CN109904104B - Semiconductor wafer positioning device and method - Google Patents
Semiconductor wafer positioning device and method Download PDFInfo
- Publication number
- CN109904104B CN109904104B CN201711309059.9A CN201711309059A CN109904104B CN 109904104 B CN109904104 B CN 109904104B CN 201711309059 A CN201711309059 A CN 201711309059A CN 109904104 B CN109904104 B CN 109904104B
- Authority
- CN
- China
- Prior art keywords
- wafer
- signal
- induction
- probe
- flat edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The invention provides a semiconductor wafer positioning device and method, and relates to the technical field of semiconductor equipment. The semiconductor wafer positioning device comprises a positioner and a rotating device, wherein the positioner comprises a first induction probe and a control module, and the first induction probe is electrically connected with the control module. The rotating device is used for bearing the wafer and can drive the wafer to rotate. The first induction probe is used for scanning the wafer when the rotating device rotates and drives the wafer to rotate, and generating a first induction signal when receiving an optical signal reflected by the wafer. The control module is used for generating a first judgment result and a second judgment result when the wafer always receives the first induction signal within the time of rotating the wafer by the preset angle, wherein the second judgment result represents that the first induction probe scans the flat edge of the wafer. The semiconductor wafer positioning device can accurately identify various wafers such as single and double polished wafers of silicon wafers, sapphires and silicon carbide, so that the universality of equipment is improved, and the risk of wafer damage is reduced.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a semiconductor wafer positioning device and method.
Background
The semiconductor industry technology continues to evolve, extending to different substrate materials and sizes. With the development of automation of semiconductor devices, the automatic transmission system has been widely used in the production process. The problem that follows is how to accurately sense the position state of the wafer in the process of transferring the wafer, and if the state sensing error can cause the process abnormality of the wafer or the wafer damage, the process abnormality has a great influence on the production cost and the yield.
With the improvement of the precision of the inductor and the adoption of a reasonable induction method, the state of the wafer in the production process can be accurately induced. In modern manufacturing lines for manufacturing semiconductor devices and integrated circuits, it is widely used. The existing substrates utilized in semiconductor factories comprise various substrates such as silicon wafers, sapphires, silicon carbide and the like, and wafers need to be transmitted, positioned by induction and the like before various processes, but the existing equipment can only sense the substrate made of one material, so that the accuracy is low, the risks of wafer falling, fragmentation and induction error are increased, and the production difficulty and the cost are increased.
Disclosure of Invention
One of the purposes of the present invention is to provide a semiconductor wafer positioning device, which can accurately identify various wafers such as single-double polished wafers of silicon wafers, sapphire and silicon carbide, increase the versatility of the device, and reduce the risk of wafer damage.
Another object of the present invention is to provide a semiconductor wafer positioning method, which can accurately identify various wafers such as single-double polished wafers of silicon wafers, sapphire, and silicon carbide, thereby increasing the versatility of the apparatus and reducing the risk of wafer damage.
The embodiment of the invention is realized by the following steps:
the semiconductor wafer positioning device comprises a positioner and a rotating device, wherein the positioner comprises a first induction probe and a control module, the first induction probe is electrically connected with the control module, and the first induction probe is arranged at a position corresponding to the rotating device. The rotating device is used for bearing the wafer and can drive the wafer to rotate. The first induction probe is used for scanning the wafer when the rotating device rotates and drives the wafer to rotate, and generating a first induction signal when receiving an optical signal reflected by the wafer. The control module is used for generating a first judgment result when the first induction signal is always received within the time when the wafer rotates for a preset angle, wherein the first judgment result represents that the first induction probe does not scan the flat edge of the wafer; the control module is further configured to generate a second determination result when the first sensing signal is not received within a time when the wafer rotates by a preset angle, where the second determination result represents that the first sensing probe scans the flat edge of the wafer.
Furthermore, the rotating device is provided with a round edge placing position corresponding to the round edge of the wafer, a flat edge placing position corresponding to the flat edge of the wafer and a vacancy position, the vacancy position is arranged on one side, opposite to the round edge placing position, of the flat edge placing position, and the first induction probe corresponds to the vacancy position.
Further, the preset angle is 360 degrees.
Further, the first induction probe is also used for detecting the position information of the flat edge of the wafer and generating a position signal when the optical signal reflected by the wafer is not received;
the control module is electrically connected with the rotating device and used for controlling the rotating device to rotate according to the position signal, so that the flat edge of the wafer rotates to a preset position.
Further, the positioner is a fiber amplifier.
Furthermore, the semiconductor wafer positioning device also comprises an inductor, wherein the inductor comprises a reflector plate, a second induction probe and a control unit, the reflector plate and the second induction probe are oppositely arranged, and the second induction probe is electrically connected with the control unit. The second sensing probe is used for emitting light to the reflector plate and generating a second sensing signal when the light signal reflected back by the reflector plate is not received. The control unit is used for generating a third judgment result according to the second induction signal, wherein the third judgment result represents that the wafer is arranged between the second induction probe and the reflector plate; the control unit is further configured to generate a fourth determination result when the second sensing signal is not received, where the fourth determination result indicates that the wafer is not located between the second sensing probe and the reflector plate.
Further, the control unit comprises a relay and a judgment module, the relay is electrically connected with the second induction probe, and the relay is electrically connected with the judgment module. The relay is used for generating an intermediate signal when receiving the second induction signal. The judging module is used for generating the third judging result according to the intermediate signal and generating a fourth judging result when the intermediate signal is not received.
Further, the sensor is a laser sensor.
Furthermore, the semiconductor wafer positioning device also comprises an alarm unit which is electrically connected with the control module and used for alarming according to the first judgment result.
A method of positioning a semiconductor wafer, the method comprising: the wafer is rotated. The wafer in the rotating process is scanned, and a first sensing signal is generated when an optical signal reflected by the wafer is received. And generating a first judgment result when the first induction signal is always received within the time when the wafer rotates by a preset angle, wherein the first judgment result represents that the first induction probe does not scan the flat edge of the wafer. And generating a second judgment result when the first induction signal is not received within the time when the wafer rotates for a preset angle, wherein the second judgment result represents that the first induction probe scans the flat edge of the wafer.
The semiconductor wafer positioning device and the semiconductor wafer positioning method provided by the embodiment of the invention have the beneficial effects that: the semiconductor wafer positioning device provided by the embodiment of the invention bears the wafer through the rotating device and drives the wafer to rotate, the wafer is scanned when the rotating device rotates and drives the wafer to rotate through the first induction probe, a first induction signal is generated when an optical signal reflected by the wafer is received, the control module can generate a first judgment result when the first induction signal is always received within the time of the wafer rotating by a preset angle, and the first judgment result represents that the first induction probe does not scan the flat edge of the wafer; the control module can also generate a second judgment result when the first induction signal is not received within the time when the wafer rotates for the preset angle, wherein the second judgment result represents that the first induction probe scans the flat edge of the wafer. Therefore, the semiconductor wafer positioning device can accurately judge whether the wafer has a flat edge or not so as to carry out subsequent processes. The semiconductor wafer positioning device can accurately identify various wafers such as single and double polished wafers of silicon wafers, sapphires and silicon carbide, increases the universality of equipment, and reduces the damage of the wafers caused by injection process problems and wafer induction errors due to misalignment of flat edges.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a block diagram of a semiconductor wafer positioning apparatus according to a first embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a rotating device of a semiconductor wafer positioning device according to a first embodiment of the present invention;
FIG. 3 is a schematic view of a second inductive probe of the semiconductor wafer positioning apparatus according to the first embodiment of the present invention in operation;
FIG. 4 is a block diagram of a control unit of a semiconductor wafer positioning apparatus according to a first embodiment of the present invention;
fig. 5 is a schematic block diagram of a flow chart of a semiconductor wafer positioning method according to a second embodiment of the invention.
Icon: 10-a semiconductor wafer positioning device; 100-a locator; 110-a first inductive probe; 120-a control module; 200-a rotation device; 210-round edge placing position; 220-placing the flat edge; 230-a vacant bit; 300-an inductor; 310-a reflective sheet; 320-a second inductive probe; 330-a control unit; 331-a relay; 332-a judgment module; 340-a first power supply module; 350-a second power supply module; 400-an alarm unit; 500-cup; 510-grooves.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "inside", "outside", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, or the orientations or positional relationships that the products of the present invention are conventionally placed in use, or the orientations or positional relationships that are conventionally understood by those skilled in the art, and are used for the purpose of facilitating the description and simplifying the description, but do not indicate or imply that the equipment or the elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
First embodiment
Referring to fig. 1, the present embodiment provides a semiconductor wafer positioning device 10, which is applied in semiconductor device technology to realize wafer positioning and wafer identification during wafer transferring. The semiconductor wafer positioning device 10 can accurately identify various wafers such as single and double polished wafers of silicon wafers, sapphires and silicon carbide, so that the universality of equipment is improved, and the risk of wafer damage is reduced.
The semiconductor wafer positioning device 10 comprises a positioner 100 and a rotating device 200, wherein the positioner 100 comprises a first induction probe 110 and a control module 120, the first induction probe 110 is electrically connected with the control module 120, the first induction probe 110 is arranged at a position corresponding to the rotating device 200, and a dotted line between the first induction probe 110 and the rotating device 200 in fig. 1 represents the position relationship between the two.
The rotating device 200 is used for carrying the wafer and can drive the wafer to rotate. It should be noted that the wafers are transferred to the rotating device 200 by a transfer device, which may be a robot arm, during the beginning of the process, and the wafers are transferred from the cassette to the rotating device 200 by the robot arm.
The first inductive probe 110 is used for scanning the wafer when the rotating device 200 rotates and drives the wafer to rotate, and generating a first inductive signal when receiving the optical signal reflected by the wafer.
It should be noted that, when the first inductive probe 110 scans the wafer, the rotating device 200 drives the wafer to rotate by a preset angle, and optionally, the preset angle is 360 degrees. Of course, the wafer may be set at other predetermined angles depending on the initial position of the wafer on the rotating device 200.
Referring to fig. 2, in the present embodiment, the rotating device 200 is provided with a circle edge placing position 210 capable of corresponding to a circle edge of a wafer, a flat edge placing position 220 capable of corresponding to a flat edge of a wafer, and a blank position 230. The vacant site 230 is disposed on one side of the flat edge placing site 220 opposite to the round edge placing site 210, and the first inductive probe 110 corresponds to the vacant site 230.
It should be noted that, when the wafer is placed on the rotating device 200, the circular edge placing position 210 corresponds to the circular edge of the wafer, the circular edge of the wafer always corresponds to the circular edge placing position 210 when the wafer rotates, and the flat edge placing position 220 corresponds to the position when the flat edge rotates to a predetermined direction when the wafer rotates. Further, the circle edge placement site 210 may be considered as a circle matching the size of the wafer, and the flat edge placement site 220 may be considered as a chord of the circle and divide the circle into two arcs, such that the vacancy 230 is an area surrounded by the flat edge placement site 220 and one of the two arcs. The first inductive probe 110 corresponds to the vacancy 230, which means that the first inductive probe 110 is disposed at a position where the region can be scanned. In this embodiment, the first inductive probe 110 is disposed perpendicular to the rotating device 200 and above the vacancy 230.
Referring to fig. 1, the control module 120 is configured to generate a first determination result when the first sensing signal is always received within a time period when the wafer rotates by a preset angle, where the first determination result indicates that the first sensing probe 110 does not scan the flat edge of the wafer. The control module 120 is further configured to generate a second determination result when the first sensing signal is not received within a time period when the wafer rotates by the preset angle, where the second determination result represents that the first sensing probe 110 scans the flat edge of the wafer.
It should be noted that the control module 120 generates the second determination result when the first sensing signal is not received within the time when the wafer rotates by the preset angle, that is, the control module 120 generates the second determination result when receiving the first sensing signal as long as the control module 120 receives the first sensing signal within the time when the wafer rotates by the preset angle.
Whether the wafer has a flat edge can be determined by generating the first determination result and the second determination result through the control module 120, so that the corresponding subsequent process can be performed through the first determination result or the second determination result.
Further, in this embodiment, the first sensing probe 110 is also used for detecting the position information of the flat edge of the wafer and generating a position signal when the optical signal reflected by the wafer is not received. The control module 120 is electrically connected to the rotating device 200, and is configured to control the rotating device 200 to rotate according to the position signal, so that the flat edge of the wafer rotates to a predetermined position.
That is, when the first sensing probe 110 detects the flat edge of the wafer, the first sensing probe generates position information of the flat edge into a position signal and sends the position signal to the control module 120, and the control module 120 can control the rotating device 200 to rotate the flat edge of the wafer to a preset position according to the second determination result and the position signal, thereby achieving the function of trimming the flat edge.
Further, in this embodiment, the positioner 100 is preferably an optical fiber amplifier, and the operating voltage of the optical fiber amplifier is DC24V, and the sensitivity thereof is within 200 ms. The adoption of the optical fiber amplifier can effectively improve the accuracy of induction identification.
Further, the semiconductor wafer positioning apparatus 10 provided in the present embodiment further includes an inductor 300. The sensor 300 includes a reflective sheet 310, a second sensing probe 320, and a control unit 330. The reflective sheet 310 is disposed opposite to the second inductive probe 320, and a dotted line between the reflective sheet 310 and the second inductive probe 320 in fig. 1 indicates a positional relationship therebetween. The second inductive probe 320 is electrically connected to the control unit 330. The second sensing probe 320 is used for emitting light to the reflective sheet 310 and generating a second sensing signal when the light signal reflected back by the reflective sheet 310 is not received. In this embodiment, the sensor 300 is preferably a laser sensor, the operating voltage of the laser sensor is DC24V, the light source of the light emitted by the second sensing probe 320 is visible red semiconductor laser, and the wavelength of the emitted light is 655 nm.
The control unit 330 is configured to generate a third determination result according to the second sensing signal, where the third determination result indicates that a wafer is located between the second sensing probe 320 and the reflector 310; the control unit 330 is further configured to generate a fourth determination result when the second sensing signal is not received, where the fourth determination result indicates that there is no wafer between the second sensing probe 320 and the reflective sheet 310 of the second sensing probe 320.
Referring to fig. 3, in the present embodiment, after the edge trimming is completed, the wafer is transferred into the storage chamber before the injection by the transfer device. The storage chamber may be provided with a glass cover, the second inductive probe 320 being provided outside the glass cover. The storage chamber has a cup500 therein, the cup500 is provided with a groove 510, and the reflective sheet 310 is disposed in the groove 510. The wafer can be placed on the cup500 during transmission and shield the reflective sheet 310 in the groove 510. If the wafer blocks the reflective sheet 310 in the groove 510, the second sensing probe 320 cannot receive the optical signal reflected by the reflective sheet 310, at this time, the second sensing probe 320 generates a second sensing signal, the control unit 330 generates a third determination result according to the second sensing signal, determines that a wafer is located between the second sensing probe 320 and the reflective sheet 310, which indicates that the wafer is transferred to the cup500 of the storage chamber, and then may perform subsequent processes. If no wafer blocks the reflection sheet 310 in the groove 510, the second sensing probe 320 can receive the optical signal reflected by the reflection sheet 310, at this time, the second sensing probe 320 does not generate the second sensing signal, and the control unit 330 generates the fourth determination result when not receiving the second sensing signal, and determines that no wafer exists between the second sensing probe 320 and the reflection sheet 310, which indicates that no wafer is transferred to the cup500 of the storage chamber.
Referring to fig. 4, the inductor 300 further includes a first power module 340 and a second power module 350. The control unit 330 includes a relay 331 and a determination module 332, and the first power module 340 is electrically connected to the second inductive probe 320 for providing the DC working power to the second inductive probe 320, in this embodiment, the first power module 340 provides the DC 24V. The second power module 350 is electrically connected to the relay 331 and is configured to provide power to the relay 331, in this embodiment, the second power module 350 provides-5V power. The relay 331 is electrically connected to the second inductive probe 320, and the relay 331 is electrically connected to the determination module 332. The relay 331 is configured to generate an intermediate signal when receiving the second sensing signal. In this embodiment, the second sensing signal is a 24V signal, and the intermediate signal is a-5V signal. The determining module 332 is configured to generate a third determining result according to the intermediate signal, and generate a fourth determining result when the intermediate signal is not received.
In this embodiment, if there is no wafer on the cup500, the laser emitted by the second sensing probe 320 irradiates on the reflective sheet 310 in the groove 510 on the cup500, and a reflected light signal is input to the second sensing probe 320, and at this time, the second sensing probe 320 does not output a second sensing signal (24V) to act on the relay 331; if a wafer is placed on the cup500, since the laser emitted by the second sensing probe 320 is blocked by the wafer and no incident light irradiates the reflector 310, no reflected light is input to the second sensing probe 320, and at this time, the second sensing probe 320 outputs a second sensing signal (24V) to act on the relay 33110; the relay 331 attracts the intermediate signal (-5V) to transmit to the judging module 332 after receiving the second sensing signal, and the judging module 332 judges that a wafer is placed on the cup500 after receiving the intermediate signal (-5V), and at the moment, the wafer waits to be transmitted to the process chamber for processing.
Referring to fig. 1, the semiconductor wafer positioning apparatus 10 further includes an alarm unit 400, wherein the alarm unit 400 is electrically connected to the control module 120 and the control unit 330, respectively, for alarming according to the first determination result or alarming according to the fourth determination result. That is, when the flat edge of the wafer is scanned, if the first sensing probe 110 does not scan the flat edge of the wafer, the alarm unit 400 gives an alarm. When a wafer is sensed in the storage chamber, if there is no wafer in the groove 510 of the cup500 of the storage chamber, the alarm unit 400 alarms.
Therefore, in the semiconductor wafer positioning device 10 provided in this embodiment, the wafer is carried by the rotating device 200 and is driven to rotate, the wafer is scanned by the first sensing probe 110 when the rotating device 200 rotates and drives the wafer to rotate, and a first sensing signal is generated when an optical signal reflected by the wafer is received, the control module 120 can generate a first determination result when the first sensing signal is always received within a time when the wafer rotates by a preset angle, and the first determination result represents that the first sensing probe 110 does not scan the flat edge of the wafer; the control module 120 can also generate a second determination result when the first sensing signal is not received within the time when the wafer rotates by the preset angle, wherein the second determination result represents that the first sensing probe 110 scans the flat edge of the wafer. Therefore, the semiconductor wafer positioning apparatus 10 can accurately determine whether or not the wafer has a flat edge for the subsequent process. The semiconductor wafer positioning device 10 can accurately identify various wafers such as single and double polished wafers of silicon wafers, sapphires and silicon carbide, increases the universality of equipment, and reduces the damage of the wafers caused by injection process problems and wafer induction errors due to misalignment of flat edges.
Second embodiment
Referring to fig. 5, the present embodiment provides a semiconductor wafer positioning method using the semiconductor wafer positioning device 10 of the first embodiment. The semiconductor wafer positioning method comprises the following steps:
step S101, transmitting the wafer to a first preset position.
In this embodiment, the step S101 is completed by the transmission device. The wafers are transferred to the rotary apparatus 200 by a transfer device, optionally a robot arm, during the beginning of the process, wherein the wafer is transferred from the cassette to a first predetermined position on the rotary apparatus 200 by the robot arm.
Step S102, the wafer is rotated.
In this embodiment, the step S102 is completed by the rotating device 200. The rotating device 200 rotates and drives the wafer to rotate by a preset angle, optionally, the preset angle is 360 degrees.
Step S103, scanning the wafer in the rotation process, generating a first sensing signal when receiving the optical signal reflected by the wafer, and detecting the position information of the flat edge of the wafer and generating a position signal when not receiving the optical signal reflected by the wafer.
In this embodiment, the step S103 is completed by the first inductive probe 110.
Step S104, generating a first determination result when the first sensing signal is always received within a time when the wafer rotates by a preset angle, wherein the first determination result indicates that the first sensing probe 110 does not scan the flat edge of the wafer.
In this embodiment, the step S104 is completed by the control module 120.
And step S105, sending out an alarm according to the first judgment result.
In this embodiment, the step S105 is completed by the alarm unit 400.
Step S106, generating a second determination result when the first sensing signal is not received within the time when the wafer rotates by the preset angle, wherein the second determination result represents that the first sensing probe 110 scans the flat edge of the wafer.
In this embodiment, the step S106 is completed by the control module 120.
Step S107, controlling the rotation device 200 to rotate according to the second determination result and the position signal, so that the flat edge of the wafer rotates to a preset position.
In this embodiment, the step S107 is completed by the control module 120.
And step S108, judging whether the edge trimming processing of the wafer is finished.
In this embodiment, the step S108 is completed by the control module 120.
And step S109, when the flat edge processing of the wafer is judged to be not finished, an alarm is given.
In this embodiment, the step S109 is completed by the alarm unit 400.
Step S201, when the trimming process for the wafer is determined to be completed, the wafer is continuously transferred to a second preset position.
In this embodiment, the step S201 is completed by the transmission device. The wafer is transferred into the groove 510 of the cup500 of the storage chamber by a transfer device.
Step S202, light is emitted, and a second sensing signal is generated when the reflected light signal is not received.
In this embodiment, the step S202 is completed by the second inductive probe 320. The second sensing probe 320 emits light toward the reflective sheet 310 and generates a second sensing signal when the light signal reflected back by the reflective sheet 310 is not received.
Step S203, a third determination result is generated according to the second sensing signal, wherein the third determination result indicates that a wafer is located between the second sensing probe 320 and the reflector 310.
In this embodiment, the step S203 is completed by the control unit 330.
In step S204, the wafer is transferred into the process chamber.
In this embodiment, the step S204 is completed by the transmission device.
In step S205, a fourth determination result is generated when the second sensing signal is not received, wherein the fourth determination result indicates that there is no wafer between the second sensing probe 320 and the reflective sheet 310.
In this embodiment, the step S205 is completed by the control unit 330.
And step S206, sending an alarm according to the fourth judgment result.
In this embodiment, the step S206 is completed by the alarm unit 400.
In summary, the semiconductor wafer positioning apparatus 10 and the method provided by the embodiment of the invention use the highly sensitive positioner 100 and the sensor 300, and change the conventional commonly used correlation sensing method, so that the semiconductor wafer positioning apparatus 10 can accurately determine whether the wafer has a flat edge for performing the subsequent processes. The semiconductor wafer positioning device 10 can realize high-precision wafer sensing on various wafers such as single-double polished wafers of silicon wafers, sapphires and silicon carbide, saves the space of equipment, increases the universality of the equipment, and reduces the wafer damage caused by injection process problems and wafer sensing errors caused by misalignment of flat edges.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The semiconductor wafer positioning device is characterized by comprising a positioner and a rotating device, wherein the positioner comprises a first induction probe and a control module, the first induction probe is electrically connected with the control module, and the first induction probe is arranged at a position corresponding to the rotating device;
the rotating device is used for bearing the wafer and can drive the wafer to rotate;
the first induction probe is used for scanning the wafer when the rotating device rotates and drives the wafer to rotate, and generating a first induction signal when receiving an optical signal reflected by the wafer;
the control module is used for generating a first judgment result when the first induction signal is always received within the time when the wafer rotates by a preset angle, wherein the first judgment result represents that the first induction probe does not scan the flat edge of the wafer, and the preset angle is 360 degrees; the control module is further configured to generate a second determination result when the first sensing signal is not received within a time when the wafer rotates by a preset angle, where the second determination result represents that the first sensing probe scans the flat edge of the wafer;
the rotating device is provided with a round edge placing position which can correspond to the round edge of the wafer, a flat edge placing position which can correspond to the flat edge of the wafer and a vacancy position, the vacancy position is arranged on one side, opposite to the round edge placing position, of the flat edge placing position, and the first induction probe corresponds to the vacancy position;
the first induction probe is also used for detecting the position information of the flat edge of the wafer and generating a position signal when the optical signal reflected by the wafer is not received;
the control module is electrically connected with the rotating device and used for controlling the rotating device to rotate according to the position signal, so that the flat edge of the wafer rotates to a preset position, and flat edge trimming is achieved.
2. The semiconductor wafer positioning device of claim 1, wherein the positioner is a fiber amplifier.
3. The semiconductor wafer positioning device as claimed in claim 1, further comprising a sensor, wherein the sensor comprises a reflective sheet, a second inductive probe and a control unit, the reflective sheet is arranged opposite to the second inductive probe, and the second inductive probe is electrically connected with the control unit;
the second sensing probe is used for emitting light to the reflector plate and generating a second sensing signal when not receiving the light signal reflected by the reflector plate;
the control unit is used for generating a third judgment result according to the second induction signal, wherein the third judgment result represents that the wafer is arranged between the second induction probe and the reflector plate; the control unit is further configured to generate a fourth determination result when the second sensing signal is not received, where the fourth determination result indicates that the wafer is not located between the second sensing probe and the reflector plate.
4. The semiconductor wafer positioning device as claimed in claim 3, wherein the control unit comprises a relay and a judgment module, the relay is electrically connected with the second induction probe, and the relay is electrically connected with the judgment module;
the relay is used for generating an intermediate signal when receiving the second induction signal;
the judging module is used for generating the third judging result according to the intermediate signal and generating a fourth judging result when the intermediate signal is not received.
5. A semiconductor wafer positioning device as claimed in claim 3 or 4, characterized in that the sensor is a laser sensor.
6. The semiconductor wafer positioning device as claimed in claim 1, further comprising an alarm unit electrically connected to the control module for alarming based on the first determination result.
7. A method of positioning a semiconductor wafer, the method comprising:
rotating the wafer;
scanning the wafer in the rotating process, generating a first sensing signal when receiving an optical signal reflected by the wafer, and detecting position information of a flat edge of the wafer and generating a position signal when not receiving the optical signal reflected by the wafer;
generating a first judgment result when the first induction signal is always received within the time when the wafer rotates for a preset angle, wherein the first judgment result represents that the first induction probe does not scan the flat edge of the wafer;
generating a second judgment result when the first induction signal is not received within the time when the wafer rotates for a preset angle, wherein the second judgment result represents that the first induction probe scans the flat edge of the wafer;
and controlling a rotating device to rotate according to the second judgment result and the position signal, so that the flat edge of the wafer rotates to a preset position, and the flat edge is straightened.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711309059.9A CN109904104B (en) | 2017-12-11 | 2017-12-11 | Semiconductor wafer positioning device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711309059.9A CN109904104B (en) | 2017-12-11 | 2017-12-11 | Semiconductor wafer positioning device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109904104A CN109904104A (en) | 2019-06-18 |
| CN109904104B true CN109904104B (en) | 2021-07-13 |
Family
ID=66942376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711309059.9A Active CN109904104B (en) | 2017-12-11 | 2017-12-11 | Semiconductor wafer positioning device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109904104B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060125150A (en) * | 2005-06-02 | 2006-12-06 | 삼성전자주식회사 | Apparatus for aligning flat zone of a wafer |
| CN205140936U (en) * | 2015-12-01 | 2016-04-06 | 海太半导体（无锡）有限公司 | Unusual monitoring devices of wafer conveying |
-
2017
- 2017-12-11 CN CN201711309059.9A patent/CN109904104B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060125150A (en) * | 2005-06-02 | 2006-12-06 | 삼성전자주식회사 | Apparatus for aligning flat zone of a wafer |
| CN205140936U (en) * | 2015-12-01 | 2016-04-06 | 海太半导体（无锡）有限公司 | Unusual monitoring devices of wafer conveying |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109904104A (en) | 2019-06-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4961895B2 (en) | Wafer transfer device, wafer transfer method, and storage medium | |
| KR100495323B1 (en) | Defect inspecting device for substrate to be processed | |
| US6591160B2 (en) | Self teaching robot | |
| EP1137052B1 (en) | Automatic calibration system for wafer transfer robot | |
| US5822213A (en) | Method and apparatus for determining the center and orientation of a wafer-like object | |
| KR100516367B1 (en) | Wafer position error detection and correction system | |
| US6162008A (en) | Wafer orientation sensor | |
| US9097515B2 (en) | Measuring device and measuring method | |
| US6532403B2 (en) | Robot alignment system and method | |
| WO2016201717A1 (en) | Combined detection method and device for silicon wafer distribution state in loading region of semiconductor device | |
| WO2003022534A1 (en) | Wafer position teaching method and teaching jig | |
| KR101785790B1 (en) | Alignment apparatus | |
| KR20190055068A (en) | Integrated Radiation Sensor Alignment Characteristics | |
| TW201009291A (en) | A system for measuring the vertical distance between the thin substrates | |
| CN110164787B (en) | Cavity wafer position detection device and detection method | |
| CN116525499A (en) | Wafer box scanning system | |
| CN110896021A (en) | Wafer edge cleaning device and wafer edge cleaning method | |
| CN109904104B (en) | Semiconductor wafer positioning device and method | |
| CN104752295A (en) | Position monitoring device, plasma processing device and method for loading and unloading workpiece | |
| CN106684026B (en) | Automatic wafer center-searching device | |
| JPH05160245A (en) | Circular board positioning apparatus | |
| KR20080008443A (en) | Equipment for detecting wafer flat zone of semiconductor coating device | |
| CN111668131A (en) | System and method for detecting position deviation of mechanical arm and wafer | |
| JPH05206249A (en) | Alignment equipment | |
| JPH05238513A (en) | Positioning method for semiconductor wafer storage cassette semiconductor wafer carrier mechanism |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |