiment, the frame portion 11 can extend between the plurality of electrical connections (12a and 12b).
在一實施例中,導線架件1是用於製作發光二極體裝置,而電連接部(12a或12b)是作為發光二極體之電極。In one embodiment, the leadframe member 1 is for making a light emitting diode device, and the electrical connection portion (12a or 12b) is an electrode for the light emitting diode.
在一實施例中,兩電連接部(12a和12b)不同大小,而具較大面積之電連接部(12a或12b)可承載發光二極體。In one embodiment, the two electrical connections (12a and 12b) are of different sizes, and the electrical connections (12a or 12b) having a larger area can carry the light-emitting diodes.
參照圖2所示,電連接部(12a和12b)是以連結部13相互連接或連接至框部11。連結部13可排列成複數行與複數列。框部11可包含複數第一長孔111。複數第一長孔111對應複數行之連結部13或複數列之連結部13設置。第一長孔111是一種可用於切割(singulation)之開孔,即在進行切割時,切割刀進入第一長孔111。行或列之連結部13在延伸通過對應第一長孔111之一方向4排列,而且第一長孔111同時也沿該方向4縱向延伸。方向4可為切割刀切割之切割方向。Referring to FIG. 2, the electrical connection portions (12a and 12b) are connected to each other or to the frame portion 11 by a joint portion 13. The joint portion 13 can be arranged in a plurality of rows and a plurality of columns. The frame portion 11 may include a plurality of first elongated holes 111. The plurality of first long holes 111 are provided corresponding to the connecting portion 13 of the plurality of rows or the connecting portion 13 of the plurality of rows. The first elongated hole 111 is an opening that can be used for singulation, that is, the cutting blade enters the first elongated hole 111 when cutting is performed. The row or column of joints 13 are arranged in a direction 4 extending through one of the corresponding first elongated holes 111, and the first elongated holes 111 also extend longitudinally in the direction 4 at the same time. Direction 4 can be the cutting direction of the cutting blade.
參照圖2所示,各第一長孔111具有兩短邊1111和1112,其中短邊1111較另一短邊1112靠近電連接部(12a和12b)。各短邊1111可為框部11之一區段112所界定。Referring to FIG. 2, each of the first elongated holes 111 has two short sides 1111 and 1112, wherein the short side 1111 is closer to the electrical connection portions (12a and 12b) than the other short side 1112. Each short side 1111 can be defined by a section 112 of the frame portion 11.
區段112是在一切割方向上為開孔或開孔與框部之邊界所界定出之框部之部分。在一實施例中,框部11包含至少一區段(112、116或117),其中在切割時可沿方向4通過至 少一區段(112、116或117)、對應之第一長孔111及對應之連結部13。Section 112 is the portion of the frame defined by the opening or opening and the boundary of the frame in a cutting direction. In an embodiment, the frame portion 11 includes at least one section (112, 116 or 117), wherein the cutting can be performed in the direction 4 to There is one less section (112, 116 or 117), a corresponding first elongated hole 111 and a corresponding connecting portion 13.
在一實施例中,界定各第一長孔111之區段112在對應行或列之連結部13之排列方向4上之尺寸W小於2.7毫米(mm)。在一實施例中,區段112之尺寸W小於2.5毫米。在一實施例中,區段112之尺寸W小於2毫米。在一實施例中,區段112之尺寸W小於1毫米。區段112具有較大之尺寸W可讓框部11在區段112處有較大的剛性;而區段112具有較小之尺寸W可減少框部11上需進行切割的部分,減少切割兩不同材質所產生之問題。In one embodiment, the dimension W defining the section 112 of each of the first elongated holes 111 in the direction of arrangement 4 of the corresponding row or column of joints 13 is less than 2.7 millimeters (mm). In an embodiment, section 112 has a dimension W that is less than 2.5 millimeters. In an embodiment, section 112 has a dimension W that is less than 2 millimeters. In an embodiment, the dimension 112 has a dimension W that is less than 1 millimeter. The section 112 has a larger dimension W to allow the frame portion 11 to have greater rigidity at the section 112; and the section 112 has a smaller dimension W to reduce the portion of the frame portion 11 that needs to be cut, reducing the cut two. Problems with different materials.
在一實施例中,區段112之尺寸W不小於框部11之厚度(在垂直圖2之圖面上框部11之尺寸)。在一實施例中,框部11之厚度是在框部11上一預定點上量測之厚度。在一實施例中,框部11之厚度是框部11上複數預定點上量測之厚度之平均值。在一實施例中,框部11之厚度是框部11上最厚處之量測值。在一實施例中,框部11之厚度是框部11上最薄處之量測值。在一實施例中,框部11之厚度介於框部11上最薄處之量測值與最厚處之量測值之間。在一實施例中,框部11之厚度介於0.1至0.5毫米之間。In one embodiment, the dimension W of the section 112 is not less than the thickness of the frame portion 11 (the size of the frame portion 11 on the plane of the vertical view of Fig. 2). In one embodiment, the thickness of the frame portion 11 is the thickness measured at a predetermined point on the frame portion 11. In one embodiment, the thickness of the frame portion 11 is the average of the thicknesses measured at a plurality of predetermined points on the frame portion 11. In one embodiment, the thickness of the frame portion 11 is the measured value at the thickest portion of the frame portion 11. In one embodiment, the thickness of the frame portion 11 is the measured value of the thinnest portion of the frame portion 11. In one embodiment, the thickness of the frame portion 11 is between the measured value at the thinnest portion of the frame portion 11 and the measured value at the thickest portion. In an embodiment, the thickness of the frame portion 11 is between 0.1 and 0.5 mm.
參照圖2所示,在一實施例中,在連結部13之排列方向4上,緊鄰框部11之一外邊緣114之區段117在方向4上之尺寸D可小於2.7毫米。在一實施例中,區段117在方向4上之尺寸D可小於2.5毫米。在一實施例中,區段117在方向4上之尺寸D可小於2毫米。在一實施例中,區段117在方向4上 之尺寸D可小於1毫米。在一實施例中,區段117在方向4上之尺寸D不小於框部11之厚度(在垂直圖2之圖面上框部11之尺寸)。較大之距離D可讓框部11在該處有較大的剛性;而具有較小之距離D可減少框部11上需進行切割的部分,減少切割刀刃之磨耗。Referring to Fig. 2, in an embodiment, in the direction of arrangement 4 of the joint portion 13, the dimension D of the section 117 adjacent the outer edge 114 of one of the frame portions 11 in the direction 4 may be less than 2.7 mm. In an embodiment, the dimension D of the segment 117 in the direction 4 may be less than 2.5 mm. In an embodiment, the dimension D of the segment 117 in the direction 4 may be less than 2 mm. In an embodiment, section 117 is in direction 4 The dimension D can be less than 1 mm. In one embodiment, the dimension D of the segment 117 in the direction 4 is not less than the thickness of the frame portion 11 (the size of the frame portion 11 on the plane of the vertical view 2). The larger distance D allows the frame portion 11 to have greater rigidity there; and the smaller distance D reduces the portion of the frame portion 11 that needs to be cut, reducing the wear of the cutting blade.
在一實施例中,在方向4上之尺寸D不小於框部11之厚度(在垂直圖2之圖面上框部11之尺寸)。In one embodiment, the dimension D in the direction 4 is not less than the thickness of the frame portion 11 (the size of the frame portion 11 on the plane of the vertical view 2).
再參圖2所示,框部11可另包含複數第二長孔113。複數第二長孔113對應複數第一長孔111設置,其中區段112是介於對應之第一長孔111與第二長孔113之間。Referring to FIG. 2 again, the frame portion 11 may further include a plurality of second elongated holes 113. The plurality of second long holes 113 are disposed corresponding to the plurality of first long holes 111, wherein the segment 112 is between the corresponding first long holes 111 and the second long holes 113.
參照圖2所示,框部11具有一內邊緣115,內邊緣115連接部分之電連接部(12a和12b)。緊鄰框部11之內邊緣115有一區段116。在一實施例中,區段116在方向4上之尺寸L小於2.7毫米。在一實施例中,區段116在方向4上之尺寸L小於2.5毫米。在一實施例中,區段116在方向4上之尺寸L小於2毫米。在一實施例中,區段116在方向4上之尺寸L小於1毫米。在一實施例中,區段116在方向4上之尺寸L不小於框部11之厚度(在垂直圖2之圖面上框部11之尺寸)。Referring to Figure 2, the frame portion 11 has an inner edge 115 that connects portions of the electrical connections (12a and 12b). The inner edge 115 of the adjacent frame portion 11 has a section 116. In one embodiment, the dimension L of the segment 116 in direction 4 is less than 2.7 millimeters. In an embodiment, the dimension L of the segment 116 in the direction 4 is less than 2.5 mm. In an embodiment, the dimension L of the segment 116 in the direction 4 is less than 2 mm. In an embodiment, the dimension L of the segment 116 in the direction 4 is less than 1 mm. In one embodiment, the dimension L of the segment 116 in the direction 4 is not less than the thickness of the frame portion 11 (the size of the frame portion 11 on the plane of the vertical view 2).
導線架件1包含導體。在一實施例中,導線架件1包含至少一金屬。在一實施例中,導線架件1包含鐵元素。在一實施例中,導線架件1包含鎳元素。在一實施例中,導線架件1包含銀元素。在一實施例中,導線架件1包含銅元素。在一實施例中,導線架件1包含合金。在一實施例中,導線架件1包含鎳鐵合金(nickel iron alloy)。在一實施例中,導 線架件1包含銅合金(copper alloy)。在一實施例中,導線架件1包含覆蓋層材料(clad materials),例如銅包不鏽鋼(copper clad stainless steel)或其他類似者。在一實施例中,導線架件1包含鍍金屬材料,例如包含銅鍍銀或其他類似者。此外,導線架件1另可以金屬以外材料製作。在一實施例中,導線架件1包含矽。The lead frame member 1 contains a conductor. In an embodiment, the leadframe member 1 comprises at least one metal. In an embodiment, the leadframe member 1 contains an element of iron. In an embodiment, the leadframe member 1 contains a nickel element. In an embodiment, the leadframe member 1 comprises a silver element. In an embodiment, the leadframe member 1 comprises a copper element. In an embodiment, the leadframe member 1 comprises an alloy. In an embodiment, the leadframe member 1 comprises a nickel iron alloy. In an embodiment, the guide The wire frame member 1 contains a copper alloy. In an embodiment, the leadframe member 1 comprises clad materials, such as copper clad stainless steel or the like. In an embodiment, the leadframe member 1 comprises a metallized material, for example comprising copper plated silver or the like. Further, the lead frame member 1 may be made of a material other than metal. In an embodiment, the leadframe member 1 comprises a weir.
在一實施例中,導線架件1之導熱係數可大於400W/mK。在一實施例中,導線架件1之導熱係數介於300W/mK至400W/mK之間。在一實施例中,導線架件1之導熱係數可小於300W/mK。In an embodiment, the lead frame member 1 may have a thermal conductivity greater than 400 W/mK. In an embodiment, the lead frame member 1 has a thermal conductivity of between 300 W/mK and 400 W/mK. In an embodiment, the lead frame member 1 may have a thermal conductivity of less than 300 W/mK.
在一實施例中,導線架件1可將金屬板以蝕刻而製成。在一實施例中,導線架件1可沖壓製作而得。In an embodiment, the leadframe member 1 can be made by etching a metal plate. In an embodiment, the leadframe member 1 can be stamped.
圖3為本創作一實施例之導線架組合3之示意圖。參照圖3所示,導線架組合3包含一前述之導線架件1及一膠體2,其中膠體2和導線架件1固接。FIG. 3 is a schematic view of a lead frame assembly 3 according to an embodiment of the present invention. Referring to FIG. 3, the lead frame assembly 3 includes a lead frame member 1 and a colloid 2 as described above, wherein the colloid 2 and the lead frame member 1 are fixed.
膠體2可填充導線架件1上電連接部(12a和12b)間之間隙,如圖4中點狀區域所示。在一實施例中,膠體2填充導線架件1之第二長孔113。在一實施例中,膠體2可覆蓋部分之區段112。The colloid 2 can fill the gap between the electrical connections (12a and 12b) of the lead frame member 1, as shown by the dotted regions in FIG. In an embodiment, the colloid 2 fills the second elongated hole 113 of the leadframe member 1. In an embodiment, the colloid 2 can cover a portion 112 of the portion.
膠體2包含一主體部21。主體部21凸出導線架件1。主體部21可形成一體(integrally formed)。主體部21上可形成有複數個凹槽211,凹槽211可收容發光二極體。界定凹槽211之側壁可為斜面或曲面,以反射發光二極體之發光。The colloid 2 includes a body portion 21. The main body portion 21 protrudes from the lead frame member 1. The body portion 21 may be integrally formed. A plurality of grooves 211 may be formed on the main body portion 21, and the grooves 211 may receive the light emitting diodes. The sidewall defining the recess 211 may be a bevel or a curved surface to reflect the illumination of the LED.
膠體2可為絕緣材料。膠體2可具高反射率(reflectivity) ,以反射來自發光二極體之發光。膠體2可為白色。在一實施例中,膠體2可包含樹脂(epoxy)。在一實施例中,膠體2可包含矽酮(silicone)。在一實施例中,膠體2可為液晶聚合物(liquid crystal polymer)、聚亞醯胺高分子材料(polyimide based polymer)或其他類似者。The colloid 2 can be an insulating material. Colloid 2 can have high reflectivity To reflect the luminescence from the light-emitting diode. The colloid 2 can be white. In an embodiment, the colloid 2 may comprise an epoxy. In an embodiment, the colloid 2 may comprise a silicone. In one embodiment, the colloid 2 can be a liquid crystal polymer, a polyimide based polymer, or the like.
在一實施例中,膠體2可利用埋設(insert-molded)製程固著導線架件1。在一實施例中,膠體2可利用射出成型(injection molding)製程固著導線架件1。在一實施例中,膠體2可利用轉移成型(transfer molding)製程固著導線架件1。在一實施例中,膠體2可利用加壓成型(compression molding)製程固著導線架件1。In one embodiment, the colloid 2 can secure the leadframe member 1 using an insert-molded process. In an embodiment, the colloid 2 can secure the leadframe member 1 by an injection molding process. In an embodiment, the colloid 2 can be used to secure the leadframe member 1 by a transfer molding process. In one embodiment, the colloid 2 can secure the leadframe member 1 using a compression molding process.
參照圖3所示,膠體2可形成緊鄰區段112。由於區段112之尺寸小,使得膠體2可延伸靠近第一長孔111,如此在進行切割時,即便使用同一切割方法,也不會發生膠體2鼓起或產生大殘膠等問題。Referring to Figure 3, the colloid 2 can be formed adjacent to the section 112. Since the size of the segment 112 is small, the colloid 2 can be extended close to the first long hole 111, so that even when the same cutting method is used, problems such as the swelling of the colloid 2 or the generation of large residual glue do not occur.
導線架件之框部上可形成有別於前述長孔之另一種類開孔。圖5為本創作另一實施例之導線架件1'之示意圖。圖6為圖5之導線架件1'之局部放大圖。圖7為本創作另一實施例之導線架組合3'之示意圖。圖8例示圖7之導線架組合3'之背面。參照圖5與圖6所示,導線架件1'包含一框部11'及複數電連接部(12a和12b),其中部分電連接部(12a和12b)以連結部13連接框部11'之內邊緣115。Another type of opening different from the long hole may be formed in the frame portion of the lead frame member. FIG. 5 is a schematic view of a lead frame member 1' according to another embodiment of the present invention. Figure 6 is a partial enlarged view of the lead frame member 1' of Figure 5. FIG. 7 is a schematic view of a lead frame assembly 3' according to another embodiment of the present invention. Figure 8 illustrates the back side of the leadframe assembly 3' of Figure 7. Referring to Figures 5 and 6, the lead frame member 1' includes a frame portion 11' and a plurality of electrical connecting portions (12a and 12b), wherein the partial electrical connecting portions (12a and 12b) are connected to the frame portion 11' by the connecting portion 13. The inner edge 115.
框部11'可為環繞複數電連接部(12a和12b)之框體之一部份或框體之一框邊或框體之一框邊之部份。在一實施例 中,框部11'可於複數電連接部(12a和12b)之間延伸。The frame portion 11' may be a portion of the frame surrounding the plurality of electrical connection portions (12a and 12b) or a frame edge of one of the frames or a frame edge portion of the frame. In an embodiment The frame portion 11' may extend between the plurality of electrical connections (12a and 12b).
框部11'上形成有一框孔51,框孔51可為平行框部11'之外邊緣114或內邊緣115縱向延伸或沿框部11'之縱長方向10延伸之開孔(圖8)。框孔51用於切割。即當進行切割時,切割刀先進入框孔51,再沿切割路徑進行切割。A frame hole 51 is formed in the frame portion 11'. The frame hole 51 may be an opening extending longitudinally from the outer edge 114 or the inner edge 115 of the parallel frame portion 11' or extending along the longitudinal direction 10 of the frame portion 11' (Fig. 8). . The frame hole 51 is used for cutting. That is, when the cutting is performed, the cutting blade first enters the frame hole 51, and then cuts along the cutting path.
當框部11'為框體之一框邊時,框部11'可包含一框孔51,其中框孔51延伸涵蓋切割範圍。在另一實施例中,框部11'可包含複數框孔51,各框孔51平行框部11'之外邊緣114或內邊緣115縱向延伸。複數框孔51之長度可相同或不同。複數框孔51之寬度可相同或不同。複數框孔51在平行外邊緣114或內邊緣115之方向上可對齊或不對齊。When the frame portion 11' is a frame edge of the frame, the frame portion 11' may include a frame hole 51, wherein the frame hole 51 extends to cover the cutting range. In another embodiment, the frame portion 11' may include a plurality of frame holes 51 each extending longitudinally parallel to the outer edge 114 or the inner edge 115 of the frame portion 11'. The lengths of the plurality of frame holes 51 may be the same or different. The widths of the plurality of frame holes 51 may be the same or different. The plurality of frame apertures 51 may or may not be aligned in the direction of the parallel outer edge 114 or the inner edge 115.
框部11'可包含至少一區段(112、116或117),其中框孔51或第二長孔113界定至少一區段(112、116或117),且複數電連接部(12a和12b)在延伸通過框孔51、第二長孔113和至少一區段(112、116或117)之一切割方向7上排列。The frame portion 11' may include at least one section (112, 116 or 117), wherein the frame hole 51 or the second elongated hole 113 defines at least one section (112, 116 or 117), and the plurality of electrical connections (12a and 12b) ) arranged in a cutting direction 7 extending through one of the frame aperture 51, the second elongated aperture 113 and at least one section (112, 116 or 117).
參照圖6所示,框孔51可靠近框部11'之外邊緣114。在一實施例中,框孔51與框部11'之外邊緣114間之區段117在方向4上之尺寸D小於2.7毫米。在一實施例中,區段117在方向4上之尺寸D小於2毫米。在一實施例中,區段117在方向4上之尺寸D小於1毫米。在一實施例中,區段117在方向4上之尺寸D不小於框部11'之厚度。Referring to Figure 6, the frame aperture 51 can be adjacent the outer edge 114 of the frame portion 11'. In one embodiment, the dimension D of the section 117 between the frame aperture 51 and the outer edge 114 of the frame portion 11' is less than 2.7 millimeters in the direction 4. In an embodiment, the dimension D of the segment 117 in the direction 4 is less than 2 mm. In an embodiment, the dimension D of the segment 117 in the direction 4 is less than 1 mm. In an embodiment, the dimension D of the segment 117 in the direction 4 is not less than the thickness of the frame portion 11'.
參照圖7與圖8所示,導線架組合3'包含一上述導線架件1'及膠體2,其中導線架件1'與膠體2可固接。Referring to Figures 7 and 8, the leadframe assembly 3' includes a leadframe member 1' and a colloid 2, wherein the leadframe member 1' is affixed to the colloid 2.
參照圖7所示,膠體2包含一主體部21,主體部21凸出 導線架件1',主體部21上可形成有複數個凹槽211,凹槽211可收容發光二極體。界定凹槽211之側壁可為斜面或曲面,以反射發光二極體之發光。Referring to FIG. 7, the colloid 2 includes a main body portion 21, and the main body portion 21 is convex. The lead frame member 1' can be formed with a plurality of grooves 211 on the main body portion 21, and the recess 211 can accommodate the light emitting diodes. The sidewall defining the recess 211 may be a bevel or a curved surface to reflect the illumination of the LED.
膠體2可為絕緣材料。膠體2可具高反射率(reflectivity),以反射來自發光二極體之發光。膠體2可為白色。在一實施例中,膠體2可包含樹脂(epoxy)。在一實施例中,膠體2可包含矽酮(silicone)。在一實施例中,膠體2可為液晶聚合物(liquid crystal polymer)、聚亞醯胺高分子材料(polyimide based polymer)或其他類似者。The colloid 2 can be an insulating material. The colloid 2 can have a high reflectivity to reflect the luminescence from the luminescent diode. The colloid 2 can be white. In an embodiment, the colloid 2 may comprise an epoxy. In an embodiment, the colloid 2 may comprise a silicone. In one embodiment, the colloid 2 can be a liquid crystal polymer, a polyimide based polymer, or the like.
圖9為本創作另一實施例之導線架件1"之示意圖。圖10為圖9之導線架件1"之局部放大圖。參照圖9與圖10所示,導線架件1"包含一框部11"。框部11"可包含至少一開孔91及至少一區段(112、116或117)。至少一開孔91用於切割;即切割時,切割刀會沿至少一開孔91進行切割。沿一切割方向4可經過至少一開孔91及至少一區段(112、116或117)。在一實施例中,至少一區段(112、116或117)在方向4上之尺寸(W、L或D)小於2.7毫米。在一實施例中,至少一區段(112、116或117)在方向4上之尺寸(W、L或D)小於2.5毫米。在一實施例中,至少一區段(112、116或117)在方向4上之尺寸(W、L或D)小於2毫米。在一實施例中,至少一區段(112、116或117)在方向4上之尺寸(W、L或D)小於1毫米。在一實施例中,至少一區段(112、116或117)在方向4上之尺寸(W、L或D)不小於框部11"之厚度(在垂直圖2之圖面上框部11之尺寸)。9 is a schematic view of a lead frame member 1" according to another embodiment of the present invention. FIG. 10 is a partial enlarged view of the lead frame member 1" of FIG. Referring to Figures 9 and 10, the lead frame member 1" includes a frame portion 11". The frame portion 11" may include at least one opening 91 and at least one section (112, 116 or 117). At least one opening 91 is used for cutting; that is, when cutting, the cutting blade is cut along at least one opening 91. A cutting direction 4 can pass through at least one opening 91 and at least one section (112, 116 or 117). In one embodiment, the size of at least one section (112, 116 or 117) in direction 4 (W, L or D) is less than 2.7 mm. In one embodiment, at least one segment (112, 116 or 117) has a dimension (W, L or D) in direction 4 of less than 2.5 mm. In one embodiment, at least one The dimension (W, L or D) of the segment (112, 116 or 117) in direction 4 is less than 2 mm. In one embodiment, the dimension of at least one segment (112, 116 or 117) in direction 4 ( W, L or D) is less than 1 mm. In one embodiment, the dimension (W, L or D) of at least one segment (112, 116 or 117) in direction 4 is not less than the thickness of the frame portion 11" (at The size of the frame portion 11 on the upper surface of the drawing of Fig. 2).
在一實施例中,至少一開孔91包含複數開孔。在一實施例中,至少一開孔91包含複數開孔,其中該些開孔沿方向4上排列。在一實施例中,至少一開孔91包含複數開孔,其中部分之開孔與另一部分之開孔大小不同。在一實施例中,至少一開孔91包含複數開孔,其中該些開孔大小相同。在一實施例中,至少一開孔91包含複數開孔,其中該些開孔是等距離分布。在一實施例中,至少一開孔91包含複數開孔,其中該些開孔是不等距離分布。In an embodiment, at least one opening 91 comprises a plurality of openings. In one embodiment, at least one of the openings 91 includes a plurality of openings, wherein the openings are aligned in the direction 4. In one embodiment, at least one of the openings 91 includes a plurality of openings, wherein a portion of the openings are different in size from the openings of the other portion. In one embodiment, the at least one opening 91 includes a plurality of openings, wherein the openings are the same size. In one embodiment, the at least one opening 91 includes a plurality of openings, wherein the openings are equidistantly distributed. In one embodiment, the at least one opening 91 includes a plurality of openings, wherein the openings are unequal distance distribution.
至少一開孔91包含複數開孔。在一實施例中,如圖11所示,複數開孔包含一框孔93,框孔93可為平行框部11"之外邊緣114或內邊緣115縱向延伸或沿框部11"之縱長方向10延伸之開孔。At least one opening 91 includes a plurality of openings. In an embodiment, as shown in FIG. 11, the plurality of openings includes a frame hole 93, and the frame hole 93 may be longitudinally extending from the outer edge 114 or the inner edge 115 of the parallel frame portion 11" or along the length of the frame portion 11" An opening extending in the direction 10 .
在一實施例中,至少一開孔91包含複數開孔,其中部分之該些開孔界定之一區段92在方向4上之尺寸小於2.7毫米。在一實施例中,區段92在方向4上之尺寸小於2.5毫米。在一實施例中,區段92在方向4上之尺寸小於2毫米。在一實施例中,區段92在方向4上之尺寸小於1毫米。在一實施例中,區段92在方向4上之尺寸不小於框部11"之厚度(在垂直圖2之圖面上框部11之尺寸)。In one embodiment, at least one of the apertures 91 includes a plurality of apertures, and wherein the portions of the apertures define a section 92 having a dimension in direction 4 that is less than 2.7 millimeters. In an embodiment, the dimension of section 92 in direction 4 is less than 2.5 millimeters. In an embodiment, the dimension of section 92 in direction 4 is less than 2 millimeters. In an embodiment, the dimension of section 92 in direction 4 is less than 1 millimeter. In one embodiment, the dimension of section 92 in direction 4 is not less than the thickness of frame portion 11" (the size of frame portion 11 on the top surface of Figure 2).
在一實施例中,至少一區段(112、116或117)包含一緊鄰框部11"之外邊緣114之區段117。In one embodiment, at least one segment (112, 116 or 117) includes a segment 117 adjacent the outer edge 114 of the frame portion 11".
框部11"包含一內邊緣115,部分電連接部(12a和12b)連接內邊緣115。在一實施例中,至少一區段(112、116或117)包含緊鄰框部11"之內邊緣115之區段116。The frame portion 11" includes an inner edge 115, and the partial electrical connections (12a and 12b) connect the inner edge 115. In one embodiment, at least one segment (112, 116 or 117) includes an inner edge adjacent the frame portion 11" Section 116 of 115.
參照圖10所示,導線架件1"可與膠體2固接,以形成一導線架組合3"。膠體2可填充導線架件1"上電連接部(12a和12b)間之間隙。在一實施例中,膠體2可覆蓋部分之區段112。Referring to Figure 10, the leadframe member 1" can be secured to the colloid 2 to form a leadframe assembly 3". The colloid 2 can fill the gap between the leadframe members 1" electrical connection portions (12a and 12b). In one embodiment, the colloid 2 can cover a portion of the segment 112.
在本創作之一實施例中,在導線架件之框部上形成至少一開孔,使得在一切割方向上局部之框部分割成複數區段,藉此避免在進行切割時,發生膠體鼓起或產生大殘膠等問題。至少部分之區段在切割方向上之尺寸小於一預定尺寸,例如:2.7毫米或更小。In an embodiment of the present invention, at least one opening is formed in the frame portion of the lead frame member, so that the partial frame portion is divided into a plurality of segments in a cutting direction, thereby avoiding the occurrence of the colloidal drum when the cutting is performed. It can cause problems such as large residual glue. At least a portion of the section has a dimension in the cutting direction that is less than a predetermined dimension, such as 2.7 millimeters or less.
本創作之技術內容及技術特點巳揭示如上,然而熟悉本項技術之人士仍可能基於本創作之教示及揭示而作種種不背離本創作精神之替換及修飾。因此,本創作之保護範圍應不限於實施例所揭示者,而應包括各種不背離本創作之替換及修飾,並為以下之申請專利範圍所涵蓋。The technical content and technical features of the present invention are disclosed above, but those skilled in the art may still make various substitutions and modifications without departing from the spirit of the present invention based on the teachings and disclosures of the present invention. Therefore, the scope of the present invention is not limited to the embodiments disclosed, but includes various alternatives and modifications that do not depart from the present invention and are covered by the following claims.
1‧‧‧導線架件1‧‧‧ lead frame
1'‧‧‧導線架件1'‧‧‧ lead frame
1"‧‧‧導線架件1"‧‧‧ lead frame
2‧‧‧膠體2‧‧‧colloid
3‧‧‧導線架組合3‧‧‧ lead frame combination
3'‧‧‧導線架組合3'‧‧‧ lead frame combination
3"‧‧‧導線架組合3"‧‧‧ lead frame combination
4‧‧‧方向4‧‧‧ Direction
7‧‧‧切割方向7‧‧‧Cutting direction
10‧‧‧縱長方向10‧‧‧Longitudinal direction
11‧‧‧框部11‧‧‧ Frame Department
11'‧‧‧框部11'‧‧‧ Frame Department
11"‧‧‧框部11"‧‧‧ Frame Department
12a‧‧‧電連接部12a‧‧‧Electrical connection
12b‧‧‧電連接部12b‧‧‧Electrical connection
13‧‧‧連結部13‧‧‧Connecting Department
21‧‧‧主體部21‧‧‧ Main body
51‧‧‧框孔51‧‧‧Box hole
91‧‧‧開孔91‧‧‧Opening
92‧‧‧區段Section 92‧‧‧
93‧‧‧框孔93‧‧‧Box hole
111‧‧‧第一長孔111‧‧‧First long hole
112‧‧‧區段112‧‧‧ Section
113‧‧‧第二長孔113‧‧‧Second long hole
114‧‧‧外邊緣114‧‧‧ outer edge
115‧‧‧內邊緣115‧‧‧ inner edge
116‧‧‧區段Section 116‧‧‧
117‧‧‧區段Section 117‧‧‧
211‧‧‧凹槽211‧‧‧ Groove
1111‧‧‧短邊1111‧‧‧ Short side
1112‧‧‧短邊1112‧‧‧ Short side
圖1為本創作一實施例之導線架件之示意圖;圖2為圖1之導線架件之局部放大圖;圖3為本創作一實施例之導線架組合之示意圖;圖4例示圖3之導線架組合之背面;圖5為本創作另一實施例之導線架件之示意圖;圖6為圖5之導線架件之局部放大圖;圖7為本創作另一實施例之導線架組合之示意圖;圖8例示圖7之導線架組合之背面;圖9為本創作另一實施例之導線架件之示意圖; 圖10為圖9之導線架件之局部放大圖;以及圖11圖本創作另一實施例之導線架件之示意圖。1 is a schematic view of a lead frame member according to an embodiment of the present invention; FIG. 2 is a partial enlarged view of the lead frame member of FIG. 1; FIG. 3 is a schematic view of a lead frame assembly according to an embodiment of the present invention; Figure 5 is a schematic view of a lead frame member of another embodiment of the present invention; Figure 6 is a partial enlarged view of the lead frame member of Figure 5; Figure 7 is a combination of a lead frame of another embodiment of the present invention; FIG. 8 is a schematic view showing the back of the lead frame assembly of FIG. 7; FIG. 9 is a schematic view showing a lead frame member according to another embodiment of the present invention; Figure 10 is a partial enlarged view of the lead frame member of Figure 9; and Figure 11 is a schematic view of the lead frame member of another embodiment.
1‧‧‧導線架件1‧‧‧ lead frame
2‧‧‧膠體2‧‧‧colloid
3‧‧‧導線架組合3‧‧‧ lead frame combination
12a‧‧‧電連接部12a‧‧‧Electrical connection
12b‧‧‧電連接部12b‧‧‧Electrical connection
13‧‧‧連結部13‧‧‧Connecting Department
21‧‧‧主體部21‧‧‧ Main body
111‧‧‧第一長孔111‧‧‧First long hole
112‧‧‧區段112‧‧‧ Section
113‧‧‧第二長孔113‧‧‧Second long hole
116‧‧‧區段Section 116‧‧‧
117‧‧‧區段Section 117‧‧‧
211‧‧‧凹槽211‧‧‧ Groove
1111‧‧‧短邊1111‧‧‧ Short side
1112‧‧‧短邊1112‧‧‧ Short side
Claims (37)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101218602U TWM450063U (en) | 2012-09-26 | 2012-09-26 | Leadframe assembly and leadframe thereof |
CN201310172649.7A CN103579162A (en) | 2012-07-20 | 2013-05-10 | Lead frame assembly, lead frame thereof and cutting method |
CN201320254410.XU CN203456443U (en) | 2012-09-26 | 2013-05-10 | Lead frame assembly and lead frame thereof |
KR2020130005344U KR20140001960U (en) | 2012-09-26 | 2013-07-01 | Leadframe assembly and leadframe thereof |
US13/933,690 US20140020926A1 (en) | 2012-07-20 | 2013-07-02 | Lead frame, lead frame assembly and method of cutting lead frame assembly |
JP2013003779U JP3185995U (en) | 2012-09-26 | 2013-07-02 | Lead frame assembly and its lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101218602U TWM450063U (en) | 2012-09-26 | 2012-09-26 | Leadframe assembly and leadframe thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM450063U true TWM450063U (en) | 2013-04-01 |
Family
ID=48800432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101218602U TWM450063U (en) | 2012-07-20 | 2012-09-26 | Leadframe assembly and leadframe thereof |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3185995U (en) |
KR (1) | KR20140001960U (en) |
CN (1) | CN203456443U (en) |
TW (1) | TWM450063U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD207111S (en) | 2019-10-25 | 2020-09-11 | 順德工業股份有限公司 | Lead frame part |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105810656A (en) * | 2014-12-31 | 2016-07-27 | 无锡华润安盛科技有限公司 | Upper lead frame structure |
TWI619272B (en) * | 2017-02-24 | 2018-03-21 | Ttop Corp | Light source sensor lead frame substrate structure |
-
2012
- 2012-09-26 TW TW101218602U patent/TWM450063U/en not_active IP Right Cessation
-
2013
- 2013-05-10 CN CN201320254410.XU patent/CN203456443U/en not_active Expired - Fee Related
- 2013-07-01 KR KR2020130005344U patent/KR20140001960U/en not_active Application Discontinuation
- 2013-07-02 JP JP2013003779U patent/JP3185995U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD207111S (en) | 2019-10-25 | 2020-09-11 | 順德工業股份有限公司 | Lead frame part |
Also Published As
Publication number | Publication date |
---|---|
JP3185995U (en) | 2013-09-12 |
KR20140001960U (en) | 2014-04-03 |
CN203456443U (en) | 2014-02-26 |
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MM4K | Annulment or lapse of a utility model due to non-payment of fees |