CN105679719B - Sensor assembly and its manufacturing method - Google Patents
Sensor assembly and its manufacturing method Download PDFInfo
- Publication number
- CN105679719B CN105679719B CN201510883496.6A CN201510883496A CN105679719B CN 105679719 B CN105679719 B CN 105679719B CN 201510883496 A CN201510883496 A CN 201510883496A CN 105679719 B CN105679719 B CN 105679719B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Manufacturing & Machinery (AREA)
Abstract
The present invention provides a kind of sensor assembly and its manufacturing method for capableing of space-efficient sensors configured chip and IC chip and chip part.The formed body (2) that terminal board (3,4) is embedded in a part is molded by injection moulding.It is formed with the first recess portion (5) and the second recess portion (6) in formed body (2), it is accommodated with pressure sensor chip (12) in the first recess portion (5), it is connect with terminal board (3,4) by closing line (13), it is accommodated with IC chip (14) in the second recess portion 6, is connected by closing line (15).It is equipped with the boundary wall portion (2c) for dividing the first recess portion (5) and the second recess portion (6) in formed body (2), chip part (11,11) is embedded in wall portion (2c) on boundary.
Description
Technical field
The present invention relates to the sensor assembly for the sensor chip for having pressure sensor etc. and its manufacturing methods.
Background technology
In the invention for relating to the sensor assembly for being equipped with pressure sensor described in patent document 1 and patent document 2.
In sensor assembly described in patent document 1, in the formed body formed by epoxy resin with lead frame
A part be embedded with IC chip and capacitance and resistance together.It is formed with concavity chamber in module body, is accommodated in concavity intracavitary
Pressure sensor component, pressure sensor component and lead frame are connected by closing line.
In sensor assembly described in Fig. 6 of patent document 2, lead frame is installed in IC chip and multiple chip parts
In the state of the back side of frame, keep resin forming body formed, a part for lead frame is embedded in resin-formed body, and IC cores
Piece and chip part are embedded in resin-formed body.In resin-formed body, the surface side of lead frame is formed with chamber, in the intracavitary
It is accommodated with pressure sensor chip, pressure sensor chip is connected with lead frame by closing line.
Existing technical literature
Patent document
1 Japanese Unexamined Patent Publication 2001-243437 bulletins of patent document
2 Japanese Unexamined Patent Publication 2000-329632 bulletins of patent document
In sensor assembly described in patent document 1 and patent document 2, IC chip and lead frame pass through closing line
Connection, the IC chip are embedded in the inside of formed body.Heat when in this configuration, due to keeping molding body formed and molten resin
Flowing, the closing line for connecting IC chip and lead frame is easy melting or is cut off, and the possibility for producing defective work becomes
It is high.
In addition, the construction described in patent document 1 be a side of lead frame facial plane arrange IC chip, capacitance
With resistance and the construction of pressure sensor component, therefore, the area of module becomes larger, and is not suitable for miniaturization.
Described in patent document 2 is：The installation region and storage pressure sensor chip of IC chip and chip part
Chamber is overlapped in thickness direction, therefore, it is possible to reduce the size of in-plane.But in this manufacturing process, such as Fig. 6 (a) institutes
Show, upward, IC chip and chip part are installed on lead frame for the back side for needing to make lead frame, make resin-formed body at
After type, as shown in Fig. 6 (b), in the state of making lead frame and resin-formed body inverts upside down, pressure sensor chip is received
It is contained in intracavitary and is engaged.If in this way, making the process that lead frame inverts, production line become multiple in manufacturing process's setting
Miscellaneous, manufacture efficiency also reduces.
Invention content
The present invention solves above-mentioned previous project, and its purpose is to provide a kind of it is not necessary that IC chip is embedded in formed body
Inside, the sensor assembly that overall structure can be made to minimize and its manufacturing method.
The present invention relates to a kind of sensor assembly, the sensor assembly have by the molding formed body of resin material, one
Divide the sensor chip and IC chip for being embedded in the terminal board of above-mentioned formed body and being installed on the inside of above-mentioned formed body, it is special
Sign is, in above-mentioned formed body, the first recess portion and the second recess portion is formed in the same side relative to above-mentioned terminal board, upper
It states the first recess portion and is accommodated with the sensor chip, be exposed to the above-mentioned terminal board of the bottom of above-mentioned first recess portion and above-mentioned sensing
Device chip is connected by closing line, is accommodated with above-mentioned IC chip in above-mentioned second recess portion, is exposed to the bottom of above-mentioned second recess portion
Above-mentioned terminal board connected by closing line with above-mentioned IC chip, be formed in above-mentioned formed body surround above-mentioned first recess portion and
The wall portion of at least one party of above-mentioned second recess portion is embedded with chip part in the inside of the wall portion, the chip part and above-mentioned end
Daughter board connects.
Sensor of the invention module is preferably buried in the above-mentioned wall portion for dividing above-mentioned first recess portion and above-mentioned second recess portion
Equipped with said chip component.
Sensor of the invention module is configured to：It is filled with sealing tree in above-mentioned first recess portion and above-mentioned second recess portion
Fat.
Moreover, the present invention relates to a kind of manufacturing method of sensor assembly, the sensor assembly have by resin material at
The formed body of type, a part are embedded in the terminal board of above-mentioned formed body and are installed on the sensor chip of the inside of above-mentioned formed body
And IC chip, which is characterized in that have：(1) process that chip part is installed on terminal board；It (2) will by resin material
It is embedded with a part for above-mentioned terminal board and there is the first recess portion and the second recess portion in the same side relative to above-mentioned terminal board
It is molded body formed, said chip component is embedded in the wall portion for at least one party for surrounding above-mentioned first recess portion and above-mentioned second recess portion
Process；And the sensor chip is accommodated in above-mentioned first recess portion by (3), is exposed to by lead-in wire bonding process connection
Above-mentioned IC chip is accommodated in above-mentioned second recess portion by the above-mentioned terminal board and the sensor chip for stating the bottom of the first recess portion,
The process that the above-mentioned terminal board and above-mentioned IC chip of the bottom of above-mentioned second recess portion are exposed to by lead-in wire bonding process connection.
Preferably in the process of above-mentioned (2), said chip component is buried for the manufacturing method of sensor of the invention module
In the above-mentioned wall portion for dividing above-mentioned first recess portion and above-mentioned second recess portion.
In addition, the manufacturing method of sensor of the invention module enables to after the process of above-mentioned (3), above-mentioned
One recess portion and above-mentioned second recess portion fill sealing resin.
Invention effect
In the present invention, 2 recess portions are being formed with by the molding formed body of resin material, sensing is accommodated in above-mentioned recess portion
Device chip and IC chip are simultaneously connect by closing line with terminal board, and therefore, closing line will not melt in the molding procedure of formed body
Melt or is cut off.Moreover, because chip part is embedded in the inside of wall portion, therefore, welding sequence of chip part etc. will not shadow
Ring the lead-in wire bonding process of sensor chip and IC chip.
In particular, if chip part is embedded in the wall portion for dividing the first recess portion and the second recess portion, can effectively match
All components are set, can realize the miniaturization of module.
Description of the drawings
(A) in Fig. 1 is the vertical view of the sensor assembly of embodiments of the present invention, and (B) is by line B-B to above-mentioned
Sensor assembly carries out the sectional view of cutting.
Fig. 2 is the definition graph of the first embodiment for the manufacturing process for indicating sensor assembly.
Fig. 3 is the definition graph of the second embodiment for the manufacturing process for indicating sensor assembly.
Fig. 4 is to indicate through the vertical view of the terminal board formed with steel.
Fig. 5 is the vertical view for indicating to be mounted with the state of chip part in terminal board.
Fig. 6 is that expression is embedded with a part for terminal board and is embedded with the vertical view of the molding procedure of the formed body of chip part
Figure.
In figure：
1 sensor assembly
2 formed bodys
The boundaries 2c wall portion
3,4 terminal board
5 first recess portions
6 second recess portions
11 chip parts
12 pressure sensor chips
14 IC chips
13,15 closing line
18,19 potting resin
20 band steel
I terminals are punched process
II assembly processes
III chip part fixed steps
IV is injection moulded process
V products are punched process
Specific implementation mode
Fig. 1 shows the sensor assemblies 1 of embodiments of the present invention.
Sensor assembly 1 has formed body 2.Formed body 2 passes through the formation such as epoxy resin.It is embedded in formed body 2 multiple
A part for terminal board 3 and multiple terminal boards 4.Terminal board is made of imposing gold-plated equal processing to the surface of steel plate, or whole
It is formed by the low electrical resistant material of copper etc..
Formed body 2 is shaped to that wall thickness is big in a side side of terminal board 3,4, and the first recess portion is formed in the big part of the wall thickness
5 and second recess portion 6.First recess portion 5 and the second recess portion 6 are open to same direction (top).As shown in Figure 1, in 2 one of formed body
Ground is formed with the second side wall portion of the side of the first side wall portion 2a of the side for surrounding the first recess portion 5, the second recess portion 6 of encirclement
The 2b and boundary wall portion 2c for dividing the first recess portion 5 and the second recess portion 6.In addition, under relative to these wall portions 2a, 2b, 2c
Side section is integrally formed with terminal supporting 2d, 2e.
4 terminal boards 3 are mainly embedded in terminal supporting 2d, and the surface of top 3a is exposed to the bottom of the first recess portion 5, base
Portion is protruding to the outside from terminal supporting 2d and becomes connection sheet 3b.In 3 terminal boards 4, the surface of top 4a is exposed to first
The bottom of recess portion 5, middle part 4b are exposed to the bottom of the second recess portion 6, and base portion is protruding to the outside from terminal supporting 2e and becomes
Connection sheet 4c.
The inside of above-mentioned boundary wall portion 2c is embedded with chip part 11,11.Chip part 11,11 is fixed resister, electricity
Appearance or inductor etc..The electrode portion of chip part 11,11 is fixedly welded on adjacent terminal board 3.Alternatively, viscous via electric conductivity
Agent is connect to fix in the on-state.The chip part 11,11 embedment forms the inside of the resin material of formed body 2.
It is accommodated with pressure sensor chip 12 in first recess portion 5.Pressure sensor chip 12 passes through chip bonding (die
Bonding) process is fixed on the bottom of the first recess portion 5 via bonding agent.In turn, lead-in wire bonding process, pressure sensor are moved to
The top of the top 3a and each terminal board 4 of the electrode portion of chip 12 and each terminal board 3 are connected by closing line 13.
It is accommodated with IC chip 14 in second recess portion 6.IC chip 14 is fixed on by chip bonding process, via bonding agent
The bottom of two recess portions 6.In turn, lead-in wire bonding process, the top center portion 4b of the electrode portion of IC chip 14 and each terminal board 4 are moved to
It is connected by closing line 15.Integrated circuit in IC chip 14 is ASIC, based on the detection letter from pressure sensor chip 12
Number, calculate pressure value.
As shown in Fig. 1 (B), potting resin 18 is filled in the first recess portion 5, pressure sensor chip 12 and closing line 13 are logical
Potting resin 18 is crossed to be protected.Potting resin 18 be by it is soft as silicones etc., can be by external pressure change
Pass to the resin material formation of pressure sensor chip 12.
Potting resin 19 is also filled in second recess portion 6, IC chip 14 and closing line 15 are protected.The potting resin 19
Using the heat-curing resin of epoxy resin etc., the second recess portion 6 is filled in the state of liquid, after solidification, than above-mentioned envelope
It is harder to fill resin 18.Viscosity is low in the state before curing for the resin of Thermocurable, therefore, in by the second recess portion 6 of injection
When portion, closing line 15 will not be cut off.
Next, being illustrated to the manufacturing method of the sensor module 1.
In manufacturing process shown in Fig. 2, the metal tape steel 20 for being used to form terminal board 3,4 are sent to diagram right
To.Metal tape steel 20 are intermittently transported, and the manufacture work of following each process is carried out when stopping.
As shown in Fig. 2, manufacture work, which is terminal, is punched process I, the assembly process II of chip part, chip part regular worker
Sequence III, injection moulding process IV, product are punched process V, and sensor assembly 1 is manufactured by these processes.
In manufacturing process shown in Fig. 2, metal tape steel 20 are continuously fed into product from terminal punching process I and are punched
Process V.In this regard, in manufacturing process shown in Fig. 3, it is rolled-up by the metal tape steel 20 of terminal punching process I.It is rolled-up
Metal tape steel 20 be sent to the assembly process II and chip part fixed step III of chip part, in this metal tape steel
20 are also rolled-up.Then, metal tape steel 20 are sent to final process, and process V is punched by being injection moulded process IV and product,
Complete sensor assembly 1.
As shown in figure 4, inlet ports 21 at regular intervals is formed in metal tape steel 20, and it is right to be intermittently sent to diagram
Direction.In terminal punching process I, the metal tape steel 20 temporarily ceased, from being punched up and down, form end by die cutting die
Sub-portion 3 and portion of terminal 4.
As shown in Fig. 2, assembly device 22 is equipped in assembly process II, in the metal that right direction is transported and is temporarily ceased
(mount) chip part 11,11 is assembled on terminal board 4 with steel 20 (with reference to Fig. 5).Later, metal tape steel 20 are sent to
Chip part fixed step III, chip part 11,11 are fixed on terminal board 4.
Fixed by welding in chip part 11, in assembly process II, chip part 11 passes through stickup
Welding is temporarily fixed on terminal board 4, and in chip part fixed step III, metal tape steel 20 are sent to heating furnace, weldering
Tin melts, and chip part 11 is fixed in terminal board 4.It is fixed by conductive adhesive in chip part 11,
In assembly process II, chip part 11 is temporarily fixed to by bonding agent on terminal board 4, in chip part fixed step
In III, metal tape steel 20 are sent to heating furnace, and bonding agent is made to be heating and curing.
In being injection moulded process IV, the terminal board 3,4 and chip part that are formed in metal tape steel 20 are located in note
The intracavitary of molding die is penetrated, molten resin is emitted to intracavitary, forms formed body 2 as shown in FIG. 6.In the injection moulding process
In IV, when formed body 2 is molded, on boundary, the inside of wall portion 2c is embedded with chip part 11.Product punching process V behind
In, terminal board 3 and terminal board 4 are cut off by cutting line C.
Later, as shown in Figure 1, being accommodated with pressure sensor chip 12 in the inside of the first recess portion 5 and passing through wire bonding
Process is connected to terminal board 3,4, is accommodated with IC chip 14 in the inside of the second recess portion 6 and is connected to end by lead-in wire bonding process
Daughter board 4.And it is packaged with potting resin 18 in the first recess portion 5, it is packaged with potting resin 19 in the second recess portion 6, completes each biography
Sensor module 1.
The sensor assembly shown in FIG. 1 manufactured by above-mentioned operation is used as pressure sensor module and is used, such as internal combustion
Pressure of inspiration(Pi) of machine etc. is endowed pressure sensor chip 12 via potting resin 18, and pressure is detected.Pressure sensor chip
12 detection signal is handled by the ASIC in IC chip 14, calculates pressure value.
In the embodiment shown in figure 1, chip part 11,11 is embedded in the inside of boundary wall portion 2c, and as embedded
The preferred position of chip part 11,11 can enumerate the portion (i) surrounded by dotted line in Fig. 1 and the portion (ii).
(i) portion and the boundary portion that the portion (ii) is the first side wall portion 2a and the second side wall portion 2b and boundary wall portion 2c.
It is preferred that chip part 11,11 is buried is located at the portion (i) and the portion (ii) for its at least part, more preferably more than half is located at
(i) portion and the portion (ii), and then it is entirely located in the portion (i) and the portion (ii).In addition, making being shaped so as to for terminal board 3,4 in this case
The change of wide cut etc. is necessary.
Even if the first side wall portion 2a and the second side wall portion 2b and boundary wall portion 2c are not set as respectively unnecessary
Wall thickness, (i) portion and the portion (ii) can also ensure that the wide region of comparison, and can reliably bury chip part 11,11.Due to can
The first side wall portion 2a and the second side wall portion 2b and boundary wall portion 2c are not set as unnecessary wall thickness respectively, so,
Even if by integral miniaturization, it can also ensure that the internal volume of the first recess portion 5 and the second recess portion 6 is sufficiently large, wire bonding work
It can easily be done.
After being molded in sensor assembly 1, by constituted in the formed body 2 for being embedded with terminal board 3,4 by being injection moulded, the
One recess portion 5 is provided with pressure sensor chip 12, and IC chip 14 is accommodated in the second recess portion 6, connects respectively via closing line 13,15
It is connected to terminal board, closing line 13,15 will not be melted or broken due to heat and the flowing of molten resin when formed body 2 being made to be molded
It splits.In addition, formed body 2 molding before, chip part 11 to be connected to the inside that the state of terminal board 4 is embedded in formed body 2,
Therefore, it is possible to prevent the connection of the scolding tin or conductive adhesive of fixed chip component 11 to the closing line 13,15 of terminal board 3,4
A problem that portion is flowed out.
The first recess portion 5 and the second recess portion 6 of the sensor assembly 1 are set as upwardly opening, are accommodated with pressure inside it
Sensor chip 12 and IC chip 14, by burying core in the wall portion of at least one party comprising the first recess portion 5 and the second recess portion 6
Chip part 11 is then not necessarily to set the reserved area of chip component 11, so, it is easy to that miniaturization will be integrally formed to obtain.Especially
It is, it, being capable of space availability ratio by burying chip part 11 in the boundary wall portion 2c for dividing the first recess portion 5 and the second recess portion 6
Highland chip component 11.
Claims (6)
1. a kind of sensor assembly has the terminal for being embedded in above-mentioned formed body by the molding formed body of resin material, a part
The sensor chip and IC chip of plate and the inside for being installed on above-mentioned formed body, which is characterized in that
In above-mentioned formed body, it is formed with the first recess portion and the second recess portion in the same side relative to above-mentioned terminal board, above-mentioned
First recess portion is accommodated with the sensor chip, the above-mentioned end of the sensor chip and the bottom for being exposed to above-mentioned first recess portion
Daughter board is connected by closing line, and above-mentioned IC chip is accommodated in above-mentioned second recess portion, above-mentioned IC chip and is exposed to above-mentioned second
The above-mentioned terminal board of the bottom of recess portion is connected by closing line,
The wall portion for surrounding above-mentioned first recess portion and at least one party in above-mentioned second recess portion is formed in above-mentioned formed body, at this
The inside of wall portion is embedded with chip part, which connect with above-mentioned terminal board,
Before above-mentioned molding is body formed, said chip component is embedded in above-mentioned formed body to be connected to the state of above-mentioned terminal board
Inside,
The sensor chip and above-mentioned IC chip are connected to above-mentioned terminal board by wire bonding.
2. sensor assembly according to claim 1, wherein
It is embedded with said chip component in the above-mentioned wall portion for dividing above-mentioned first recess portion and above-mentioned second recess portion.
3. sensor assembly according to claim 1 or 2, wherein
It is filled with sealing resin in above-mentioned first recess portion and above-mentioned second recess portion.
4. a kind of manufacturing method of sensor assembly, which has by the molding formed body of resin material, a part
It is embedded in the terminal board of above-mentioned formed body and is installed on the sensor chip and IC chip of the inside of above-mentioned formed body, the sensing
The manufacturing method of device module is characterized in that having：
(1) process that chip part is installed on terminal board；
(2) part for above-mentioned terminal board will be embedded with by resin material and had in the same side relative to above-mentioned terminal board
The molding of first recess portion and the second recess portion is body formed, and said chip component is embedded in and surrounds above-mentioned first recess portion and above-mentioned second
The process of the wall portion of at least one party in recess portion；And
(3) the sensor chip is accommodated in above-mentioned first recess portion, the sensor chip is connected by lead-in wire bonding process
With the above-mentioned terminal board for the bottom for being exposed to above-mentioned first recess portion, above-mentioned IC chip is accommodated in above-mentioned second recess portion, by drawing
The process that wire bonding process connects above-mentioned IC chip and is exposed to the above-mentioned terminal board of the bottom of above-mentioned second recess portion,
Before above-mentioned molding is body formed, said chip component is embedded in above-mentioned formed body to be connected to the state of above-mentioned terminal board
Inside,
The sensor chip and above-mentioned IC chip are connected to above-mentioned terminal board by lead-in wire bonding process.
5. the manufacturing method of sensor assembly according to claim 4, wherein
In the process of above-mentioned (2), said chip component is embedded in and divides the upper of above-mentioned first recess portion and above-mentioned second recess portion
It states in wall portion.
6. the manufacturing method of sensor assembly according to claim 4 or 5, wherein
After the process of above-mentioned (3), sealing resin is filled in above-mentioned first recess portion and above-mentioned second recess portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014248063A JP6218724B2 (en) | 2014-12-08 | 2014-12-08 | Sensor module and manufacturing method thereof |
| JP2014-248063 | 2014-12-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105679719A CN105679719A (en) | 2016-06-15 |
| CN105679719B true CN105679719B (en) | 2018-08-21 |
Family
ID=56123976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510883496.6A Active CN105679719B (en) | 2014-12-08 | 2015-12-04 | Sensor assembly and its manufacturing method |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6218724B2 (en) |
| CN (1) | CN105679719B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5859759A (en) * | 1996-10-02 | 1999-01-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor pressure sensor module |
| US5948991A (en) * | 1996-12-09 | 1999-09-07 | Denso Corporation | Semiconductor physical quantity sensor device having semiconductor sensor chip integrated with semiconductor circuit chip |
| US6172424B1 (en) * | 1996-10-11 | 2001-01-09 | Denso Corporation | Resin sealing type semiconductor device |
| CN102401715A (en) * | 2010-08-23 | 2012-04-04 | 霍尼韦尔国际公司 | Pressure sensor |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0926371A (en) * | 1995-07-12 | 1997-01-28 | Hitachi Ltd | Semiconductor type pressure sensor |
| JP2000329632A (en) * | 1999-05-17 | 2000-11-30 | Toshiba Chem Corp | Pressure sensor module and method for manufacture it |
| JP2001243437A (en) * | 2000-02-29 | 2001-09-07 | Toshiba Chem Corp | Data carrier module, data carrier, and method for manufacturing data carrier |
| US6927482B1 (en) * | 2003-10-01 | 2005-08-09 | General Electric Company | Surface mount package and method for forming multi-chip microsensor device |
| JP4716920B2 (en) * | 2006-05-08 | 2011-07-06 | 三菱電機株式会社 | Semiconductor pressure sensor |
| JP6092684B2 (en) * | 2013-03-27 | 2017-03-08 | アルプス電気株式会社 | Physical quantity sensor device |
-
2014
- 2014-12-08 JP JP2014248063A patent/JP6218724B2/en active Active
-
2015
- 2015-12-04 CN CN201510883496.6A patent/CN105679719B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5859759A (en) * | 1996-10-02 | 1999-01-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor pressure sensor module |
| US6172424B1 (en) * | 1996-10-11 | 2001-01-09 | Denso Corporation | Resin sealing type semiconductor device |
| US5948991A (en) * | 1996-12-09 | 1999-09-07 | Denso Corporation | Semiconductor physical quantity sensor device having semiconductor sensor chip integrated with semiconductor circuit chip |
| CN102401715A (en) * | 2010-08-23 | 2012-04-04 | 霍尼韦尔国际公司 | Pressure sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6218724B2 (en) | 2017-10-25 |
| CN105679719A (en) | 2016-06-15 |
| JP2016109581A (en) | 2016-06-20 |
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