CN209927954U - Fault control equipment with temperature control detection - Google Patents
Fault control equipment with temperature control detection Download PDFInfo
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- CN209927954U CN209927954U CN201920013739.4U CN201920013739U CN209927954U CN 209927954 U CN209927954 U CN 209927954U CN 201920013739 U CN201920013739 U CN 201920013739U CN 209927954 U CN209927954 U CN 209927954U
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Abstract
The utility model discloses a fault control device with temperature control detection, which comprises a shell with a containing space, a front panel for adjustment and a back panel for wiring; a processing unit is arranged in the accommodating space, so that the occurrence of faults can be simulated; the processing unit further comprises a radiator, a partition plate and a main board, wherein the radiator is arranged in a placing space formed by the epoxy boards, the partition plate partitions the adjacent radiators, and the main board is arranged on the support; the utility model discloses mainly simulate distribution network undercurrent ground system alternate short-circuit fault and earth fault, can reflect the physical process and the phenomenon of former system more directly perceivedly, adopt the physics movable mould more directly perceived, effective to undercurrent ground system's fault signature's research, can adjust the ground connection mode in a flexible way, can establish ungrounded system very conveniently through local switch operation or remote protocol remote control.
Description
Technical Field
The utility model relates to a fault control equipment technical field especially relates to a fault control equipment with control by temperature change detects.
Background
Because the performance of the protection equipment is generally difficult to study by fault experiments due to the requirement of safe and stable operation on the actual power distribution network, the establishment of a power supply line for simulating the power distribution network to carry out the fault simulation experiments is an effective way for carrying out power distribution network protection study and protection equipment test.
The faults of the power distribution network are random and uncontrollable, so that the research on the protection of the power distribution network usually needs a large amount of fault researches of different positions and different types to better master the fault characteristics of the power distribution network, wherein the fault phase angle of voltage is an important parameter of an electrical fault, and the impacts generated by different fault phase angles on electrical equipment are different; on the other hand, short circuit, open circuit and earth fault are common faults of the power distribution network, the simulation of the faults is indispensable in a fault simulation experiment, and for the earth fault, different grounding positions can cause different types of earth faults, wherein arc grounding is a more serious fault, and the design of a device which can simulate various faults into a whole and simulate corresponding faults under a set fault phase angle according to requirements is difficult.
SUMMERY OF THE UTILITY MODEL
This section is for the purpose of summarizing some aspects of embodiments of the invention and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and in the abstract of the specification and the title of the application to avoid obscuring the purpose of this section, the abstract of the specification and the title of the application, and such simplifications or omissions are not intended to limit the scope of the invention.
In view of the above-mentioned problem that has the fault control equipment that control by temperature change detected now to exist, provided the utility model discloses.
Therefore, the utility model aims at providing a fault control equipment with control by temperature change detects, its alternate short-circuit fault of this device main simulation distribution network undercurrent ground connection system and earth fault can reflect former system's physical process and phenomenon more directly perceivedly, adopt the physics movable mould more directly perceived, effective to undercurrent ground connection system's fault signature's research, can adjust the ground connection mode in a flexible way, can found ungrounded system very conveniently through local switch operation or remote protocol remote control.
In order to solve the technical problem, the utility model provides a following technical scheme: a fault control device with temperature control detection comprises a shell with an accommodating space, a front panel for adjustment and a rear panel for wiring, wherein the shell comprises a front panel and a rear panel; a processing unit is arranged in the accommodating space, so that the occurrence of faults can be simulated; the processing unit further comprises a radiator, a partition plate and a main board, wherein the radiator is arranged in a placing space formed by the epoxy boards, the partition plate partitions the adjacent radiators, and the main board is arranged on the support; the main board comprises a control module, a communication module and a response module, wherein the control module comprises a local component, a remote component and an adjusting component, one end of the local component is connected with the adjusting component and sends a first signal, and the other end of the local component and the remote component send a second signal to the control module; the control module is connected with the control module and used for receiving the second signal and identifying and processing the second signal to convert the second signal into a third signal; the communication module can receive the third signal and feed back a fourth signal to the control module according to the third signal; the response module is connected with the control module, the communication module and the adjusting component, and receives the fifth signal converted by the fourth signal processing.
The utility model has the advantages that: the utility model has the advantages of being scientific and reasonable in design, this device mainly simulates alternate short-circuit fault and earth fault of distribution network undercurrent ground system, like single-phase earth fault, double-phase short-circuit ground fault, three-phase short-circuit fault, fault type such as three-phase short-circuit ground fault, can reflect the physical process and the phenomenon of former system more directly perceivedly, adopt the research of physics movable mould to undercurrent ground system's fault signature more directly perceived, effective, can adjust the ground connection mode in a flexible way, can found ungrounded system very conveniently through local switch operation or remote protocol remote control.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor. Wherein:
fig. 1 is a schematic view of an overall structure of a fault controller according to a first embodiment of the fault control device with temperature control detection according to the present invention;
fig. 2 is a schematic view of an overall structure of a housing space in a fault controller according to a first embodiment of the fault control device with temperature control detection of the present invention;
fig. 3 is a schematic view of the overall structure of the fault controller with the upper cover removed according to the first embodiment of the fault control device with temperature control detection of the present invention;
fig. 4 is a schematic view of the overall structure of the control unit according to the first embodiment of the fault control device with temperature control detection according to the present invention;
fig. 5 is a schematic structural diagram of a heat sink according to a first embodiment of the fault control device with temperature control detection of the present invention;
fig. 6 is a schematic view of the overall structure of the front panel according to the first embodiment of the fault control device with temperature control detection according to the present invention;
fig. 7 is a schematic view of the overall structure of the rear panel according to the first embodiment of the fault control device with temperature control detection of the present invention.
Fig. 8 is a schematic circuit diagram of a second embodiment of the fault control device with temperature control detection according to the present invention.
Fig. 9 is a schematic structural view of a third switching terminal block according to a second embodiment of the fault control device with temperature control detection of the present invention.
Fig. 10 is a schematic structural diagram of a control module according to a second embodiment of the fault control device with temperature control detection according to the present invention.
Fig. 11 is a schematic structural diagram of a driving circuit according to a third embodiment of the fault control device with temperature control detection of the present invention.
Fig. 12 is a schematic structural view of a first switching terminal block according to a third embodiment of the fault control device with temperature control detection according to the present invention.
Fig. 13 is a schematic structural view of a second switching terminal block according to a third embodiment of the fault control device with temperature control detection of the present invention.
Fig. 14 is a schematic structural diagram of an electric control assembly according to a third embodiment of the fault control device with temperature control detection according to the present invention.
Fig. 15 is a schematic structural diagram of an indicating assembly according to a third embodiment of the fault control device with temperature control detection of the present invention.
Fig. 16 is a schematic diagram of a connection structure of a serial port module according to a fourth embodiment of the fault control device with temperature control detection of the present invention.
Fig. 17 is a schematic structural diagram of a network port assembly according to a fourth embodiment of the fault control device with temperature control detection of the present invention.
Fig. 18 is a schematic structural diagram of a power module according to a fifth embodiment of the fault control device with temperature control detection of the present invention.
Fig. 19 is a schematic view of the temperature control module according to the sixth embodiment of the fault control device with temperature control detection according to the present invention.
Fig. 20 is a schematic structural diagram of a detection assembly according to a sixth embodiment of the fault control device with temperature control detection of the present invention.
Fig. 21 is a schematic structural diagram of an electric control assembly according to a sixth embodiment of the fault control device with temperature control detection of the present invention.
Fig. 22 is a schematic structural view of a fifth switching terminal block according to a sixth embodiment of the fault control device with temperature control detection of the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments accompanying the present invention are described in detail below with reference to the accompanying drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be implemented in other ways different from the specific details set forth herein, and one skilled in the art may similarly generalize the present invention without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
Furthermore, the references herein to "one embodiment" or "an embodiment" refer to a particular feature, structure, or characteristic that may be included in at least one implementation of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.
Furthermore, the present invention will be described in detail with reference to the drawings, and in the detailed description of the embodiments of the present invention, for convenience of illustration, the sectional view showing the device structure will not be enlarged partially according to the general scale, and the drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
Referring to fig. 1 to 7, for a first embodiment of the present invention, an overall structure schematic diagram of a fault control device with temperature control detection is provided, as shown in fig. 1, the fault control device with temperature control detection includes a housing having an accommodating space S, the housing further includes a front panel 100 for adjustment and a rear panel 200 for wiring; the processing unit 300 is arranged in the accommodating space S, so that the occurrence of faults can be simulated; the processing unit 300 further includes a heat sink 303, a partition 304, a fan 306, and a motherboard M, wherein the heat sink 303 is disposed in the placement space formed by the epoxy board 302, the partition 304 separates adjacent heat sinks 303, and the motherboard M is disposed on the bracket 305; the fan 306 is disposed on the side of the heat sink 303.
Specifically, the main structure of the present invention includes a front panel 100, a rear panel 200, and a processing unit 300. Specifically, the controller includes a housing having an accommodating space S, the housing further including a front panel 100 for adjustment and a rear panel 200 for wiring; and the processing unit 300 is arranged in the accommodating space S, so that the occurrence of faults can be simulated. Of course, the front panel 100 and the rear panel 200 are electrically connected to the processing unit 300 through an electrical circuit, and further, the processing unit 300 further includes a tray 301, an epoxy board 302, a bracket 305, a heat sink 303, a partition 304, and a main board M; the two layers of epoxy boards 302 are arranged at intervals to form a placing space, the epoxy board 302 at the bottom is arranged on the tray 301, and the epoxy board 302 at the top is provided with a support 305. The heat sink 303 is disposed in the placement space formed by the epoxy board 302, the partition 304 separates adjacent heat sinks 303, and the motherboard M is disposed on the bracket 305, where it should be noted that the motherboard M is an integrated circuit board on which components of the control circuit and lines for establishing connection are disposed. The epoxy board 302 is also called epoxy glass fiber board, and the molecular structure contains active epoxy groups, so that the epoxy board and the curing agent can generate cross-linking reaction to form insoluble and infusible high polymer with a three-dimensional network structure, the epoxy resin is an organic high polymer compound containing two or more epoxy groups in the molecule, and the relative molecular mass of the epoxy resin is not high except individual ones. The molecular structure of the epoxy resin is characterized in that a molecular chain contains active epoxy groups, and the epoxy groups can be positioned at the tail ends, in the middle or in a ring structure. Because the molecular structure contains active epoxy group, they can produce cross-linking reaction with several curing agents to form insoluble and infusible high polymer with three-dimensional network structure.
Further, the front panel 100 further includes an adjusting knob 101, an indicator light 102, and a switch 103, and the rear panel 200 further includes a network interface 201, a serial port 202, a fan control 203, an input terminal 204, and a connection terminal 206, specifically, the adjusting knob 101 is used for shifting a fault transition resistor, the indicator light 102 corresponds to different gear resistance values and indicates a current state, the switch 103 includes a remote/cut/local switch, the gear resistance values corresponding to the indicator light 102 include 0 Ω, 0.7 Ω, 2 Ω, 12 Ω, and 32 Ω, and the fault transition resistor is set to metallic ground, low-impedance ground, medium-impedance ground, or high-impedance ground, the network interface 201 and the serial port 202 and external devices, wherein the network interface 201 adopts RJ45 model, and the serial port 202 is RS232/485, so as to realize that the fault simulation cabinet supports local or remote operation, and the setting is performed through a local knob or a human-machine interface such as ethernet, and supports time pairing by IRIG-B codes. The three-phase voltage is connected through an input end 204, and the input end 204 is an A-phase, B-phase and C-phase three-phase voltage input end; the rear panel 200 further includes a power supply terminal 205 and a power switch 206; and the power supply terminal 205 is provided with terminal L, N, G. And finally, simulation of different fault scenes is performed by matching between the position of the selection adjusting knob 101 and the selection wiring terminal 206, wherein the number of the wiring terminals 206 is 30, and the 30 wiring terminals 206 are respectively connected with one ends of the 30 resistors.
Refer to table 1 for the terminal numbers and names of the front panel 100.
| Numbering | Corresponding phase | Remarks for |
|
| 1 | A-N | A-phase 0 omega, 0.7 omega, 2 omega, 12 omega, 32 omega fault transition |
|
| 2 | A-N | A phase fault transition |
|
| 3 | B-N | B- |
|
| 4 | B-N | B-phase fault transition |
|
| 5 | C-N | C- |
|
| 6 | C-N | C-phase fault transition |
|
| 7 | Remote/cut/ |
||
| 8 | | A-B phase | 0 omega, 0.7 omega, 2 omega, 12 omega, 32 omega fault transition |
| 9 | | B-C phase | 0 omega, 0.7 omega, 2 omega, 12 omega, 32 omega fault transition |
| 10 | A-B | A-B phase fault transition |
|
| 11 | B-C | B-C phase fault transition |
|
| 12 | | A-C phase | 0 omega, 0.7 omega, 2 omega, 12 omega, 32 omega fault transition |
| 13 | A-C | A-C phase fault transition resistance adjusting knob |
Referring to table 2, there is shown a correspondence table of X-phase terminals of the present example (X is a phase a or B or C):
| X-N phase knob position | Transition resistance (omega) | The indicator light is on | Connecting terminal | Remarks for |
| 0 | Is free of | Is free of | Is free of | Is not grounded |
| 1 | 0 | 0Ω | X-G1 | The X phase is grounded through a0 |
| 2 | 0.7 | 0.7Ω | X-G2 | The X phase is grounded through a 0.7 |
| 3 | 2 | 2Ω | X-G3 | The X phase is grounded through |
| 4 | 12 | 12Ω | X-G4 | The X phase is grounded through a 12 |
| 5 | 32 | 32Ω | X-G5 | The X phase is grounded through a 32 omega resistor |
Table 3 shows a table corresponding to the X-Y phase terminals of this example (X-Y phases are A-B phases or B-C or C-A phases):
| X-Y phase knob position | Transition resistance (omega) | The indicator light is on | Connecting terminal | Remarks for |
| 0 | Is free of | Is free of | Is free of | Is free of |
| 1 | 0 | 0Ω | X-P1 | The X phase is connected to the Y phase through a0 |
| 2 | 0.7 | 0.7Ω | X-P2 | The X phase passes through a 0.7 omega resistor to the |
| 3 | 2 | 2Ω | X-P3 | The X phase is connected to the Y phase through |
| 4 | 12 | 12Ω | X-P4 | The X phase is connected to the Y phase through a 12 |
| 5 | 32 | 32Ω | X-P5 | The X phase is connected to the Y phase through a 32 omega resistor |
The fault controller in this embodiment includes main functional specifications, for example:
controlling in situ: the remote/cutting/local switch is set to be local, and the knobs of the A phase, the B phase, the C phase, the AB phase, the BC phase and the AC phase on the panel are effective.
The resistance adjusting knobs for the faults of the A phase, the B phase, the C phase, the AB phase, the BC phase and the AC phase are adjusted to be different resistance values, so that different fault scenes (such as single-phase grounding, two-phase short-circuit faults, two-phase short-circuit grounding faults, three-phase short-circuit faults and three-phase short-circuit grounding faults) can be realized.
Remote control: the change-over switch is set to be far, the operation of a transition resistance setting knob on the panel is invalid, and different fault scenes are simulated by setting related parameters through a dynamic simulation platform TCP.
Cutting: when the 'remote/cut-off/local' change-over switch is set to 'cut-off', no matter what 'local' or 'remote' control is adopted before, all the operations are failed, the fault connection mode is disconnected, and the indicator light is completely turned off.
IGIR-B code pair: the time synchronization is externally connected through the serial port RS485+ and RS 485-and is performed with the time synchronization preposed.
Specific examples are as follows:
the local control can set the local/cutting/remote switch to local through the panel operation knob, realize different fault scenes by selecting the knobs of A phase, B phase, C phase, AB phase, BC phase and AC phase, and indicate the current state through the indicator light.
When a single-phase earth fault mode needs to be simulated, taking an A-phase earth fault through a0 omega resistor as an example, the setting steps are as follows: firstly, setting a rotary 'local/cutting/far' change-over switch as 'local'; and secondly, rotating the knob of the phase A to set the knob of the phase A as a resistor of 0 omega, and lighting a corresponding indicator light of 0 omega above the knob of the phase A to realize a fault scene that the phase A is grounded through the resistor of 0 omega.
When a two-phase short-circuit fault mode needs to be simulated, taking an AB phase short-circuit fault through a0 omega resistor as an example, the setting steps are as follows: firstly, setting a rotary 'local/cutting/far' change-over switch as 'local'; and secondly, rotating the AB phase knob to set the AB phase knob as a0 omega resistor, and enabling a0 omega indicator lamp corresponding to the right side of the AB phase knob to be on, so that an AB phase short circuit fault scene through the 0 omega resistor is realized.
When a two-phase short circuit ground fault mode needs to be simulated, namely a two-phase resistance short circuit and a ground fault of each single phase in the two phases, taking an example that an AB phase is short circuit through a0 omega resistance and an A phase and a B phase are ground fault through the 0 omega resistance, the setting steps are as follows: firstly, setting a rotary 'local/cutting/far' change-over switch as 'local'; secondly, rotating the AB phase knob to set the AB phase knob as a0 omega resistor, and enabling a0 omega indicator lamp corresponding to the right side of the AB phase knob to be on, so that an AB phase short circuit fault scene through the 0 omega resistor is realized; thirdly, rotating the knob of the phase A to set the knob of the phase A as a resistor of 0 omega, and enabling a corresponding indicator light of 0 omega above the knob of the phase A to be on so as to realize a fault scene that the phase A is grounded through the resistor of 0 omega; and fourthly, rotating the knob of the 'B phase' to set the knob of the '0 omega' resistor, and enabling the indicator lamp of the '0 omega' corresponding to the knob of the 'B phase' to be on, so as to realize the fault scene of the 'B phase' grounded through the resistor of the '0 omega'.
When a three-phase short-circuit fault mode needs to be simulated, taking an ABC phase short-circuit fault through a0 omega resistor as an example, the setting steps are as follows: firstly, setting a rotary 'local/cutting/far' change-over switch as 'local'; secondly, rotating the AB phase knob to set the AB phase knob as a0 omega resistor, and enabling a0 omega indicator lamp corresponding to the right side of the AB phase knob to be on, so that an AB phase short circuit fault scene through the 0 omega resistor is realized; thirdly, rotating the BC phase knob to set the BC phase knob to be 0 omega resistor, and enabling a0 omega indicator lamp corresponding to the right side of the BC phase knob to be on, so that a BC phase short circuit fault scene through the 0 omega resistor is realized; and fourthly, rotating the 'AC phase' knob to set the '0 omega' resistor, and enabling a '0 omega' indicator lamp corresponding to the right side of the 'AC phase' knob to be on, so that the 'AC phase' is in a short-circuit fault scene through the '0 omega' resistor.
When a three-phase short circuit grounding fault mode needs to be simulated, namely a three-phase resistor short circuit and grounding faults of single-phase resistors in three phases are taken as examples, the method comprises the following setting steps: firstly, setting a rotary 'local/cutting/far' change-over switch as 'local'; secondly, rotating the AB phase knob to set the AB phase knob as a0 omega resistor, and enabling a0 omega indicator lamp corresponding to the right side of the AB phase knob to be on, so that an AB phase short circuit fault scene through the 0 omega resistor is realized; thirdly, rotating the BC phase knob to set the BC phase knob to be 0 omega resistor, and enabling a0 omega indicator lamp corresponding to the right side of the BC phase knob to be on, so that a BC phase short circuit fault scene through the 0 omega resistor is realized; fourthly, rotating the 'AC phase' knob to set the '0 omega' resistor, and enabling a '0 omega' indicator lamp corresponding to the right side of the 'AC phase' knob to be on to realize a 'AC phase' short circuit fault scene through the '0 omega' resistor; fifthly, rotating the knob of the phase A to set the knob of the phase A as a resistor of 0 omega, and enabling a corresponding indicator light of the phase A above the knob of the phase A to be on, so as to realize a fault scene that the phase A is grounded through the resistor of the phase A; sixthly, rotating the knob of the 'B phase' to set the knob of the '0 omega', and enabling a corresponding indicator light of the '0 omega' above the knob of the 'B phase' to be on, so as to realize a fault scene of grounding of the 'B phase' through the resistor of the '0 omega'; seventhly, the C-phase knob is rotated to be set as a0 omega resistor, a0 omega indicator lamp corresponding to the upper part of the C-phase knob is turned on, and a C-phase grounding fault scene through the 0 omega resistor is realized
When remote control is needed, the local/cutting/remote switch can be set to be remote, and knob adjustment of an A phase, a B phase, a C phase, an AB phase, a BC phase and an AC phase on the panel is ineffective; the rotary 'local/cut-off/far-place' change-over switch is set to be 'far-place', different fault scenes are realized and started through three-phase different fault modes set by a remote PC (personal computer) TCP (transmission control protocol) A, B, C, and the current fault state is indicated through an indicator lamp.
Referring to fig. 8 to 10, a second embodiment of the present invention is different from the first embodiment in that: the mainboard M comprises a control module M-100, a control module M-200, a communication module M-300 and a response module M-400. Specifically, the control module M-100, the control module M-200, the communication module M-300 and the response module M-400 are matched with each other, so that interphase short-circuit faults and ground faults of a power distribution network low-current grounding system, such as single-phase ground faults, two-phase short-circuit ground faults, three-phase short-circuit ground faults and other fault types, can be simulated really, and meanwhile, the grounding mode can be adjusted flexibly, wherein the control module M-100 can be used for selecting a ground fault control mode and a fault type and comprises an on-site component M-101, a remote component M-102 and an adjusting component M-103, the adjusting component M-103 is connected with one end of the on-site component M-101 and sends a first signal, the other end of the on-site component M-101 and the remote component M-102 send a second signal to, an ungrounded system can be conveniently constructed by remotely controlling the local component M-101 and the remote component M-102, wherein the first signal is an effective instruction signal regulated and controlled by the adjusting component M-103, the adjusting component M-103 is an adjusting processor, the second signal is a signal for starting the control module M-200, and it needs to be noted that the adjusting component M-103 and the adjusting knob 101 are respectively in an A phase, a B phase, a C phase, an AB phase, a BC phase and an AC phase; the control module M-200 is connected with the local component M-101 and the remote component M-102 of the control module M-100 and used for receiving a second signal, performing identification processing according to the second signal and converting the second signal into a third signal, wherein the control module M-200 identifies the second signal received by the control module M-100, identifies the signal sent by the local component M-101 or the remote component M-102, performs corresponding processing according to the signal, and only one of the local component M-101 and the remote component M-102 sends the second signal according to different selected fault control modes when in use, wherein the control module M-200 is an MCU (micro control unit); the communication module M-300 is used for completing a communication function, can receive a third signal and feeds a fourth signal back to the control module M-200 according to the third signal, the third signal is an instruction signal for starting the communication module M-300, and the communication module M-300 and the control module M-200 adopt a bidirectional transmission mode to transmit signals; the response module M-400 plays roles of conveying, driving, displaying a ground fault state and the like, is connected with the control module M-200, the communication module M-300 and the adjusting component M-103, and receives a fifth signal converted by fourth signal processing, wherein the fourth signal is a feedback signal of the communication module M-300 to the control module M-200, and the fifth signal is a signal of the fourth signal processed and fed back by the control module M-200.
Further, the control module M-100 further comprises a cutting-off assembly for cutting off all operations so as to disable any operation, it should be noted that the local assembly M-101, the remote assembly M-102 and the cutting-off assembly are all connected to the switch 103, the local assembly M-101, the remote assembly M-102 and the cutting-off assembly are respectively a local processing circuit, a remote processing circuit and a cutting-off processing circuit, when in use, the remote/cutting-off/local control mode is selected by the switch 103, and when the remote/cutting-off/local switch 103 is set as the local assembly M-101, the 'A phase', 'B phase', 'C phase', 'AB phase', 'BC phase', 'AC phase' knob connected to the adjusting assembly M-103 is effective, and the 'A phase', 'B phase', 'C phase', 'AC phase' knob is adjusted, The C-phase, AB-phase, BC-phase and AC-phase fault resistance adjusting knobs are different in resistance values, and different fault scenes (such as single-phase grounding, two-phase short-circuit faults, two-phase short-circuit grounding faults, three-phase short-circuit faults and three-phase short-circuit grounding faults) can be realized; when the remote/cut-off/local switch 103 is set as a remote component M-102, the knobs of the phase A, the phase B, the phase C, the phase AB, the phase BC and the phase AC connected with the adjusting component M-103 are not operated effectively, the relevant parameters of the TCP set by the external P C dynamic simulation platform simulate different fault scenes, and the current fault state is indicated by the indicating component M-404 of the response module M-400, wherein the TCP is a connection-oriented, reliable and byte stream-based transport layer communication protocol; when the "remote/cut/local" switch 103 is set to "cut", either previously "local" or "remote" control, all operations fail, breaking the failed connection.
Further, the control module M-200 is connected to the local module M-101 and the remote module M-102 of the control module M-100 via a third through terminal row N3 for transmitting a second signal to the control module M-200, where the third through terminal row N3 includes a pin 1 (GND JD), a pin 2 (GND YF), a pin 3 (+ 12V), a pin 4 (+ 2.5V), a pin 5 (switch) and a pin 6 (GND), the local module M-101 and the remote module M-102 respectively correspond to the pin 1 (GND JD) and the pin 2 (GND YF) of the third through terminal row N3, the pin 1 (jdd), the pin 2 (GND YF) and the pin 5 (switch) are respectively connected to the pin PB1 (JD), the pin PB0 (YF) and the pin 4 (switch) of the control module M-200, that is, the second signals of the local module M-101 and the remote module M-102 are respectively transmitted through the pin 1 (GNDJD), the pin 2 (GND YF) and the pin 5 (switch) of the third through terminal row N3 to the pin PB1 (GND JD), the pin PB0 (GND YF) and the pin PA4 (switch) of the control module M-200, and the pin 3 (+ 12V), the pin 4 (+ 2.5V) and the pin 6 (GND) are respectively connected to the 12V voltage, the 2.5V voltage and the ground, so as to supply power and stabilize; meanwhile, the pin PA13 (SWDIO) and the pin PA14 (SWCLK) of the control module M-200 are connected to an external jlink interface circuit, which is used for program burning.
Referring to fig. 11 to 15, a third embodiment of the present invention is different from the previous embodiment in that: the response module M-400 comprises a driving circuit M-401, an electric control component M-402, a switching component M-403 and an indication component M-404, and the driving circuit M-401, the electric control component M-402, the switching component M-403 and the indication component M-404 are matched to drive corresponding short-circuit faults. Specifically, the number of the response modules M-400 is six, and each of the six response modules M-400 includes a driving circuit M-401, an electric control component M-402, an on-off component M-403, and an indication component M-404, where the driving circuit M-401 is used for driving a high level to boost and reversely output a low level, is connected to the control module M-200, receives a fifth signal, and sends a sixth signal to the electric control component M-402, where the fifth signal is a signal fed back by processing of a fourth signal by the control module M-200, the sixth signal is a signal fed back by processing of the fifth signal by the driving circuit M-401, and the indication component M-404 is connected to the indication lamp 102, and the indication lamp 102 corresponds to different gear resistance values and indicates a current state.
Furthermore, the six driving circuits M-401 each include a decoding chip M-401a, a first driving chip M-401b and a second driving chip M-401c, the first driving chip M-401b is configured to drive a high level boost, the second driving chip M-401c is configured to drive a high level boost and reversely output a low level, the decoding chip M-401a is connected to the second driving chip M-401c through the first driving chip M-401b, receives a fifth signal, and converts the fifth signal into a sixth signal through the first driving chip M-401b and the second driving chip M-401c, and the control module M-200 includes a pin PC0 (1 a 0), a PC pin 1 (1 a 1), a pin PC2 (1 a 2), a pin PC3 (6 a 0), a pin PC4 (6 a 1), a pin 5 (6 a 2), and a second driving chip M-401c, Pin PC (2A), pin PC (5A), pin PCM-10 (5A), pin PC (5A), pin PE (3A), pin PE (4A), and pin PD (E), wherein pin PD (E) is connected to pin E (E) of six decoding chips M-401A, respectively, and pin PC (1A), pin PC (6A), pin PC (2A), pin PC (5A), pin PCM-10 (5A), pin PC (5A), pin PE (3A); and, Three pins of the pin PE2 (3A 2), the pin PE3 (4A 0), the pin PE4 (4A 1) and the pin PE5 (4A 2) of the 18 control modules M-200 are respectively connected with the pin A0 (XA 0), the pin A1 (XA 1) and the pin A3 (XA 3) of the six decoding chips M-401a (X is one of 1, 2, 3, 4, 5 and 6); it should be noted that the decoding chip M-401a is a 3-8 decoder, and specifically, the models of the decoding chip M-401a, the first driving chip M-401b and the second driving chip M-401c are SN74HCT138PW, SN74LSO4DR and ULNM-2003L, respectively.
Furthermore, the electric control module M-402 receives a sixth signal of the second driving chip M-401C and a seventh signal converted by the first signal processing through the first switching terminal row N1, recognizes the sixth signal and the adjusting module M-103 according to the received sixth signal and the seventh signal, and sends a response signal according to the sixth signal and the seventh signal, where the seventh signal is a command signal sent to the electric control module M-402 through the processing of the adjusting module M-103, and the first switching terminal row N1 is provided with two, and the "a phase", "B phase", "C phase", "AB phase", "BC phase", "AC phase" knobs of the adjusting module M-103 are each provided with 0 Ω, 0.7 Ω, 2 Ω, 12 Ω, 32 Ω gears, and the "a phase", "B phase", "C phase", "AB phase", "BC phase", "AC phase" knobs have M-30 gears and six pins OUI1 (YKX 1) of the second driving chip M-401C, The pin OUI2 (YKX 2), the pin OUI3 (YKX 3), the pin OUI4 (YKX 4), and the pin OUI5 (YKX 5) (where X is one of 1, 2, 3, 4, 5, and 6) have M-30 pins, each pair of pins corresponds to a group and is respectively connected with M-30 pins of two first transfer terminal rows N1, and M-30 ports corresponding to M-30 pins of a first transfer terminal row N1 are respectively connected with pin 1 of M-30 electric control components M-402, it should be noted that the electric control components M-402 are power breakers.
Further, the on-off component M-403 can receive a response signal, send a fault state signal to the network port component M-301 of the communication module M-300 according to the response signal, and send an indication signal to the indication component M-404; in addition, three-phase voltage is accessed through an input end 204, the input end 204 is connected with an on-off component M-403 of a response module M-400, the on-off component M-403 is connected with one end of an external fault transition resistor through a wiring terminal 206, the other end of the external fault transition resistor is grounded, and M-30 on-off components M-403 are arranged (corresponding to S in the figure)X1、SX2、SX3、SX4And SX5Where X is one of 1, 2, 3, 4, 5, and 6), pin 1 of M-30 on-off modules M-403 are connected to M-30 ports of the corresponding first switching terminal row N1, respectively, the on-off modules M-403 are connected to the electric control module M-402 through the second switching terminal row N2, and the second switching terminal row N2; it should be noted that the on-off component M-403 is an ac contactor, and functions as a switch, thereby truly simulating various types of interphase short-circuit fault and ground fault.
Taking YK6_1 as an example, Y1 is gated through a decoding chip M-401a (SN 74HCT138 PW) of a driving circuit M-401, the level is increased to 5V through a first driving chip M-401b, then the level is increased to 12V through a second driving chip M-401c and is reversed, YK6_1 is controlled to output low level, 3 and 4 of an electric control component M-402 can be attracted, namely, a conductor 6_1 of a second transfer terminal row N2 is connected with 2M-20V _6 of the electric control component M-402, and therefore the on-off component M-403 is controlled to be closed (namely S74 HCT138 PW) so as to control the on-off component M-403 to be closed (namely S3 and 4 of the electric control component M61Closed), the indicator light of the corresponding indicator assembly M-404 is illuminated.
Referring to fig. 16 to 17, a fourth embodiment of the present invention is different from the above embodiments in that: the network interface 201 and the serial port 202 are respectively connected with a serial port component M-302 and a network port component M-301 of a communication module M-300 through a fourth switching terminal row N4, the network interface 201 and the serial port 202 are connected with external equipment, specifically, remote control, setting of various fault scenes and grounding scenes, program upgrading, fault state signals and the like are realized through the network port component M-301, and the network port component M-301 is used for realizing synchronization of a main clock by an external GPS time synchronization device through IRIG-B time synchronization; one end of the serial port assembly M-302 and one end of the network port assembly M-301 are both connected with the control module M-200, the other end of the serial port assembly M-302 and the other end of the network port assembly M-301 are respectively connected with a GPS time synchronization device and a PC (personal computer) of an external device through a fourth switching terminal row N4, and it should be noted that the serial port assembly M-302 is connected with a pin 11 (2-485-), a pin 12 (2-485 +), a pin 13 (1-485-) and a pin 14 (1-485 +) of a fourth switching terminal row N4.
Further, the serial port assembly M-302 includes a third driver chip M-302a, a first transceiver chip M-302b and a second transceiver chip M-302c, the third driver chip M-302a is capable of receiving a third signal of the control module M-200, and establishes a connection with the first and second transceiving chips M-302b and M-302c, the third driving chip M-302a plays a role in driving isolation, pins VIA (TXD 2), VOC (RXD 2), VIB (TXD 1) and VOD (RXD 2) of the third driving chip M-302a are connected with pins PA1 (TXD 2), PA2 (RXD 2), PA9 (TXD 1) and PAM-10 (RXD 2) of the control module M-200, the third driving chip M-302a is an ADUM1M-402 driving chip, and the first transceiving chip M-302b and the second transceiving chip M-302c are MAX13488 chips (485 chips).
The network interface component M-301 comprises a network card chip M-301a and a network transformer M-301b, one end of the network card chip M-301a is connected with the control module M-200, the other end of the network card chip M-301a is connected with an external PC through the network transformer M-301b, the model of the network card chip M-301a is DM9000A1, 15 pins SD 0-15 (DB 0-15) of the network card chip M-200 are respectively connected with 15 pins PD 14-15 (DB 0-1), PD 0-1 (DB 2-3), PE 7-15 (DB 4-12) and PD 8-M-10 (DB 13-15) of the control module M-200, a pin CMD (A0), a pin INT (NET) (INT), a (IOR (INT), a pin W (WE), a (CSI), and a pin RST) of the network card chip M-301a are respectively connected with a pin 11A (0A) of the PD control module M-200, The pin PB11 (NETINT), the pin PD4 (OE), the pin PD5 (WE), the pin PD7 (CSI) and the pin PA8 (NETRST) are connected, the model of the network transformer M-301b is H1M-102 (M-10M/M-100M), the connection wires TIN-, TIN +, TO + and TO-of the network transformer are respectively connected with the pin 3 (TIN-), the pin 4 (TIN +), the pin 5 (TO +) and the pin 6 (TO-) of the fourth adapter terminal row N4, and preferably, an electrostatic protection component M-301c is further arranged between the network transformer M-301b and the fourth adapter terminal row N4 and plays roles of voltage stabilization and protection circuits.
Referring to fig. 18, a fifth embodiment of the present invention is different from the above embodiments in that: the main structure further comprises a power supply module M-500 which plays a role in converting voltage, so that the voltage transmitted by the power supply module M-500 is suitable for the operation and control module M-100, the control module M-200, the communication module M-300 and the response module M-400 to use, and therefore the operation and control module M-100, the control module M-200, the communication module M-300 and the response module M-400 can operate, and a power supply terminal 205 is connected with the power supply module M-500. Specifically, the power module M-500 is configured to supply power to the control module M-100, the control module M-200, the communication module M-300, and the response module M-400, and includes a first conversion module M-501, a second conversion module M-502, a third conversion module M-503, and a power isolation module M-504, where the first conversion module M-501, the second conversion module M-502, the third conversion module M-503, and the power isolation module M-504 are all conversion circuits, and play a role in voltage reduction and power isolation, further, the first conversion module M-501 includes a K7805-M-1000 chip and elements (resistors, capacitors, etc.), a circuit formed by the K7805-M-1000 chip and the elements can implement voltage reduction, and can convert an input 12V voltage into a 5V voltage for output, the output 5V voltage is respectively transmitted to a first driving chip M-401b and a second driving chip M-401c of a second conversion component M-502 and a driving circuit M-401 for use, and it should be noted that the second conversion component M-502, the first driving chip M-401b and the second driving chip M-401c are connected in parallel; the second conversion component M-502 comprises an AMS1117-3.3 chip and elements (resistors, capacitors and the like), a circuit formed by the elements and the AMS1117-3.3 chip plays a role of stabilizing and reducing voltage, an input 5V voltage can be converted into a 3.3V voltage to be output, the output 3.3V voltage is respectively transmitted to the third conversion component M-503, the control module M-200, the communication module M-300 and the response module M-400 for use, and the third conversion component M-503, the control module M-200, the communication module M-300 and the response module M-400 are mutually connected in parallel; the third conversion component M-503 comprises a U _ TL431 chip and an element (a resistor, a capacitor, etc.), the circuit formed by the element and the U _ TL431 chip plays a role of stable voltage reduction, the U _ TL431 is a controllable precise voltage-stabilizing source, an input 3.3V voltage can be converted into a 2.5V voltage for output, and the output 2.5V voltage is respectively transmitted to the control module M-200 and the network transformer M-301b of the network interface component M-301 for use by the response module M-400; the third conversion component M-503, the control module M-200, the communication module M-300 and the response module M-400 are mutually arranged in parallel, and the power isolation component M-504 is a digital power supply and an analog power supply and is used for isolating a digital ground from an analog ground.
Referring to fig. 19 ~, a sixth embodiment of the present invention is different from the above embodiments in that the fan control 203 is connected to the fan 306 through the temperature control module M-600 to adjust the opening of the fan, the temperature control module M-600 includes a detection component M-601 and a heat dissipation component M-602, the detection component M-601, the heat dissipation component M-602 and the control module M-200 cooperate with each other to achieve automatic cooling, specifically, the temperature control module M-600 includes a detection component M-601 and a heat dissipation component M-602, the detection component M-601 is used for detecting temperature information of each module, the detection component M-601 is connected to the control module M-200 and sends the temperature information to the control module M-200, a temperature threshold is preset in the control module M-200 and compares the detected temperature information with the temperature threshold, the heat dissipation component M-602 is connected to the response module M-400 through the control module M-200, the on/off of the circuit of the heat dissipation component M-602 is controlled according to different comparison results, specifically, when the detected temperature information is greater than the temperature threshold, the temperature of the heat dissipation component M-602 is greater than the temperature detection component PA — 4656, the detection component PA — 2, the power connection of the heat dissipation component M-602, the detection component PA — 400 is connected to the PA — 3627, and the detection component (PA — PA.
Further, the heat dissipation assembly M-602 is connected with the response module M-400 through the control module M-200, specifically, the detection assembly M-601 is used for detecting temperature information of each module, the detection assembly M-601 is connected with the control module M-200 to perform the functions of turning on and off the detection assembly M-601 and judging whether the temperature of each module is larger than a set temperature threshold value, the control module M-200 is connected with the driving circuit M-401 of the response module M-400 to perform the functions of driving and reversing electrical level, it should be noted that the control module M-200 is connected with the second driving chip M-401c of the driving circuit M-401, the second driving chip M-401c is connected with the electric control assembly M-402, according to the electrical level switching connection circuit, the electric control assembly M-402 is connected with the heat dissipation assembly M-602 through the turn-on and turn-off assembly M-403, according to the function of the electrical control module M-402 for switching on/off the on/off module M-403 and finally the heat dissipation module M-602, it should be noted IN detail that the pin PB8 (FAN 1) and the pin PB9 (FAN 2) of the control module M-200 are connected to the pin IN6 (FAN 1) and the pin IN7 (FAN 2) of the second driver chip M-401c of the response module M-400, the pin OUT7 (FAN nb) and the pin OUT6 (FAN) of the second driver chip M-401c are connected to the electrical control module M-402 of the terminal FANB and the terminal FANA, respectively, the terminal FANB1, the terminal FANB2, the terminal FANA1 and the terminal FANA2 of the electrical control module M-402 are connected to the pin 4 (FANB 1), the pin 3 (FANB 2), the pin 6 (FANA 1) and the pin 5 (FANA 2) of the fifth relay terminal row, and the fifth relay terminal row is connected to the connection port of the on/off module M-402, the on-off component M-403 is connected with the heat dissipation component M-602, wherein the on-off component M-403 is a contactor, the electric control component M-402 is a relay, and the second driving chip M-401c is an ULNM-2003L driving chip.
It is important to note that the construction and arrangement of the present application as shown in the various exemplary embodiments is illustrative only. Although only a few embodiments have been described in detail in this disclosure, those skilled in the art who review this disclosure will readily appreciate that many modifications are possible (e.g., variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters (e.g., temperatures, pressures, etc.), mounting arrangements, use of materials, colors, orientations, etc.) without materially departing from the novel teachings and advantages of the subject matter recited in this application. For example, elements shown as integrally formed may be constructed of multiple parts or elements, the position of elements may be reversed or otherwise varied, and the nature or number of discrete elements or positions may be altered or varied. Accordingly, all such modifications are intended to be included within the scope of this invention. The order or sequence of any process or method steps may be varied or re-sequenced according to alternative embodiments. In the claims, any means-plus-function clause is intended to cover the structures described herein as performing the recited function and not only structural equivalents but also equivalent structures. Other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the exemplary embodiments without departing from the scope of the present inventions. Therefore, the present invention is not limited to a particular embodiment, but extends to various modifications that nevertheless fall within the scope of the appended claims.
Moreover, in an effort to provide a concise description of the exemplary embodiments, all features of an actual implementation may not be described (i.e., those unrelated to the presently contemplated best mode of carrying out the invention, or those unrelated to enabling the invention).
It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure, without undue experimentation.
It should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the scope of the claims of the present invention.
Claims (10)
1. The utility model provides a fault control equipment with control by temperature change detects which characterized in that: the device comprises a shell with an accommodating space (S), a front panel (100) for adjustment and a rear panel (200) for wiring; a processing unit (300) is arranged in the accommodating space (S) and can simulate the occurrence of faults;
the processing unit (300) further comprises a radiator (303), a partition plate (304), a bracket (305), a fan (306) and a main board (M), wherein the radiator (303) is arranged in a placing space formed by epoxy boards (302), the partition plate (304) separates the adjacent radiators (303), and the main board (M) is arranged on the bracket (305); the fan (306) is arranged on one side of the radiator (303);
the main board (M) comprises a control module (M-100), a control module (M-200), a communication module (M-300) and a response module (M-400), the control module (M-100) comprises a local component (M-101), a remote component (M-102) and a regulating component (M-103), one end of the local component (M-101) is connected with the regulating component (M-103) and sends a first signal, and the other end of the local component (M-101) and the remote component (M-102) send a second signal to the control module (M-200); the control module (M-200) is connected with the control module (M-100) and is used for receiving the second signal and carrying out identification processing on the second signal to convert the second signal into a third signal; the communication module (M-300) can receive the third signal and feed back a fourth signal to the control module (M-200) according to the third signal; the response module (M-400) is connected with the control module (M-200), the communication module (M-300) and the adjusting component (M-103), and the response module (M-400) receives the fifth signal converted by the fourth signal processing; and the temperature control unit (600) is connected with the control module (M-200) and used for receiving a third signal to detect the temperature information of each unit and responding to the temperature information.
2. The fault control device with temperature controlled detection of claim 1, wherein: the processing unit (300) further comprises a tray (301), an epoxy board (302) and a bracket (305);
two-layer epoxy board (302) interval sets up and constitutes and places the space, and is located the bottom epoxy board (302) set up in on tray (301), be located the top set up on epoxy board (302) support (305).
3. Fault control device with temperature controlled detection according to claim 1 or 2, characterized in that: the front panel (100) further comprises an adjusting knob (101), an indicator lamp (102) and a switch (103);
the adjusting knob (101) is used for shifting the fault transition resistor, the indicating lamp (102) corresponds to different gear resistance values and indicates the current state, and the change-over switch (103) comprises a remote/cut-off/local change-over switch;
wherein the adjusting knob (101) is connected with the adjusting assembly (M-103), and the selector switch (103) is connected with the local assembly (M-101), the remote assembly (M-102) and the cutting assembly.
4. The fault control device with temperature controlled detection of claim 3, wherein: the rear panel (200) further comprises a network interface (201), a serial port (202), a fan control (203), an input end (204) and a wiring terminal (207);
the network interface (201) and the serial port (202) are respectively connected with a serial port assembly (M-302) and a network port assembly (M-301) of the communication module (M-300) through a fourth switching terminal row (N4), the network interface (201) and the serial port (202) are connected with external equipment, three-phase voltage is accessed through the input end (204), the input end (204) is connected with an on-off assembly (M-403) of the response module (M-400), and the on-off assembly (M-403) is connected with an external fault transition resistor through the wiring terminal (207); the fan control (203) is connected with the fan (306) through a temperature control module (M-600) and can adjust the opening of the fan.
5. The fault control device with temperature controlled detection of claim 4, wherein: the rear panel (200) further comprises a power supply terminal (205) and a power switch (206); and the power supply terminal (205) is provided with an L, N, G terminal.
6. The fault control device with temperature controlled detection of claim 4 or 5, wherein: the response module (M-400) further comprises a drive circuit (M-401) and an electric control component (M-402), the drive circuit (M-401) being connected to the control module (M-200) and receiving the fifth signal and sending a sixth signal to the electric control component (M-402).
7. The fault control device with temperature controlled detection of claim 6, wherein: the driving circuit (M-401) comprises a decoding chip (M-401 a), a first driving chip (M-401 b) and a second driving chip (M-401 c), wherein the decoding chip (M-401 a) is connected with the second driving chip (M-401 c) through the first driving chip (M-401 b), receives a fifth signal, and converts the fifth signal into a sixth signal through the first driving chip (M-401 b) and the second driving chip (M-401 c) to be sent.
8. The fault control device with temperature controlled detection of claim 7, wherein: the electric control module (M-402) receives the sixth signal of the second driver chip (M-401 c) through the first switching terminal block (N1) and the adjustment module (M-103) processes the converted seventh signal according to the received first signal, identifies it, and transmits a response signal according to the sixth signal and the seventh signal.
9. The fault control device with temperature controlled detection of claim 8, wherein: the on-off component (M-403) can receive the response signal and send a fault state signal to the internet access component (M-301) of the communication module (M-300) and the indicating component (M-404) of the response module (M-400) according to the response signal.
10. The fault control device with temperature controlled detection of claim 9, wherein: the temperature control module (M-600) comprises a detection component (M-601) and a heat dissipation component (M-602), the detection component (M-601) detects temperature information of each module, establishes connection with the control module (M-200) and sends the temperature information to the control module (M-200); a temperature threshold is preset in the control module (M-200), the temperature information is compared with the temperature threshold, and the on-off of a circuit of the radiating assembly (M-602) is controlled according to different comparison results.
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| CN201920013739.4U CN209927954U (en) | 2019-01-04 | 2019-01-04 | Fault control equipment with temperature control detection |
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| CN201920013739.4U CN209927954U (en) | 2019-01-04 | 2019-01-04 | Fault control equipment with temperature control detection |
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| CN109459668A (en) * | 2019-01-04 | 2019-03-12 | 国网江苏省电力有限公司宿迁供电分公司 | A kind of Fault Control equipment with temperature control detection |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109459668A (en) * | 2019-01-04 | 2019-03-12 | 国网江苏省电力有限公司宿迁供电分公司 | A kind of Fault Control equipment with temperature control detection |
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