CN109839576B

CN109839576B - Emulation fault device with control by temperature change

Info

Publication number: CN109839576B
Application number: CN201910287946.3A
Authority: CN
Inventors: 王秀茹; 刘刚; 张科; 邱冬; 刘勇; 赖勇; 康冬波; 杨敬之; 卢邵龙; 欧晓旭; 颜岩; 陈岩; 王科龙; 凌万水
Original assignee: State Grid Jiangsu Electric Power Co ltd Suqian Power Supply Branch; State Grid Corp of China SGCC; State Grid Jiangsu Electric Power Co Ltd
Current assignee: State Grid Jiangsu Electric Power Co ltd Suqian Power Supply Branch; State Grid Corp of China SGCC; State Grid Jiangsu Electric Power Co Ltd
Priority date: 2019-01-04
Filing date: 2019-04-11
Publication date: 2024-06-21
Anticipated expiration: 2039-04-11
Also published as: CN109839576A

Abstract

The invention discloses a simulation fault device with temperature control, which comprises a shell with a containing space, a front panel for adjustment and a rear panel for wiring, wherein the rear panel comprises a power supply terminal and a power switch; the power supply terminal is arranged at L, N, G ends; the processing unit is arranged in the accommodating space, so that the occurrence of faults can be simulated; the processing unit further comprises a radiator, a partition plate and a main board, wherein the radiator is arranged in a placement space formed by the epoxy plates; the invention mainly simulates interphase short-circuit faults and grounding faults of the grounding system of the power distribution network, can more intuitively reflect the physical process and phenomenon of the original system, adopts a physical movable mould to more intuitively and effectively study the fault characteristics of the low-current grounding system, can flexibly adjust the grounding mode, and can conveniently construct the non-grounding system through local switch operation or remote control by remote protocol.

Description

Emulation fault device with control by temperature change

Technical Field

The invention relates to the technical field of fault control equipment, in particular to a simulation fault device with temperature control.

Background

The performance of protection equipment is generally difficult to study due to the requirement of safe and stable operation on an actual power distribution network, and the construction of a power supply line of a simulated power distribution network to conduct fault simulation experiments is an effective way for conducting power distribution network protection study and protection equipment test.

The faults of the power distribution network are random and uncontrollable, so that a large number of fault researches in different positions and different types are often required to better grasp the fault characteristics of the power distribution network, wherein the fault phase angle of voltage is an important parameter of electric faults, and the impact of different fault phase angles on electric equipment is different; on the other hand, short circuit, open circuit and grounding faults are common faults of the power distribution network, simulation of the faults is indispensable in fault simulation experiments, and for grounding faults, different grounding faults can be caused by different grounding positions, wherein arc grounding is a serious fault, and a device capable of integrating multiple faults into a whole and simulating corresponding faults under a set fault phase angle according to requirements is difficult to design.

Disclosure of Invention

This section is intended to outline some aspects of embodiments of the application and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section as well as in the description of the application and in the title of the application, which may not be used to limit the scope of the application.

The present invention has been made in view of the above-mentioned problems with the conventional fault simulator with temperature control.

Therefore, the invention aims to provide the simulation fault device with the temperature control, which is mainly used for simulating the interphase short circuit fault and the grounding fault of the small-current grounding system of the power distribution network, can more intuitively reflect the physical process and phenomenon of the original system, adopts a physical movable mould to more intuitively and effectively study the fault characteristics of the small-current grounding system, can flexibly adjust the grounding mode, and can conveniently construct an ungrounded system through local switch operation or remote control.

In order to solve the technical problems, the invention provides the following technical scheme: the simulation fault device with the temperature control comprises a shell with a containing space, wherein the shell further comprises a front panel for adjustment and a rear panel for wiring; the processing unit is arranged in the accommodating space, so that the occurrence of faults can be simulated; the processing unit further comprises a radiator, a partition board and a main board, wherein the radiator is arranged in a placement space formed by the epoxy boards, the partition board separates adjacent radiators, and the main board is arranged on the bracket; the main board comprises a control module, a communication module and a response module, wherein the control module comprises a local assembly, a remote assembly and an adjusting assembly, one end of the local assembly is connected with the adjusting assembly and sends a first signal, and the other end of the local assembly and the remote assembly send a second signal to the control module; the control module is connected with the control module and is used for receiving the second signal, identifying the second signal and converting the second signal into a third signal; the communication module can receive the third signal and feed back a fourth signal to the control module according to the third signal; and the response module is connected with the control module, the communication module and the adjusting component and receives the fifth signal converted by the fourth signal processing.

The invention has the beneficial effects that: the invention has scientific and reasonable design, mainly simulates the interphase short-circuit faults and grounding faults of the small-current grounding system of the distribution network, such as single-phase grounding faults, two-phase short-circuit grounding faults, three-phase short-circuit grounding faults and other fault types, can more intuitively reflect the physical process and phenomenon of the original system, is more intuitive and effective in researching the fault characteristics of the grounding system by adopting a physical movable die, can flexibly adjust the grounding mode, and can conveniently construct the non-grounding system by local switch operation or remote control.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Wherein:

FIG. 1 is a schematic diagram of the overall structure of a fault controller according to a first embodiment of a simulated fault device with temperature control according to the present invention;

FIG. 2 is a schematic diagram of the overall structure of the accommodating space in the fault controller according to the first embodiment of the temperature-controlled simulated fault device of the present invention;

FIG. 3 is a schematic diagram of an overall structure of a fault controller with a first embodiment of a temperature-controlled simulated fault device according to the present invention, with an upper cover removed;

FIG. 4 is a schematic diagram of the overall structure of a control unit according to a first embodiment of the temperature-controlled fault simulation apparatus of the present invention;

FIG. 5 is a schematic diagram of a heat sink according to a first embodiment of the present invention with temperature control;

FIG. 6 is a schematic view of the overall structure of a front panel according to a first embodiment of the temperature-controlled fault simulation apparatus of the present invention;

fig. 7 is a schematic view of the overall structure of the back panel according to the first embodiment of the temperature-controlled simulated fault device of the present invention.

FIG. 8 is a schematic diagram of an application structure of a magnetic joint in a controller according to a second embodiment of the present invention with temperature control;

FIG. 9 is a schematic diagram of the overall structure of a magnetic joint according to a second embodiment of the present invention with temperature control for a simulated fault device;

FIG. 10 is a schematic view of the overall structure of a driving sleeve according to a second embodiment of the present invention with temperature control for a simulated fault device;

FIG. 11 is a schematic view showing a deployment state of a driving sleeve according to a second embodiment of the temperature-controlled fault simulation apparatus of the present invention;

FIG. 12 is a schematic view showing an unfolded state of the driving sleeve with the magnetic ring removed according to the second embodiment of the temperature-controlled simulated fault device of the present invention;

FIG. 13 is a schematic view of a magnetic ring structure according to a second embodiment of the temperature-controlled fault simulation device of the present invention;

FIG. 14 is a schematic view of the overall structure of a joint according to a second embodiment of the present invention with temperature control for a simulated fault device;

FIG. 15 is a schematic view of the overall structure of a second embodiment of a simulated fault device with temperature control according to the present invention with the joint removed from the retaining sleeve;

FIG. 16 is a schematic view of the overall structure of a block according to a second embodiment of the present invention with temperature control for a simulated fault device;

FIG. 17 is a schematic view of the overall structure of a plug according to a second embodiment of the present invention with temperature control for a simulated fault device;

Fig. 18 is a schematic structural view of a fitting and plug assembly according to a second embodiment of the present invention with temperature control.

Fig. 19 is a schematic circuit diagram of a third embodiment of a simulated fault device with temperature control according to the present invention.

Fig. 20 is a schematic structural diagram of a third switching terminal strip according to a third embodiment of the temperature-controlled fault simulation device of the present invention.

Fig. 21 is a schematic structural diagram of a control module according to a third embodiment of the temperature-controlled fault simulation apparatus of the present invention.

Fig. 22 is a schematic diagram of a driving circuit structure of a fourth embodiment of a fault simulation device with temperature control according to the present invention.

Fig. 23 is a schematic structural diagram of a first switching terminal strip according to a fourth embodiment of the present invention with temperature control.

Fig. 24 is a schematic view of a second switching terminal strip structure according to a fourth embodiment of the present invention with temperature control.

Fig. 25 is a schematic structural diagram of an electrical control assembly according to a fourth embodiment of the present invention with temperature control.

Fig. 26 is a schematic structural diagram of an indication assembly according to a fourth embodiment of the temperature-controlled fault simulation device of the present invention.

Fig. 27 is a schematic diagram of a connection structure of a serial port assembly according to a fifth embodiment of the temperature-controlled fault simulation device of the present invention.

Fig. 28 is a schematic structural diagram of a network port assembly according to a fifth embodiment of the present invention with temperature control.

Fig. 29 is a schematic structural diagram of a power module according to a sixth embodiment of the present invention with temperature control.

Fig. 30 is a schematic structural diagram of a temperature control module according to a seventh embodiment of the present invention with a temperature control fault simulation device.

Fig. 31 is a schematic structural diagram of a detection assembly according to a seventh embodiment of the temperature-controlled fault simulation apparatus of the present invention.

Fig. 32 is a schematic structural diagram of an electrical control assembly according to a seventh embodiment of the present invention with temperature control.

Fig. 33 is a schematic view of a fifth switching terminal strip structure according to a seventh embodiment of the present invention with temperature control.

Detailed Description

In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways other than those described herein, and persons skilled in the art will readily appreciate that the present invention is not limited to the specific embodiments disclosed below.

Further, reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic can be included in at least one implementation of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.

Further, in describing the embodiments of the present invention in detail, the cross-sectional view of the device structure is not partially enlarged to a general scale for convenience of description, and the schematic is only an example, which should not limit the scope of protection of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.

Referring to fig. 1 to 7, for a first embodiment of the present invention, an overall structure schematic diagram of a temperature-controlled simulated fault device is provided, as shown in fig. 1, the temperature-controlled simulated fault device includes a housing having a receiving space S, the housing further includes a front panel 100 for adjustment and a rear panel 200 for wiring, and the rear panel 200 includes a power supply terminal 205 and a power switch 206; and the power supply terminal 205 is provided with L, N, G ends; the processing unit 300 is arranged in the accommodating space S, so that the occurrence of faults can be simulated; the processing unit 300 further includes a heat sink 303, a partition 304, and a motherboard M, where the heat sink 303 is disposed in a placement space formed by the epoxy board 302, the partition 304 separates adjacent heat sinks 303, and the motherboard M is disposed on the support 305.

Specifically, the main structure of the present invention includes a front panel 100, a rear panel 200, and a processing unit 300. Specifically, the controller includes a housing having a receiving space S, the housing further including a front panel 100 for adjustment and a rear panel 200 for wiring; and the processing unit 300 is arranged in the accommodating space S, so that the occurrence of faults can be simulated. Of course, the front panel 100 and the rear panel 200 are electrically connected to the processing unit 300, and further, the processing unit 300 further includes a tray 301, an epoxy board 302, a bracket 305, a heat sink 303, a partition 304, and a motherboard M; the two layers of epoxy plates 302 are arranged at intervals to form a placement space, the epoxy plates 302 at the bottom are arranged on the tray 301, and the epoxy plates 302 at the top are provided with the brackets 305. The heat sink 303 is disposed in a placement space formed by the epoxy board 302, the partition 304 separates adjacent heat sinks 303, and the motherboard M is disposed on the support 305, where it is noted that the motherboard M is an integrated circuit board, and components of a control circuit and circuits for establishing connection are disposed on the motherboard M. The epoxy board 302 is also called epoxy glass fiber board, and the molecular structure contains active epoxy groups, so that the epoxy board can be crosslinked with various curing agents to form insoluble and infusible high polymer with three-way network structure, and the epoxy resin is organic high polymer compound containing two or more epoxy groups in the molecule, and the relative molecular mass of the epoxy resin is not high except individual epoxy groups. The molecular structure of the epoxy resin is characterized in that the molecular chain contains active epoxy groups, and the epoxy groups can be positioned at the tail end, the middle or in a ring structure of the molecular chain. Because the molecular structure contains active epoxy groups, the epoxy groups can be subjected to crosslinking reaction with various curing agents to form insoluble and infusible high polymer with a three-dimensional network structure.

Further, the front panel 100 further includes an adjusting knob 101, an indicator light 102, and a switch 103, and the rear panel 200 further includes a network interface 201, a serial port 202, an input end 204 connection terminal 206, a power supply terminal 205, and a power switch 206, specifically, the adjusting knob 101 is used for shifting a fault transition resistance, the indicator light 102 corresponds to different gear resistance values and indicates a current state, the switch 103 includes a remote/cut/on-site switch, the gear resistance value corresponding to the indicator light 102 includes 0Ω,0.7Ω,2Ω,12Ω, 32Ω, and the fault transition resistance is set to metallic ground, low-resistance ground, medium-resistance ground, or high-resistance ground, the network interface 201 and the serial port 202 are connected to an external device, wherein the network interface 201 adopts an RJ45 model, the serial port 202 is RS232/485, the fault simulation cabinet supports local or remote operation, is set through a local knob or ethernet and other man-machine interface, and supports time synchronization through an IRIG-B code. The three-phase voltage is connected through the input end 204, and the input end 204 is an A-phase, B-phase and C-phase three-phase voltage input end; the rear panel 200 further includes a power supply terminal 205 and a power switch 206; and power supply terminal 205 is provided at L, N, G ends. And finally, simulation of different fault scenes is performed by matching between the position of the selected adjusting knob 101 and the selected connecting terminals 206, wherein 30 connecting terminals 206 are arranged, and 30 connecting terminals 206 are respectively connected with one ends of 30 resistors.

Referring to table 1, the terminal numbers and names of the front panel 100 are given.

Numbering device	Corresponding phase	Remarks
			1	A-N	A phase 0 omega, 0.7 omega, 2 omega, 12 omega, 32 omega fault transition resistance indicator lamp
2	A-N	A phase fault transition resistance adjusting knob
			3	B-N	B-phase 0 omega, 0.7 omega, 2 omega, 12 omega and 32 omega fault transition resistance indicator lamp
4	B-N	B-phase fault transition resistance adjusting knob
			5	C-N	C-phase 0 omega, 0.7 omega, 2 omega, 12 omega and 32 omega fault transition resistance indicator lamp
6	C-N	C-phase fault transition resistance adjusting knob
			7		Remote/cut/in-situ switch
8	A-B	A-B phase 0 omega, 0.7 omega, 2 omega, 12 omega, 32 omega fault transition resistance indicator lamp
			9	B-C	B-C phase 0 omega, 0.7 omega, 2 omega, 12 omega and 32 omega fault transition resistance indicator lamp
10	A-B	A-B phase fault transition resistance adjusting knob
			11	B-C	B-C phase fault transition resistance adjusting knob
12	A-C	A-C phase 0 omega, 0.7 omega, 2 omega, 12 omega, 32 omega fault transition resistance indicator lamp
			13	A-C	A-C phase fault transition resistance adjusting knob

Referring to table 2, the table corresponds to the X-phase terminal of the present example (X is a phase or B phase or C phase):

X-N phase knob position	Transition resistor (omega)	Indication lamp is lighted	Connecting terminal	Remarks
					0	Without any means for	Without any means for	Without any means for	Not grounded
1	0	0Ω	X-G1	X phase is grounded through 0 omega resistor
					2	0.7	0.7Ω	X-G2	X phase is grounded through 0.7 omega resistor
3	2	2Ω	X-G3	X phase is grounded through 2 omega resistor
					4	12	12Ω	X-G4	X phase is grounded through 12 omega resistor
5	32	32Ω	X-G5	X phase is grounded through a 32 omega resistor

Table 3 shows the correspondence table for the X-Y phase terminals of this example (X-Y phase is A-B phase or B-C or C-A phase):

X-Y phase knob position	Transition resistor (omega)	Indication lamp is lighted	Connecting terminal	Remarks
					0	Without any means for	Without any means for	Without any means for	Without any means for
1	0	0Ω	X-P1	X phase is connected to Y phase through 0 omega resistor
					2	0.7	0.7Ω	X-P2	X phase is connected to Y phase through 0.7 omega resistor
3	2	2Ω	X-P3	X phase is connected to Y phase through 2 omega resistor
					4	12	12Ω	X-P4	X phase is connected to Y phase through 12 omega resistor
5	32	32Ω	X-P5	X phase is connected to Y phase through 32 omega resistor

The fault controller in this embodiment includes main functional descriptions, for example:

In-situ control: the "remote/cut/in place" switch is set to "in place" and the "a-phase", "B-phase", "C-phase", "AB-phase", "BC-phase", "AC-phase" knobs on the panel are active.

The fault resistance adjusting knobs of the phase A, the phase B, the phase C, the phase AB, the phase BC and the phase AC are adjusted to different resistance values, so that different fault scenes (such as single-phase grounding, two-phase short-circuit faults, two-phase short-circuit grounding faults, three-phase short-circuit faults and three-phase short-circuit grounding faults) can be realized.

Remote control: setting the change-over switch to be 'far', setting the transition resistance on the panel to be invalid in operation, and setting related parameters to simulate different fault scenes through a dynamic simulation platform TCP.

Excision: when the "remote/cut/on-site" switch is set to "cut", either the "on-site" or "remote" control is used, all operations fail, the fault connection is broken, and the indicator light is turned off.

IGIR-B code pairs: the external time setting is carried out by the serial port RS485 and RS 485.

Specific examples are as follows:

the in-situ control can set the 'in-situ/cut/remote' change-over switch to be 'in-situ' through a panel operation knob, different fault scenes are realized through selecting 'A', 'B', 'C', 'AB', 'BC', 'AC' knobs, and the current state is indicated through an indicator lamp.

When a single-phase grounding fault mode needs to be simulated, taking an example of a grounding fault of an A phase through a resistor of 0 omega, the setting steps are as follows: first, the rotary "in-situ/cut/remote" switch is set to "in-situ"; and secondly, rotating the 'A phase' knob to set the '0 omega' resistor, and lighting a corresponding '0 omega' indicator lamp above the 'A phase' knob to realize a grounding fault scene of the 'A phase' through the '0 omega' resistor.

When a two-phase short-circuit fault mode needs to be simulated, taking an example of an AB phase short-circuit fault through a resistor of 0 omega, the setting steps are as follows: first, the rotary "in-situ/cut/remote" switch is set to "in-situ"; and secondly, rotating the 'AB phase' knob to set the '0 omega' resistor, and lighting a corresponding '0 omega' indicating lamp on the right side of the 'AB phase' knob to realize a 'AB phase' short circuit fault scene through the '0 omega' resistor.

When a two-phase short circuit ground fault mode needs to be simulated, namely, two-phase resistance short circuits and each single phase in the two phases is grounded, taking an example that an AB phase is short-circuited through a 0Ω resistor and A phase and B phase are grounded through a 0Ω resistor, the setting steps are as follows: first, the rotary "in-situ/cut/remote" switch is set to "in-situ"; secondly, rotating the 'AB phase' knob to set the '0 omega' resistor, and lighting a corresponding '0 omega' indicator lamp on the right side of the 'AB phase' knob to realize a short circuit fault scene of the 'AB phase' through the '0 omega' resistor; third, rotating the 'A phase' knob to set the '0 omega' resistance, and lighting a corresponding '0 omega' indicator lamp above the 'A phase' knob to realize a grounding fault scene of the 'A phase' through the '0 omega' resistance; and fourthly, rotating the 'B phase' knob to set the '0 omega' resistor, and lighting a corresponding '0 omega' indicator lamp above the 'B phase' knob to realize the 'B phase' grounding fault scene through the '0 omega' resistor.

When a three-phase short circuit fault mode needs to be simulated, taking an ABC phase short circuit fault through 0 omega resistor as an example, the setting steps are as follows: first, the rotary "in-situ/cut/remote" switch is set to "in-situ"; secondly, rotating the 'AB phase' knob to set the '0 omega' resistor, and lighting a corresponding '0 omega' indicator lamp on the right side of the 'AB phase' knob to realize a short circuit fault scene of the 'AB phase' through the '0 omega' resistor; thirdly, rotating the 'BC phase' knob to set the '0 omega' resistor, and lighting a corresponding '0 omega' indicator lamp on the right side of the 'BC phase' knob to realize a 'BC phase' short-circuit fault scene through the '0 omega' resistor; and fourthly, rotating the 'AC phase' knob to set the '0 omega' resistor, and lighting a corresponding '0 omega' indicating lamp on the right side of the 'AC phase' knob to realize a short circuit fault scene of the 'AC phase' through the '0 omega' resistor.

When a three-phase short circuit ground fault mode needs to be simulated, namely, three-phase resistors are short-circuited and each single-phase resistor in the three phases is grounded, taking an example that an ABC phase is short-circuited through a 0 omega resistor and an A phase, a B phase and a C phase are grounded through the 0 omega resistor, the setting steps are as follows: first, the rotary "in-situ/cut/remote" switch is set to "in-situ"; secondly, rotating the 'AB phase' knob to set the '0 omega' resistor, and lighting a corresponding '0 omega' indicator lamp on the right side of the 'AB phase' knob to realize a short circuit fault scene of the 'AB phase' through the '0 omega' resistor; thirdly, rotating the 'BC phase' knob to set the '0 omega' resistor, and lighting a corresponding '0 omega' indicator lamp on the right side of the 'BC phase' knob to realize a 'BC phase' short-circuit fault scene through the '0 omega' resistor; fourthly, rotating the 'AC phase' knob to set the '0 omega' resistor, and lighting a corresponding '0 omega' indicator lamp on the right side of the 'AC phase' knob to realize a short circuit fault scene of the 'AC phase' through the '0 omega' resistor; fifthly, rotating the 'A phase' knob to set the '0 omega' resistor, and lighting a corresponding '0 omega' indicator lamp above the 'A phase' knob to realize a grounding fault scene of the 'A phase' through the '0 omega' resistor; sixthly, rotating the 'B phase' knob to set as a '0 omega' resistor, and lighting a corresponding '0 omega' indicator lamp above the 'B phase' knob to realize a 'B phase' grounding fault scene through the '0 omega' resistor; seventh, the rotary C-phase knob is set to be 0 omega resistor, and a corresponding 0 omega indicating lamp above the C-phase knob is turned on, so that a grounding fault scene of the C-phase through the 0 omega resistor is realized

When remote control is needed, the 'on-site/cut/remote' change-over switch can be set as 'remote', and the 'A', 'B', 'C', 'AB', 'BC', 'AC' knobs on the panel are not effective to adjust; the 'on-site/cut-off/remote' change-over switch is rotated to be set as 'remote', different fault scenes are realized through the three-phase different fault modes set A, B, C by the TCP of the remote PC and started, and the current fault state is indicated by the indicator lamp.

Referring to fig. 8 to 13, a second embodiment of the present invention is different from the first embodiment in that: for the magnetic connector 400 provided in this embodiment, the quick installation and the disassembly of the magnetic connector 400 can be realized by a magnetic driving mode, and the plug is used at the power supply terminal 205 to realize the quick installation and the connection of the power supply on the controller. The power terminal of the existing controller is generally to insert the power plug into the power hole, and the two sides of the power plug are correspondingly provided with screw holes, when the power plug is inserted into the power hole, the screw holes on the two sides are aligned, and then the power plug and the power hole need to be screwed down by bolts on the two sides, so that the installation and the disassembly of the power plug are very complicated, and therefore, the embodiment provides the magnetic joint 400 convenient to install and disassemble. Specifically, the magnetic connector 400 includes a driving sleeve 401, a connector 402 and a plug 403, wherein the connector 402 and the plug 403 are symmetrically arranged in the inner structure part; the driving sleeve 401 is coaxially sleeved with the connector 402 and the plug 403, and can perform axial rotation and axial forward and backward movement, and the magnetic force acts on the driving connector 402 and the plug 403 to butt against each other, in this embodiment, the power supply terminal 205 is taken as an example, the connector 402 is arranged at the power supply terminal 205 and is electrically communicated with the internal components of the controller, the plug 403 can be connected with the output end of the external power supply, when the connector 402 and the plug 403 are butted against each other, the power supply of the controller is connected, and a person skilled in the art can easily find that the relative arrangement objects of the connector 402 and the plug 403 can be interchanged.

Further, the driving sleeve 401 of this embodiment further includes a middle bad block 401a, a sliding rod 401b, a stopper 401c, a magnetic ring 401d and a ring sleeve 401e. Specifically, the sliding rod 401b is arranged between the middle bad block 401a and the sliding rod 401b, a plurality of magnetic rings 401d are spliced for enhancing magnetic force, the magnetic rings 401d are arranged in the ring sleeve 401e for limiting and fixing, the magnetic rings 401d and the ring sleeve 401e are respectively provided with a communicated sliding hole 401d-1, and the sliding rod 401b passes through the sliding holes 401d-1 to realize the sliding of the magnetic rings 401d and the ring sleeve 401e on the sliding rod 401 b. In order to facilitate disassembly and assembly, the middle bad block 401a, the magnetic ring 401d and the ring sleeve 401e are arranged in a semi-open structure, and are assembled and disassembled in an opening and closing mode, and acting force in closing can be in a magnetic attraction mode, and the inner diameter of the middle bad block 401a is matched with the inner diameters of the connector 402 and the plug 403.

Referring to fig. 14-16, the joint 402 further includes an end 402a, a fixed sleeve 402b, an in-sleeve magnetic block 402c, a conductive sleeve 402d, and a blocking block 402e. Specifically, the end 402a includes an abutting end 402a-1 extending outwards and a circular truncated cone 402a-2 extending along an axial direction, the fixing sleeve 402b is sleeved on the extending circular truncated cone 402a-2, the end abuts against the abutting end 402a-1 to limit, and after the driving sleeve 401 is sleeved and installed, the limiting block 401c abuts against the abutting end 402a-1 to limit. The conductive sleeve 402d extends through the end 402a and outwardly in the direction of the circular boss 402 a-2. The in-sleeve magnetic block 402c is provided with a sliding hole for sliding the conductive sleeve 402d, so that the in-sleeve magnetic block 402c can slide in the fixed sleeve 402 b. Further, one of the sliding holes of the magnetic block 402c in the sleeve is provided with a nest 402c-1 extending outwards, the nest 402c-1 is sleeved on the conductive sleeve 402d, the nest 402c-1 is externally connected with a conductive column 402c-2, the inner diameter of the conductive column 402c-2 can be larger than the inner diameter of the conductive sleeve 402d, or the conductive column 402c-2 can be provided by length examples, so that the conductive column 402c-2 does not contact the conductive sleeve 402d during sliding, and the conductive column 402c-2, the conductive sleeve 402d and the nest 402c-1 are mutually conductive. Further, the inner magnetic block 402c is further integrally connected with a fastening block 402c-3, an elastic member 402c-4 and an inner magnetic ring 402c-5, which can slide along with the sliding of the inner magnetic block 402 c.

Specifically, the fastening block 402c-3 is provided with a notch 402c-6, one end of the fixing sleeve 402b is provided with a through port 402b-1 and a groove 402b-2, the groove 402b-2 is a fan-shaped groove with two symmetrical ends, two sides in the groove are provided with holes for the conductive column 402c-2 to go in and go out, and the center is provided with a spring hole for the elastic piece 402c-4 to extend out. The assembly relation is as follows: after the fixing sleeve 402b is sleeved, as shown in fig. 15 to 14, the fastening block 402c-3 corresponds to the through hole 402b-1 and can be freely moved in and out, the conductive column 402c-2 corresponds to the inner hole of the groove 402b-2 and is freely moved in and out, the center of the blocking block 402e is connected with the elastic member 402c-4 extending out, one end of the fixing sleeve 402b is limited, the elastic member 402c-4 is spring, and the elastic member is spring. And the block 402e can be rotated about the center by a certain angle. In this embodiment, in order to slide the conductive sleeve 402d, the blocking block 402e rotates relatively to close or leave the hole for the conductive post 402c-2 to go in and out. In this embodiment, the plugging block 402e further includes a guiding surface 402e-1 or a limiting pin 402e-2, where the guiding surface 402e-1 is correspondingly matched with the conductive column 402c-2, and since the limiting pin 402e-2 has an elastic return hook, when the limiting pin 402e-2 is inserted into the spring hole, the deformation is recovered, and the elastic return hook acts on the spring hole, so as to realize the limitation of the plugging block 402 e.

Referring to fig. 17 to 18, the plug 403 and the connector 402 have symmetrical assembly structures, so the plug 403 is provided with a structure corresponding to the connector 402. In a specific symmetrical relationship, referring to the illustration of fig. 18, when the plug 403 is mated with the connector 402, the symmetrical mating relationship and assembly process of each part are as follows: first, the conductive wires are connected to the plug 403 and the connector 402, respectively, and holes for the power supply wires are provided in the end 402a, and the electrical connection is achieved by the contact with the conductive sleeve 402 d. The driving sleeve 401 is sleeved on the outer surface of the fixed sleeve 402b, a magnetic force effect is provided between the magnetic force ring 401d of the outer ring and the inner magnetic force ring 402c-5 of the inner ring, the magnetic force which can be absorbed by the same polarity can drive the inner magnetic force ring 402c-5 to move inwards when the driving sleeves 401 on two sides move towards the middle, and the driving sleeve 401 can drive the inner magnetic force ring 402c-5 to rotate through rotating according to the partial magnetic force absorption traction, so that the abutting angle of the plug 403 and the connector 402 can be finely adjusted. When the inner magnetic rings 402c-5 are arranged symmetrically and gradually get close, the conductive posts 402c-2 are arranged symmetrically and gradually extend out to abut against the guide surface 402e-1 to prop the plugging block 402e open, so that the conductive posts 402c-2 and the clamping blocks 402c-3 extend out of the fixing sleeve 402b synchronously, the conductive posts 402c-2 gradually enter the conductive sleeve 402d to realize contact conduction, the clamping blocks 402c-3 extend out to expose the notch 402c-6, and the plugging block 402e which is abutted by the conductive posts 402c-2 and magnetically driven to rotate is inserted into the notch 402c-6 to limit, and therefore, when the matching is completed, the plugging block 402e is inserted into the notch 402c-6 only without rotation, the plug 403 and the connector 402 are always in a locked state, and thus the conductive connection between the plug 403 and the connector 402 is realized. On the contrary, when the disassembly is needed, the inner magnetic ring 402c-5 is driven to rotate reversely by magnetic force, the blocking block 402e leaves the notch 402c-6, and the restoring elastic force of the elastic piece 402c-4 is used for restoring the elastic piece, so that the whole assembly and disassembly process is completed.

The magnetic connector 400 moves towards the middle, then a certain angle is selected to realize the connection of wires and the mutual engagement of bayonets, and the functions of wiring and fixing are realized, and the magnetic connector 400 provided in the above embodiment is not limited to the illustration of the power supply terminal 205, and can be replaced to a plug port commonly used in the power distribution process of the controller, so that the power distribution test process is convenient to install and detach.

Referring to fig. 19 to 21, a third embodiment of the present invention is different from the previous embodiment in that: the main board M comprises a control module M-100, a control module M-200, a communication module M-300 and a response module M-400. Specifically, the control module M-100, the control module M-200, the communication module M-300 and the response module M-400 are mutually matched, so that the inter-phase short circuit fault and the ground fault of the distribution network small-current ground system, such as single-phase ground fault, two-phase short circuit ground fault, three-phase short circuit ground fault and other fault types, can be truly simulated, and the ground mode can be flexibly adjusted, wherein the control module M-100 can be used for selecting a ground fault control mode and fault types, and comprises a local component M-101, a remote component M-102 and an adjusting component M-103, the adjusting component M-103 is connected with one end of the local component M-101 and transmits a first signal, the other end of the local component M-101 and the remote component M-102 transmit a second signal to the control module M-200, and a non-ground system can be conveniently constructed through remote control of the local component M-101 and the remote component M-102, the first signal is an effective command signal regulated and controlled by the adjusting component M-103, the adjusting component M-103 is an adjusting processor, the second signal is a control phase, and the second signal is a control signal, and the phase B is an adjusting module, and an adjusting phase B-C phase C needs to be adjusted, and a knob phase B, and a phase B-phase B is required to be adjusted, and a phase adjusting module; the control module M-200 plays a role of processing and regulating the communication module M-300 and the response module M-400, is connected with the local component M-101 and the remote component M-102 of the control module M-100, is used for receiving the second signal, and is used for carrying out recognition processing according to the second signal to be converted into a third signal, the control module M-200 needs to recognize whether the second signal is received by the control module M-200 or is a signal sent by the local component M-101 or the remote component M-102, and carries out corresponding processing according to the signal, when the control module M-200 is used, only one of the local component M-101 and the remote component M-102 sends the second signal according to different selected fault control modes, wherein the control module M-200 is an MCU; the communication module M-300 is used for completing a communication function, can receive a third signal, and feeds back a fourth signal to the control module M-200 according to the third signal, wherein the third signal is an instruction signal for starting the communication module M-300, and the communication module M-300 and the control module M-200 adopt a bidirectional transmission mode to transmit signals; the response module M-400 plays roles of conveying, driving, displaying ground fault states and the like, is connected with the control module M-200, the communication module M-300 and the adjusting component M-103, and receives a fifth signal converted by fourth signal processing, wherein the fourth signal is a feedback signal from the communication module M-300 to the control module M-200, and the fifth signal is a signal fed back by the fourth signal processed by the control module M-200.

Further, the manipulation module M-100 further includes a cut-off component for disconnecting all operations so as to disable any operations, and it is to be noted that the local component M-101, the remote component M-102 and the cut-off component are all connected to the switch 103, and the local component M-101, the remote component M-102 and the cut-off component are respectively an in-situ processing circuit, a remote processing circuit and a cut-off processing circuit, when in use, a remote/cut-off/in-situ control mode is selected by the switch 103, and when the "remote/cut-off/in-situ" switch 103 is set as the local component M-101, the "a phase", "B phase", "C phase", "AB phase", "BC phase", "AC phase" knobs connected to the adjustment component M-103 are enabled, and the a phase, B phase, C phase, AB phase, BC phase, AC phase fault resistance adjustment knobs are adjusted to different resistance values, so that different fault scenarios (e.g., single phase ground fault, two phase ground fault, three phase ground fault) can be realized; when the remote/cut/in-situ switch 103 is set as the remote component M-102, the operation of the knobs of the phase A, the phase B, the phase C, the phase AB, the phase BC and the phase AC connected with the adjusting component M-103 is invalid, different fault scenes are simulated through the dynamic simulation platform TCP setup related parameters of the external P C motor simulation platform, the current fault state is indicated through the indication component M-404 of the response module M-400, wherein the TCP is a connection-oriented, reliable and byte stream-based transmission layer communication protocol; when the "remote/cut/on site" switch 103 is set to "cut", whether it is "on site" or "remote" control, all operations fail, breaking the fault connection.

Further, control module M-200 establishes a connection with local component M-101 and remote component M-102 of control module M-100 via third switch terminal bank N3 for transmitting a second signal to control module M-200, wherein third switch terminal bank N3 includes pin 1 (GND JD), pin 2 (GND YF), pin 3 (+12V), pin 4 (+2.5V), pin 5 (switcher) and pin 6 (GND), local component M-101 and remote component M-102 respectively correspond to pin 1 (GND JD) and pin 2 (GND YF) of third switch terminal bank N3, pin 1 (GND), pin 2 (GND YF) and pin 5 (switcher) respectively connect with PB1 (GND JD), pin 0 (GND YF) and PA4 (switcher) of control module M-200, i.e., the second signal of local component M-101 and remote component M-102 respectively connects with voltage (+2.5V) of control module M-200 via pin 1 (GND) and pin 1 (GND JD) of third switch terminal bank N3, pin 2 (GND) and pin 2 (GND YF) and pin 2 (GND) respectively, and pin 3+2.Xd2.3264 respectively stabilize voltage with voltage (+2V) and with the other pins 1 and 5 (GND) of control module M-200; while pins PA13 (SWDIO) and PA14 (SWCLK) of control module M-200 are connected to external jlink interface circuitry, which is used for program burn-in.

Referring to fig. 22 to 26, a fourth embodiment of the present invention is different from the previous embodiment in that: the response module M-400 comprises a driving circuit M-401, an electric control component M-402, an on-off component M-403 and an indication component M-404, wherein the driving circuit M-401, the electric control component M-402, the on-off component M-403 and the indication component M-404 are matched, and corresponding short circuit faults can be driven. Specifically, six response modules M-400 are provided, and each of the six response modules M-400 includes a driving circuit M-401, an electric control module M-402, an on-off module M-403, and an indication module M-404, where the driving circuit M-401 is used for implementing the functions of driving high level boost and reversely outputting low level, and is connected with the control module M-200, receives a fifth signal, and sends a sixth signal to the electric control module M-402, and it is noted that the fifth signal is a signal that the fourth signal is fed back through the control module M-200, and the sixth signal is a signal that the fifth signal is fed back through the processing of the driving circuit M-401, and the indication module M-404 is connected with the indication lamp 102, where the indication lamp 102 corresponds to different gear resistance values and indicates the current state.

Further, the six driving circuits M-401 each include a decoding chip M-401a, a first driving chip M-401b and a second driving chip M-401c, the first driving chip M-401b is used for driving high level boosting, the second driving chip M-401c is used for driving high level boosting and reversely outputting low level, the decoding chip M-401a is connected with the second driving chip M-401c through the first driving chip M-401b, and the received fifth signal is converted into a sixth signal through the first driving chip M-401b and the second driving chip M-401c for transmission, the control module M-200 includes pin PC0 (1A 0), pin PC1 (1A 1), pin PC2 (1A 2), pin PC3 (6A 0), pin PC4 (6A 1), pin PC5 (6A 2), pin PC6 (2A 0), pin PC7 (2A 1), pin PC8 (2A 2), pin PC9 (5A 0), pin PCM-10 (5A 1), pin PC11 (5A 2), pin PE0 (3A 0), pin PE1 (3A 1), pin PE2 (3A 2), pin PE3 (4A 0), pin PE4 (4A 1), pin PE5 (4A 2) and pin PD4 (E0), wherein pin PD4 (E0) is connected with pin E3 (E0) of six decoding chips M-401a, respectively, and pin PC0 (1A 0), pin PC1 (1A 1), pin PC2 (1A 2), pin PC3 (6A 0), pin PC4 (6A 1), pin PC5 (6A 2), pin PC6 (2A 0), pin PC7 (2A 1), pin PC8 (2A 2), pin PC9 (5A 0), pin PCM-10 (5A 1), pin PC11 (5A 2), pin PE0 (3A 0), pin PE1 (3A 1), pin PE2 (3A 2), pin PE3 (4A 0), pin PE4 (4A 1) and pin PE5 (4A 2) the three pins of 18 control modules M-200 are respectively connected with pin A0 (XA 0), pin A1 (XA 1) and pin A3 (XA 3) of six decoding chips M-401a (X is one value among 1,2,3, 4, 5 and 6); it should be noted that the decoding chip M-401a is a 3-8 decoder, and specifically, the models of the decoding chip M-401a, the first driving chip M-401b and the second driving chip M-401c are SN74HCT138PW, SN74LSO4DR and ULNM-2003L, respectively.

Further, the electric control module M-402 receives the sixth signal of the second driving chip M-401C and the adjusting module M-103 through the first switching terminal row N1, recognizes the sixth signal according to the seventh signal converted by the first signal processing, and sends a response signal according to the sixth signal and the seventh signal, the seventh signal is an instruction signal sent to the electric control module M-402 through the processing of the adjusting module M-103, wherein the first switching terminal row N1 is provided with two, the "a phase", "B phase", "C phase", "AB phase", "BC phase", "AC phase" of the adjusting module M-103 are respectively provided with 0 Ω, 0.7 Ω,2Ω, 12Ω, 32Ω shift positions, the pins OUI1 (YKX 1), the pins OUI2 (YKX 2), the OUI3 (YKX 3), the pins OUI4 (YKX 4) and the pins 3 (YKX 5) of the electric control module M-401C are respectively connected with the two corresponding terminals of the first switching module M-402 and the two switching module M-402, and the two switching terminal groups are respectively connected with the two switching terminal groups of the two switching module M-402, and the two switching terminal groups are respectively 30 to the two switching terminal groups are respectively connected with the two switching terminal groups of the two switching module M-402.

Further, the on-off component M-403 can receive the response signal, and send a fault state signal to the network port component M-301 of the communication module M-300 according to the response signal, and simultaneously send an indication signal to the indication component M-404; in addition, three-phase voltages are connected through the input end 204, the input end 204 is connected with the on-off component M-403 of the response module M-400, the on-off component M-403 is connected with one end of an external fault transition resistor through the connecting terminal 206, the other end of the on-off component M-403 is grounded, M-30 on-off components (corresponding to S _X1、S_X2、S_X3、S_X4 and S _X5 in the figure, X is one of values of 1,2, 3, 4, 5 and 6), pins 1 of the M-30 on-off components M-403 are respectively connected with M-30 ports of the corresponding first switching terminal row N1, and the on-off component M-403 is connected with the electric control component M-402 through a second switching terminal row N2; it should be noted that, the on-off component M-403 is an ac contactor, and functions as a switch, so as to truly simulate various types of inter-phase short circuit faults and ground faults.

Taking YK6_1 as an example, the Y1 is firstly gated by a decoding chip M-401a (SN 74HCT138 PW) of the driving circuit M-401, the level is raised to 5V by a first driving chip M-401b, then the level is raised to 12V by a second driving chip M-401c and is reversed, YK6_1 is controlled to output a low level, 3 and 4 of the electric control component M-402 are attracted, namely contactor6_1 of the second switching terminal row N2 is connected with 2M-20V_6 of the electric control component M-402, so that the on-off component M-403 is controlled to be closed (namely S ₆₁ is closed), and the corresponding indicator lamp of the indicator component M-404 is lightened.

Referring to fig. 27 and 28, a fifth embodiment of the present invention is different from the above embodiments in that: the network interface 201 and the serial port 202 are respectively connected with a serial port component M-302 and a network port component M-301 of the communication module M-300 through a fourth switching terminal row N4, the network interface 201 and the serial port 202 are particularly remotely controlled, various fault scenes, grounding scenes, program upgrading, fault state signals and the like are set through the network port component M-301, and the network port component M-301 is used for an external GPS time setting device to time through IRIG-B, so that the main clock is kept synchronous; one end of each of the serial port component M-302 and the network port component M-301 is connected with the control module M-200, the other end of each of the serial port component M-302 and the network port component M-301 is respectively connected with the GPS time setting device of the external equipment and the PC through the fourth switching terminal row N4, and it is noted that the serial port component M-302 is connected with the pin 11 (2-485-), the pin 12 (2-485+), the pin 13 (1-485-) and the pin 14 (1-485+), of the fourth switching terminal row N4.

Further, the serial port component M-302 includes a third driving chip M-302a, a first transceiver chip M-302b and a second transceiver chip M-302c, the third driving chip M-302a can receive a third signal of the control module M-200 and establish connection with the first transceiver chip M-302b and the second transceiver chip M-302c, wherein the third driving chip M-302a plays a role in driving isolation, pins VIA (TXD 2), VOC (RXD 2), VIB (TXD 1) and VOD (RXD 2) of the third driving chip are connected with pins PA1 (TXD 2), PA2 (RXD 2), PA9 (TXD 1) and PAM-10 (RXD 2) of the control module M-200, the third driving chip M-302a is ADUM M-402 driving chip, and the first transceiver chip M-302b and the second transceiver chip M-302c are all 485 MAX13488 chips (485 chips).

The network port component M-301 comprises a network card chip M-301a and a network transformer M-301b, one end of the network card chip M-301a is connected with the control module M-200, the other end is connected with an external PC through the network transformer M-301b, it is noted that the model of the network card chip M-301a is DM9000A1, the pins SD 0-15 (DB 0-15) 15 are respectively connected with the pins PD 14-15 (DB 0-1), PD 0-1 (DB 2-3), PE 7-15 (DB 4-12) and PD 8-M-10 (DB 13-15) 15 of the control module M-200, pins CMD (A0), INT (NETINT), IOR (OE), IOW (WE), CS (CSI) and PWRST (NETRST) of the network card chip M-301a are respectively connected with pins PD11 (A0), PB11 (NETINT), PD4 (OE), PD5 (WE), PD7 (CSI) and PA8 (NETRST) of the control module M-200, a network transformer M-301b is H1M-102 (M-10M/M-100M), wiring TIN-, TIN+, TO+ and TO-are respectively connected with pins 3 (TIN-), 4 (TIN+), 5 (TO+) and 6 (TO-) of the fourth switching terminal row N4, preferably, an electrostatic protection component M-301c is further arranged between the network transformer M-301b and the fourth switching terminal row N4, the voltage stabilizing and protecting circuit is realized.

Referring to fig. 29, a sixth embodiment of the present invention is different from the above embodiments in that: the main structure further comprises a power module M-500, which plays a role in converting voltage, so that the voltage conveyed by the power module M-500 is suitable for the operation module M-100, the control module M-200, the communication module M-300 and the response module M-400, and therefore the operation module M-100, the control module M-200, the communication module M-300 and the response module M-400 can operate, and the power supply terminal 205 is required to be connected with the power module M-500. specifically, the power module M-500 is configured to supply power to the control module M-100, the control module M-200, the communication module M-300 and the response module M-400, and comprises a first conversion component M-501, a second conversion component M-502, a third conversion component M-503 and a power isolation component M-504, wherein the first conversion component M-501, the second conversion component M-502, the third conversion component M-503 and the power isolation component M-504 are all conversion circuits, and play roles of voltage reduction and power isolation, and further the first conversion component M-501 comprises a K7805-M-1000 chip and elements (resistors), Capacitance, etc.), the circuit formed by the K7805-M-1000 chip and the components can realize voltage reduction, the input 12V voltage can be converted into 5V voltage to be output, the output 5V voltage is respectively transmitted to the second conversion component M-502 and the first driving chip M-401b and the second driving chip M-401c of the driving circuit M-401 to be used, and the second conversion component M-502, the first driving chip M-401b and the second driving chip M-401c are connected in parallel; The second conversion component M-502 comprises an AMS1117-3.3 chip and elements (resistors, capacitors and the like), a circuit formed by the elements and the AMS1117-3.3 chip plays a role in stabilizing and reducing voltage, the input 5V voltage can be converted into 3.3V voltage and output, the output 3.3V voltage is respectively transmitted to the third conversion component M-503, the control module M-200, the communication module M-300 and the response module M-400 for use, and the third conversion component M-503, the control module M-200, the communication module M-300 and the response module M-400 are mutually connected in parallel; the third conversion component M-503 comprises a U_TL431 chip and elements (resistor, capacitor and the like), the circuit formed by the elements and the U_TL431 chip plays a role in stabilizing and reducing voltage, the U_TL431 is a controllable precise voltage stabilizing source, 3.3V voltage can be converted into 2.5V voltage to be output, and the output 2.5V voltage is respectively transmitted to the control module M-200 and the network transformer M-301b response module M-400 of the network port component M-301 for use; The third conversion component M-503, the control module M-200, the communication module M-300 and the response module M-400 are mutually connected in parallel, and the power isolation component M-504 is used for isolating digital power and analog power from digital ground.

Referring to fig. 30 to 33, a seventh embodiment of the present invention is different from the above embodiments in that: the fan control 203 is connected with the fan 306 through the temperature control module M-600, the opening of the fan control 203 can be adjusted, the temperature control module M-600 comprises a detection component M-601 and a heat dissipation component M-602, the detection component M-601, the heat dissipation component M-602 and the control module M-200 are mutually matched, automatic cooling can be achieved, specifically, the temperature control module M-600 comprises the detection component M-601 and the heat dissipation component M-602, the detection component M-601 is used for detecting temperature information of each module, the temperature information is connected with the control module M-200, and the temperature information is sent to the control module M-200; the control module M-200 is internally preset with a temperature threshold value, the detected temperature information is compared with the temperature threshold value, the heat dissipation assembly M-602 is connected with the response module M-400 through the control module M-200, the circuit on-off of the heat dissipation assembly M-602 is controlled according to different comparison results, and specifically, when the detected temperature information is greater than the temperature threshold value, the heat dissipation assembly M-602 is powered on, and the heat dissipation assembly M-602 corresponding to each module starts heat dissipation; when the detected temperature information is smaller than the temperature threshold, the heat dissipating component M-602 is not powered on, and it should be noted that the connector NT1 and the connector NT2 of the detecting component M-601 are correspondingly connected to the pin PA5 (NT 1) and the pin PA4 (NT 2) of the control module M-200, respectively, preferably, the detecting component M-601 is a temperature sensor, and the heat dissipating component M-602 is a fan driving circuit.

Further, the heat dissipation component M-602 is connected with the response module M-400 through the control module M-200, specifically, the detection component M-601 is used for detecting temperature information of each module, the detection component M-601 is connected with the control module M-200 to play a role of detecting the on-off detection component M-601 and judging whether the temperature of each module is greater than a set temperature threshold value, the control module M-200 is connected with the driving circuit M-401 of the response module M-400 to play a role of driving and reversing level, the control module M-200 is connected with the second driving chip M-401c of the driving circuit M-401, the second driving chip M-401c is connected with the electric control component M-402, and the connection circuit is switched according to the level, the electric control component M-402 is connected with the heat dissipation component M-602 through the on-off component M-403, and finally the effect of the on-off heat dissipation component M-602 is achieved according to the on-off component M-403 of the electric control component M-402, and it is to be noted that the pin PB8 (FAN 1) and the pin PB9 (FAN 2) of the control module M-200 are connected with the pin IN6 (FAN 1) and the pin IN7 (FAN 2) of the second driving chip M-401c of the response module M-400, the pin OUT7 (FANB) and the pin OUT6 (FANA) of the second driving chip M-401c are respectively connected with the electric control component M-402 of the connector FANB and the connector FANA, the connector FANB1, the connector FANB, the connector FANA1 and the connector FANA2 of the electric control component M-402 are correspondingly connected with the pin 4 (FANB) of the fifth switching terminal row, the pin 3 (FANB), the pin 6 (FANA 1) and the pin 5 (FANA 2) are connected, the wiring port of the fifth switching terminal row is connected with the on-off component M-403, the on-off component M-403 is connected with the heat dissipation component M-602, the on-off component M-403 is a contactor, the electric control component M-402 is a relay, and the second driving chip M-401c is a ULNM-2003L driving chip.

It is important to note that the construction and arrangement of the application as shown in the various exemplary embodiments is illustrative only. Although only a few embodiments have been described in detail in this disclosure, those skilled in the art who review this disclosure will readily appreciate that many modifications are possible (e.g., variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters (e.g., temperature, pressure, etc.), mounting arrangements, use of materials, colors, orientations, etc.) without materially departing from the novel teachings and advantages of the subject matter described in this application. For example, elements shown as integrally formed may be constructed of multiple parts or elements, the position of elements may be reversed or otherwise varied, and the nature or number of discrete elements or positions may be altered or varied. Accordingly, all such modifications are intended to be included within the scope of present application. The order or sequence of any process or method steps may be varied or re-sequenced according to alternative embodiments. In the claims, any means-plus-function clause is intended to cover the structures described herein as performing the recited function and not only structural equivalents but also equivalent structures. Other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the exemplary embodiments without departing from the scope of the present applications. Therefore, the application is not limited to the specific embodiments, but extends to various modifications that nevertheless fall within the scope of the appended claims.

Furthermore, in an effort to provide a concise description of the exemplary embodiments, all features of an actual implementation may not be described (i.e., those not associated with the best mode presently contemplated for carrying out the invention, or those not associated with practicing the invention).

It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure.

It should be noted that the above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present invention may be modified or substituted without departing from the spirit and scope of the technical solution of the present invention, which is intended to be covered in the scope of the claims of the present invention.

Claims

1. The utility model provides a simulation fault device with control by temperature change which characterized in that: comprising a housing with a receiving space (S), the housing comprising a front panel (100) for adjustment and a rear panel (200) for wiring, the rear panel (200) comprising a power supply terminal (205) and a power switch (206); and the power supply terminal (205) is arranged at L, N, G ends; and a processing unit (300) is arranged in the accommodating space (S) and can simulate the occurrence of faults;

The power supply terminal (205) is provided with a magnetic joint (400); the magnetic joint (400) comprises a driving sleeve (401), a joint (402) and a plug (403), wherein the joint (402) and the plug (403) are symmetrically arranged in the inner structure part; the driving sleeve (401) is coaxially sleeved with the connector (402) and the plug (403) and can perform axial rotation and axial forward and backward movement;

The driving sleeve (401) comprises a middle ring block (401 a), a sliding rod (401 b), a limiting block (401 c), a magnetic force ring (401 d) and a ring sleeve (401 e); the sliding rod (401 b) is arranged between the middle ring block (401 a) and the limiting block (401 c), a plurality of magnetic rings (401 d) are spliced for enhancing magnetic force and are arranged in the ring sleeve (401 e) for limiting and fixing, the magnetic rings (401 d) and the ring sleeve (401 e) are respectively provided with a communicated sliding hole (401 d-1) correspondingly, and the sliding rod (401 b) penetrates through the sliding holes (401 d-1) to realize sliding of the magnetic rings (401 d) and the ring sleeve (401 e) on the sliding rod (401 b);

The joint (402) comprises an end part (402 a), a fixed sleeve (402 b), an in-sleeve magnetic block (402 c), a conductive sleeve (402 d) and a blocking block (402 e); the end part (402 a) comprises an outward extending abutting end (402 a-1) and a round table (402 a-2) extending along the axial direction, the fixed sleeve (402 b) is sleeved on the extending round table (402 a-2), the tail end of the fixed sleeve (402 b) abuts against the abutting end (402 a-1) to limit, and after the driving sleeve (401) is sleeved and installed, the limiting block (401 c) abuts against the abutting end (402 a-1) to limit; the conductive sleeve (402 d) penetrates through the end part (402 a) and extends outwards along the direction of the round table (402 a-2); a sliding hole for sliding the conductive sleeve (402 d) is formed in the sleeve inner magnetic block (402 c), so that the sleeve inner magnetic block (402 c) can slide in the fixed sleeve (402 b); a nested sleeve (402 c-1) is arranged on one sliding hole of the magnetic block (402 c) in the sleeve in an outward extending way, the nested sleeve (402 c-1) is sleeved on the conductive sleeve (402 d), and the nested sleeve (402 c-1) is externally connected with the conductive column (402 c-2);

The clamping block (402 c-3), the elastic piece (402 c-4) and the inner magnetic ring (402 c-5) are integrally connected with the inner magnetic block (402 c) of the sleeve, and can slide relatively along with the sliding of the inner magnetic block (402 c) of the sleeve;

A notch (402 c-6) is arranged on the clamping block (402 c-3), a through port (402 b-1) and a groove (402 b-2) are arranged at one end of the fixed sleeve (402 b), the groove (402 b-2) is a fan-shaped groove with two symmetrical ends, holes for the conductive column (402 c-2) to go in and go out are arranged at two sides in the groove, and a spring hole for the elastic piece (402 c-4) to extend out is arranged at the center of the groove (402 b-2); the assembly relation is as follows: after the fixing sleeve (402 b) is sleeved, the clamping blocks (402 c-3) are corresponding to the through openings (402 b-1) and can freely enter and exit, the conductive columns (402 c-2) are corresponding to the inner holes of the grooves (402 b-2) and freely enter and exit, the centers of the plugging blocks (402 e) are connected with the elastic pieces (402 c-4) which extend out, one end of the fixing sleeve (402 b) is limited, the elastic pieces (402 c-4) are limited to pop out; the plugging block (402 e) can rotate around the center by a certain angle; the plug (403) and the joint (402) have symmetrical assembly structures;

The processing unit (300) comprises a radiator (303), a partition board (304) and a main board (M), wherein the radiator (303) is arranged in a placement space formed by an epoxy board (302), a support (305) is arranged on the epoxy board (302) at the top, the partition board (304) separates adjacent radiators (303), and the main board (M) is arranged on the support (305);

The main board (M) comprises a control module (M-100), a control module (M-200), a communication module (M-300) and a response module (M-400), wherein the control module (M-100) comprises a local component (M-101), a remote component (M-102) and an adjusting component (M-103), one end of the local component (M-101) is connected with the adjusting component (M-103) and transmits a first signal, and the other end of the local component (M-101) and the remote component (M-102) transmit a second signal to the control module (M-200); the control module (M-200) is connected with the control module (M-100) and is used for receiving the second signal, identifying the second signal and converting the second signal into a third signal; the communication module (M-300) is capable of receiving the third signal and feeding back a fourth signal to the control module (M-200) according to the third signal; the response module (M-400) is connected with the control module (M-200), the communication module (M-300) and the adjusting component (M-103), the response module (M-400) receives the fifth signal converted by the fourth signal processing, and the temperature control module (M-600) is connected with the control module (M-200) and is used for receiving the third signal, detecting temperature information of each module and responding to the temperature information.

2. The simulated fault device with temperature control of claim 1 wherein: the temperature control module (M-600) comprises a detection component (M-601) and a heat dissipation component (M-602), wherein the detection component (M-601) detects temperature information of each module, establishes connection with the control module (M-200) and sends the temperature information to the control module (M-200); the temperature threshold value is preset in the control module (M-200), the temperature information is compared with the temperature threshold value, and the circuit on-off of the heat radiation assembly (M-602) is controlled according to different comparison results.

3. The simulated fault device with temperature control of claim 2 wherein: the front panel (100) comprises an adjusting knob (101), an indicator lamp (102) and a change-over switch (103);

the adjusting knob (101) is used for shifting a fault transition resistor, the indicator lamp (102) corresponds to different gear resistance values and indicates the current state, and the change-over switch (103) comprises a remote/cut-off/local change-over switch;

The adjusting knob (101) is connected with the adjusting component (M-103), and the change-over switch (103) is connected with the local component (M-101), the remote component (M-102) and the cutting component.

4. A simulated fault device with temperature control as claimed in claim 3 wherein: the rear panel (200) further comprises a network interface (201), a serial port (202), an input end (204) and a wiring terminal (207);

the network interface (201) and the serial port (202) are respectively connected with a serial port component (M-302) and a network port component (M-301) of the communication module (M-300) through a fourth switching terminal row (N4), the network interface (201) and the serial port (202) are connected with external equipment, three-phase voltage is accessed through the input end (204), the input end (204) is connected with an on-off component (M-403) of the response module (M-400), and the on-off component (M-403) is connected with an external fault transition resistor through the wiring terminal (207).

5. The simulated fault device with temperature control of claim 4 wherein: the serial port assembly (M-302) comprises a third driving chip (M-302 a), a first transceiver chip (M-302 b) and a second transceiver chip (M-302 c), wherein the third driving chip (M-302 a) can receive a third signal of the control module (M-200) and is connected with the first transceiver chip (M-302 b) and the second transceiver chip (M-302 c).

6. The simulated fault device with temperature control of claim 5 wherein: the response module (M-400) further comprises a driving circuit (M-401) and an electric control component (M-402), wherein the driving circuit (M-401) is connected with the control module (M-200), receives the fifth signal and sends a sixth signal to the electric control component (M-402).

7. The simulated fault device with temperature control of claim 6 wherein: the driving circuit (M-401) comprises a decoding chip (M-401 a), a first driving chip (M-401 b) and a second driving chip (M-401 c), wherein the decoding chip (M-401 a) is connected with the second driving chip (M-401 c) through the first driving chip (M-401 b), and receives a fifth signal, and the fifth signal is converted into a sixth signal to be transmitted through the first driving chip (M-401 b) and the second driving chip (M-401 c).

8. The simulated fault device with temperature control of claim 7 wherein: the electric control component (M-402) receives a sixth signal of the second driving chip (M-401 c) through the first switching terminal block (N1) and the regulating component (M-103) processes the converted seventh signal according to the received first signal, identifies the seventh signal and sends a response signal according to the sixth signal and the seventh signal.

9. The simulated fault device with temperature control of claim 8 wherein: the on-off assembly (M-403) can receive the response signal and send a fault state signal to the network port assembly (M-301) of the communication module (M-300) and the indication assembly (M-404) of the response module (M-400) according to the response signal.

10. The simulated fault device with temperature control of claim 9 wherein: the indicating component (M-404) is connected with the indicating lamp (102), and the indicating lamp (102) corresponds to different gear resistance values and indicates the current state.