CN109904174B - 一种显示面板的电路背板及其制备方法和显示面板 - Google Patents
一种显示面板的电路背板及其制备方法和显示面板 Download PDFInfo
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- CN109904174B CN109904174B CN201910149604.5A CN201910149604A CN109904174B CN 109904174 B CN109904174 B CN 109904174B CN 201910149604 A CN201910149604 A CN 201910149604A CN 109904174 B CN109904174 B CN 109904174B
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Abstract
本发明公开了一种显示面板的电路背板及其制备方法和显示面板,用于解决现有技术中显示面板的电路背板和LED的绑定过程中容易出现短路的问题。其中的显示面板的电路背板包括衬底基板,所述衬底基板上具有多个电路区域,每个所述电路区域包括:位于所述衬底基板上的阴极焊接电极、阳极焊接电极和阻流台;其中,所述阻流台位于所述阴极焊接电极和所述阳极焊接电极之间,所述阻流台在所述电路背板的厚度方向的高度高于所述阴极焊接电极和阳极焊接电极的高度。
Description
技术领域
本发明涉及显示面板技术领域,特别涉及一种显示面板的电路背板及其制备方法和显示面板。
背景技术
微发光二极管(Light-Emitting Diode,LED)是将LED结构设计进行薄膜化、微小化、阵列化,后将微LED批量式转移至电路背板上,再制作保护层与电极,对电路背板进行封装,相较于现有的OLED技术亮度更高、发光效率更好、但功耗更低。
微LED的制作过程中,电路背板制作完成后需要与LED进行绑定,目前电路背板与LED的绑定通过回流焊接实现,焊接所用粘结剂为银浆。由于银胶的流动性较好,焊接过程中银胶可能会流动到阴极和阳极之间并连通阴极和阳极,导致出现短路。
发明内容
本申请实施例提供一种显示面板的电路背板及其制备方法和显示面板,用于解决现有技术中显示面板的电路背板和LED的绑定过程中容易出现短路的问题。
第一方面,本申请实施例提供了一种显示面板的电路背板,该显示面板的电路背板包括衬底基板,所述衬底基板上具有多个电路区域,每个所述电路区域包括:位于所述衬底基板上的阴极焊接电极、阳极焊接电极和阻流台;其中,
所述阻流台位于所述阴极焊接电极和所述阳极焊接电极之间,所述阻流台在所述电路背板的厚度方向的高度高于所述阴极焊接电极和所述阳极焊接电极的高度。
本申请实施例中,电路背板上的阴极焊接电极和阳极焊接电极之间具有阻流台,且阻流台在电路背板的厚度方向的高度高于阴极焊接电极和阳极焊接电极的高度,从而在制作显示面板时,阻流台可以阻止焊接微LED发光器件的阳极和阴极时采用的银浆的流动,以防止因为银浆的流动导致阳极和阴极连通发生短路。
一种可能的实施方式中,每个所述电路区域还包括:位于所述衬底基板之上的驱动电路,位于所述驱动电路与所述阴极焊接电极和所述阳极焊接电极所在层之间的平坦化层,位于所述阴极焊接电极和所述阳极焊接电极所在层之上的电极保护层;
所述阻流台包括所述平坦化层在所述阴极焊接电极和所述阳极焊接电极之间的凸出区域,以及所述电极保护层位于所述凸出区域之上的区域。
本申请实施中,阻流台可以由衬底基板上的平坦化层和电极保护层形成,不需要另外设置,尽量简化制作工艺。
一种可能的实施方式中,所述凸出区域具有分别面向所述阴极焊接电极和所述阳极焊接电极设置的坡面。
本申请实施例中,阻流台分别面向阴极焊接电极和阳极焊接电极设置的坡面,以尽量增加阻止银浆流动的阻力。
一种可能的实施方式中,所述坡面与所述衬底基板之间的夹角范围为[50°,80°]。
本申请实施例中,坡面与衬底基板之间的夹角位于[50°,80°],在保证阻止银浆流动的阻力尽量大的同时,限制阻流台沿衬底基板厚度方向的高度,以便于焊接微LED发光器件。
一种可能的实施方式中,所述电极保护层位于所述坡面之上的区域具有多个阻流槽。
本申请实施例中,电极保护层位于坡面之上的区域可以设置多个阻流槽,进一步阻止银浆的流动。
一种可能的实施方式中,每个所述阻流槽在所述衬底基板上的正投影为圆弧形,且在面向所述阴极焊接电极的坡面上设置的阻流槽的圆弧形圆心指向所述阴极焊接电极,在面向所述阳极焊接电极的坡面上设置的阻流槽的圆弧形圆心指向所述阳极焊接电极。
本申请实施例中,阻流槽可以是在电极保护层面向阴极焊接电极和阳极焊接电极的位置处设置的凹槽,形成包围状圆弧,以阻止银浆的流动。
第二方面,本申请实施例提供了一种显示面板的电路背板的制备方法,该制备方法包括:
在衬底基板上的各电路区域形成驱动电路;
在所述驱动电路上采用半掩膜工艺形成平坦化层;
在所述平坦化层上形成阴极焊接电极和阳极焊接电极;
在所述阴极焊接电极和阳极焊接电极的所在层之上形成电极保护层;其中,
所述平坦化层在所述阴极焊接电极和所述阳极焊接电极之间具有凸出区域,所述凸出区域与所述电极保护层位于所述凸出区域之上的区域构成阻流台。
一种可能的实施方式中,在所述阴极焊接电极和阳极焊接电极的所在层之上形成电极保护层,具体包括:
所述凸出区域具有分别面向所述阴极焊接电极和所述阳极焊接电极设置的坡面;在所述电极保护层位于所述坡面之上的区域形成多个阻流槽。
第三方面,本申请实施例提供了一种显示面板,该显示面板包括如第一方面所述的电路背板以及多个微LED发光器件,其中,各所述微LED发光器件的阳极和阴极分别通过银浆固定于所述电路背板中对应的各电路区域中的阳极焊接电极和阴极焊接电极。
附图说明
图1为本申请实施例提供的显示面板的电路背板的一种结构示意图;
图2为本申请实施例提供的显示面板的电路背板的一种结构示意图;
图3为本申请实施例提供的显示面板的电路背板的一种结构示意图;
图4为本申请实施例提供的显示面板的电路背板的一种结构示意图;
图5为本申请实施例提供的显示面板的电路背板的一种结构示意图;
图6为本申请实施例提供的显示面板的电路背板的一种结构示意图;
图7为本申请实施例提供的显示面板的电路背板的制备方法的流程示意图。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚明白,下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。应当理解,下面所描述的优选实施例仅用于说明和解释本发明,并不用于限定本发明。并且在不冲突的情况下,本申请中的实施例及实施例中的特征可以相互组合。需要注意的是,附图中各层厚度和形状不反映真实比例,目的只是示意说明本发明内容。并且自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。
微LED整体制作过程中,微LED芯片焊接到电路背板,例如薄膜晶体管(Thin FilmTransistor,TFT)背板是一个重要环节。目前将微LED芯片焊接到TFT背板通过回流焊接实现,焊接所用粘结剂为银胶。由于银胶的流动性较好,焊接过程中银浆会流动到阴极和阳极之间,可能会连通阴极和阳极,导致出现短路。
鉴于此,本申请实施例提供了一种显示面板的电路背板,可以阻止银浆的流动,避免连通微LED的阴极和阳极。
下面结合附图,对本申请实施例提供的显示面板的电路背板及其制备方法和显示面板的具体实施方式进行详细地说明。附图中各膜层的厚度和形状不反映真实比例,目的只是示意说明本发明内容。
本申请实施例提供了一种显示面板的电路背板,请参见图1,图1为电路基板沿厚度方向的截面示意图。本申请实施例提供的电路背板包括衬底基板10,该衬底基板10上具有多个电路区域,多个电路区域中的每个电路区域包括位于衬底基板10上的阴极焊接电极12、阳极焊接电极11和阻流台13,图1以一个电路区域为例。
其中,每个电路区域的阻流台13位于阴极焊接电极12和阳极焊接电极11之间,阻流台13在电路背板的厚度方向的高度高于阴极焊接电极12和阳极焊接电极11的高度,从而可以阻止将微LED发光器件焊接在电路背板的过程中,焊接剂即银浆在阳极和阴极之间流动,以防止因为银浆的流动导致阳极和阴极连通发生短路。可能的实施方式中,阻流台13位于阴极焊接电极12和阳极焊接电极11的中间位置,以使得对分别从阴极焊接电极12和阳极焊接电极11流过来的银浆的阻流效果尽量相同。阻流台13在电路背板的厚度方向的高度位于[1um,2um]之间,低于微LED发光器件的阳极和阴极的长度,既可以阻止银浆的流动,又不影响微LED发光器件的焊接。
具体地,请参见图2,每个电路区域还包括位于衬底基板10之上的驱动电路20,位于驱动电路20与阴极焊接电极12和阳极焊接电极11所在层之间的平坦化(PLN)层,位于阴极焊接电极12和阳极焊接电极11所在层之上的电极保护层106,例如PVX层,当然每个电路区域还包括显示面板的电路背板其他必备的膜层,例如位于衬底基板10上依次层叠的缓存层101、第一绝缘层102、第二绝缘层103和介质层104,其中,介质层104上具有源极203和漏极204,第一绝缘层102和第二绝缘层103分别设置有栅极(201/202),其中,驱动电路20位于缓存层101远离衬底基板10一侧。
一种可能的实施方式中,本申请实施例中的阻流台13包括平坦化层105在阴极焊接电极12和阳极焊接电极11之间的凸出区域,和电极保护层106位于凸出区域之上的区域,这样制作平坦化层105时,就可以形成阻流台13,不需要设置另外单独设置阻流台13,以尽量简化制作工艺。
请继续参见图2,阻流台13也就是凸出区域具有分别面向阴极焊接电极12和阳极焊接电极11设置的坡面,使得阻流台13在电路背板的厚度方向的截面形状包括梯形,以尽量增加阻止银浆流动的阻力。
可能的实施方式中,坡面与衬底基板10之间的夹角α较小,那么阻流台13在电路背板的厚度方向的高度较低,阻止银浆流动的效果较差,而如果α较大,阻流台13在电路背板的厚度方向的高度较高,可能高于微LED发光器件的阴极和阳极的高度,增加了焊接微LED发光器件的难度。因此本申请实施例中,坡面与衬底基板10之间的夹角α位于[50°,80°]范围内,在保证阻止银浆流动的阻力尽量大的同时,限制阻流台13沿衬底基板10厚度方向的高度,以便于焊接微LED发光器件。
为了进一步增强对银浆流动的阻止效果,本申请实施例在位于坡面之上的区域的电极保护层106上设置了多个阻流槽30,如图3所示。
具体地,请参见图4,可能的实施方式中,多个阻流槽30中的每个阻流槽30在衬底基板10上的正投影为圆弧形,且在面向阴极焊接电极12的坡面上设置的阻流槽30的圆弧形圆心指向阴极焊接电极12,在面向阳极焊接电极11的坡面上设置的阻流槽30的圆弧形圆心指向阳极焊接电极11。图4中,虚线分别为阻流台远离衬底基板的顶部和靠近衬底基板的底部在衬底基板上的投影。
本申请实施例中,阻流槽30可以是在电极保护层106面向阴极焊接电极12和阳极焊接电极11的位置处设置的凹槽,形成包围状圆弧,以阻止银浆的流动,其原理是包围状圆弧即迎流方向为反向弧形,与液体接触后可以阻止液体的流动。具体地,请参见图5,图5为液体相对阻流槽30的运动示意图,液体在流动过程中,遇到阻流槽30的圆弧后,阻流槽30将产生较大阻力,因阻流槽30阻力的存在消耗液体内部流动惯性力,减缓流动,所以本申请实施例中阻流槽30的增设可以提高对银浆的流动的阻止效果。图5中箭头方向表示液体流动方向。
进一步地,请参见图6,图6为液体相对阻流槽30的另一运动示意图,液体与阻流槽30的接触角多为直接接触,此时液体流动消耗的流动力,阻流槽30提高了对液体流动的阻力,进一步消耗了液体本身的流动力。图6中箭头方向表示液体流动方向。
一种可能的实施方式中,电极保护层106的厚度范围为相较于现有技术中厚度是左右的电极保护层106更加厚,可以是左右,这样阻流槽30内陷的深度就较深,提高了对银浆流动的阻止效果。可选的,阻流槽30的开槽尺寸可以位于2-10μm,以尽量消耗银浆流动的流动力。
本申请上述实施例中,以每个电路区域包括一个阻流台13为例,实际中,阴极焊接电极12和阳极焊接电极11之间的距离约为80um,阻流台13远离衬底基板10一侧的顶部尺寸约为5-10um,靠近衬底基板10一侧的底部尺寸约为20um左右,可选的,阴极焊接电极12和阳极焊接电极11之间可以设置多个阻流台13,以尽量提高对银浆流动的阻止效果。
请参见图7,基于同一发明思想,本申请实施例还提供了一种显示面板的电路背板的制备方法,该制备方法的具体流程描述如下:
S701、在衬底基板10上的各电路区域形成驱动电路;
S702、在驱动电路上采用半掩膜工艺形成平坦化层;
S703、在平坦化层上形成阴极焊接电极12和阳极焊接电极11;
S704、在阴极焊接电极12和阳极焊接电极11的所在层之上形成电极保护层;其中,平坦化层在阴极焊接电极12和阳极焊接电极11之间具有凸出区域,凸出区域与电极保护层位于凸出区域之上的区域构成阻流台13。
本申请实施例在制备显示面板的电路背板时,首先按照正常工艺在衬底基板10上制备缓存层、驱动电路、第一绝缘层、第二绝缘层、栅极,以及源极和漏极,之后进行平坦化层的制备,具体地在驱动电路上采用半掩膜工艺形成平坦化层,使得平坦化层在固定位置处形成高度约为1-2μm的凸出区域,该固定位置两侧分别用于形成阴极焊接电极12和阳极焊接电极11,其中,凸出区域与衬底基板10之间的夹角范围为[50°,80°],也就是凸出区域面向阴极焊接电极12和阳极焊接电极11设置的坡面与衬底基板10之间的夹角范围为[50°,80°]。
凸出区域形成后,在阴极焊接电极12和阳极焊接电极11的所在层之上形成电极保护层,将原有电极保护层的厚度增厚,由现有技术中的增加至左右,这样凸出区域与电极保护层位于凸出区域之上的区域构成阻流台13,以尽量阻止银浆的流动。
可能的实施方式中,在阴极焊接电极12和阳极焊接电极11的所在层之上形成电极保护层,具体包括在电极保护层位于坡面之上的区域形成多个阻流槽,阻流槽的开槽尺寸为2-10μm,以尽量消耗银浆流动的流动力。该显示面板的电路背板的制备方法中形成的电路背板结构可以参见上述显示面板的电路背板的实施例,重复之处不再赘述。
基于同一发明思想,本申请实施例还提供了一种显示面板,该显示面板包括如本申请实施例上述的任一电路背板以及多个微LED发光器件,其中,各微LED发光器件的阳极和阴极分别通过银浆固定于电路背板中对应的各电路区域中的阳极焊接电极11和阴极焊接电极12。该显示面板的实施可以参见上述显示面板的电路背板的实施例,重复之处不再赘述。
显然,本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样,倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内,则本发明也意图包含这些改动和变型在内。
Claims (5)
1.一种显示面板的电路背板,其特征在于,包括衬底基板,所述衬底基板上具有多个电路区域,每个所述电路区域包括:位于所述衬底基板上的阴极焊接电极、阳极焊接电极和阻流台;其中,
所述阻流台位于所述阴极焊接电极和所述阳极焊接电极之间,所述阻流台在所述电路背板的厚度方向的高度高于所述阴极焊接电极和所述阳极焊接电极的高度;
每个所述电路区域还包括:位于所述衬底基板之上的驱动电路,位于所述驱动电路与所述阴极焊接电极和所述阳极焊接电极所在层之间的平坦化层,位于所述阴极焊接电极和所述阳极焊接电极所在层之上的电极保护层;
所述阻流台包括所述平坦化层在所述阴极焊接电极和所述阳极焊接电极之间的凸出区域,以及所述电极保护层位于所述凸出区域之上的区域;
所述凸出区域具有分别面向所述阴极焊接电极和所述阳极焊接电极设置的坡面;
所述电极保护层位于所述坡面之上的区域具有多个阻流槽,每个所述阻流槽在所述衬底基板上的正投影为圆弧形,且在面向所述阴极焊接电极的坡面上设置的阻流槽的圆弧形圆心指向所述阴极焊接电极,在面向所述阳极焊接电极的坡面上设置的阻流槽的圆弧形圆心指向所述阳极焊接电极。
2.如权利要求1所述的电路背板,其特征在于,所述坡面与所述衬底基板之间的夹角范围为[50°,80°]。
4.一种显示面板的电路背板的制备方法,其特征在于,包括:
在衬底基板上的各电路区域形成驱动电路;
在所述驱动电路上采用半掩膜工艺形成平坦化层;
在所述平坦化层上形成阴极焊接电极和阳极焊接电极;
在所述阴极焊接电极和阳极焊接电极的所在层之上形成电极保护层;其中,
所述平坦化层在所述阴极焊接电极和所述阳极焊接电极之间具有凸出区域,所述凸出区域与所述电极保护层位于所述凸出区域之上的区域构成阻流台;
在所述阴极焊接电极和阳极焊接电极的所在层之上形成电极保护层,具体包括:
所述凸出区域具有分别面向所述阴极焊接电极和所述阳极焊接电极设置的坡面;在所述电极保护层位于所述坡面之上的区域形成多个阻流槽,每个所述阻流槽在所述衬底基板上的正投影为圆弧形,且在面向所述阴极焊接电极的坡面上设置的阻流槽的圆弧形圆心指向所述阴极焊接电极,在面向所述阳极焊接电极的坡面上设置的阻流槽的圆弧形圆心指向所述阳极焊接电极。
5.一种显示面板,其特征在于,包括如权利要求1-3任一所述的电路背板以及多个微LED发光器件,其中,各所述微LED发光器件的阳极和阴极分别通过银浆固定于所述电路背板中对应的各电路区域中的阳极焊接电极和阴极焊接电极。
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