CN203151537U - Embedded-type modularized information unit - Google Patents

Embedded-type modularized information unit Download PDF

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Publication number
CN203151537U
CN203151537U CN 201320167441 CN201320167441U CN203151537U CN 203151537 U CN203151537 U CN 203151537U CN 201320167441 CN201320167441 CN 201320167441 CN 201320167441 U CN201320167441 U CN 201320167441U CN 203151537 U CN203151537 U CN 203151537U
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CN
China
Prior art keywords
module
embedded
information unit
type modularized
flush bonding
Prior art date
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Expired - Fee Related
Application number
CN 201320167441
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Chinese (zh)
Inventor
汤一清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Jinhui Dongfang Science & Technology Co Ltd
Original Assignee
Beijing Jinhui Dongfang Science & Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Jinhui Dongfang Science & Technology Co Ltd filed Critical Beijing Jinhui Dongfang Science & Technology Co Ltd
Priority to CN 201320167441 priority Critical patent/CN203151537U/en
Application granted granted Critical
Publication of CN203151537U publication Critical patent/CN203151537U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses an embedded-type modularized information unit. The embedded-type modularized information unit comprises a switch module, a power supply module, a back-panel PCB (printed circuit board) and at least one embedded module, wherein the switch module, the power supply module and the embedded module are connected with the back-panel PCB; and a power supply bus circuit and an Ethernet bus circuit are arranged on the back-panel PCB. The embedded-type modularized information unit has the characteristics of being modularized, good in integrality, small and deployed in batches, thus being capable of being configured as needed; the switch module and the power supply module are necessarily configured, switch ports may be the various types of 2-8 ports, and the embedded-type module can be configured as needed according to occasions; and cost can be set and the modules can be selected according to functional performances.

Description

A kind of embedded-type modularized information unit
Technical field
The utility model relates to the embedded device technology field, relates in particular to a kind of embedded-type modularized information unit.
Background technology
Existing flush bonding module generally carries out multiple devices by the general network switch and connects, and adds grid line, and several embedded devices just need bigger space, have lost the little advantage of embedded device compact conformation volume, and the globality of system is also bad.Even done casing, existing device is installed, follow-up autgmentability is also bad, therefore needs clear and definite demand in advance, is not suitable for deployment request in batches; Individual device has been gone bad, and dismounting is also inconvenient.
The utility model content
The purpose of this utility model is to provide a kind of embedded-type modularized information unit for the flush bonding module assembled unit function that realizes modularization, miniaturization, thereby solves the foregoing problems that exists in the prior art.
To achieve these goals, the technical solution adopted in the utility model is as follows:
A kind of embedded-type modularized information unit, comprise switch module, power module, backboard PCB and at least one flush bonding module, described switch module, described power module and described flush bonding module all are connected with backboard PCB, and backboard PCB is provided with power bus circuit and industry ethernet circuit.
Preferably, described switch module, described power module and described flush bonding module all adopt inserting mode to be connected with described backboard PCB.
Preferably, described flush bonding module comprises ARM chip, control chip, interface circuit and input/output interface, and the equal and described input/output interface of described ARM chip, described control chip and described interface circuit is connected.
Preferably, described embedded-type modularized information unit also comprises rear board and housing.
Preferably, described housing is square.
Preferably, described rear board is arranged on a side of described housing, and described backboard PCB is fixed on the described rear board, and described switch module, described flush bonding module, described power module and described backboard PCB all are positioned at the cavity of described housing.
Preferably, be provided with three above groove positions in the described cavity, described switch module, described power module, described flush bonding module are fixed in the described cavity by described groove position.
Preferably, described backboard PCB is provided with three above sockets.
Preferably, the rear end of described switch module, described power module and described flush bonding module is equipped with plug, and the described socket on described plug and the described backboard PCB is corresponding one by one.
Preferably, described switch module is provided with RJ45 connector and indicator light, and described power module is provided with switch, indicator light, power supply input jack and earthing of casing line.
The beneficial effects of the utility model are:
1. modularization: can dispose as required, switch module, power module must be joined, and switching port can be used the multiple model of 2-8 port, and flush bonding module can dispose according to the occasion needs; Can select module by the functional performance cost;
2. good integrity.A plurality of modules such as same equipment.Modular construction convenient maintenance and replacement, expansion are easily in addition;
3. miniaturization: the intensive design of each module sets up that fully volume is very little;
4. dispose: expand by module expansion, equipment stacking mode, can dispose concrete application as required in batches in batches.
Description of drawings
Fig. 1 is structural representation of the present utility model;
Wherein: the 1---housing; The 2---rear board; 3---backboard PCB; The 4---flush bonding module; The 5---switch module; The 6---power module;
Fig. 2 is backboard PCB slot schematic diagram of the present utility model;
Fig. 3 is circuit connecting relation schematic diagram of the present utility model.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing, the utility model is further elaborated.Should be appreciated that embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
As shown in Figure 1, the utility model discloses a kind of embedded-type modularized information unit, comprise switch module, power module, backboard PCB and at least one flush bonding module, described switch module, described power module and described flush bonding module all are connected with backboard PCB, and backboard PCB is provided with power bus circuit and industry ethernet circuit.As shown in Figure 2, power bus and industry ethernet circuit that backboard PCB go up to arrange have played the function of power line and netting twine in the legacy network syndeton.Described switch module, described power module and described flush bonding module all adopt inserting mode to be connected with described backboard PCB.The rear end of described switch module, described flush bonding module and described power module is fixed on the described backboard PCB.Described flush bonding module comprises ARM chip, control chip, interface circuit and input/output interface, and the equal and described input/output interface of described ARM chip, described control chip and described interface circuit is connected.Described embedded-type modularized information unit also comprises rear board and housing.Described housing is the square cavity structure, and periphery is provided with installing hole, groove bit architecture.Described rear board is arranged on a side of described housing, and described backboard PCB is fixed on the described rear board, and described switch module, described flush bonding module, described power module and described backboard PCB all are positioned at the cavity of described housing.Be provided with three above groove positions in the described cavity, the rear end is provided with backboard PCB, and described backboard PCB is fixed on the rear board of described housing, and described switch module, described power module, described flush bonding module are fixed in the described cavity by described groove position.Described backboard PCB is provided with three above sockets, is used for the how described flush bonding module of expansion.The rear end of described switch module, described power module and described flush bonding module is equipped with plug, and the described socket on described plug and the described backboard PCB is corresponding one by one.Described switch module is provided with RJ45 connector and indicator light etc., and described power module is provided with switch, indicator light, power supply input jack and earthing of casing line etc.Each flush bonding module can also be provided with indicator light, switch, little LCD, antenna pedestal etc. by the purposes front end.Switch module, the plug-in position of power module on backboard PCB are fixed, and for preventing the wrong plug position, can be had any different in rear end plug size, position with the shell that varies in size.Size and the position of the size of other all flush bonding modules, rear end socket are identical, and grafting can replace.Module (comprising switch module, power module and flush bonding module) related in the utility model is the hardware entities module.
By adopting the disclosed technique scheme of the utility model, obtained following useful effect:
1. modularization: can dispose as required, switch module, power module must be joined, and switching port can be used the multiple model of 2-8 port, and flush bonding module can dispose according to the occasion needs; Can select module by the functional performance cost;
2. good integrity.A plurality of modules such as same equipment.Modular construction convenient maintenance and replacement, expansion are easily in addition;
3. miniaturization: the intensive design of each module sets up that fully volume is very little;
4. dispose: expand by module expansion, equipment stacking mode, can dispose concrete application as required in batches in batches.
The above only is preferred implementation of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be looked protection range of the present utility model.

Claims (10)

1. embedded-type modularized information unit, it is characterized in that, comprise switch module, power module, backboard PCB and at least one flush bonding module, described switch module, described power module and described flush bonding module all are connected with backboard PCB, and backboard PCB is provided with power bus circuit and industry ethernet circuit.
2. embedded-type modularized information unit according to claim 1 is characterized in that, described switch module, described power module and described flush bonding module all adopt inserting mode to be connected with described backboard PCB.
3. embedded-type modularized information unit according to claim 1, it is characterized in that, described flush bonding module comprises ARM chip, control chip, interface circuit and input/output interface, and the equal and described input/output interface of described ARM chip, described control chip and described interface circuit is connected.
4. embedded-type modularized information unit according to claim 1 is characterized in that, described embedded-type modularized information unit also comprises rear board and housing.
5. embedded-type modularized information unit according to claim 4 is characterized in that, described housing is square.
6. according to claim 4 or 5 arbitrary described embedded-type modularized information units, it is characterized in that, described rear board is arranged on a side of described housing, described backboard PCB is fixed on the described rear board, and described switch module, described flush bonding module, described power module and described backboard PCB all are positioned at the cavity of described housing.
7. embedded-type modularized information unit according to claim 6 is characterized in that, is provided with three above groove positions in the described cavity, and described switch module, described power module, described flush bonding module are fixed in the described cavity by described groove position.
8. embedded-type modularized information unit according to claim 1 is characterized in that, described backboard PCB is provided with three above sockets.
9. embedded-type modularized information unit according to claim 8 is characterized in that, the rear end of described switch module, described power module and described flush bonding module is equipped with plug, and the described socket on described plug and the described backboard PCB is corresponding one by one.
10. embedded-type modularized information unit according to claim 1 is characterized in that, described switch module is provided with RJ45 connector and indicator light, and described power module is provided with switch, indicator light, power supply input jack and earthing of casing line.
CN 201320167441 2013-04-07 2013-04-07 Embedded-type modularized information unit Expired - Fee Related CN203151537U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201320167441 CN203151537U (en) 2013-04-07 2013-04-07 Embedded-type modularized information unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201320167441 CN203151537U (en) 2013-04-07 2013-04-07 Embedded-type modularized information unit

Publications (1)

Publication Number Publication Date
CN203151537U true CN203151537U (en) 2013-08-21

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104545449A (en) * 2013-10-23 2015-04-29 美的集团股份有限公司 Water dispenser
WO2021197271A1 (en) * 2020-03-31 2021-10-07 华为技术有限公司 Switch insertion frame and cabinet system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104545449A (en) * 2013-10-23 2015-04-29 美的集团股份有限公司 Water dispenser
WO2021197271A1 (en) * 2020-03-31 2021-10-07 华为技术有限公司 Switch insertion frame and cabinet system

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130821

Termination date: 20190407