CN109844571A - 抗反射材料 - Google Patents

抗反射材料 Download PDF

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Publication number
CN109844571A
CN109844571A CN201780063063.3A CN201780063063A CN109844571A CN 109844571 A CN109844571 A CN 109844571A CN 201780063063 A CN201780063063 A CN 201780063063A CN 109844571 A CN109844571 A CN 109844571A
Authority
CN
China
Prior art keywords
mentioned
resin combination
rubber particles
weight
antireflection material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780063063.3A
Other languages
English (en)
Chinese (zh)
Inventor
高林尚史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Corp
Original Assignee
Daicel Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Chemical Industries Ltd filed Critical Daicel Chemical Industries Ltd
Publication of CN109844571A publication Critical patent/CN109844571A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/02—Diffusing elements; Afocal elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
CN201780063063.3A 2016-10-11 2017-10-03 抗反射材料 Pending CN109844571A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-200398 2016-10-11
JP2016200398 2016-10-11
PCT/JP2017/035961 WO2018070301A1 (ja) 2016-10-11 2017-10-03 反射防止材

Publications (1)

Publication Number Publication Date
CN109844571A true CN109844571A (zh) 2019-06-04

Family

ID=61905435

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780063063.3A Pending CN109844571A (zh) 2016-10-11 2017-10-03 抗反射材料

Country Status (5)

Country Link
JP (1) JP7128112B2 (ja)
KR (1) KR20190059970A (ja)
CN (1) CN109844571A (ja)
TW (1) TW201823348A (ja)
WO (1) WO2018070301A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114539721A (zh) * 2022-01-05 2022-05-27 广东盈骅新材料科技有限公司 一种扩散板用环氧树脂组合物、半固化片及其制备方法和应用
CN115322641A (zh) * 2022-08-25 2022-11-11 北京星驰恒动科技发展有限公司 一种高吸收率的杂散光抑制涂料及其制备方法和应用

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7329320B2 (ja) * 2018-11-01 2023-08-18 株式会社ダイセル 硬化性エポキシ樹脂組成物
JP7329319B2 (ja) * 2018-11-01 2023-08-18 株式会社ダイセル 硬化性エポキシ樹脂組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5082259B2 (ja) 2006-02-28 2012-11-28 日亜化学工業株式会社 つや消し保護部材およびその保護部材を有する発光装置
EP2472578B1 (en) * 2010-12-28 2020-06-03 Nichia Corporation Light emitting device
US10147853B2 (en) * 2011-03-18 2018-12-04 Cree, Inc. Encapsulant with index matched thixotropic agent
JP6044096B2 (ja) * 2012-03-29 2016-12-14 住友ベークライト株式会社 封止用エポキシ樹脂組成物および電子機器の製造方法
JP6185703B2 (ja) * 2012-10-19 2017-08-23 株式会社ダイセル 硬化性エポキシ樹脂組成物及びその硬化物、並びに光半導体装置
WO2016127938A1 (zh) * 2015-02-13 2016-08-18 苏州中科纳福材料科技有限公司 一种具有色相和光泽的光学功能材料及其制备与应用
DE102019123890A1 (de) * 2019-09-05 2021-03-11 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optischer körper, reflexionselement, bauelement, verfahren zur herstellung eines optischen körpers und verfahren zur herstellung eines rerflexionselements

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114539721A (zh) * 2022-01-05 2022-05-27 广东盈骅新材料科技有限公司 一种扩散板用环氧树脂组合物、半固化片及其制备方法和应用
CN115322641A (zh) * 2022-08-25 2022-11-11 北京星驰恒动科技发展有限公司 一种高吸收率的杂散光抑制涂料及其制备方法和应用

Also Published As

Publication number Publication date
KR20190059970A (ko) 2019-05-31
TW201823348A (zh) 2018-07-01
JP7128112B2 (ja) 2022-08-30
JPWO2018070301A1 (ja) 2019-07-25
WO2018070301A1 (ja) 2018-04-19

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PB01 Publication
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20190604