CN109844927B - 基板保持装置、用于制造这种装置的方法、以及用于处理或成像样品的设备和方法 - Google Patents

基板保持装置、用于制造这种装置的方法、以及用于处理或成像样品的设备和方法 Download PDF

Info

Publication number
CN109844927B
CN109844927B CN201780059072.5A CN201780059072A CN109844927B CN 109844927 B CN109844927 B CN 109844927B CN 201780059072 A CN201780059072 A CN 201780059072A CN 109844927 B CN109844927 B CN 109844927B
Authority
CN
China
Prior art keywords
plate
base plate
array
substrate
droplets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201780059072.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN109844927A (zh
Inventor
P·I·谢弗斯
J·J·M·皮耶斯特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Holding NV
Original Assignee
ASML Holding NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/222,708 external-priority patent/US20180033586A1/en
Priority claimed from US15/222,705 external-priority patent/US9829804B1/en
Application filed by ASML Holding NV filed Critical ASML Holding NV
Publication of CN109844927A publication Critical patent/CN109844927A/zh
Application granted granted Critical
Publication of CN109844927B publication Critical patent/CN109844927B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2037—Exposure with X-ray radiation or corpuscular radiation, through a mask with a pattern opaque to that radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
  • Sampling And Sample Adjustment (AREA)
CN201780059072.5A 2016-07-28 2017-07-27 基板保持装置、用于制造这种装置的方法、以及用于处理或成像样品的设备和方法 Active CN109844927B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15/222,708 2016-07-28
US15/222,705 2016-07-28
US15/222,708 US20180033586A1 (en) 2016-07-28 2016-07-28 Apparatus and method for processing or imaging a sample
US15/222,705 US9829804B1 (en) 2016-07-28 2016-07-28 Substrate holding device, method for manufacturing such a device, and use of such a device in a lithography system
PCT/JP2017/028156 WO2018021581A1 (en) 2016-07-28 2017-07-27 Substrate holding device, method for manufacturing such a device, and apparatus and method for processing or imaging a sample

Publications (2)

Publication Number Publication Date
CN109844927A CN109844927A (zh) 2019-06-04
CN109844927B true CN109844927B (zh) 2024-01-09

Family

ID=61016195

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780059072.5A Active CN109844927B (zh) 2016-07-28 2017-07-27 基板保持装置、用于制造这种装置的方法、以及用于处理或成像样品的设备和方法

Country Status (5)

Country Link
JP (2) JP6951415B2 (cg-RX-API-DMAC7.html)
KR (2) KR102449579B1 (cg-RX-API-DMAC7.html)
CN (1) CN109844927B (cg-RX-API-DMAC7.html)
TW (2) TWI757314B (cg-RX-API-DMAC7.html)
WO (1) WO2018021581A1 (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI883050B (zh) * 2019-10-01 2025-05-11 荷蘭商Ａｓｍｌ荷蘭公司 用於對準及接合組件之正反兩用長型元件、用於極紫外線（ｅｕｖ）輻射源之容器、微影系統、及用於將裝置接合至容器之方法
CN114302514B (zh) * 2021-12-27 2022-09-27 哈尔滨工业大学 集成交叉式双针板热沉的电热耦合温控装置及其控温方法
JP7797234B2 (ja) 2022-02-18 2026-01-13 キヤノン株式会社 保持装置、リソグラフィ装置、および物品製造方法
CN115586710B (zh) * 2022-11-09 2025-09-02 浙江大学 基于pcm隔绝内部温度波动的温控装置和控制方法
TWI856833B (zh) * 2023-09-27 2024-09-21 大陸商鵬鼎控股（深圳）股份有限公司 感測模組及其製造方法
WO2026115695A1 (ja) * 2024-11-28 2026-06-04 株式会社Kokusai Electric 基板処理装置、基板加熱方法および半導体装置の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6470108B1 (en) * 2000-04-26 2002-10-22 Tini Alloy Company Optical switching device and method

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252288A (ja) 1999-03-04 2000-09-14 Komatsu Ltd 基板保持装置
KR100351049B1 (ko) 1999-07-26 2002-09-09 삼성전자 주식회사 웨이퍼 가열 방법 및 이를 적용한 장치
JP2003224180A (ja) * 2002-01-28 2003-08-08 Kyocera Corp ウエハ支持部材
US7195693B2 (en) * 2002-06-05 2007-03-27 Advanced Thermal Sciences Lateral temperature equalizing system for large area surfaces during processing
US7156951B1 (en) * 2002-06-21 2007-01-02 Lam Research Corporation Multiple zone gas distribution apparatus for thermal control of semiconductor wafer
US7106416B2 (en) * 2003-12-10 2006-09-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20050128449A1 (en) 2003-12-12 2005-06-16 Nikon Corporation, A Japanese Corporation Utilities transfer system in a lithography system
US7532310B2 (en) 2004-10-22 2009-05-12 Asml Netherlands B.V. Apparatus, method for supporting and/or thermally conditioning a substrate, a support table, and a chuck
JP4761948B2 (ja) 2004-12-01 2011-08-31 京セラ株式会社 炭化珪素質焼結及びそれを用いた半導体製造装置用部品
JP4462143B2 (ja) 2005-07-29 2010-05-12 住友電気工業株式会社 ウェハ保持体及びウェハ保持体を備えたウェハプローバ
US7528349B1 (en) * 2006-07-25 2009-05-05 Kla-Tencor Technologies Corporation Temperature stabilization for substrate processing
CN101495922B (zh) * 2006-07-28 2012-12-12 迈普尔平版印刷Ip有限公司 光刻系统、热消散方法和框架
US8325321B2 (en) * 2006-07-28 2012-12-04 Mapper Lithography Ip B.V. Lithography system, method of heat dissipation and frame
JP2008311595A (ja) * 2007-06-18 2008-12-25 Canon Inc ステージ装置、露光装置およびデバイス製造方法
JP5247175B2 (ja) 2008-02-06 2013-07-24 株式会社アルバック 真空処理装置
SG156564A1 (en) * 2008-04-09 2009-11-26 Asml Holding Nv Lithographic apparatus and device manufacturing method
EP2196857A3 (en) * 2008-12-09 2010-07-21 ASML Netherlands BV Lithographic apparatus and device manufacturing method
JP5607907B2 (ja) * 2009-09-17 2014-10-15 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置
US8529729B2 (en) * 2010-06-07 2013-09-10 Lam Research Corporation Plasma processing chamber component having adaptive thermal conductor
JP2012231046A (ja) * 2011-04-27 2012-11-22 Nikon Corp 光学装置、露光装置、及びデバイス製造方法
WO2013033315A2 (en) * 2011-09-01 2013-03-07 Veeco Instruments Inc. Wafer carrier with thermal features
CN103843129B (zh) * 2011-09-30 2017-03-01 应用材料公司 具有温度控制的静电夹具
JP2014017445A (ja) * 2012-07-11 2014-01-30 Canon Inc 保持装置、処理装置、リソグラフィー装置、および物品の製造方法
US9514916B2 (en) * 2013-03-15 2016-12-06 Varian Semiconductor Equipment Associates, Inc. Wafer platen thermosyphon cooling system
JP6595313B2 (ja) * 2014-11-20 2019-10-23 永大産業株式会社 蓄熱壁パネル

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6470108B1 (en) * 2000-04-26 2002-10-22 Tini Alloy Company Optical switching device and method

Also Published As

Publication number Publication date
TW202234574A (zh) 2022-09-01
JP6951415B2 (ja) 2021-10-20
KR102449579B1 (ko) 2022-10-04
TWI757314B (zh) 2022-03-11
TWI835063B (zh) 2024-03-11
WO2018021581A1 (en) 2018-02-01
KR102580712B1 (ko) 2023-09-21
KR20220137160A (ko) 2022-10-11
KR20190041477A (ko) 2019-04-22
JP7240463B2 (ja) 2023-03-15
JP2022008512A (ja) 2022-01-13
JP2019523561A (ja) 2019-08-22
TW201812429A (zh) 2018-04-01
CN109844927A (zh) 2019-06-04

Similar Documents

Publication Publication Date Title
JP7240463B2 (ja) 基板保持デバイス、そのようなデバイスを製造するための方法、ならびに、サンプルを処理または像形成するための装置および方法
JP3814598B2 (ja) 温度調整装置、露光装置及びデバイス製造方法
TW201250291A (en) Mirror array
EP3171393A1 (en) Sealed elastomer bonded si electrodes and the like for reduced particle contamination in dielectric etch
KR101116999B1 (ko) 광학 요소를 위한 교체 장치
EP2181357A1 (en) Controllable optical element and method for operating an optical element with thermal actuators and projection exposure apparatus for semiconductor lithography
JP5214771B2 (ja) リソグラフィ装置およびリソグラフィ装置の冷却方法
KR102943336B1 (ko) 처리 방법 및 플라즈마 처리 장치
KR101486407B1 (ko) 리소그래피 시스템, 방열 방법 및 프레임
US9829804B1 (en) Substrate holding device, method for manufacturing such a device, and use of such a device in a lithography system
US20080100812A1 (en) Immersion lithography system and method having a wafer chuck made of a porous material
JP2020077810A (ja) 温調装置
US20140017613A1 (en) Holding apparatus, processing apparatus, lithography apparatus, and method for manufacturing article
JP7162499B2 (ja) 温調装置
NL2019355B1 (en) Method and apparatus for exposing a sample
JP2006156916A (ja) 熱補償ヒーターモジュールを有するレーザー熱処理用チャック
JP4995478B2 (ja) ナノインプリント用スペーサ、及びこれを用いた電子顕微鏡調整用試料の製造方法、並びに電子顕微鏡調整用試料、及びこれを備えた電子顕微鏡
US20140118709A1 (en) Holding apparatus, lithography apparatus, and method of manufacturing article
JP2005295762A (ja) ステージ装置および露光装置
US20150029484A1 (en) Stage apparatus, lithography apparatus and method of manufacturing article
US5289009A (en) Charged particle beam system and cooling device, a coil comprising a cooling member and a cooling member for use in such a charged particle beam system
US20140273536A1 (en) Charged particle beam writing apparatus, aperture unit, and charged particle beam writing method
JPH10209036A (ja) 露光方法および露光装置
JP4559137B2 (ja) 真空機器の製造装置及び製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TG01 Patent term adjustment

Free format text: NEW EXPIRY DATE: 20380513

TG01 Patent term adjustment