CN109913808A - The metal mask version and production method for preventing evaporated metal layer from falling off - Google Patents
The metal mask version and production method for preventing evaporated metal layer from falling off Download PDFInfo
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- CN109913808A CN109913808A CN201910303005.4A CN201910303005A CN109913808A CN 109913808 A CN109913808 A CN 109913808A CN 201910303005 A CN201910303005 A CN 201910303005A CN 109913808 A CN109913808 A CN 109913808A
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- Prior art keywords
- invar alloy
- ink
- metal mask
- mask version
- product
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- 239000002184 metal Substances 0.000 title claims abstract description 64
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 64
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 229910001374 Invar Inorganic materials 0.000 claims abstract description 67
- 239000000956 alloy Substances 0.000 claims abstract description 67
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 55
- 238000005530 etching Methods 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 238000004140 cleaning Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 5
- 238000005286 illumination Methods 0.000 claims description 4
- 238000007740 vapor deposition Methods 0.000 abstract description 5
- 239000007769 metal material Substances 0.000 abstract description 4
- 238000002360 preparation method Methods 0.000 abstract description 3
- 230000002950 deficient Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
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- ing And Chemical Polishing (AREA)
- Printing Plates And Materials Therefor (AREA)
Abstract
The invention discloses a kind of metal mask versions and preparation method thereof for preventing evaporated metal layer from falling off, the present invention is in production, first a face of INVAR alloy is etched, it is that whole face etching becomes rough surface by a face of INVAR alloy, then opening is made again, therefore rough region and opening are limited without distance.Metal mask version is the laminated structure with hollow grid, the wherein all rough surfaces of one side of metal mask version.Binding force when to improve vapor deposition between metal material and metal mask version prevents metal material when vapor deposition from falling off, reduces the fraction defective of product.
Description
Technical field
The present invention relates to a kind of metal mask versions and preparation method thereof for preventing evaporated metal layer from falling off, and belong to OLED technology
Field.
Background technique
OLED industry vapor deposition uses metal mask plate (mask), as shown in Figure 1, at evaporated metal layer (cathode layer)
In the process, because of doping lithium fluoride (LiF) in magnesium silver alloy (Mg/Ag), material 21 and 1 binding force of metal mask plate are inadequate, metal
Layer 22 be easy to cause obscission.It, can be to metal in order to guarantee to be vaporized on the adhesive force of the magnesium silver alloy on metal mask plate
Mask plate lower surface increases roughness.If directly increasing roughness at the finished metal mask plate back side, in order to avoid metal is covered
The opening of film version is damaged, and usually by rough region boundary, there are at a distance from 0.3 ~ 1mm with opening.
Summary of the invention
The purpose of the present invention is to provide a kind of metal mask version and preparation method thereof for preventing evaporated metal layer from falling off, with
Solve the technical problem that the metal mask version of the prior art cannot make its entire back side completely coarse.
The metal mask version production method that the present invention prevents evaporated metal layer from falling off adopts the following technical scheme that and prevents from being deposited
The metal mask version production method of metal liftoff comprising following steps: (1) it cleans: using cleaning equipment to sheet INVAR
Alloy material is cleaned, and INVAR alloy surface greasy dirt is removed;(2) ink-jet: ink-jet apparatus uniformly sprinkling respectively by ink is used
To two surfaces up and down of the INVAR alloy cleaned up, ink is respectively formed oil after two dry tack frees of INVAR alloy
Layer of ink;(3) single side exposes: UV illumination being mapped to INVAR alloy wherein on the ink layer of one side using exposure machine, the face ink layer
It is all irradiated by UV light and photopolymerization reaction occurs;(4) develop: developing solution being sprayed onto previous step single side using developing machine and is exposed
On product afterwards, the face ink layer not irradiated by UV light is reacted with developer solution, exposes INVAR alloy;(5) it etches: using erosion
Quarter, etching solution was sprayed on the product after development by machine, and one side and the etching that INVAR alloy is exposed in the product of previous step are molten
Liquid reaction, forms rough surface;It is not contacted, is not reacted with etching solution by the one side that ink layer covers;(6) it moves back film: using
Moving back film machine will move back on the product after coating solution is sprayed onto etching, moves back coating solution and reacts with remaining ink layer in previous step product,
Ink layer is dissolved into solution, and INVAR alloy material is completely exposed to obtain the coarse sheet INVAR alloy of single side;(7) it cleans:
It is cleaned using the cleaning equipment INVAR alloy material coarse to previous step single side, removes INVAR alloy surface greasy dirt;(8)
Ink-jet: ink is uniformly sprayed onto the upper and lower surface for the INVAR alloy that previous step cleans up, ink respectively using ink-jet apparatus
Ink layer is respectively formed after the upper and lower surface of INVAR alloy is dry;(9) UV light double-sided exposure: is passed through into light using exposure machine
Cover is irradiated on the ink layer on two surfaces of INVAR alloy, and light shield is light-blocking to the portion of INVAR alloy, is irradiated by UV light
Ink occur photopolymerization reaction, photopolymerization reaction is not occurred by the ink that UV light irradiates;(10) develop: will using developing machine
Developing solution is sprayed on the product after previous step exposure, is not reacted by the ink at ink layer that UV light irradiates with developer solution,
It is developed fall, expose INVAR alloy;(11) it forms the grid of hollow out: previous step exposing INVAR alloy being removed, thus producing
The grid of hollow out is formed on product;(12) it moves back film: being sprayed onto the production that previous step forms hollow grid for coating solution is moved back using film machine is moved back
On product, moves back coating solution and reacted with ink layer remaining on product, ink layer is dissolved into solution, and INVAR alloy material reveals completely
Metal mask version with grid and coarse on one side is formed out.
In step (5), INVAR alloy surface is etched away 5 ~ 10 μm.
After the etching process of step (5), the roughness ratio of INVAR alloy rough surface is not etched preceding increasing
It is 0.25 ~ 1 μm big.
In step (11), grid is formed using engraving method, specifically: etching solution being sprayed onto development using etching machine
On product afterwards, the INVAR alloy of exposing is reacted with etching solution, forms the grid of hollow out, by ink layer covering part not with
Etching solution contact, does not react.
The metal mask version that the present invention prevents evaporated metal layer from falling off adopt the following technical scheme that metal mask version be with
The laminated structure of hollow grid, the wherein all rough surfaces of one side of metal mask version.
The roughness in another face of roughness ratio of metal mask version rough surface is 0.25 ~ 1 μm big.
The beneficial effects of the present invention are: the present invention is first etched a face of INVAR alloy in production,
The face is set to become rough surface, so that binding force when vapor deposition between metal material and metal mask version is improved, when preventing vapor deposition
Metal material falls off, and reduces the fraction defective of product;In addition, a face of INVAR alloy is that whole face etching becomes rough surface, so
Make opening again afterwards, therefore rough region and opening are limited without distance.The present invention thoroughly solves the metal mask version of the prior art not
The technical problem that its entire back side can be made completely coarse.
Preferably, grid is formed using engraving method, becomes the section at metal mask version hollow grid without flash, without heat
Shape.
Detailed description of the invention
Fig. 1 is the schematic diagram of metal mask version vapor deposition process;
Fig. 2 is the metal mask version manufacturing process schematic diagram of an embodiment of the present invention;
Fig. 3 is the schematic diagram and its enlarged section of the metal mask version rough surface of an embodiment of the present invention.
In figure, 1- metal mask version, 11- grid, 12- rough surface, 21- material, 22- metal layer.
Specific embodiment
The present invention is described in detail with specific embodiment below in conjunction with the accompanying drawings.
The process such as Fig. 2 institute for the metal mask version production method that an embodiment of the present invention prevents evaporated metal layer from falling off
Show, the production method of the present embodiment is the following steps are included: (1) is cleaned: sheet INVAR alloy material being carried out using cleaning equipment
Cleaning removes INVAR alloy surface greasy dirt;(2) ink-jet: using ink-jet apparatus ink is uniformly sprayed onto respectively and is cleaned up
Two surfaces up and down of INVAR alloy, ink are respectively formed ink layer after two dry tack frees of INVAR alloy;(3) single side
Exposure: UV illumination is mapped to INVAR alloy wherein on the ink layer of one side using exposure machine, the face ink layer is all by UV illumination
Penetrate generation photopolymerization reaction;(4) develop: on the product that developing solution is sprayed onto after the exposure of previous step single side using developing machine,
The face ink layer not irradiated by UV light is reacted with developer solution, exposes INVAR alloy;(5) it etches: will be etched using etching machine molten
Liquid is sprayed on the product after development, and the one side that INVAR alloy is exposed in the product of previous step is reacted with etching solution, is formed thick
Rough surface;It is not contacted, is not reacted with etching solution by the one side that ink layer covers;(6) move back film: using film machine is moved back, will to move back film molten
Liquid is sprayed on the product after etching, is moved back coating solution and is reacted with remaining ink layer in previous step product, ink layer is dissolved into molten
In liquid, INVAR alloy material is completely exposed to obtain the coarse sheet INVAR alloy of single side;(7) it cleans: using cleaning equipment pair
The coarse INVAR alloy material of previous step single side is cleaned, and INVAR alloy surface greasy dirt is removed;(8) ink-jet: ink-jet is used
Ink is uniformly sprayed onto the upper and lower surface for the INVAR alloy that previous step cleans up by equipment respectively, and ink is in INVAR alloy
Ink layer is respectively formed after upper and lower surface is dry;(9) UV light double-sided exposure: is irradiated to INVAR by light shield using exposure machine
On the ink layer on two surfaces of alloy, light shield is light-blocking to the portion of INVAR alloy, and light occurs by the ink that UV light irradiates and gathers
Reaction is closed, photopolymerization reaction is not occurred by the ink that UV light irradiates;(10) develop: being sprayed onto developing solution using developing machine
On product after previous step exposure, do not reacted by the ink at ink layer that UV light irradiates with developer solution, it is developed fall, exposing
INVAR alloy;(11) it forms the grid of hollow out: previous step exposing INVAR alloy being removed, to form hollow out on product
Grid;(12) move back film: using move back film machine will move back coating solution be sprayed onto previous step formed hollow grid product on, move back coating solution with
Remaining ink layer reaction, ink layer are dissolved into solution on product, and INVAR alloy material is completely exposed to be formed with grid
And the metal mask version that one side is coarse.
In step (5), INVAR alloy surface is etched away 5 ~ 10 μm.
After the etching process of step (5), the roughness ratio of INVAR alloy rough surface is not etched preceding increasing
It is 0.25 ~ 1 μm big.
In step (11), grid is formed using engraving method, specifically: etching solution being sprayed onto development using etching machine
On product afterwards, the INVAR alloy of exposing is reacted with etching solution, forms the grid of hollow out, by ink layer covering part not with
Etching solution contact, does not react.
The embodiment of the metal mask version that the present invention prevents evaporated metal layer from falling off as shown in figure 3, the present embodiment metal
Mask plate 1 is the laminated structure with hollow grid 11, the wherein all rough surfaces 12 of one side of metal mask version 1.Metal is covered
The roughness in another face of roughness ratio of film version rough surface 12 is 0.25 ~ 1 μm big.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention, this field is common
All deformations that technical staff directly can export or associate from present disclosure, are considered as protection of the invention
Range.
Claims (6)
1. the metal mask version production method for preventing evaporated metal layer from falling off, which is characterized in that it is the following steps are included: (1) is clear
It washes: sheet INVAR alloy material being cleaned using cleaning equipment, remove INVAR alloy surface greasy dirt;(2) it ink-jet: uses
Ink is uniformly sprayed onto two surfaces up and down of the INVAR alloy cleaned up by ink-jet apparatus respectively, and ink is in INVAR alloy
Two dry tack frees after be respectively formed ink layer;(3) single side expose: using exposure machine by UV illumination be mapped to INVAR alloy its
On the ink layer of middle one side, which, which is all irradiated by UV light, occurs photopolymerization reaction;(4) develop: will using developing machine
Developing solution is sprayed on the product after the exposure of previous step single side, and the face ink layer not irradiated by UV light is reacted with developer solution,
Expose INVAR alloy;(5) it etches: on the product that etching solution is sprayed onto after development using etching machine, in the product of previous step
The one side for exposing INVAR alloy is reacted with etching solution, forms rough surface;It is not connect with etching solution by the one side that ink layer covers
Touching, does not react;(6) it moves back film: will be moved back on the product after coating solution is sprayed onto etching using film machine is moved back, move back coating solution and upper one
It walks the reaction of remaining ink layer, ink layer in product to be dissolved into solution, INVAR alloy material is completely exposed to obtain single side coarse
Sheet INVAR alloy;(7) it cleans: being cleaned using the cleaning equipment INVAR alloy material coarse to previous step single side,
Remove INVAR alloy surface greasy dirt;(8) ink-jet: using ink-jet apparatus ink is uniformly sprayed onto previous step respectively and cleaned up
INVAR alloy upper and lower surface, ink is respectively formed ink layer after the upper and lower surface of INVAR alloy is dry;(9) two-sided exposure
Light: UV light is irradiated on the ink layer on two surfaces of INVAR alloy by light shield using exposure machine, light shield is to INVAR alloy
Portion it is light-blocking, photopolymerization reaction occurs for the ink irradiated by UV light, and photopolymerization does not occur by the ink that UV light irradiates
Reaction;(10) develop: developing solution being sprayed on the product after previous step exposes using developing machine, the oil not irradiated by UV light
Ink at layer of ink is reacted with developer solution, it is developed fall, expose INVAR alloy;(11) it forms the grid of hollow out: previous step is revealed
INVAR alloy removes out, to form the grid of hollow out on product;(12) it moves back film: coating solution sprinkling will be moved back using film machine is moved back
It is formed to previous step on the product of hollow grid, moves back coating solution and reacted with ink layer remaining on product, ink layer is dissolved into molten
In liquid, INVAR alloy material is completely exposed to form metal mask version with grid and coarse on one side.
2. the metal mask version production method according to claim 1 for preventing evaporated metal layer from falling off, it is characterised in that: step
Suddenly in (5), INVAR alloy surface is etched away 5 ~ 10 μm.
3. the metal mask version production method according to claim 1 for preventing evaporated metal layer from falling off, it is characterised in that: warp
After crossing the etching process of step (5), the roughness ratio of INVAR alloy rough surface increases 0.25 ~ 1 μm before not being etched.
4. the metal mask version production method according to claim 1 for preventing evaporated metal layer from falling off, it is characterised in that: step
Suddenly in (11), grid is formed using engraving method, specifically: etching solution being sprayed onto the product after development using etching machine
On, the INVAR alloy of exposing is reacted with etching solution, forms the grid of hollow out, is not connect with etching solution by ink layer covering part
Touching, does not react.
5. producing the metal mask version that metal when preventing evaporated metal layer falls off using method of claim 1 method, metal mask
Version is the laminated structure with hollow grid, it is characterised in that: the wherein all rough surfaces of one side of metal mask version.
6. metal mask version according to claim 5, it is characterised in that: the roughness ratio of metal mask version rough surface is another
The roughness in a face is 0.25 ~ 1 μm big.
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CN201910303005.4A CN109913808A (en) | 2019-04-16 | 2019-04-16 | The metal mask version and production method for preventing evaporated metal layer from falling off |
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CN201910303005.4A CN109913808A (en) | 2019-04-16 | 2019-04-16 | The metal mask version and production method for preventing evaporated metal layer from falling off |
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CN201910303005.4A Pending CN109913808A (en) | 2019-04-16 | 2019-04-16 | The metal mask version and production method for preventing evaporated metal layer from falling off |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113943918A (en) * | 2021-10-15 | 2022-01-18 | 山东奥莱电子科技有限公司 | Metal mask plate structure and preparation method thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1448532A (en) * | 2002-03-01 | 2003-10-15 | 三洋电机株式会社 | Evaporation method and manufacturing method of display device |
CN103205701A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A vapor deposition mask plate and a production method thereof |
-
2019
- 2019-04-16 CN CN201910303005.4A patent/CN109913808A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1448532A (en) * | 2002-03-01 | 2003-10-15 | 三洋电机株式会社 | Evaporation method and manufacturing method of display device |
CN103205701A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A vapor deposition mask plate and a production method thereof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113943918A (en) * | 2021-10-15 | 2022-01-18 | 山东奥莱电子科技有限公司 | Metal mask plate structure and preparation method thereof |
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Application publication date: 20190621 |