CN109926299B - Magnetic compatible ultrasonic transducer and manufacturing method thereof - Google Patents
Magnetic compatible ultrasonic transducer and manufacturing method thereof Download PDFInfo
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- CN109926299B CN109926299B CN201711365837.6A CN201711365837A CN109926299B CN 109926299 B CN109926299 B CN 109926299B CN 201711365837 A CN201711365837 A CN 201711365837A CN 109926299 B CN109926299 B CN 109926299B
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Abstract
The invention is applicable to the technical field of ultrasonic transducers and discloses a magnetic compatibility type ultrasonic transducer and a manufacturing method thereof. A magnetic compatible ultrasonic transducer comprises a shell, a piezoelectric material component and a cable, wherein the piezoelectric material component is arranged in the shell; the piezoelectric material component comprises a piezoelectric block array, wherein the piezoelectric block array comprises piezoelectric blocks arranged in an array manner and insulators filled in the separation grooves and used for connecting the adjacent piezoelectric blocks; at least a plurality of piezoelectric blocks are energy conversion piezoelectric blocks, the front surfaces of the piezoelectric blocks are provided with independent anode conducting layers, and the back surfaces of the energy conversion piezoelectric blocks are provided with cathode conducting layers which are mutually and electrically conducted; the cable is connected with a plurality of anode leads and at least one ground lead, each anode lead is connected with the anode conductive layer of each energy conversion piezoelectric block, and the ground lead is connected with the cathode conductive layer. The manufacturing method is used for manufacturing the ultrasonic transducer. The magnetic compatible ultrasonic transducer and the manufacturing method thereof provided by the invention have the advantages of good MRI compatibility and clear and reliable imaging.
Description
Technical Field
The invention belongs to the technical field of ultrasonic transducers, and particularly relates to a magnetic compatibility type ultrasonic transducer and a manufacturing method thereof.
Background
The core of the arc array ultrasonic system is a two-dimensional area array ultrasonic transducer, and the problems of arc surface forming, consistency of each array element, simple and reliable array element lead method, focusing performance of a sound field of the transducer and magnetic compatibility of the existing large-scale two-dimensional arc array ultrasonic transducer are difficult. A two-dimensional arc array probe is generally composed of one to thousands of individual piezoelectric array elements, and the length and width of each piezoelectric array element are very small, so that it is difficult to ensure the consistency of each piezoelectric array element and lead out the electrode of each piezoelectric array element. The traditional scheme is that the positive electrode and the negative electrode of a piezoelectric array element are directly connected to an external cable, when the number of the piezoelectric array elements of the ultrasonic transducer is large, welding is unreliable due to the fact that electrodes of piezoelectric sheets are unreliable, the consistency of leads of each array element cannot be guaranteed due to direct welding, and most importantly, the welding process can cause serious poor MRI (magnetic resonance imaging) compatibility and unclear imaging.
Disclosure of Invention
The present invention is directed to overcome the above-mentioned deficiencies of the prior art and to provide a magnetically compatible ultrasound transducer and a method for manufacturing the same, wherein the ultrasound transducer has good MRI compatibility.
The technical scheme of the invention is as follows: a magnetically compatible ultrasonic transducer comprising a housing, a piezoelectric material component and a cable, the piezoelectric material component being disposed within the housing;
the piezoelectric material component comprises a piezoelectric block array, the piezoelectric block array comprises piezoelectric blocks arranged in an array, adjacent piezoelectric blocks are separated by a separation groove, and the piezoelectric block array further comprises an insulator which is filled in the separation groove and is used for connecting the adjacent piezoelectric blocks;
the front surfaces of at least a plurality of piezoelectric blocks are provided with mutually independent positive electrode conducting layers, the piezoelectric blocks with the positive electrode conducting layers are transduction piezoelectric blocks, and the back surfaces of the transduction piezoelectric blocks are provided with mutually and electrically conducted negative electrode conducting layers;
the cable is connected with a plurality of anode leads and at least one earth lead, each anode lead is connected with the anode conductive layer of each energy conversion piezoelectric block, and the earth lead is connected with the cathode conductive layer.
Optionally, the piezoelectric blocks located at the edge of the piezoelectric block array are edge piezoelectric blocks, the front surface, the side surface and the back surface of at least one edge piezoelectric block are provided with mutually and electrically communicated conductive layers, and the communicated conductive layer at the back surface of the edge piezoelectric block is connected with the negative conductive layer; and the earth pole lead is connected with the communicating conducting layer on the front surface of the edge piezoelectric block.
Optionally, a positioning strip for positioning each of the positive electrode lead and the ground electrode lead is arranged in the housing, the positioning strip is provided with a plurality of wire clamping grooves, and each of the positive electrode lead and the ground electrode lead is clamped in the wire clamping groove respectively.
Optionally, the casing includes a casing and a cover connected to the casing, and the casing or/and the cover is provided with a lead bar positioning groove for positioning the positioning bar.
Optionally, the back of the piezoelectric block array is further provided with a matching layer.
Optionally, the surface of the matching layer is further provided with an acoustic lens.
Optionally, the positive electrode conductive layer, the negative electrode conductive layer and the communication conductive layer are conductive layers integrally formed on the piezoelectric block array, an electrode dividing groove for dividing at least part of the conductive layers on the front surface of the piezoelectric block array into the positive electrode conductive layers is formed on the front surface of the piezoelectric block array, and the electrode dividing groove is formed along the separation groove.
Optionally, the piezoelectric block array is planar, arc-shaped or spherical.
Optionally, the piezoelectric block array is curved, and one surface of the piezoelectric block array having the electrode dividing groove is an inner curved surface.
Optionally, the transduction piezoelectric block has multiple rows, each row is provided with one corresponding to the transduction piezoelectric block, each positioning strip is provided with at least three wire clamping grooves arranged at intervals, each wire clamping groove is longitudinally arranged on the side surface of the positioning strip, the wire clamping grooves close to the two ends of the positioning strip are negative wire clamping grooves, and the two negative wire clamping grooves are communicated through a communication groove at the upper end of the positioning strip.
The invention also provides a manufacturing method of the magnetic compatible ultrasonic transducer, which comprises the following steps: preparing a shell, a piezoelectric material part and a cable;
wherein the preparation of the piezoelectric material part comprises the steps of:
preparing a piezoelectric block array: preparing a plurality of piezoelectric blocks arranged in an array and insulators for connecting adjacent piezoelectric blocks, connecting the insulators between the adjacent piezoelectric blocks to form a piezoelectric block array,
preparing a conductive layer: dividing a plurality of piezoelectric blocks in the piezoelectric block array into transduction piezoelectric blocks, forming a plurality of independent positive electrode conducting layers which are respectively connected with the transduction piezoelectric blocks on the front surface of the piezoelectric block array, and forming negative electrode conducting layers which are electrically conducted with each other on the back surface of the transduction piezoelectric blocks;
a cable connecting step: and connecting a plurality of positive leads in the cable to the positive conducting layers respectively, and connecting a ground lead in the cable with the negative conducting layer.
Optionally, in the step of preparing the conductive layer, the method further includes: dividing the piezoelectric blocks at the edge of the piezoelectric block array into edge piezoelectric blocks, arranging communicated conductive layers which are mutually and electrically communicated on the front surface, the side surface and the back surface of the edge piezoelectric blocks, and communicating the communicated conductive layers with the negative conductive layer; in the cable step, the earth electrode lead is connected with the communicated conducting layer on the front face of the edge piezoelectric block, so that the earth electrode lead is connected with the negative conducting layer.
Optionally, in the step of connecting a cable, the following steps are included: preparing a positioning strip with a plurality of wire clamping grooves, respectively clamping the positive lead and the ground lead in the wire clamping grooves, installing the positioning strip in the shell, and respectively connecting the positive lead and the ground lead with the positive conducting layer and the communicating conducting layer which are positioned on the front surface of the piezoelectric block array.
Optionally, in the step of preparing the piezoelectric block array, the method includes the following steps:
preparing a piezoelectric sheet, forming a first separation groove on the front surface of the piezoelectric sheet along a first direction, and filling an insulating material in the first separation groove; forming a second isolation groove intersecting with the first isolation groove on the front surface of the piezoelectric plate along a second direction, and filling an insulating material in the second isolation groove;
and removing the material with the set thickness on the back surface of the piezoelectric sheet, so that the piezoelectric sheet is divided into independent piezoelectric blocks by the first separation grooves and the second separation grooves, and the adjacent piezoelectric blocks are connected by the insulator.
Optionally, in the step of preparing the conductive layer, the following steps are included:
the method comprises the steps of sputtering a conducting layer on the surface of a piezoelectric block array, forming a first cutting groove and a second cutting groove which are intersected and have the cutting depth larger than or equal to the thickness of the conducting layer on the surface of the piezoelectric block array, wherein the first cutting groove and the second cutting groove are respectively arranged along a first separation groove and a second separation groove, the conducting layer on the front surface of the piezoelectric block array is divided into a plurality of anode conducting layers by the first cutting groove and the second cutting groove, and the array blocks of the piezoelectric block array are simultaneously divided into transduction piezoelectric blocks by the first cutting groove and the second cutting groove.
Optionally, after a first cutting groove and a second cutting groove are formed in the surface of the piezoelectric block array, pressing the piezoelectric block array into an arc surface shape, wherein one surface of the piezoelectric block array, which is provided with the first cutting groove and the second cutting groove, is an inner arc surface;
alternatively, the piezoelectric block array having the first and second slits is pressed into a spherical shape, and one surface of the piezoelectric block array having the first and second slits is an aspherical surface.
According to the magnetic compatibility type ultrasonic transducer and the manufacturing method thereof provided by the invention, the piezoelectric composite material is prepared, the electrodes are divided finally, and the piezoelectric composite material is cut into a part to form the cutting groove when the electrodes are divided, so that the piezoelectric composite material can be ensured not to crack when the cambered surface is formed and is easy to press into the cambered surface. By the cambered surface forming, the good focusing performance of the probe can be ensured. When the lead is led, the cable and the array elements are positioned in a one-to-one correspondence mode through the prepared cable positioning strips, and then each cable is bonded with the array elements by using the conductive polymer, so that the electrode lead is led out. Thus, the lead can be ensured to be reliable, and the magnetic compatibility requirement can be met.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic perspective assembly diagram of a magnetic compatible ultrasonic transducer according to an embodiment of the present invention;
fig. 2 is a schematic exploded perspective view of a magnetic compatible ultrasonic transducer according to an embodiment of the present invention;
fig. 3 is a schematic perspective view of a piezoelectric block array (without a conductive layer and without an electrode dividing groove) in a magnetic compatible ultrasonic transducer according to an embodiment of the present invention;
fig. 4 is a schematic perspective view of a piezoelectric material component (after a conductive layer is disposed and an electrode dividing groove is formed) in a magnetic compatible ultrasonic transducer according to an embodiment of the present invention;
fig. 5 is a schematic perspective view of a piezoelectric material component of a magnetic compatible ultrasonic transducer according to an embodiment of the present invention after a matching layer is disposed thereon;
fig. 6 is a schematic perspective view of a positioning bar in a magnetic compatible ultrasonic transducer according to an embodiment of the present invention;
fig. 7 is a schematic perspective view of a positioning bar connected with a positive electrode lead and a ground electrode lead in a magnetic compatible ultrasonic transducer according to an embodiment of the present invention;
fig. 8 is a schematic perspective view of a piezoelectric plate in a method for manufacturing a magnetic compatible ultrasonic transducer according to an embodiment of the present invention;
FIG. 9 is a schematic perspective view of the piezoelectric sheet of FIG. 8 with a first spacer groove disposed on the front surface thereof;
FIG. 10 is a schematic perspective view of the piezoelectric sheet of FIG. 9 with the first cells filled with an insulating polymer;
FIG. 11 is a schematic perspective view of the piezoelectric sheet of FIG. 10 with a second spacer groove formed in the front surface thereof;
FIG. 12 is a schematic perspective view of the piezoelectric sheet of FIG. 11 with the second cells filled with an insulating polymer;
FIG. 13 is a schematic perspective view of the piezoelectric patch of FIG. 12 with the backside material removed to form an array of piezoelectric patches;
FIG. 14 is a perspective view of the piezoelectric block array of FIG. 13 with a conductive layer disposed on the surface;
FIG. 15 is a schematic perspective view of the front side of the piezoelectric block array of FIG. 14 with electrode dividing grooves;
FIG. 16 is another perspective view of the front side of the piezoelectric block array of FIG. 14 with electrode dividing slots;
fig. 17 is a schematic plan view illustrating a piezoelectric block array pressed by a mold in a method for manufacturing a magnetic compatible ultrasonic transducer according to an embodiment of the present invention;
fig. 18 is a schematic perspective view illustrating a lead bar being mounted in a method for manufacturing a magnetic compatible ultrasonic transducer according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.
It should be noted that the terms of orientation such as left, right, up and down in the embodiments of the present invention are only relative to each other or are referred to the normal use state of the product, and should not be considered as limiting.
As shown in fig. 1 to 4, a magnetic compatible ultrasonic transducer provided in an embodiment of the present invention may be used in ultrasonic equipment such as a medical ultrasonic machine, and includes a housing 1, a piezoelectric material component 2, and a cable 3, where the piezoelectric material component 2 is disposed in the housing 1, and the cable may be inserted through the housing 1 and connected to the piezoelectric material component 2.
The piezoelectric material component 2 includes a piezoelectric block array 200, the piezoelectric block array 200 includes piezoelectric blocks 20 arranged in an array, and the piezoelectric block array 200 may be circular, polygonal, irregular, or the like as a whole. In the present embodiment, the piezoelectric block array 200 is rectangular, each piezoelectric block 20 is also rectangular, and the piezoelectric blocks 20 may be ceramic piezoelectric blocks. The adjacent piezoelectric blocks 20 are separated by slots, and the piezoelectric block array 200 further includes insulators (such as insulating polymers 910 and 920 shown in fig. 10 and 12) filled in the slots and used for connecting the adjacent piezoelectric blocks 20, wherein the insulating polymers can connect the piezoelectric blocks 20 on one hand and suppress crosstalk between the piezoelectric blocks 20 on the other hand.
At least the front surfaces of the piezoelectric blocks 20 are provided with mutually independent positive electrode conductive layers 221, the piezoelectric blocks 20 having the positive electrode conductive layers 221 are transduction piezoelectric blocks 20, and the back surfaces of the transduction piezoelectric blocks 20 are provided with mutually electrically conductive negative electrode conductive layers 222.
The cable may be a coaxial cable, and a plurality of positive electrode leads 31 and at least one ground electrode lead 32 are connected to the cable, each positive electrode lead 31 is connected to the positive electrode conductive layer 221 of each transducer piezoelectric block 20, and the ground electrode lead 32 is connected to the negative electrode conductive layer 222. The ground lead 32 and the negative conductive layer 222 may be in direct or indirect electrical communication. The positive electrode leads 31 and the transduction piezoelectric blocks 21 can correspond to each other one by one, and each positive electrode lead 31 can be connected to the positive electrode conductive layer 221 corresponding to each transduction piezoelectric block 21 through a conductive polymer (conductive adhesive), so that the connection reliability is high, the magnetic compatibility requirement can be met, the MRI compatibility is good, and the imaging of the ultrasonic machine is clear and reliable.
Optionally, the piezoelectric blocks 20 located at the edge of the piezoelectric block array 200 are edge piezoelectric blocks 22, that is, the piezoelectric blocks 20 include the transducer piezoelectric blocks 21 and the edge piezoelectric blocks 22. In this embodiment, a ring of piezoelectric blocks at the outermost circle of the piezoelectric block array 200 (i.e. piezoelectric blocks having at least one side surface that is the side surface of the piezoelectric block array 200) are edge piezoelectric blocks 22, and the rest of piezoelectric blocks (i.e. piezoelectric blocks located in the middle region of the piezoelectric block array 200, i.e. piezoelectric blocks that are not side surfaces that are the side surfaces of the piezoelectric block array 200) are transduction piezoelectric blocks 21. The front, side and back of at least one edge piezoelectric block 22 are provided with communicating conductive layers 223 that are electrically communicated with each other, the communicating conductive layers 223 can lead the negative conductive layer 222 on the back to the front for wiring, and the back of the piezoelectric block array 200 is flat. The communicating conducting layer 223 on the back of the edge piezoelectric block 22 is integrally connected with the negative conducting layer 222, the positive conducting layer 221, the negative conducting layer 222 and the communicating conducting layer 223 can be integrally formed, and a plurality of positive conducting layers 221 are divided by cutting grooves; the ground lead 32 is connected to the communicating conductive layer 223 on the front surface of the edge piezoelectric block 22. The ground lead 32 may be connected to the connecting conductive layer 223 on the front surface of the edge piezoelectric block 22 by a conductive polymer (e.g., conductive adhesive). Each positive electrode lead 31 and each ground electrode lead 32 can be arranged in an array form, the positive electrode leads 31 and the ground electrode leads 32 can be connected to the corresponding conducting layer from one surface (front surface) of the piezoelectric block array 200, the positive electrode leads 31 and the ground electrode leads 32 are arranged in order, the wiring mode is simple and reliable, and the requirement of magnetic compatibility can be further met. It should be understood that the terms of orientation such as front and back in the present embodiment are relative to each other, and should not be considered as limiting.
Optionally, as shown in fig. 5, the matching layer 5 is further disposed on the back surface of the piezoelectric block array 200, and the thickness of the matching layer 5 satisfies the acoustic performance requirement. The matching layer 5 has the function of ensuring that the acoustic energy can be more effectively output on one hand; on the other hand, the composite material is used as a substrate of the composite material and plays a role in protecting the piezoelectric material and the insulated electrode.
Optionally, the surface of the matching layer 5 is also provided with an acoustic lens to increase the focusing effect of the probe.
Alternatively, the positive electrode conductive layer 221, the negative electrode conductive layer 222, and the communication conductive layer 223 are conductive layers integrally formed on the piezoelectric block array 200, and the conductive layers may be formed on the surface of the piezoelectric block array 200 by sputtering. The front surface of the piezoelectric block array 200 is provided with electrode dividing grooves for dividing at least part of the conductor layers of the front surface of the piezoelectric block array 200 into positive electrode conductive layers 221, the electrode dividing grooves are arranged along the partition grooves, the electrode dividing grooves form a plurality of positive electrode conductive layers 221 on the front surface of the piezoelectric block array 200, and the remaining conductor layers are used as negative electrode conductive layers 222 and communication conductive layers 223. The separation grooves can be arranged in a crisscross mode, and the electrode dividing grooves can also be arranged in a crisscross mode. That is, the cutting depth of the electrode dividing groove is greater than the thickness of the conductive layer and less than the thickness of the isolation groove, so as to avoid cutting the negative conductive layer 222 on the back surface of the piezoelectric block array 200. It is understood that when the electrode dividing groove is formed, only part or all of the conductor layer on the separating groove and part of the insulator in the separating groove are removed, and in a specific application, the width of the electrode dividing groove may be less than or equal to the width of the separating groove.
Alternatively, the piezoelectric block array 200 may be planar, arcuate, spherical, or the like.
In this embodiment, the piezoelectric block array 200 is a curved surface (for example, an arc surface or a spherical surface), and one surface of the piezoelectric block array 200 having the electrode dividing groove is an inner curved surface or an outer curved surface, and the piezoelectric block array 200 can be pressed into a curved surface shape from a planar shape, and by providing the electrode dividing groove, the curved surface (the arc surface or the spherical surface) is not broken when being formed.
Optionally, as shown in fig. 6 to 7, a positioning strip 4 for positioning each positive electrode lead 31 and each ground electrode lead 32 is provided in the housing 1, the positioning strip 4 is provided with a plurality of wire clamping grooves, each positive electrode lead 31 and each ground electrode lead 32 are respectively clamped in the wire clamping grooves, and each positive electrode lead 31 and each ground electrode lead 32 are arranged in order, are not easy to be disordered and interfered, and are easy to assemble and maintain. Each positioning strip 4 is provided with at least three wire clamping grooves which are arranged at intervals, each wire clamping groove is longitudinally arranged on the side surface of the positioning strip 4, and the wire clamping grooves are vertically communicated with the upper end and the lower end of the positioning strip 4. The wire clamping grooves close to the two ends of each positioning strip 4 are negative wire clamping grooves 402, the wire clamping grooves between the two negative wire clamping grooves 402 are positive wire clamping grooves 401, the two negative wire clamping grooves 402 are communicated through a communicating groove 403 located at the upper end of each positioning strip 4, each positioning strip 4 is provided with a ground lead 32, the ground lead 32 is clamped in the communicating groove 403, and the two ends of the ground lead 32 downwards extend out of the negative wire clamping grooves 402 and are connected to the corresponding communicating conductive layers 223 on the front sides of the edge piezoelectric blocks 22. The positive lead 31 is engaged with the positive wire engaging groove 401.
Alternatively, as shown in fig. 1 to 6, the casing 1 includes a casing 12 and a cover 11 connected to the casing 12, the casing 12 or/and the cover 11 is provided with a lead bar positioning slot 121 for positioning the positioning bar 4, in this embodiment, the upper end of the casing 12 is provided with at least one set (two) of lead bar positioning slots 121, and two ends of each positioning bar 4 can be clamped in the set of lead bar positioning slots 121. The number of groups of the lead bar positioning grooves 121 is matched with the number of the positioning bars 4.
In specific application, the number of the positive electrodes and the negative electrodes in the cable is equal, and the negative electrodes in the cable can be overlapped with the ground lead 32 after being summarized or independently. The wiring quantity is few, and the wiring is clean and tidy, interference immunity is good. In this embodiment, each positioning strip 4 is connected to a plurality of positive leads 31 and one ground lead 32, a plurality of positive wires of the cable may be connected to the positive leads 31, and a negative wire of the cable corresponding to each positioning strip 4 may be connected to the same ground lead 32. Namely: the positive leads 31 of the same positioning strip 4 are respectively connected with the corresponding positive cable wires, and the negative cable wires can be connected with the ground leads 32 of the positioning strip.
Optionally, a positioning structure may be disposed between the housing 12 and the cover 11, the positioning structure may include a cover positioning groove 122 disposed on the housing 12 and a protrusion disposed on the cover 11, and the protrusion may be engaged in the cover positioning groove 122.
Alternatively, the transducer piezoelectric block 21 has a plurality of rows and columns. Each row and each column has a plurality of piezoelectric transducing blocks 21, and edge piezoelectric blocks 22 are arranged at two ends of each row and each column of piezoelectric transducing blocks 21. In this embodiment, each row or every two rows of the energy-converting piezoelectric blocks 21 are correspondingly provided with one positioning strip 4, each positioning strip 4 is provided with at least three wire clamping grooves arranged at intervals, each wire clamping groove is longitudinally arranged on the side surface of the positioning strip 4, and the wire clamping grooves are vertically communicated with the upper end and the lower end of the positioning strip 4. The wire clamping grooves close to the two ends of each positioning strip 4 are negative wire clamping grooves 402, the two negative wire clamping grooves 402 are communicated through a communication groove 403 located at the upper end of each positioning strip 4, each positioning strip 4 is provided with a ground lead 32, and the two ends of each ground lead 32 extend downwards from the negative wire clamping grooves 402 and are connected to the corresponding communicated conductive layers 223 on the front side of the edge piezoelectric blocks 22.
The ultrasonic transducer can be prepared by the following steps: as shown in fig. 8, a piece of piezoelectric sheet 210 is cut to a predetermined size. As shown in fig. 9, a first cutting is performed along the transverse direction of the piezoelectric sheet 210 to form a first isolation groove 901, the cutting interval and the cutting depth can be determined by the acoustic characteristics of the transducer, and M rows of piezoelectric ceramic posts are cut. As shown in fig. 10, an insulating polymer 910 is added to the first isolation channel 901, and the insulating polymer 910 can connect the piezoelectric ceramic posts on one hand and is used for suppressing crosstalk interference between array elements on the other hand. As shown in fig. 11, a second slot 902 is formed by cutting along the longitudinal direction of the piezoelectric sheet 210 after adding the insulating polymer 910 into the first slot 901, the cutting interval and the cutting depth can be determined by the acoustic characteristics of the transducer, and the N columns of ceramic posts are determined by the matrix of array elements designed by us. As shown in fig. 12, an insulating polymer 920 is added in the second slot 902, and the insulating polymer 920 can connect the N rows of piezoelectric ceramic posts on one hand and is used for suppressing the crosstalk between the array elements on the other hand. As shown in fig. 13, the two-dimensional M × N matrix composite (piezoelectric block array 200) for the transducer is prepared by grinding away the excess piezoelectric material on the bottom surface of the piezoelectric sheet 210 filled with the insulating polymer 920. As shown in fig. 14, electrodes were sputtered on the surface of the two-dimensional M × N matrix composite prepared above. As shown in fig. 15 and 16, the composite material (piezoelectric block array 200) after sputtering the electrode is divided into electrodes along the cutting groove positions, and when the electrodes are divided, the electrode dividing grooves (including the first cutting groove 801 and the second cutting groove 802 which are vertically intersected) have a certain cutting depth, so that the material is not cracked when the arc surface is formed. As shown in fig. 5, a matching layer 5 is added to the bottom of the composite material (piezoelectric block array 200), and the thickness of the matching layer 5 meets the thickness required by the acoustic performance. The matching layer 5 has the function of ensuring that the acoustic energy can be more effectively output on one hand; and on the other hand, the piezoelectric material and the insulated electrode are used as a substrate of the composite material and are protected. As shown in fig. 17, the material prepared above was pressed into a curved surface using a die/jig. As shown in fig. 2 and 18, the piezoelectric material component is pressed into an arc surface and then installed into the housing 12, and the housing 12 is provided with a lead positioning groove 121 and a cover positioning groove 122 for installing the positioning strip 4 and the cover 11, so as to ensure that each electrode lead on the positioning strip 4 can correspond to an array element one by one. As shown in fig. 13, the positioning bars 4 are added on the M × N array ceramic on which the housing 12 is mounted, and the lead positioning bars 4 (composed of the positioning bars 4 and the leads) are mounted in the positioning slots on the housing 12, so that each lead can be ensured to correspond to an array element one by one. And all the lead positioning strips 4 are installed at one time, so that all the array element leads can be connected into the cable. As shown in fig. 1, 2 and 18, the above steps are subjected to top cover packaging and circuit lead to prepare the final magnetic compatibility cambered surface two-dimensional area array ultrasonic transducer.
An embodiment of the present invention further provides a method for manufacturing a magnetic compatible ultrasound transducer, which can be used for manufacturing the ultrasound transducer, as shown in fig. 1 to 4, and includes the following steps: preparing a shell 1, a piezoelectric material part 2 and a cable; the piezoelectric material part 2 is placed in the housing 1 and connected to the cable.
Wherein the preparation of the piezoelectric material part 2 comprises the steps of:
the piezoelectric block array 200 is prepared by the following steps: preparing a plurality of piezoelectric blocks 20 arranged in an array and insulators for connecting adjacent piezoelectric blocks 20, connecting the insulators between the adjacent piezoelectric blocks 20 to form a piezoelectric block array 200,
preparing a conductive layer: dividing a plurality of piezoelectric blocks 20 in the piezoelectric block array 200 into transduction piezoelectric blocks 21, forming a plurality of independent positive electrode conductive layers 221 connected with the transduction piezoelectric blocks 21 on the front surface of the piezoelectric block array 200, and forming negative electrode conductive layers 222 electrically connected with each other on the back surface of the transduction piezoelectric blocks 21;
a cable connecting step: a plurality of positive electrode leads 31 in the cable are connected to the positive electrode conductive layers 221, respectively, and a ground lead 32 in the cable is connected to the negative electrode conductive layer 222. The positive electrode leads 31 and the transduction piezoelectric blocks 21 can correspond to each other one by one, and each positive electrode lead 31 can be connected to the positive electrode conductive layer 221 corresponding to each transduction piezoelectric block 21 through a conductive polymer (conductive adhesive), so that the connection reliability is high, the magnetic compatibility requirement can be met, the MRI compatibility is good, and the imaging of the ultrasonic machine is clear and reliable.
Alternatively, in the step of preparing the piezoelectric block array 200, the following steps are included:
as shown in fig. 7 to 18, preparing a piezoelectric sheet 210 (a piezoelectric composite material plate), cutting the piezoelectric sheet 210 into a predetermined shape and size, forming a first groove 901 in a first direction on a front surface of the piezoelectric sheet 210, and filling an insulator (an insulating polymer 910) in the first groove 901; forming a second isolation groove 902 intersecting with the first isolation groove 901 on the front surface of the piezoelectric sheet 210 along a second direction, and filling an insulator (insulating polymer 920) in the second isolation groove 902; the first trenches 901 and the second trenches 902 intersect perpendicularly, and the depths H1 of the first trenches 901 and the second trenches 902 may be equal.
As shown in fig. 13, a material with a predetermined thickness on the back surface of the piezoelectric sheet 210 is removed, so that the first grooves 901 and the second grooves 902 divide the piezoelectric sheet 210 into piezoelectric blocks 20 (including the transducing piezoelectric block 21 and the edge piezoelectric block 22) which are independent of each other, and the adjacent piezoelectric blocks 20 are connected by an insulator (insulating polymers 910 and 920). I.e., the thickness of the piezoelectric sheet 210 is H, the thickness of the material removed from the back side of the piezoelectric sheet 210 should be equal to or greater than H-H1, so that the piezoelectric blocks 20 are completely separated by the insulation.
Optionally, in the step of preparing the conductive layer, the method further includes: dividing the piezoelectric blocks 20 at the edge of the piezoelectric block array 200 into edge piezoelectric blocks 22, arranging communicating conductive layers 223 which are mutually and electrically communicated on the front surface, the side surface and the back surface of the edge piezoelectric blocks 22, and enabling the communicating conductive layers 223 to be communicated with the negative electrode conductive layer 222; in the cabling step, the ground lead 32 is connected to the conductive layer 223 on the front surface of the edge piezoelectric block 22, so that the ground lead 32 is connected to the negative conductive layer 222. The positive electrode lead 31 and the ground electrode lead 32 can be connected to corresponding conductive layers from one side (front side) of the piezoelectric block array 200, the positive electrode leads 31 and the ground electrode leads 32 are arranged orderly, the wiring mode is simple and reliable, and the requirement of magnetic compatibility can be further met.
Optionally, in the step of preparing the conductive layer, the following steps are included:
as shown in fig. 7 to 16, a conductive layer is sputtered on the surface of the piezoelectric block array 200, and a first cutting groove 801 and a second cutting groove 802 intersecting each other and having a cutting depth greater than or equal to the thickness of the conductive layer are formed on the surface of the piezoelectric block array 200, and the first cutting groove 801 and the second cutting groove 802 are electrode dividing grooves. The first incision 801 and the second incision 802 are respectively arranged along the first isolation groove 901 and the second isolation groove 902, i.e. the first incision 801 and the second incision 802 intersect perpendicularly. The first and second cutting grooves 801 and 802 divide the conductive layer of the front surface of the piezoelectric block array 200 into a plurality of positive electrode conductive layers 221, and the first and second cutting grooves 801 and 802 simultaneously divide the plurality of array blocks of the piezoelectric block array 200 into the transducing piezoelectric blocks 21.
In a specific application, the matching layer 5 may be continuously disposed on the conductive layer on the back side of the piezoelectric block array 200. On one hand, the acoustic energy can be more effectively output; on the other hand, the composite material is used as a substrate of the composite material and plays a role in protecting the piezoelectric material and the insulated electrode.
In a specific application, an acoustic lens may be provided on the matching layer 5 to increase the focusing effect of the probe.
Optionally, after the first cutting groove 801 and the second cutting groove 802 are formed on the surface of the piezoelectric block array 200, pressing the piezoelectric block array 200 into an arc surface shape, and making one surface of the piezoelectric block array 200, which has the first cutting groove 801 and the second cutting groove 802, be an inner arc surface or an outer arc surface;
alternatively, the piezoelectric block array 200 having the first and second slots 801 and 802 is pressed into a spherical shape, and one surface of the piezoelectric block array 200 having the first and second slots 801 and 802 is an inner spherical surface or an outer spherical surface.
In a specific application, as shown in fig. 17, the piezoelectric block array 200 may be pressed by using a mold, the mold may include a female mold having a concave surface cavity or a spherical surface cavity, and a male mold having a concave surface punch or a spherical surface punch, the piezoelectric block array 200 may be placed in the female mold facing the male mold or facing away from the female mold, and the piezoelectric block array 200 may be pressed into a curved surface or a spherical surface.
It is understood that the two-dimensional planar magnetic compatible ultrasonic transducer can also be prepared by using the scheme, and the number of the array elements is not limited. The piezoelectric block array 200 and the circuit board may be made of any material that satisfies magnetic compatibility, and the size and shape thereof are not limited.
Optionally, in the step of connecting the cable, the following steps are included: the method comprises the steps of preparing a positioning strip 4 with a plurality of wire clamping grooves, respectively clamping a positive lead 31 and a ground lead 32 in the wire clamping grooves, installing the positioning strip 4 in a shell 1, and respectively connecting the positive lead 31 and the ground lead 32 with a positive conducting layer 221 and a communicating conducting layer 223 which are positioned on the front side of a piezoelectric block array 200, wherein the array element leads are simple and reliable, the positioning strip 4 is installed in a lead positioning groove 121 to ensure that each lead on the positioning strip 4 can correspond to an array element of a transducer one by one, and the array element electrodes are led out through a bonding lead, and the positive leads 31 and the ground leads 32 are arranged neatly and are not easy to disorder and mutual interference, and are easy to assemble and maintain.
According to the magnetic compatible ultrasonic transducer and the manufacturing method thereof provided by the embodiment of the invention, the piezoelectric sheet 210 is prepared and the electrodes are divided, the reliability and consistency of arc surface forming are ensured by dividing the electrodes and adding the matching layer 5, the emitting surface of the transducer is protected and insulated, and the piezoelectric sheet 210 is cut into a part to form the electrode dividing groove when the electrodes are divided, so that the piezoelectric composite material (the piezoelectric block array 200) is not broken when the arc surface is formed and is easy to be pressed into the arc surface. By the cambered surface forming, the good focusing performance of the probe can be ensured. Through the location strip 4 of preparation in the time of the lead wire, fix a position cable conductor and array element (piezoelectric block 20) one-to-one, reuse conducting polymer and bond every cable conductor and array element, come out the electrode lead wire, avoid using materials such as circuit board and welding in the traditional scheme to reach good magnetic compatibility, can guarantee that the lead wire is reliable, guarantee the uniformity of every array element lead wire, and satisfy the magnetic compatibility requirement.
The present invention is not limited to the above preferred embodiments, and any modification, equivalent replacement or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (12)
1. The magnetic compatible ultrasonic transducer is characterized by comprising a shell, a piezoelectric material part and a cable, wherein the piezoelectric material part is arranged in the shell;
the piezoelectric material component comprises a piezoelectric block array, the piezoelectric block array comprises piezoelectric blocks arranged in an array, adjacent piezoelectric blocks are separated by a separation groove, and the piezoelectric block array further comprises an insulator which is filled in the separation groove and is used for connecting the adjacent piezoelectric blocks;
the front surfaces of at least a plurality of piezoelectric blocks are provided with mutually independent positive electrode conducting layers, the piezoelectric blocks with the positive electrode conducting layers are transduction piezoelectric blocks, and the back surfaces of the transduction piezoelectric blocks are provided with mutually and electrically conducted negative electrode conducting layers;
the cable is connected with a plurality of anode leads and at least one earth lead, each anode lead is connected with the anode conductive layer of each energy conversion piezoelectric block, and the earth lead is connected with the cathode conductive layer;
a positioning strip for positioning each positive lead and each ground lead is arranged in the shell, the positioning strip is provided with a plurality of wire clamping grooves, and each positive lead and each ground lead are clamped in the wire clamping grooves respectively;
the energy conversion piezoelectric block is provided with a plurality of rows, each row of the energy conversion piezoelectric block is correspondingly provided with one positioning strip, each positioning strip is provided with at least three wire clamping grooves which are arranged at intervals, each wire clamping groove is longitudinally arranged on the side surface of the positioning strip, the wire clamping grooves close to the two ends of the positioning strip are negative wire clamping grooves, and the two negative wire clamping grooves are communicated through a communication groove positioned at the upper end of the positioning strip;
the shell comprises a shell and a cover body connected to the shell, and the shell or/and the cover body are/is provided with a lead strip positioning groove used for positioning the positioning strip.
2. The magnetically compatible ultrasonic transducer according to claim 1,
the piezoelectric blocks positioned at the edge of the piezoelectric block array are edge piezoelectric blocks, the front surface, the side surface and the back surface of at least one edge piezoelectric block are provided with communicated conductive layers which are mutually and electrically communicated, and the communicated conductive layer at the back surface of the edge piezoelectric block is connected with the negative conductive layer; and the earth pole lead is connected with the communicating conducting layer on the front surface of the edge piezoelectric block.
3. The magnetically compatible ultrasonic transducer according to claim 1 wherein the back of the array of piezoelectric blocks is further provided with a matching layer.
4. A magnetically compatible ultrasonic transducer according to claim 3 wherein the surface of the matching layer is further provided with acoustic lenses.
5. The magnetically compatible ultrasonic transducer according to claim 2, wherein the positive electrode conductive layer, the negative electrode conductive layer and the interconnecting conductive layer are conductive layers integrally formed on the piezoelectric block array, and the front surface of the piezoelectric block array is provided with electrode dividing grooves for dividing at least a part of the conductive layers on the front surface of the piezoelectric block array into the positive electrode conductive layers, the electrode dividing grooves being provided along the separation grooves.
6. The magnetically compatible ultrasound transducer according to claim 1, wherein the array of piezoelectric blocks is planar, arcuate, or spherical.
7. The magnetically compatible ultrasonic transducer according to claim 5, wherein the piezoelectric block array has a curved surface, and a surface of the piezoelectric block array having the electrode dividing grooves has an inner curved surface or an outer curved surface.
8. A method for manufacturing a magnetic compatible ultrasonic transducer is characterized by comprising the following steps: preparing a shell, a piezoelectric material part and a cable;
wherein the preparation of the piezoelectric material part comprises the steps of:
preparing a piezoelectric block array: preparing a plurality of piezoelectric blocks arranged in an array and insulators for connecting adjacent piezoelectric blocks, connecting the insulators between the adjacent piezoelectric blocks to form a piezoelectric block array,
preparing a conductive layer: dividing a plurality of piezoelectric blocks in the piezoelectric block array into transduction piezoelectric blocks, forming a plurality of independent positive electrode conducting layers which are respectively connected with the transduction piezoelectric blocks on the front surface of the piezoelectric block array, and forming negative electrode conducting layers which are electrically conducted with each other on the back surface of the transduction piezoelectric blocks;
a cable connecting step: connecting a plurality of positive leads in the cable to each positive conductive layer respectively, and connecting a ground lead with a negative conductive layer;
in the cable connecting step, the following steps are included: preparing a positioning strip with a plurality of wire clamping grooves, respectively clamping the positive electrode lead and the ground electrode lead in the wire clamping grooves, and installing the positioning strip on the shell, wherein the positive electrode lead and the ground electrode lead are respectively connected with the positive electrode conducting layer and the communicating conducting layer which are positioned on the front surface of the piezoelectric block array;
the energy conversion piezoelectric blocks are provided with a plurality of rows, so that each row of the energy conversion piezoelectric blocks is correspondingly provided with one positioning strip, each positioning strip is provided with at least three wire clamping grooves which are arranged at intervals, each wire clamping groove is longitudinally arranged on the side surface of each positioning strip, the wire clamping grooves close to the two ends of each positioning strip are negative wire clamping grooves, and the two negative wire clamping grooves are communicated through a communication groove at the upper end of each positioning strip.
9. The method of manufacturing a magnetically compatible ultrasonic transducer according to claim 8, wherein in the step of preparing the conductive layer, the method further comprises: dividing the piezoelectric blocks at the edge of the piezoelectric block array into edge piezoelectric blocks, arranging communicated conductive layers which are mutually and electrically communicated on the front surface, the side surface and the back surface of the edge piezoelectric blocks, and communicating the communicated conductive layers with the negative conductive layer; in the cable step, the earth electrode lead is connected with the communicated conducting layer on the front face of the edge piezoelectric block, so that the earth electrode lead is connected with the negative conducting layer.
10. The method of manufacturing a magnetically compatible ultrasonic transducer according to claim 9, wherein the step of preparing the piezoelectric block array comprises the steps of:
preparing a piezoelectric sheet, forming a first separation groove on the front surface of the piezoelectric sheet along a first direction, and filling an insulating material in the first separation groove; forming a second isolation groove intersecting with the first isolation groove on the front surface of the piezoelectric plate along a second direction, and filling an insulating material in the second isolation groove;
and removing the material with the set thickness on the back surface of the piezoelectric sheet, so that the piezoelectric sheet is divided into independent piezoelectric blocks by the first separation grooves and the second separation grooves, and the adjacent piezoelectric blocks are connected by the insulator.
11. The method of claim 10, wherein the step of preparing the conductive layer comprises the steps of:
the method comprises the steps of sputtering a conducting layer on the surface of a piezoelectric block array, forming a first cutting groove and a second cutting groove which are intersected and have the cutting depth larger than or equal to the thickness of the conducting layer on the surface of the piezoelectric block array, wherein the first cutting groove and the second cutting groove are respectively arranged along a first separation groove and a second separation groove, the conducting layer on the front surface of the piezoelectric block array is divided into a plurality of anode conducting layers by the first cutting groove and the second cutting groove, and the array blocks of the piezoelectric block array are simultaneously divided into transduction piezoelectric blocks by the first cutting groove and the second cutting groove.
12. The method of claim 11, wherein the piezoelectric patch array is pressed into an arc shape after the first and second cuts are formed on the surface of the piezoelectric patch array, and one surface of the piezoelectric patch array having the first and second cuts is an inner arc surface or an outer arc surface;
alternatively, the piezoelectric block array having the first and second slots is pressed into a spherical shape, and one surface of the piezoelectric block array having the first and second slots is an inner spherical surface or an outer spherical surface.
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| CN105596027A (en) * | 2014-11-05 | 2016-05-25 | 香港理工大学深圳研究院 | Two-dimensional array ultrasonic transducer based on three-dimensional ultrasonic imaging and preparation method for same |
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| US6803701B2 (en) * | 2001-06-19 | 2004-10-12 | Nihon Dempa Kogyo Co., Ltd. | Matrix type ultrasonic probe and method of manufacturing the same |
| CN1817486A (en) * | 2005-02-07 | 2006-08-16 | 北京大学 | Transducer array and production thereof |
| CN105596027A (en) * | 2014-11-05 | 2016-05-25 | 香港理工大学深圳研究院 | Two-dimensional array ultrasonic transducer based on three-dimensional ultrasonic imaging and preparation method for same |
| CN105170435A (en) * | 2015-09-23 | 2015-12-23 | 深圳先进技术研究院 | High-frequency ultrasonic transducer and preparing method thereof |
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