CN109878195A - Stripping off device - Google Patents
Stripping off device Download PDFInfo
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- CN109878195A CN109878195A CN201910163136.7A CN201910163136A CN109878195A CN 109878195 A CN109878195 A CN 109878195A CN 201910163136 A CN201910163136 A CN 201910163136A CN 109878195 A CN109878195 A CN 109878195A
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- stripping
- blue film
- camera
- control unit
- bearing tool
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Abstract
The present invention relates to stripping off device technical fields, and in particular to the stripping off device for removing the multiple semiconductor chips being sticked on blue film.The stripping off device can precisely obtain the location information of the small electronic component of volume, it only needs to carry out camera shooting movement, it just can determine the location information of small electronic part, reduce the time needed for obtaining electronic component location information, improve the charge stripping efficiency of electronic component.
Description
Technical field
The present invention relates to stripping off device technical fields, and in particular to for removing the multiple semiconductors being sticked on blue film
The stripping off device of chip.
Background technique
Existing stripping off device, the location information of the electronic components such as semiconductor chip on available indigo plant film, is based on this
Location information is pressed from blue film inboard with thimble, then is adsorbed from blue film surface, is stripped electronic component one by one.
In order to precisely obtain the location information of the small electronic component of volume, use high pixel camera in close blue film
In the state of shoot electronic component.In this case, since the region that can be shot of camera is limited, in order to shoot indigo plant
It is dynamic will repeatedly to carry out camera shooting while supporting the bearing tool of blue film against camera movement for electronic component on film entire area
Make.
Such as here, it in order to which the electronic component for being stripped device on blue film and having removed a part is completely exfoliated, is taking
When obtaining the location information of electronic component, allow the bearing tool for supporting blue film that area is not present to shoot electronic component against camera lens is mobile
Domain.Movement supports the bearing tool of blue film to shoot the region that electronic component is not present, and has become extra movement, because before
The location information of electronic component present on blue film is had been achieved for, so becoming to waste time.
Summary of the invention
In order to overcome defect present in background technique, the technical solution adopted by the present invention to solve the technical problems is:
Stripping off device, what which was equipped with the 1st range region that can take the blue film that multiple electronic components are pasted the 1st takes the photograph
As means, and the mobile mechanism and base that keep above-mentioned blue either film or above-mentioned 1st camera shooting means mobile relative to other sides
In the location information for the electronic component that above-mentioned 1st camera shooting means shooting obtains, make the removing of the electronic component removing
Mechanism；It is equipped with the 2nd camera shooting means that the wider array of 2nd range region in the 1st range region is imaged that can compare；Above-mentioned movement
Mechanism, the presence that whether there is based on the electronic component on the blue film obtained by the 2nd camera shooting means imaging
Either information, make in above-mentioned blue film or above-mentioned 1st camera shooting means, it is mobile relative to above-mentioned either side.
The preferred stripping off device is equipped with the blue film bearing tool for supporting above-mentioned blue film, the indigo plant film bearing tool,
Can be with 90 degree centered on the axis of the extension in the vertical direction in the face that multiple electronic components described in the blue film are pasted
Unit rotation.
The preferred stripping off device, each of the multiple electronic components being attached on the blue film can be stored in advance by being equipped with
From the storage unit of characteristic information, the mechanism for stripping can believe the multiple electronic components being attached on blue film according to above-mentioned characteristic
Breath is classified, and is removed.
The preferred 2nd camera shooting means are to be taken the photograph by scanning on above-mentioned blue film to shoot the scanning in the 2nd range region
As device.
The all of the stripping system constitutes summary, and stripping system contains stripping off device, control unit, storage unit and portrait
Processing unit, the stripping off device 1 contain blue film bearing tool, bearing tool mobile mechanism, mechanism for stripping, linear scan photograph
2nd photographic device of camera and the 1st photographic device of area camera, the control unit are used to control these stripping off devices, institute
Stating mechanism for stripping 1 includes suction jig, fixture driving and reversing mechanism, thimble and thimble driving and reversing mechanism, and the portrait processing unit includes
1st portrait information acquisition unit and the 2nd portrait information acquisition unit.
The application method of the stripping off device, it is characterised in that the steps include:
Firstly, control unit controls bearing tool mobile mechanism, which can be by the 2nd camera position of blue film bearing tool direction
It is mobile, while control unit also controls linear scan camera, which can shoot blue film whole region, and control unit passes through
The 2nd portrait information that 2nd setting-out information acquisition unit of processing unit of drawing a portrait obtains, obtaining related semiconductor chip W whether there is
Information；
Then, control unit is based on controlling bearing tool mobile mechanism there are information, making blue film bearing tool to the 1st camera position
It is mobile, specifically, control unit is based on there are information, when area camera shoots the 1st range region, used by control support
The 1st camera position that blue film bearing tool is imaged to semiconductor W in tool mobile mechanism is mobile；
In addition, control unit controls area camera to shoot the 1st region on blue film, control unit is based on there are information, work
All it is judged to being unable to complete taking the photograph to image all areas of object, also, by supporting apparatus mobile mechanism to support to use by blue film
Tool is moved to other 1st camera positions, this and then carry out identical camera shooting movement；
Control unit is based on that all areas as camera shooting object are all judged to completing to image there are information, from portrait processing dress
In the 1st portrait information that the 1st portrait information acquisition unit set obtains, the location information about semiconductor chip W is obtained；
After this, control unit is based on location information, is moved blue film bearing tool to removing position by bearing tool mobile mechanism
Dynamic, then, control unit drives mechanism for stripping, a semiconductor chip W as removing object is removed, control unit is using as stripping
All semiconductor chip W from object are judged to completing to remove, also, drive stripping machine by bearing tool mobile mechanism
Structure, to remove other semiconductor chips W as the removing object of blue film bearing tool, control unit repeats such peeling action
Until the removing of all semiconductor chip W as removing object is completed.
Stripping off device according to the present invention, the stripping off device can precisely obtain the position of the small electronic component of volume
Information, it is only necessary to carry out camera shooting movement, it will be able to determine the location information of small electronic part, reduce and obtain electronic component position
Time needed for information improves the charge stripping efficiency of electronic component.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 relates to the programme diagram of the physical make-up summary of the stripping system of present embodiment；
Fig. 2 is the perspective view of stripping off device of the present invention；
Fig. 3 is perspective view when supporting blue film using the blue film bearing tool of stripping off device shown in Fig. 2；
Fig. 4 is the plan view that blue film semiconductor-on-insulator chip is pasted onto terms of blue film front；
Fig. 5 is the upper surface of the stripping off device of present embodiment figure one；
Fig. 6 is the upper surface of the stripping off device of present embodiment figure two；
Fig. 7 is the upper surface of the stripping off device of present embodiment figure three；
Fig. 8 is that blue film front sees that the plan view of state is not present in the semiconductor chip of part；
Fig. 9 is the upper surface of the stripping off device of present embodiment figure four；
Figure 10 is the side view one of blue film and mechanism for stripping in removing position；
Figure 11 is the side view two of blue film and mechanism for stripping in removing position；
Figure 12 is the side view three of blue film and mechanism for stripping in removing position；
Figure 13 is the flow chart of control unit movement in present embodiment.
Figure 14 is the plan view after being rotated by 90 ° blue film shown in Fig. 8 from the direction θ
Wherein: 1, stripping off device；2, blue film bearing tool；3, mechanism for stripping；31, suction jig；32, fixture driving and reversing mechanism；
33, thimble；34, thimble driving and reversing mechanism；35, robotic arm；36, motor；6, mechanism supports turntable；7, chip transports turntable；71
, chip conveying unit；10, control unit；51, holder；70, linear scan camera；80, area camera；85, reflecting mirror；
90, portrait processing unit；91, the 1st portrait information acquisition unit；92, the 2nd portrait information acquisition unit；100, stripping system.
Specific embodiment
In conjunction with the accompanying drawings, the present invention is further explained in detail.Attached drawing is simplified schematic diagram, only with signal side
Formula illustrates basic structure of the invention, therefore it only shows the composition relevant to the invention.
Referring to Fig. 1, Fig. 1, which illustrates all of the stripping system 100 of present embodiment, constitutes summary, stripping system 100
Stripping off device 1, control unit 10, storage unit 15 and portrait processing unit 90 are contained, the stripping off device 1 contains blue film support
Apparatus 2, bearing tool mobile mechanism 21, mechanism for stripping 3, linear scan camera 70 the 2nd photographic device and area camera
80 the 1st photographic device, the control unit 10 are used to control these stripping off devices 1, and the mechanism for stripping 1 includes suction jig
31, fixture driving and reversing mechanism 32, thimble 33 and thimble driving and reversing mechanism 34, the portrait processing unit 90 include that the 1st portrait information takes
Obtain the portrait information acquisition unit 92 of portion 91 and the 2nd.
Fig. 2 is the perspective view of stripping off device of the present invention, and the blue film in stripping off device supports apparatus 2 that can circlewise support
The blue film S that multiple semiconductor chip W are pasted after cutting.Blue film S is similar to the gluing with retractility that resin material is made
Property indigo plant film, semiconductor chip W is similar to the luminous sub-prime such as LED.In the following description, blue film S is supported on blue film support and uses
In the state of tool 2, the semiconductor chip W side for being pasted onto blue film S is referred to as front, the side that do not paste is known as reverse side.So
It afterwards as shown in Figures 2 and 3, is Y direction, up and down direction Z towards positive direction (normal direction of blue film surface) by reverse side
The direction definition that axis direction, Y direction and Z-direction intersect vertically is X-direction.In addition, being rotated by axis of Y direction
Direction definition be the direction θ.
As shown in figure 4, multiple semiconductor chips after being cut are pasted in the front of blue film S.As shown in figure 4, semiconductor
Chips W is arranged in X-direction and Z-direction.But indigo plant film S shown in Fig. 4 only wherein an example, the shape of blue film S and
The arrangement of semiconductor chip W is not limited thereto.In Fig. 4, in order to avoid drawing becomes complicated, 1 half only is indicated with symbol W
Conductor chip is omitted the symbol about other semiconductor chips and is shown.In aftermentioned Fig. 8, Figure 14
It is the same.
Blue film bearing tool 2, by bearing tool mobile mechanism 21, can X-direction, Y direction, Z-direction with
And the direction θ (using the center of blue film S as the direction of rotation of axis) is mobile.Fig. 3 indicates blue film bearing tool 2, is shelled by mechanism for stripping 3
When from the semiconductor chip W being pasted on blue film S, the state of present removing position (hereinafter referred to as removing position).In indigo plant
When film bearing tool 2 is in removing location status, the front of blue film bearing tool 2 supports absorption and semiconductor chip W is kept to inhale
Attached fixture 31 and suction jig 31.Advance and retreat fixture driving and reversing mechanism 32 is assembled on blue film S.
For example suction jig 31 is made by rubber elastomeric material.Suction jig 31 passes through fixture driving and reversing mechanism
32 can retreat to blue film S.Suction jig 31 is mounted on the robotic arm 35 rotated by motor 36, and is supported in blue film
It is rotated between the relative position of the relative position blue film S and aftermentioned middle chip conveying turntable 7 that apparatus 2 supports.In addition, fixture is retreated
Mechanism 3 is equipped with the pump being not shown for assigning 31 adsorption capacity of suction jig.
In addition, the front of blue film bearing tool 2 is equipped with to transport from suction jig 31 and receives removing for semiconductor chip W
Feed turntable 7.It is disk-shaped that chip, which transports turntable 7, includes the transport unit for arranging multiple chips at certain intervals along edge
71.Chip conveying turntable 7 makes multiple chip trucking departments 71 successively close to suction jig 31 by being rotated intermittently, and from absorption
Fixture 31 receives semiconductor chip W.
In addition, blue film bearing tool 2 is in the state in removing position, the reverse side of blue film bearing tool 2 is equipped with guarantor
The holder 51 of thimble 33 is held, and the thimble driving and reversing mechanism 34 for making thimble 33 retreat to blue film S.Holder 51 is in opposite face
Central portion has through-hole, and the hole is opposite with the blue film S that the blue film bearing tool 2 in removing position is supported, and matches in through-hole
Have thimble 41.In addition, equipped with mechanism supports platform 6, which can make to push up in the reverse side of blue film bearing tool 2
Needle driving and reversing mechanism 34 is retreated relative to blue film bearing tool 2.
Area camera 80 shown in FIG. 1, being can be in the 1st range area on the blue film S that blue film bearing tool 2 is supported
The photographic device of domain camera shooting.In addition, area camera 80 can be mobile relative to the blue film S that blue film bearing tool 2 is supported.?
In present embodiment, blue film bearing tool 2 is by the way that with the movement of bearing tool mobile mechanism 21, area camera 80 is facing to blue
Film S is mobile relative to X-direction and Z-direction.
Linear scan camera 70 shown in FIG. 1, being can be wide in the 2nd on the blue film S that blue film bearing tool 2 is supported
Spend the photographic device of region camera shooting.2nd range region, it is bigger than the 1st range region area.Linear scan camera 70, can
By scanning on blue film S, the whole region of blue film S is shot, and obtain the portrait information of the semiconductor chip W on blue film S.
However, without being limited thereto, as long as the range that shoots than area camera 80 of the field that can image of linear scan camera 70 is extensively i.e.
It can.
In addition, area camera 80 has used the image than 70 higher-definition of linear scan camera.That is with linear
Smear camera 70 is compared, and area camera 80 possesses higher resolution ratio.In the present embodiment, 20 lis of diameter will be pasted onto
For about 20,000 semiconductor chip W on the blue film S of rice as camera shooting object, having used resolution ratio is about the region photograph of 470,000 pixels
Machine 80, the linear scan camera 70 of resolution ratio about 8,000.
In addition, the portrait of the semiconductor chip W obtained according to area camera 80 and linear scan camera 70, passes through picture
As processing unit 90 carries out portrait processing, it can be known with user and be shown on the computer monitor comprising control unit 10 otherwise
Show.
As described above, portrait processing unit 90 includes the 1st portrait portrait information acquisition unit 92 of information acquisition unit 91 and the 2nd.
2nd portrait information acquisition unit 92 obtains the 2nd portrait feelings of the semiconductor chip W on blue film S by linear scan camera 70
Report.2nd portrait information contain on blue film S with the presence or absence of semiconductor chip W there are information.1st portrait information acquisition unit 91,
The 1st portrait information of the semiconductor chip W on blue film S is obtained by area camera 80.1st portrait information contains blue film S
The location information of semiconductor-on-insulator chips W.
By the 2nd portrait information acquisition unit 92 obtain there are information, do not need the detailed letter of the position semiconductor chip W
Breath, it is only necessary to whether there is semiconductor chip W on some position (coordinate) on blue film S.On the other hand, pass through the 1st portrait feelings
The location information for reporting acquisition unit 91 to obtain, illustrates the details of position (coordinate) of multiple semiconductor chip W on blue film.
As described above, area camera 80 has high-resolution, therefore the detailed location information of semiconductor chip W can be obtained.
Above-mentioned mechanism for stripping 3 successively removes the semiconductor chip W as removing object based on location information.Tool
For body, location information of the control unit 10 based on area camera 80 image obtained and the acquisition of the 1st portrait intelligence department is shelled
X-direction and Z-direction coordinate from object semiconductor chip W, thimble 33 and suction jig 31 with this coordinate pair towards answering
Position, blue film bearing tool 2 is moved by bearing tool mobile mechanism 21.Then, from the reverse side of blue film S that thimble 33 is right
Quasi- semiconductor chip W is adsorbed, thus stripping semiconductor chips W from the front of blue film S with suction jig 31.To as removing pair
As multiple semiconductor chip W successively carry out act.
In addition, storage unit 15 stores the arrangement mode for the semiconductor chip W being pasted on blue film S in advance, control unit 10 will
The arrangement mode that storage unit 10 stores in advance is compared with the location information that the 1st portrait information acquisition unit 91 obtains, to adjust indigo plant
The removing position of film bearing tool 2.For example, control unit 10 compares the arrangement mode stored in advance with the location information of acquisition
Compared with when determining that semiconductor chip W inclination is pasted on blue film S, blue film bearing tool 2 passes through bearing tool mobile mechanism 21 to θ
Direction movement is finely adjusted.
In addition, such as storing the characteristic letter about the multiple semiconductor chip W pasted on blue film S in advance in storage unit 15
Breath is based on this information, can use the structure of stripping semiconductor chips W.Specifically, for example, being based on multiple semiconductor chip W
Respective characteristic information can only remove the semiconductor chip W for possessing same levels characteristic.Therefore, semiconductor core can be passed through
The characteristic of piece W is classified.In addition, it need not be made to remove about defective products (the low semiconductor chip of grade).In addition, for example,
Characteristic information can be and the related information such as voltage value, light emission luminance.Furthermore it is possible to by pre-stored each characteristic
The mode that information distinguishes shows the structure of the image of semiconductor chip W on the display of computer.
Fig. 5, which is illustrated, schemes (figure in terms of Z axis positive direction) about the upper surface of stripping off device of present embodiment, also shows
When semiconductor chip W is pasted on the blue film that blue film bearing tool is supported, gone out by linear scan camera imaging
Figure.In addition, in Fig. 5, it is schematically omitted the configuration and shape of each structure of above-mentioned stripping off device 1, and to being omitted
It with a portion of diagram, about the blue film S supported by blue film bearing tool 2, diagram also omited.In aftermentioned Fig. 6, figure
It 7, is also the same in Fig. 9.In addition, dotted arrow shown in fig. 5, is expressed as the field of photography by linear scan camera 70.
In Fig. 5, blue film bearing tool 2, which is located at, is pasted onto partly leading on blue film S by what line scan cameras 70 was imaged out
On the position of body chips W (hereinafter referred to as the 2nd camera position).Blue film bearing tool 2 is in 2 camera position, by linearly sweeping
Camera is retouched to the region-wide same shooting of blue film S.In the present embodiment, the region BELAND that linear scan camera can be shot
The whole region of film S is big.In this way, being imaged by using the semiconductor chip W on 70 couples of line scan camera blue film S, pass through
Image processing apparatus 90, obtain in relation to the indigo plant entire area film S whether have semiconductor chip W there are information.
Fig. 6, Fig. 7 are illustrated to scheme about the upper surface of stripping off device of present embodiment, and it is viscous to also show semiconductor chip W
When being attached on the blue film that blue film bearing tool is supported, pass through the figure of area camera imaging out.In addition, Fig. 6 is shown in Fig. 7
The imaging area of dotted arrow expression area camera 80.In addition, blue film bearing tool 2 is located to be shone by region in Fig. 6, Fig. 7
The position (becoming the 1st camera position below) for pasting the semiconductor chip W on blue film S of the shooting of camera 80.In addition, in Fig. 6
In, before being moved to the 1st camera position, the blue film being represented by dashed line out positioned at the 2nd camera position supports apparatus 2.
In the present embodiment, as shown in Figure 6, Figure 7, reflecting mirror 85 is located at the region that area camera 80 can image,
By reflecting mirror 85, the 1st range field on blue film S is imaged.It is however not limited to this, it can not also by reflecting mirror 85
It is imaged with the composition directly to blue film S.In addition, in order to improve the image pixel obtained after area camera 80 is imaged, it can
With near the blue film bearing tool 2 of the 1st camera position, the lighting apparatus such as arrangement White LED (light emitting diode) are made to irradiate
For the semiconductor chip W of imaging object.
In order to accurately obtain the position information of semiconductor chip W, need area camera 80 in the state close to blue film S
Lower shooting semiconductor chip W.At this point, since the region that area camera 80 can be imaged is limited, in order to take the complete of blue film S
The semiconductor chip W in region needs repeatedly to carry out camera operation while blue film bearing tool 2 of mobile blue film s.
Specifically, by area camera 80, the blue film that shooting is located at the 1st camera position supports what apparatus 2 support
(referring to Fig. 6) after the predetermined region of blue film S, apparatus 2 is supported by supporting apparatus mobile mechanism 2 to move, after movement
1st camera position, to regional imagings other on blue film S (referring to Fig. 7).In Fig. 6, the center O illustrated in blue film S is attached
The case where semiconductor chip W closely taken.In Fig. 7, the region of the X-axis positive direction side of blue film S takes half is illustrated
The case where conductor chip W.Like this, by using repeatedly being imaged on the blue film S of 80 pairs of area camera, image processing apparatus
90 can obtain the location information for all semiconductor chip W being pasted on blue film S.
At this, semiconductor chip W is not to be not present in X-direction and Y direction always present in blue film S
In region through being stripped the region of the removing of device 1 and being removed by certain problem.Fig. 8 is partly led from part in terms of blue film front
The plan view of state is not present in body chip.When Fig. 8 shows being (X, Z)=(O, O) for the coordinate representation at, the center zero of blue film S, X-axis
With there's almost no semiconductor chip W in the positive region of Z axis, the semiconductor chip W of negative region a part of X-axis and Z axis is shelled
From.
At this, circle of dotted line r1, r2 in Fig. 8 indicate area size (the 1st range area that area camera 80 can image
Domain).Using state as shown in Figure 8 blue film S when, when attempting to shoot the entire area of blue film S with area camera 80, be
The region that shooting semiconductor chip W is not present supports the bearing tool 2 of blue film S mobile relative to area camera 80.In order to
The field that shooting semiconductor chip W is not present carries out extra movement on the mobile blue film bearing tool 2 for supporting blue film S, is
The location information for obtaining the semiconductor chip W being present on blue film S, wastes the time.Specifically, until there is no partly lead
Until the region of round r2 body chips W, shown in Fig. 8, also imaged by area camera 80.
Herein, in the present embodiment, whether there is based on the semiconductor chip W obtained of linear scan camera 70
Information, when having taken imageable region by area camera 80, semiconductor chip W is in the position that is imaged, by
The mobile blue film bearing tool 2 of bearing tool mobile mechanism 21.It is surrounded as shown in figure 8, control unit 10 obtains in Fig. 8 by dotted line E
Region in there are semiconductor chip W there are information.Then, control unit 10 be based on there are information, in order to only shoot semiconductor
Region existing for chips W, the movement of control area camera 80 and bearing tool mobile mechanism 21.Circle of dotted line r1 table in Fig. 8
Show region captured by area camera 80 in present embodiment, circle of dotted line r2 indicates that area camera 80 is not in present embodiment
The region of shooting.
In the present embodiment, by the mobile blue film bearing tool 2 of bearing tool mobile mechanism 21, to make area camera
Region existing for 80 shooting semiconductor chip W.The amount of movement of blue film bearing tool 2 can be reduced.It in this way can be in the short time
The interior location information for obtaining the semiconductor chip W as removing object.
Also, referring to Fig. 9-Figure 12, the peeling action carried out by mechanism for stripping 3 is illustrated.Fig. 9 illustrate about
The upper surface of stripping off device of present embodiment figure.By mechanism for stripping come the schematic diagram of stripping semiconductor chip.Figure 10 is to indicate
The side view of blue film and mechanism for stripping in removing position, the state being incorporated in the figure shows thimble on fixed frame.Figure
11 illustrate the side view of blue film and mechanism for stripping in removing position, the figure shows thimbles from fixed frame it is prominent when
State.Figure 12 illustrates the side view of blue film and mechanism for stripping in removing position, keeps inhaling the figure shows suction jig
Attached semiconductor sub-prime, and towards conveying chip turntable when state.In addition, in figs. 10-12, in order to avoid answering for drawing
The diagram of blue film bearing tool 2 is omitted in hydridization, shows only a semiconductor chip W.
The position for the blue film semiconductor-on-insulator chips W that mechanism for stripping 3 is obtained based on area camera 80 is successively removed on blue film
Semiconductor chip W.Specifically, being furnished with suction jig 31 and thimble in the relative position of the semiconductor W as removing object
33, so that blue film bearing tool 2 is moved to removing position from the 1st camera position.(referring to Fig.1 0 etc.)
Later, by thimble driving and reversing mechanism that the opposite removing object semiconductor chip W of thimble 33 is prominent.In this way, as stripping
Semiconductor chip W from object is mobile (referring to Fig.1 1) towards 31 direction of suction jig.Then, in the state of shown in Figure 11,
Pass through 31 adsorption stripping object semiconductor chip W of suction jig.Suction jig 31 keeps the shape of absorption semiconductor chip W later
State allows suction jig 31 to be kept out of the way from blue film S by fixture driving and reversing mechanism 32.Later, the semiconductor chip W being adsorbed such as schemes
Shown in 2 Fig. 3,2) direction opposite towards chip conveying turntable 6 rotates suction jig 31(referring to Fig.1.After this, such as Fig. 2 Fig. 3
Shown, chip conveying unit 71 receives semiconductor chip W from suction jig 31.
In addition, as described above, blue film bearing tool 2 is in addition to that next, referring to Fig.1 3 etc., can illustrate present embodiment in X
In control unit movement.Figure 13 is the flow chart for illustrating control unit movement in present embodiment.
Firstly, control unit 10 controls bearing tool mobile mechanism 21, which can be by blue film bearing tool 2 towards
2 camera positions are mobile (step S1).Control unit 10 also controls linear scan camera 70, which can shoot blue film
Whole region (step S2, referring to Fig. 5).Control unit 10 can also pass through the 2nd setting-out information acquisition unit of processing unit 90 of drawing a portrait
92 the 2nd portrait information obtained, obtain the information (stepS3) that whether there is in relation to semiconductor chip W.
Later, control unit 10 is based on controlling bearing tool mobile mechanism 21 there are information, making blue film bearing tool 2 to the 1st
Mobile (the stepS4, referring to Fig. 6) of camera position.Specifically, control unit 10 is based on there are information, when area camera 80 is shot
When the 1st range region, the blue film bearing tool 2 be imaged to semiconductor W the 1st is set to image by controlling bearing tool mobile mechanism 21
Position is mobile.
In addition, control unit 10 controls area camera 80 to shoot the 1st region (stepS5) on blue film.Control unit 10
Based on there are information, all areas as camera shooting object are all judged to being unable to complete camera shooting (NO of step6), also, logical
It crosses support apparatus mobile mechanism 21 and blue film support apparatus 2 is moved to other 1st camera positions (stepS4, referring to Fig. 7).This
And then carry out identical camera shooting movement.
Control unit 10 is based on that all areas as camera shooting object are all judged to completing to image (step6's there are information
YES), from the 1st portrait information that the 1st portrait information acquisition unit of portrait processing unit 90 obtains, obtain about semiconductor
The location information (stepS7) of chips W.
After this, control unit 10 is based on location information, by bearing tool mobile mechanism 21 by blue film bearing tool 2 to stripping
It offs normal and sets mobile (stepS8).Then, control unit 10 drives mechanism for stripping 3, by a semiconductor chip W as removing object
Removing (stepS9, referring to Fig. 9-Figure 11).Control unit 10 is all judged to all semiconductor chip W as removing object to complete
It removes (NO of stepS10), also, mechanism for stripping 3 is driven by bearing tool mobile mechanism 21, using removing as blue film support
Other semiconductor chips W of the removing object of apparatus 2.Control unit 10 repeats such peeling action until as removing object
Until the removing of all semiconductor chip W is completed
Axis direction, Y direction, Z-direction can also be moved in the direction θ by bearing tool mobile mechanism 21.For passing through
The image for the semiconductor chip W that the shooting of area camera 80 obtains, merges with the pattern of rows and columns stored in memory portion 15 in advance, into
Mobile micro-adjustment to the direction θ again when the so-called pattern match of row.In addition, it is not limited to this fine tuning, bearing tool 2
Can by bearing tool mobile mechanism 21 with 90 degree be unit moving in rotation.Figure 14 is illustrated blue film shown in Fig. 8 from the side θ
To the plan view after being rotated by 90 °.
In this way, lead to blue toner bearing tool 2 to be rotated by 90 ° using blue film S center O as axis in the direction θ, can make to paste
The direction of semiconductor chip W on blue film S changes 90 degree.That is, as shown in figure 8, will be pasted as Z-direction using length direction
Semiconductor chip W is at the state that length direction as shown in figure 14 is X-direction.Accordingly, it is being adsorbed the absorption of fixture 31
When etc., the direction of semiconductor chip W can be changed in stripping process subsequent process.As a result, after stripping process, it is not necessarily to
Changed nyctitropic process individually, can easily obtain the semiconductor chip W that user requires direction.
In addition in the above-described embodiment, the position of area camera 80 is fixed although having been noted above, and by propping up
Holding apparatus mobile mechanism 21 makes the structure of the mobile blue film S of blue film bearing tool 2, but not limited to this.As long as area camera 80
The structure that can be relatively moved with blue film S.That is, it is possible to which the position of blue film bearing tool 2 is fixed, pass through moving machine
Structure moving area camera 80.
In the present embodiment, although to the area camera 80 as the 1st camera shooting means and as the 2nd camera shooting means
The camera that linear scan camera is independently constituted is illustrated, but can also be in 1 camera, shared the 1st
The effect of camera shooting means and the 2nd camera shooting means.For example, region video camera 80 can have can shoot when by shutter next time
The zoom function of entire indigo plant film S.It in this case, can although the image quality for the image that the shooting of area camera 80 obtains is low
With obtain illustrated in the present embodiment there are information, that is, it is therefore desirable to obtain same with linear scan camera 70
The image of image quality.Through this structure, 1 area camera 80 can be made to undertake the 1st imaged to the 1st range region
Photographic device, and compare the both sides for the 2nd camera shooting means that the wider array of 2nd range region in the 1st range region is imaged
Effect.
Stripping off device according to the present invention, the stripping off device can precisely obtain the position of the small electronic component of volume
Information, it is only necessary to carry out camera shooting movement, it will be able to determine the location information of small electronic part, reduce and obtain electronic component position
Time needed for information improves the charge stripping efficiency of electronic component.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (6)
1. stripping off device, which is characterized in that the stripping off device is equipped with the blue film that can take that multiple electronic components are pasted
The 1st camera shooting means in the 1st range region, and make above-mentioned blue either film or above-mentioned 1st camera shooting means relative to other sides
Mobile mobile mechanism, and the location information of the electronic component of acquirement based on above-mentioned 1st camera shooting means shooting, make described
The mechanism for stripping of electronic component removing；The wider array of 2nd range region in the 1st range region is imaged can be compared by being equipped with
2 camera shooting means；Above-mentioned mobile mechanism, based on the ministry of electronics industry on the blue film obtained by the 2nd camera shooting means imaging
Part whether there is there are information, either make in above-mentioned blue film or above-mentioned 1st camera shooting means, relative to above-mentioned any one
Fang Yidong.
2. stripping off device according to claim 1, it is characterised in that: the stripping off device is equipped with the above-mentioned blue film of support
Blue film bearing tool, the indigo plant film bearing tool, the face that can be pasted with multiple electronic components described in the blue film are vertical
Direction extension axis centered on, rotated as unit of 90 degree.
3. stripping off device according to claim 1, it is characterised in that: the stripping off device, be equipped with to store in advance
It is attached to the storage unit of the respective characteristic information of multiple electronic components on the blue film, the mechanism for stripping can will be attached to indigo plant
Multiple electronic components on film are classified according to above-mentioned characteristic information, and are removed.
4. stripping off device according to claim 1, it is characterised in that: the 2nd camera shooting means are by above-mentioned blue film
It is upper to scan to shoot the scan camera shooting device in the 2nd range region.
5. the stripping system of stripping off device according to claim 1, it is characterised in that: the entirety of the stripping system (100)
Summary is constituted, stripping system (100) contains stripping off device (1), control unit (10), storage unit (15) and portrait processing unit
(90), the stripping off device 1 contains blue film bearing tool (2), bearing tool mobile mechanism (21), mechanism for stripping (3), linear
2nd photographic device of smear camera (70) and the 1st photographic device of area camera (80), the control unit (10) are used to control
These stripping off devices (1) are made, the mechanism for stripping 1 includes suction jig (31), fixture driving and reversing mechanism (32), thimble (33) and top
Needle driving and reversing mechanism (34), the portrait processing unit (90) include that the 1st portrait information acquisition unit (91) and the 2nd portrait information obtain
Portion (92).
6. the application method of stripping off device according to claim 1, it is characterised in that the steps include:
Firstly, control unit (10) controls bearing tool mobile mechanism (21), which can be by blue film bearing tool (2) direction
2nd camera position is mobile, while control unit (10) also controls linear scan camera (70), which can shoot blue film
Whole region, the 2nd portrait feelings that control unit (10) is obtained by the 2nd setting-out information acquisition unit (92) of portrait processing unit (90)
Report, obtains the information that whether there is in relation to semiconductor chip W；
Then, control unit (10) is based on controlling bearing tool mobile mechanism (21) there are information, make blue film bearing tool (2) to
1st camera position is mobile, specifically, control unit (10) is based on there are information, when area camera (80) shoot the 1st range area
When domain, by controlling bearing tool mobile mechanism (21) the 1st camera position that blue film bearing tool (2) is imaged to semiconductor W
It is mobile；
In addition, control unit (10) controls area camera (80) to shoot the 1st region on blue film, control unit (10) is based on depositing
In information, all areas as camera shooting object are all judged to being unable to complete taking the photograph, also, by supporting apparatus mobile mechanism
(21) blue film support apparatus (2) is moved to other 1st camera positions, this and then carry out identical camera shooting movement；
Control unit (10) is based on all areas as camera shooting object being all judged to completing to image, from portrait there are information
It manages in the 1st portrait information of the 1st portrait information acquisition unit acquisition of device (90), obtains the position about semiconductor chip W
Information；
After this, control unit (10) be based on location information, by bearing tool mobile mechanism (21) by blue film bearing tool (2) to
It is mobile to remove position, then, control unit (10) drives mechanism for stripping (3), and a semiconductor chip W as removing object is shelled
From control unit (10) is all judged to all semiconductor chip W as removing object to complete to remove, also, is used by support
Has mobile mechanism (21) driving mechanism for stripping (3), to remove other semiconductors as the removing object of blue film bearing tool (2)
Chips W, control unit (10) repeat such peeling action until the removing of all semiconductor chip W as removing object is completed
Until.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910163136.7A CN109878195A (en) | 2019-03-05 | 2019-03-05 | Stripping off device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910163136.7A CN109878195A (en) | 2019-03-05 | 2019-03-05 | Stripping off device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109878195A true CN109878195A (en) | 2019-06-14 |
Family
ID=66930649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910163136.7A Pending CN109878195A (en) | 2019-03-05 | 2019-03-05 | Stripping off device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109878195A (en) |
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| JP2000012571A (en) * | 1998-06-26 | 2000-01-14 | Rohm Co Ltd | Method for positioning in die bonder of semiconductor chip |
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