CN109913818A - Evaporation source and evaporation coating device - Google Patents
Evaporation source and evaporation coating device Download PDFInfo
- Publication number
- CN109913818A CN109913818A CN201811070878.7A CN201811070878A CN109913818A CN 109913818 A CN109913818 A CN 109913818A CN 201811070878 A CN201811070878 A CN 201811070878A CN 109913818 A CN109913818 A CN 109913818A
- Authority
- CN
- China
- Prior art keywords
- container
- evaporation source
- positioning region
- evaporation
- receiving component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention provides evaporation source and evaporation coating device, in evaporation source, is able to suppress temperature reduction, and carry out the position control for the opening that evaporation material is passed through.Evaporation source includes container, accommodates evaporation material, and have opening；Heating element heats container；And receiving component, accepting container and heating element, which is characterized in that receiving component includes container supporting part, side surface part and positioning region, the at least part in the outside of the bottom of container supporting part supporting container, positioning region are provided projectingly relative to container in rodlike or plate from side surface part.
Description
Technical field
The present invention relates to evaporation sources and evaporation coating device.
Background technique
In recent years, as one kind of display, have having for the organic EL element for the electroluminescence for having used organic material
Machine EL device is concerned.In the manufacture of the organic electronic devices such as the organic el display, has and use evaporation source, make to have
The process to form a film on the evaporation materials such as machine material, metal electrode material vapor deposition to substrate.
The evaporation source used in vapor deposition process has as the function of the container of receiving evaporation material and for making
The temperature of evaporation material rises and evaporates and the heating function on the surface that makes evaporation material be attached to substrate.In the past, in order to improve
Heating function and carry out good film forming, proposition has and can be uniformly heated up evaporation source as evaporation material.
In patent document 1, by near the nozzle, preventing the nozzle temperature of evaporation source because of heat radiation heater configuration
And it reduces.
Patent document 1: Japanese Unexamined Patent Publication 2015-67847 bulletin
In conventional structure, the bearing method of the crucible of receiving evaporation material is not recorded.It is steamed to be uniformly heated up
Material is plated, the few as much as possible with the contact point of crucible of the mechanism of the crucible of material is steamed in preferably bearing receiving.Especially because
Radiant heat and crucible top that temperature is easily reduced can prevent the temperature of crucible by reducing the contact point with supporting device
It is reduced from contact point.
But in the case where being not fixed configuring crucible top, it is difficult to the position for the opening that evaporation material is passed through
It is micro-adjusted.Since the position of opening has an impact vapor deposition to by the uniformity of the film thickness of vapor deposition body, so control position
It is important.
Summary of the invention
The object of the present invention is to provide a kind of evaporation sources, in evaporation source, are able to suppress the drop of temperature
It is low, and carry out the position control for the opening that evaporation material is passed through.
A technical solution to solve project
For above-mentioned purpose, the present invention uses structure below.That is,
A kind of evaporation source, the evaporation source include
Container accommodates evaporation material, and has opening；
Heating element heats the container；And
Component, housing said container and the heating element are accommodated,
It is characterized in that,
The receiving component includes container supporting part, side surface part and positioning region,
The container supporting part supports at least part in the outside of the bottom of the container,
The positioning region is provided projectingly relative to the container in rodlike or plate from the side surface part.
The effect of invention
In accordance with the invention it is possible to inhibit the reduction of the temperature of evaporation source, and carry out that evaporation material passed through opens
The position control of mouth.
Detailed description of the invention
Fig. 1 is the schematical cross-sectional view of evaporation coating device.
Fig. 2 is the schematic diagram of the evaporation source of embodiment 1.
Fig. 3 is the schematic diagram of the evaporation source of embodiment 2.
Fig. 4 is the schematic diagram of the evaporation source of embodiment 3.
Fig. 5 is the schematic diagram of the evaporation source of embodiment 4.
Fig. 6 is the schematic diagram of the evaporation source of embodiment 5.
Fig. 7 is the explanatory diagram of organic EL display device.
Specific embodiment
Hereinafter, mode for carrying out the present invention is illustratively described in detail based on embodiment referring to attached drawing.But remember
It is loaded in size, material, shape and their relative configuration etc. of the constituent part of the mode of this implementation, it should be according to application invention
The structure of device, various conditions and be suitable for change.That is, the scope of the present invention is not limited to the mode of implementation below.
[embodiment 1]
[outline structure of vacuum plant]
Fig. 1 is the schematic diagram for indicating the structure of evaporation coating device (film formation device).Evaporation coating device has chamber 200.Chamber 200
Inside be maintained in reduced atmosphere.In the inside of vacuum chamber 200 generally provided with being kept by handled object setting table 210
Handled object, that is, substrate 10, mask 220 and evaporation source 240.Handled object setting table 210 is utilized for loading substrate 10
The pressing pieces such as the supporting members such as pawl and the fixture for pressing holding substrate are born to keep substrate.
Substrate 10 by conveying machine people (not shown) after being transported in vacuum chamber 200, by handled object setting table
210 keep, and when film forming is fixed to parallel with horizontal plane (X/Y plane).Mask 220 is the mask with patterns of openings, e.g.
Metal mask, the patterns of openings are corresponding with the Thinfilm pattern of predetermined pattern of formation on the substrate 10.10 quilt of substrate when film forming
It is positioned on mask 220.
In addition to this, can also have the coldplate for inhibiting the temperature of substrate 10 to rise in vacuum chamber 200 (not scheme
Show).In addition it is also possible to have the mechanism of the alignment for substrate 10 above vacuum chamber, such as X-direction or Y-direction
The driving parts such as actuator, the clamp mechanism actuator kept for substrate, the camera for shooting substrate 10 and mask 220
(not shown).
Evaporation source 240 has in inside receiving evaporation material 242 and has open container 244, for being held
The heater 246 (heating element) of the heating of device 244 and receiving component 248 for accepting container 244 and heater 246.?
In Fig. 1, heater 246 is set to the lateral surface of container 244, accommodates component 248 with the outside of lateral surface and bottom with container 244
Opposite mode is arranged, but can also be as described later configuration in addition to this.In addition to this it is possible to have baffle, film
Thick monitor etc. (not shown).About these each components, it is described in detail below.In addition, in order to equably form a film, it can also
To have the evaporation source driving mechanism 250 for keeping evaporation source 240 mobile.In addition, each structure of the evaporation source 240 in Fig. 1
It is illustrated at the shape, positional relationship, size of element than only.
As the material of container 244, there is known such as ceramics, metal, carbon materials etc., and but not limited to this, using
Good material in terms of the relationship of the heating temperature generated with the physical property of evaporation material 242, heater 246.As heater
246, there is known such as heater of the electric resistor heating types such as encapsulation heater, tinsel, but not limited to this, as long as having
The heating properties for evaporating evaporation material 242.In addition, the shape about heater, other than filiform as Fig. 1,
The arbitrary shape such as plate, netted can also be used.Component 248 is accommodated by heat preservation member (heat-barrier material) shape of the raising thermal efficiency
At, such as can be using metal etc., but not limited to this.
Evaporation coating device has control unit 270.Control unit 270 is evaporated the control of source device 240, such as heating is opened
The opening and closing opportunity of baffle controls in the case where beginning, the opportunity control terminated, temperature control, setting baffle, setting evaporation source drives
The mobile control etc. of evaporation source driving mechanism 250 in the case where mechanism 250.Alternatively, it is also possible to combining multiple control units structure
At control unit 270.Multiple control units are, for example, heating control unit, baffle controls component, evaporation source drive control component etc..
In addition, heating control section can also be arranged for each position in the case where controlling heater 246 with capable of being directed to position
Part.Control unit 270 can also also serve as the control of the mechanism other than the evaporation sources 240 such as conveying and the alignment control unit of substrate 10
Component processed.
Control unit 270 can be by having the computer such as processor, memory, storage device, I/O, UI to constitute.?
In this case, the function of control unit 270 is achieved by the program for being stored in memory or storage device by processor execution.
As computer, general personal computer both can be used, Embedded computer or PLC also can be used
(programmable logic controller).Or the circuit as ASIC, FPGA constitutes control unit 270
Function part or all.In addition, both it can be equipped with a control unit 270 for each evaporation coating device, it can also be by
One control unit 270 controls multiple evaporation coating devices.
Evaporation material 242 is housed in inside container 244, is ready to complete in mounting, alignment etc. of the substrate 10 to mask 220
When, make heater 246 start to act by the control of control unit 270, evaporation material 242 is heated.When temperature sufficiently improves, steam
Plating material 242 evaporates and is attached to the surface of substrate 10, forms film.By containing different types of vapor deposition in multiple containers
Material can also be deposited together.By being controlled while being formed by film by measurements such as film thickness monitors (not shown),
The film with desired thickness is formed on substrate.In order to form a film with uniform thickness, such as base can also be made on one side
The movement of evaporation source 240 is deposited on one side using evaporation source driving mechanism 250 in the rotation of plate 10.In addition, according to substrate
10 it is of different sizes, further preferably concurrently heat multiple evaporation sources.The shape of container 244 is arbitrary.In addition, the kind of evaporation source
Class be also possible to dotted evaporation source, linear evaporation source, planar evaporation source in any one.
It as described later, can by different types of evaporation material that forms a film on the substrate that film forming has certain evaporation material
Form cladding construction.In this case, the evaporation material in container can also be replaced or be changed to container itself and be accommodated with
The container of different types of evaporation material.In addition, multiple evaporation sources can both be arranged in vacuum chamber replaces one on one side
Side uses, and substrate 10 can also be moved out from current evaporation coating device and be moved to have and is accommodated with different types of evaporation material
Evaporation source another evaporation coating device.
[detailed construction of evaporation source]
Fig. 2 (a) is the schematic sectional view for the structure for illustrating the evaporation source 240 of present embodiment.Fig. 2 (b),
(c) be evaporation source 240 approximate vertical view.To structure identical with Fig. 1, identical appended drawing reference is marked, simplifies explanation.
The receiving component 248 of the present embodiment is made of side surface part 248a, positioning region 248c and container supporting part 248b.
Side surface part 248a is configured to opposite with the lateral surface of container 244.In addition, container 244 and side surface part 248a it
Between configure heater 246.Side surface part 248a configures to improve from heater 246 to the heating efficiency of container 244.
The bottom of container supporting part 248b supporting container 244.In Fig. 2 (a), container supporting part 248b is formed as convex,
The a part in the outside of the bottom of supporting container 244.According to the shape of a part in the outside of support foot, container 244 and appearance
The contact area of device supporting part 248b is reduced, and can reduce the reduction of the temperature of container 244.In addition, container supporting part 248b with
Side surface part 248a similarly, has the effect of improving from heater 246 to the heating efficiency of container 244.
Positioning region 248c is protrusively provided from side surface part 248a to the lateral surface direction of container 244.By the way that positioning region is arranged
248c can determine the position of container 244 in defined range.The permissible range of the position of container is under various conditions not
Together, but as an example, in the case where making diameter 1 of container, position determined by positioning region 248c, container is allowed
The diameter of range can determine to be 1.01~1.05.In addition, by setting positioning region 248c, with container supporting part 248b, side
Portion 248a is similarly, it may have improves from heater 246 to the effect of the heating efficiency of container 244.
The height of positioning region 248c is not particularly limited.But pass through the height phase for being arranged to be located at the opening of container 244
Same height also can accurately really even if the contact area in the outside of the bottom of container supporting part 248b and container 244 is reduced
The position of constant volume device 244.
As the shape example of positioning region 248c, indicate in Fig. 2 (b) from the plate-like example being protrusively provided of side surface part 248a
Son.It is indicated in Fig. 2 (c) from side surface part 248a to be in the rodlike example for being protrusively provided 4 positioning region 248c.Rodlike positioning region
The number of 248c is not limited to this.As the shape of positioning region 248c, this two are not limited to, multiple plates both can be set
Positioning region 248c can also make to be formed as plate with the interconnecting piece of side surface part 248a and form the front end towards container 244
It is rodlike.In addition, as plate, rodlike definition, in the case that in positioning region, 248c is contacted relative to container 244, contact point
Positioning region 248c as line contact is plate, and the positioning region 248c that contact point becomes point contact is rodlike.
Side surface part 248a, container supporting part 248b, the positioning region 248c of receiving component 248 are recited as one in Fig. 2 (a)
Body, but can also be constituted by connecting different mechanisms.It is preferred that emissivity is low and material resistant to high temperature, specifically enumerate molybdenum,
Tantalum etc..
Although can also be arranged relative to positioning region 248c in container 244 in rodlike in addition, not recorded in figure
Or plate-like protruding portion outstanding.
[embodiment 2]
In the present embodiment, it indicates that the structure of positioning region is arranged in container 244.To knot identical with other embodiments
Structure marks identical appended drawing reference, simplifies explanation.As shown in Fig. 3 (a), container 244 is by material storage portion 244a and positioning region
244b is constituted.Receiving component 248 is made of side surface part 248a and container supporting part 248b.
The direction of positioning region 244b from material storage portion 244a to the side surface part 248a of receiving component 248 of container 244 are prominent
It is arranged out.By the way that positioning region 244b is arranged, similarly to Example 1, the position of container 244 can be determined in defined model
It encloses.In addition, by setting positioning region 244b, similarly to Example 1, it may have improve adding from heater 246 to container 244
The effect of the thermal efficiency.
The height of positioning region 244b is not specifically limited.But pass through the height for being arranged to be located at the opening of container 244
Identical height also can be accurately even if the contact area in the outside of the bottom of container supporting part 248b and container 244 is reduced
Determine the position of container 244.
It indicates as the shape example of positioning region 244b, in Fig. 3 (b) to be protrusively provided from material storage portion 244a is plate-like
Example.Indicate positioning region 244b from material storage portion 244a in the rodlike example for being protrusively provided 4 in Fig. 3 (c).Rodlike
The number of positioning region 244b is not limited.As the shape of positioning region 244b, two examples are not limited to, both can be set multiple
The positioning region 244b of plate can also make to be formed as plate with the interconnecting piece of material storage portion 244a and make towards receiving component
248 front end is formed as rodlike.In addition, in positioning region, 244b connects with receiving component 248 as plate, rodlike definition
In the case where touching, the positioning region 244b that contact point becomes line contact is plate, and the positioning region 244b that contact point becomes point contact is
It is rodlike.
Accommodate component 248 side surface part 248a and container supporting part 248b and container 244 material storage portion 244a and
Positioning region 244b is recited as one respectively in Fig. 3 (a), but can also be constituted by connecting different mechanisms.
Though can also be in rodlike relative to positioning region 244b in the setting of receiving component 248 in addition, not recorded in figure
Or plate-like protruding portion outstanding.
[embodiment 3]
In the present embodiment, it indicates that positioning region is arranged in receiving component 248, protruding portion and cover is set in container 244
Structure.About structure identical with other embodiments, identical appended drawing reference is marked, simplifies explanation.As shown in figure 4, container
244 are made of material storage portion 244a and positioning region 244b.Accommodate component 248 by side surface part 248a, container supporting part 248b and
Protruding portion 248d is constituted.
Positioning region 244b is protrusively provided from the material storage portion 244a of container 244.Protruding portion 248d from receiving component 248
It is protrusively provided.Positioning region 244b is arranged towards protruding portion 248d.In addition, protruding portion 248d is arranged towards positioning region 244b.Such as
This, protruding portion 248d and positioning region 244b are arranged towards mutual direction, can be by container 244 in the same manner as embodiment 1,2
Position is determined in defined range.In addition, by setting positioning region 244b and protruding portion 248d, in the same manner as embodiment 1,2,
Have the effect of improving from heater 246 to the heating efficiency of container 244.
The steaming having for distilling or having gasified can also be set in the opening of container 244, in a manner of covering the opening
The cover 244c for the opening that plating material passes through.In this case, the positioning region 244b of the peripheral end of cover 244c and container 244
Similarly, the protruding portion 248d relative to receiving component 248 is protrusively provided.By the way that cover 244c is formed as such knot
Structure, playing can make the direction of dispersing of evaporation material with directive property, and can be to the opening set on cover 244c more accurately
It carries out positioning such effect.
In the present embodiment, be formed as that the structure of protruding portion 248d is arranged in receiving component 248, but can also be formed as
It is not provided with the structure of protruding portion 248d, and is formed as the peripheral end of positioning region 244b and cover 244c relative to receiving component
The structure that 248 side surface part 248a is protrusively provided.Effect similar to the above is also played in this case.
[embodiment 4]
The structure in the lower part setting tilt adjusting mechanism of receiving component 248 is indicated in the present embodiment.About with it is other
The identical structure of embodiment, mark identical appended drawing reference, simplify explanation.As shown in Fig. 5 (a), receiving component 248 is set
On the pedestal 320 being configured inside chamber 200.Pedestal 320 has threaded hole, the tilt adjusting mechanism being made of screw
322 are configured in the threaded hole.
Tilt adjusting mechanism 322 towards upper surface is configured from the lower surface of pedestal 320, by upper than pedestal 320
The screw front end of the high position configuration tilt adjusting mechanism 322 in surface, can make to configure the receiving component 248 on pedestal 320
Inclination.Pedestal 320 such as shown in Fig. 5 (b), has multiple tilt adjusting mechanisms 322.By adjusting these tilt adjusting mechanisms 322
To adjust the inclined direction of receiving component 248.Fig. 5 (b) is the approximate vertical view with the pedestal 320 of tilt adjusting mechanism 322.
In Fig. 5 (b), there are 6 tilt adjusting mechanisms 322, but not limited to this.
By the way that the tilt adjusting mechanism 322 of the present embodiment is arranged, determined even if being configured in container 244 by positioning region 248c
After in the permissible range of the position of the container of position, the configuration error be also capable of in the permissible range of the position of adjustment container.This
Outside, about tilt adjusting mechanism 322, the tilt adjusting mechanism based on screw is described in the present embodiment, but pedestal 320
Body can also be used as leaning device.
[embodiment 5]
Respective structure can be combined with each other as far as possible by the various embodiments described above.Fig. 6 is its an example.The shape in embodiment 5
As the structure of cover 244c and protruding portion 248d with embodiment 3 and the knot of the tilt adjusting mechanism 322 with embodiment 4
Structure.Also, in order to improve heating efficiency, the 1st shield 420 is set in the periphery of side surface part 248a, in material storage portion 244a
The 2nd shield 422 is also provided on the outside of bottom.Heater 246 can be divided into upper and lower part and be individually controlled top under
Each of portion can will be easier the cooling material storage portion top 244a and control at higher temperature.In the 1st shield 420
Outside, equipped with cooling piping 440, to prevent the heat of heater 246 from feeding through to outside.By being formed as above structure,
The reduction of the temperature of evaporation source can be further prevented, and carries out the position control for the opening that evaporation material is passed through.It is right
In structure identical with other embodiments, identical appended drawing reference is marked.In the present embodiment, the thing being not particularly illustrated
, it is same as the previously described embodiments.
[embodiment 6]
[concrete example of the manufacturing method of organic electronic device]
In the present embodiment, illustrate the manufacturer for having used the organic electronic device for the evaporation coating device for having evaporation source
An example of method.Hereinafter, enumerating example of the organic EL display device as organic electronic device, its structure and manufacturing method are illustrated.
Firstly, being illustrated to the organic EL display device to be manufactured.Fig. 7 (a) indicates the overall diagram of organic EL display device 60, Fig. 7
(b) cross-sectional configuration of 1 pixel is indicated.The evaporation source 240 (Fig. 1) that evaporation coating device as present embodiment has uses
The device that any embodiment in above-mentioned each embodiment is recorded.
As shown in Fig. 7 (a), the display area of organic EL display device 60 61 be arranged in a matrix it is multiple have it is multiple
The pixel 62 of light-emitting component.It is described in detail below, light-emitting component is respectively provided with the structure for having the organic layer clipped by a pair of electrodes
It makes.In addition, pixel said here, refers to the minimum unit that can show desired color in display area 61.Scheming
Organic EL display device in the case where, pass through mutually different the 1st luminous light-emitting component 62R of display, the 2nd light-emitting component
62G, the 3rd light-emitting component 62B combination and constitute pixel 62.Pixel 62 passes through red light-emitting component, green luminousing element mostly
Combination with blue light emitting device and constitute, but yellow emitting light elements, cyan light emitting elements and white luminous can also be passed through
The combination of element and constitute, more than at least one kind of color as long as be not particularly limited.
Fig. 7 (b) is the schematic partial cross-sectional view at the A-B line of Fig. 7 (a).Pixel 62 is as by the substrate 63 of vapor deposition body
Upper have an organic EL element, the organic EL element have the 1st electrode (anode) 64, hole transporting layer 65, luminescent layer 66R, 66G,
Either in 66B, electron supplying layer 67 and the 2nd electrode (cathode) 68.Hole transporting layer 65, luminescent layer 66R in them,
66G, 66B, electron supplying layer 67 are equivalent to organic layer.In addition, in the present embodiment, luminescent layer 66R is to issue red light
Organic EL layer, luminescent layer 66G are the organic EL layers for issuing green light, and luminescent layer 66B is the organic EL layer for issuing blue light.It shines
Layer 66R, 66G, 66B are respectively formed as (also sometimes referred to as organic with sending red light, green light, the light-emitting component of blue light
EL element) corresponding pattern.In addition, the 1st electrode 64 is formed separately for each light-emitting component.Hole transporting layer 65,
Electron supplying layer 67 and the 2nd electrode 68 both can by with a plurality of light-emitting elements 62R, 62G, 62B it is shared in a manner of be formed, can also be with
It is formed for each light-emitting component.In addition, the 1st electrode 64 and the 2nd electrode 68 are short-circuit due to foreign matter in order to prevent, the 1st
Insulating layer 69 is equipped between electrode 64.Moreover, because organic EL layer is deteriorated because of moisture and oxygen, so being equipped with for protecting organic EL
The protective layer 70 that element is influenced from moisture and oxygen.
Then, the example of the manufacturing method of organic EL display device is specifically described.
Firstly, preparing the base for being formed with circuit (not shown) and the 1st electrode 64 for driving organic EL display device
Plate 63.
Acrylic resin is formed by rotary coating on the substrate 63 for being formed with the 1st electrode 64, using photoetching process, with
Acrylic resin is formed into pattern in the mode that the part for being formed with the 1st electrode 64 forms opening and forms insulating layer 69.This is opened
Oral area is equivalent to the practical light emitting region to shine of light-emitting component.
The substrate 63 that pattern is formed with insulating layer 69 is moved in into the 1st evaporation coating device, base is kept by handled object setting table 210
Plate forms a film hole transporting layer 65 as the common layer on the 1st electrode 64 of display area.Hole transporting layer 65 passes through
Vacuum evaporation and form a film.Actually since hole transporting layer 65 is formed the size bigger than display area 61, so not needing
The mask of fine.Here, evaporation coating device used in the film forming of film forming, each layer below in this step have it is above-mentioned
The evaporation source that any embodiment in each embodiment is recorded.
Then, the substrate 63 until being formed with hole transporting layer 65 is moved in into the 2nd film formation device, by handled object setting table
210 keep.The alignment for carrying out substrate and mask issues red light in the configuration of substrate 63 by substrate-placing on mask
The part of element, film forming issue the luminescent layer 66R of red light.According to this example, mask can be made to be overlapped well with substrate, it can
Carry out high-precision film forming.
In the same manner as the film forming of luminescent layer 66R, is formed a film using the 3rd film formation device and issue the luminescent layer 66G of green light, and
It is formed a film using the 4th film formation device and issues the luminescent layer 66B of blue light.After the film forming of luminescent layer 66R, 66G, 66B are completed, utilize
Whole film forming electron supplying layer 67 of 5th film formation device in display area 61.Electron supplying layer 67 to the luminescent layer 66R of 3 colors,
66G, 66B are formed as common layer.
Substrate until being formed with electron supplying layer 67 is moved to sputtering unit, form a film the 2nd electrode 68, is moved to later
Plasma CVD equipment and the protective layer 70 that forms a film complete organic EL display device 60.
Film formation device is moved in until the film forming of protective layer 70 is completed from the substrate 63 that pattern is formed with to insulating layer 69, if
It is exposed in the atmosphere containing moisture and oxygen, then the luminescent layer being made of organic EL Material is possible to deteriorate because of moisture and oxygen.
Thus, in this example, carrying-in/carrying-out of the substrate between evaporation coating device carries out under vacuum atmosphere or non-active gas atmosphere.
The organic EL display device being achieved in that forms luminescent layer for each light-emitting component precision highland.Thus, only
To use above-mentioned manufacturing method, it will be able to inhibit because of caused by the positional shift of luminescent layer organic EL display device it is undesirable
It generates.Evaporation coating device according to the present embodiment is able to suppress the reduction of the temperature of evaporation source, and carries out evaporation material
Therefore the position control of the opening passed through is able to carry out good vapor deposition.
The explanation of appended drawing reference
240: evaporation source；244: container；246: heating element；248: receiving component；248a: side surface part；248b: hold
Device supporting part；248c: positioning region.
Claims (10)
1. a kind of evaporation source, which is included
Container accommodates evaporation material, and has opening；
Heating element heats the container；And
Component, housing said container and the heating element are accommodated,
It is characterized in that,
The receiving component includes container supporting part, side surface part and positioning region,
The container supporting part supports at least part in the outside of the bottom of the container,
The positioning region is provided projectingly relative to the container in rodlike or plate from the side surface part.
2. evaporation source according to claim 1, which is characterized in that
The positioning region is contacted relative to the container point contact or line.
3. evaporation source according to claim 1, which is characterized in that
Height identical with the height that the opening of the container is located at that the positioning region is arranged on.
4. evaporation source according to claim 1, which is characterized in that
The container has from the lateral surface of the container relative to the positioning region in rodlike or plate protruding portion outstanding.
5. a kind of evaporation source, which is included
Container accommodates evaporation material, and has opening；
Heating element heats the container；And
Component, housing said container and the heating element are accommodated,
It is characterized in that,
The receiving component includes container supporting part,
The container supporting part supports at least part in the outside of the bottom of the container,
The container includes material storage portion and positioning region,
From the lateral surface in the material storage portion, relative to the receiving component, in rodlike or plate, protrusion is set for the positioning region
It sets.
6. evaporation source according to claim 5, which is characterized in that
The positioning region is contacted relative to the receiving component point contact or line.
7. evaporation source according to claim 5, which is characterized in that
Height identical with the height that the opening of the container is located at that the positioning region is arranged on.
8. evaporation source according to claim 5, which is characterized in that
The receiving component has the side surface part from the receiving component in rodlike or plate prominent relative to the positioning region
Protruding portion.
9. evaporation source according to claim 5, which is characterized in that
The container includes the cover for covering the opening, which has opens for what the evaporation material for distilling or having gasified passed through
Mouthful,
The peripheral end of the cover is provided projectingly relative to the receiving component.
10. a kind of evaporation coating device, which is included
Chamber；And
It is configured in the handled object setting table and pedestal of the inside of the chamber, handled object setting table mounting is processed
Evaporation source is arranged in body, the pedestal,
It is characterized in that,
The evaporation source is evaporation source according to any one of claims 1 to 9,
The pedestal has the inclined tilt adjusting mechanism for adjusting the evaporation source.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-237438 | 2017-12-12 | ||
| JP2017237438A JP6595568B2 (en) | 2017-12-12 | 2017-12-12 | Evaporation source apparatus and vapor deposition apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109913818A true CN109913818A (en) | 2019-06-21 |
Family
ID=66959527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811070878.7A Pending CN109913818A (en) | 2017-12-12 | 2018-09-14 | Evaporation source and evaporation coating device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6595568B2 (en) |
| KR (3) | KR102357047B1 (en) |
| CN (1) | CN109913818A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110573647A (en) * | 2017-04-26 | 2019-12-13 | 株式会社爱发科 | Evaporation source and film forming apparatus |
| CN112575295A (en) * | 2019-09-27 | 2021-03-30 | 佳能特机株式会社 | Evaporation source apparatus, film forming method, and method for manufacturing electronic device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005298971A (en) * | 2004-03-18 | 2005-10-27 | Nippon Seiki Co Ltd | Mask for vapor deposition and vapor deposition method using the mask |
| JP2007186787A (en) * | 2005-12-14 | 2007-07-26 | Hitachi Displays Ltd | Vapor deposition pot, thin-film forming apparatus provided therewith and method for producing display device |
| CN102732838A (en) * | 2011-03-29 | 2012-10-17 | 株式会社日立高新技术 | Evaporation method and evaporation device |
| CN102732837A (en) * | 2011-03-31 | 2012-10-17 | 株式会社日立高新技术 | Evaporation device |
| CN103031520A (en) * | 2011-09-30 | 2013-04-10 | 株式会社日立高新技术 | Evaporation source and film forming device |
| JP2015067847A (en) * | 2013-09-27 | 2015-04-13 | 株式会社日立ハイテクファインシステムズ | Vacuum vapor deposition device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62169321A (en) * | 1986-01-21 | 1987-07-25 | Hitachi Ltd | Vapor source for vacuum evaporization |
| JP5674431B2 (en) * | 2010-11-17 | 2015-02-25 | 株式会社アルバック | Thin film forming equipment |
| JPWO2014174803A1 (en) * | 2013-04-22 | 2017-02-23 | 株式会社Ｊｏｌｅｄ | Method for manufacturing EL display device |
-
2017
- 2017-12-12 JP JP2017237438A patent/JP6595568B2/en active Active
-
2018
- 2018-07-25 KR KR1020180086862A patent/KR102357047B1/en active IP Right Grant
- 2018-09-14 CN CN201811070878.7A patent/CN109913818A/en active Pending
-
2022
- 2022-01-24 KR KR1020220010058A patent/KR102464807B1/en active IP Right Grant
- 2022-11-02 KR KR1020220144477A patent/KR102638573B1/en active IP Right Grant
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005298971A (en) * | 2004-03-18 | 2005-10-27 | Nippon Seiki Co Ltd | Mask for vapor deposition and vapor deposition method using the mask |
| JP2007186787A (en) * | 2005-12-14 | 2007-07-26 | Hitachi Displays Ltd | Vapor deposition pot, thin-film forming apparatus provided therewith and method for producing display device |
| CN102732838A (en) * | 2011-03-29 | 2012-10-17 | 株式会社日立高新技术 | Evaporation method and evaporation device |
| CN102732837A (en) * | 2011-03-31 | 2012-10-17 | 株式会社日立高新技术 | Evaporation device |
| CN103031520A (en) * | 2011-09-30 | 2013-04-10 | 株式会社日立高新技术 | Evaporation source and film forming device |
| JP2013076120A (en) * | 2011-09-30 | 2013-04-25 | Hitachi High-Technologies Corp | Evaporation source and film forming apparatus |
| JP2015067847A (en) * | 2013-09-27 | 2015-04-13 | 株式会社日立ハイテクファインシステムズ | Vacuum vapor deposition device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110573647A (en) * | 2017-04-26 | 2019-12-13 | 株式会社爱发科 | Evaporation source and film forming apparatus |
| CN112575295A (en) * | 2019-09-27 | 2021-03-30 | 佳能特机株式会社 | Evaporation source apparatus, film forming method, and method for manufacturing electronic device |
| CN112575295B (en) * | 2019-09-27 | 2023-04-07 | 佳能特机株式会社 | Evaporation source apparatus, film forming method, and method for manufacturing electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102638573B1 (en) | 2024-02-19 |
| KR20220017446A (en) | 2022-02-11 |
| KR102357047B1 (en) | 2022-01-27 |
| KR20220154060A (en) | 2022-11-21 |
| KR102464807B1 (en) | 2022-11-07 |
| KR20190070239A (en) | 2019-06-20 |
| JP6595568B2 (en) | 2019-10-23 |
| JP2019104960A (en) | 2019-06-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109385605A (en) | Evaporation source and its control method | |
| KR102638573B1 (en) | Evaporation source device and vapor deposition apparatus | |
| US7922820B2 (en) | Heating crucible and deposition apparatus including the same | |
| CN107815649B (en) | Evaporation coating device and evaporation coating method | |
| CN108517506A (en) | The manufacturing method of substrate-placing device and method, film formation device and method, alignment device and method and electronic device | |
| JP2019218623A (en) | Film deposition apparatus, film deposition method and method of manufacturing electronic device | |
| JP4478113B2 (en) | Heating vessel support and vapor deposition apparatus equipped with the same | |
| KR20150113742A (en) | Evaporation source and deposition apparatus including the same | |
| JP7241604B2 (en) | Heating device, evaporation source device, film forming device, film forming method, and electronic device manufacturing method | |
| JP7088891B2 (en) | Evaporation source equipment and vapor deposition equipment | |
| JP7241603B2 (en) | Heating device, evaporation source device, film forming device, film forming method, and electronic device manufacturing method | |
| KR101416977B1 (en) | Evaporation source and Apparatus for deposition having the same | |
| JP7202971B2 (en) | Evaporation Source Apparatus, Film Forming Apparatus, Film Forming Method, and Electronic Device Manufacturing Method | |
| KR100786844B1 (en) | Apparatus for manufacturing an organic light emitting display | |
| KR100761084B1 (en) | evaporating source and vacuum evaporating apparatus using the same | |
| CN209508394U (en) | The manufacturing device of evaporation source, film formation device and electronic equipment | |
| JP7162639B2 (en) | Evaporation source device, vapor deposition device, and control method for evaporation source device | |
| KR102150453B1 (en) | Evaporation source for deposition device | |
| KR20180066427A (en) | Crucible for evaporation source | |
| KR100669803B1 (en) | Apparatus for feeding deposition material and deposition apparatus therewith | |
| KR20080082261A (en) | Apparatus for depositing organic film | |
| KR100640931B1 (en) | Device for Holding Substrate for Organic Electroluminescent Device | |
| KR20210120321A (en) | Box type linear evaporation source | |
| JP2008115410A (en) | Vapor deposition apparatus | |
| TW200901534A (en) | Apparatus for depositing organic thin film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |