CN109797422B - Vertical continuous electroplating equipment - Google Patents

Vertical continuous electroplating equipment Download PDF

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Publication number
CN109797422B
CN109797422B CN201910126350.5A CN201910126350A CN109797422B CN 109797422 B CN109797422 B CN 109797422B CN 201910126350 A CN201910126350 A CN 201910126350A CN 109797422 B CN109797422 B CN 109797422B
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electroplating
conveying
substrate
cylinder
water retaining
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CN109797422A (en
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罗运浪
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Dongguan Jiafan Intelligent Technology Co ltd
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Dongguan Jiafan Intelligent Technology Co ltd
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Abstract

The invention relates to the technical field of technical electroplating equipment, in particular to vertical continuous electroplating equipment, which comprises a rack, an electroplating pretreatment tank, an electroplating post-treatment tank, an automatic feeding device, a substrate conveying device, a substrate guiding device, an electroplating tank water retaining device and an automatic discharging device, wherein the rack is provided with a plurality of grooves; the electroplating pretreatment tank, the electroplating tank and the electroplating post-treatment tank are fixed on the upper part of the frame, the automatic feeding device is fixed in front of the electroplating pretreatment tank, and the automatic discharging device is fixed behind the electroplating post-treatment tank; the base material conveying device is fixed on the upper parts of the automatic feeding device, the electroplating pre-treatment groove, the electroplating post-treatment groove and the automatic discharging device in a crossing manner, and the base material guiding device is fixed in the electroplating pre-treatment groove, the electroplating groove and the electroplating post-treatment groove in a crossing manner and is positioned below the base material conveying device. The electroplating equipment has strong practicability and is suitable for popularization in the field.

Description

Vertical continuous electroplating equipment
Technical Field
The invention relates to the technical field of technical electroplating equipment, in particular to vertical continuous electroplating equipment.
Background
Electroplating is a very important process in the production process of circuit board base materials, the thickness of the base materials is very thin and is the same as that of paper, and the production process of the base materials comprises feeding, pretreatment, electroplating, post-treatment and blanking. In an automatic production system, materials are too light, too soft and too thin, and great difficulty is brought to two links of feeding and discharging, in the past, the phenomenon that two base materials are overlapped and fed can easily occur by adopting a clamping device to clamp the feeding, so that the subsequent procedures all enable the base materials to be in an overlapped state, and the qualified rate of base material electroplating is influenced. In the conveying process of the base material in each section of the tank body, if the base material is not guided, the base material can float towards two sides, the uniformity distribution of electroplating current is influenced, and other parts in the tank can be touched, so that the surface of the base material is scratched, deformed, folded and even scrapped. In order to solve the above problem, it is necessary to develop a substrate guiding device for electroplating equipment. In the production process, the base material continuously passes through each section of groove, a notch for the base material to pass through is reserved in the middle of each section of groove, the liquid level in the electroplating bath is guaranteed to be unchanged, and the base material cannot be crossed and mixed with the solution in the front and rear sections of treatment grooves, therefore, a water retaining device needs to be installed in the front and rear of the electroplating bath, the water is prevented from entering the electroplating bath, the liquid level in the electroplating bath is guaranteed to be unchanged, and the requirement on the precision of the water retaining device is high due to the thinness of the base material. At present, a plurality of processes of the circuit board substrate are still separated in the electroplating process, and a complete, continuous and stable production line does not exist.
Disclosure of Invention
The invention aims to: in order to solve the problems, the vertical continuous electroplating equipment is provided.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a vertical continuous electroplating device comprises a frame, a pre-electroplating treatment tank, an electroplating bath, a post-electroplating treatment tank, an automatic feeding device, a substrate conveying device, a substrate guiding device, an electroplating bath water retaining device and an automatic discharging device, wherein the pre-electroplating treatment tank, the electroplating bath, the post-electroplating treatment tank, the automatic feeding device, the substrate conveying device, the substrate guiding device, the electroplating bath water retaining device and the automatic discharging device are all arranged on the frame; the electroplating pretreatment tank, the electroplating tank and the electroplating post-treatment tank are fixed at the middle section of the frame, the automatic feeding device is fixed in front of the electroplating pretreatment tank, and the automatic discharging device is fixed behind the electroplating post-treatment tank; the substrate conveying device stretches across and is fixed above the automatic feeding device, the electroplating pre-treatment groove, the electroplating post-treatment groove and the automatic discharging device, the substrate guiding device stretches across and is fixed in the electroplating pre-treatment groove, the electroplating groove and the electroplating post-treatment groove and is positioned below the substrate conveying device, and the electroplating groove water retaining devices are respectively fixed in front of and behind the electroplating groove.
Furthermore, the automatic feeding device comprises an automatic feeding operation device and a base material box, wherein the automatic feeding operation device comprises a sliding seat A, a sliding seat B, a precision sliding block, an original point return cylinder, a speed-following pressing block, a clamp-opening cylinder, a clamp-opening pressing block, a steel plate conveying limiting block, a cylinder up-and-down movement mechanism, a cylinder turnover mechanism, a rotating arm, a base material sucker, a vacuum negative pressure valve and a vacuum negative pressure source; the A sliding seat and the B sliding seat are respectively installed on the rack through the precision sliding blocks, the A sliding seat is connected with the B sliding seat through a sliding seat connecting piece, and the original point return cylinder and the conveying steel plate limiting block are installed on the rack; the speed following pressing cylinder and the opening clamping cylinder are arranged on the sliding seat A, the speed following pressing block is arranged on the speed following pressing cylinder, and the opening clamping pressing block is arranged on the opening clamping cylinder; the cylinder up-and-down movement mechanism is installed on the sliding seat B, the cylinder turnover mechanism is installed at the lower end of the cylinder up-and-down movement mechanism, the cylinder turnover mechanism is connected with the substrate sucker through the rotating arm, the vacuum negative pressure valve is connected with the substrate sucker, the vacuum negative pressure source is connected with the vacuum negative pressure valve through a negative pressure pipeline, and the vacuum negative pressure source is installed at the top of the rack; the speed-following pressing cylinder drives the speed-following pressing block to press the substrate conveying device, so that the A sliding seat and the B sliding seat move horizontally to follow the substrate conveying device to move synchronously, the cylinder up-and-down movement mechanism drives the cylinder turnover mechanism to move vertically and up, the cylinder turnover mechanism drives the substrate sucker to turn over by 90 degrees through the rotating arm, the substrate sucker is butted with the substrate box when turning to the lowest point to realize substrate material taking, the substrate sucker is butted with the substrate conveying device when turning to the highest point to realize substrate material loading, the unclamping cylinder, the unclamping pressing block and the conveying steel plate limiting block are matched with the substrate conveying device when used for substrate material loading, and the original point returning cylinder is used for returning the A sliding seat and the B sliding seat to the original point after the substrate material loading is finished so as to carry out secondary loading.
Further, the whole structure of the automatic blanking device is consistent with that of the automatic feeding device.
Further, the base material conveying device comprises a conveying device power reducer, a conveying driving wheel, a conveying driven wheel, a conveying track support, a conveying track, a conveying pulley fixing plate, a conveying steel plate, an electroplating base material clamp, a conductive brush and a cathode copper bar; the conveying device power reducer is arranged on the rack, the conveying driving wheel and the conveying driven wheel are respectively arranged at two end parts of the rack, the conveying driving wheel is connected with the conveying driven wheel through the conveying steel plate, the conveying device power reducer is connected with the conveying driving wheel, the conveying track is fixed on the rack through the conveying track support, the conveying pulley is arranged on the conveying track, the conveying pulley is connected with the conveying steel plate through the conveying pulley fixing plate, the electroplating base material clamp is arranged at the lower end of the conveying steel plate, the conductive brush is fixed on the conveying pulley fixing plate, the cathode copper bar is fixed on the conveying track support, the conductive brush is driven by the conveying pulley fixing plate to form sliding friction with the cathode copper bar, and the cathode copper bar is connected with an external electroplating rectifier, and the current output by the external electroplating rectifier is transmitted to the electroplating base material clamp through the cathode copper bar, the conductive brush, the conveying pulley fixing plate and the conveying steel plate in sequence, so that the continuous electroplating of the base material is realized.
Further, the substrate guiding device comprises two guiding frames and a fixing assembly; each guide frame comprises two side end plates, fixing lugs, a connecting rod, a cathode baffle, a connecting plate, a guide plate, a flexible guide bar and a flexible guide bar connecting block, and the fixing assembly comprises a fixing screw rod, an adjusting nut, an upper fixing plate and a lower fixing plate; the upper parts of the side end plates are provided with the fixing lugs, the upper parts of the two side end plates are connected with the upper fixing plate through the connecting rods, and the fixing screws and the adjusting nuts are used for fixing the fixing lugs with the lower fixing plate; the lower parts of the two side end plates are connected through the connecting plate, and the cathode baffle and the guide plate are arranged between the lower parts of the two side end plates; the two side end plates are respectively provided with the flexible guide bar connecting blocks, and the two flexible guide bar connecting blocks are connected through the flexible guide bars; the two guide frames are symmetrically arranged, and the bottoms of the two guide frames are fixedly connected through the lower fixing plate.
Furthermore, the plating bath water retaining device comprises a power assembly, a power transmission assembly, a first water retaining guide wheel, a second water retaining guide wheel, a water retaining guide wheel fixing box, a first conveying positioning wheel and a second conveying positioning wheel; the first water retaining guide wheel and the second water retaining guide wheel are arranged in the water retaining guide wheel fixing box, the surfaces of the first water retaining guide wheel and the second water retaining guide wheel are mutually contacted, and the power assembly drives the first water retaining guide wheel and the second water retaining guide wheel to mutually rotate reversely through the power transmission assembly; the first conveying positioning wheel and the second conveying positioning wheel are arranged above the water retaining guide wheel fixing box.
Further, the equipment also comprises a substrate clamp deplating device, wherein the substrate clamp deplating device is respectively fixed on the back surfaces of the electroplating post-treatment tank and the electroplating tank.
Further, the equipment also comprises a substrate clip drying device, wherein the substrate clip drying device is fixed on the back surface of the electroplating pretreatment tank.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
the vertical continuous electroplating equipment of the invention is characterized in that an automatic feeding device, a substrate conveying device, a substrate guiding device, a plating bath water retaining device and an automatic discharging device are tightly matched, the automatic feeding device conveys a substrate to the substrate conveying device, then the substrate conveying device drives the substrate to sequentially enter a pre-plating treatment tank, a plating bath and a post-plating treatment tank, and finally the substrate is butted with the automatic discharging device to put the plated substrate, when the substrate moves in the pre-plating treatment tank, the plating bath and the post-plating treatment tank, the movement route of the substrate is accurate and smooth due to the existence of the substrate guiding device, the movement process of the substrate tends to be stable, the plating of the substrate is more uniform and stable, due to the existence of the plating bath water retaining device, the substrate can be well retained without obstructing the inlet and outlet of the plating bath, and under the mutual tight matching of the structures, a complete, Continuous electroplating apparatus. The electroplating equipment has strong practicability and is suitable for popularization in the field.
Drawings
FIG. 1 is a front view of a vertical continuous plating apparatus of the invention;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a left side view of FIG. 1;
FIG. 4 is a schematic view showing the positional relationship between the automatic loading device and the substrate transport device;
FIG. 5 is an enlarged view of a portion of FIG. 4;
FIG. 6 is a top view of the substrate transport apparatus;
FIG. 7 is a partial side view of FIG. 6;
FIG. 8 is a front view of the substrate guide;
FIG. 9 is a side view of FIG. 8;
FIG. 10 is a schematic view of the positional relationship of the substrate transport apparatus and the substrate guide apparatus;
FIG. 11 is an enlarged partial view of FIG. 10;
FIG. 12 is a schematic view showing the positional relationship between the substrate transport apparatus and the water stop apparatus of the plating tank;
FIG. 13 is an enlarged partial view of FIG. 12;
FIG. 14 is a simplified top view of a water stop and substrate guide of an electroplating bath.
Description of the main element symbols:
in the figure, a frame 1, a pre-electroplating treatment tank 2, an electroplating tank 3, a post-electroplating treatment tank 4, an automatic feeding device 5, a substrate conveying device 6, a substrate guiding device 7, an electroplating tank water retaining device 8, an automatic blanking device 9, a base material box 51, an A slide seat 52, a B slide seat 53, a precision slide block 54, an original point return cylinder 55, a follow-up pressing cylinder 56, a follow-up pressing block 57, an open clamping cylinder 58, an open clamping pressing block 59, a conveying steel plate limiting block 510, a cylinder up-and-down movement mechanism 511, a cylinder turnover mechanism 512, a rotating arm 513, a substrate sucker 514, a vacuum negative pressure valve 515, a vacuum negative pressure source 516, a conveying device power reducer 61, a conveying driving wheel 62, a conveying driven wheel 63, a conveying track support 64, a conveying track 65, a conveying pulley 66, a conveying pulley fixing plate 67, a conveying steel plate 68, an electroplating substrate clamp 69, a conductive brush 610, the device comprises a side end plate 71, a fixing lug 72, a connecting rod 73, a cathode baffle 74, a connecting plate 75, a guide plate 76, a flexible guide bar 77, a flexible guide bar connecting block 78, a fixing screw 79, an adjusting nut 710, an upper fixing plate 711, a lower fixing plate 712, a power assembly 81, a power transmission assembly 82, a first water retaining guide wheel 83, a second water retaining guide wheel 84, a water retaining guide wheel fixing box 85, a first conveying positioning wheel 86 and a second conveying positioning wheel 87.
Detailed Description
The present invention will be further described with reference to the following examples.
Referring to fig. 1 to 14, a vertical continuous electroplating apparatus comprises a frame 1, a pre-electroplating treatment tank 2, an electroplating bath 3, a post-electroplating treatment tank 4, an automatic feeding device 5, a substrate conveying device 6, a substrate guiding device 7, a water retaining device 8 of the electroplating bath, and an automatic discharging device 9, wherein the pre-electroplating treatment tank 2, the electroplating bath 3, the post-electroplating treatment tank 4, the automatic feeding device 5, the substrate conveying device 6, the substrate guiding device 7, the water retaining device 8 of the electroplating bath, and the automatic discharging device 9 are all mounted on the frame 1; the electroplating pretreatment tank 2, the electroplating tank 3 and the electroplating post-treatment tank 4 are fixed at the middle section of the frame 1, the automatic feeding device 5 is fixed in front of the electroplating pretreatment tank 2, and the automatic discharging device 9 is fixed behind the electroplating post-treatment tank 4; the substrate conveying device 6 is fixed above the automatic feeding device 5, the pre-electroplating treatment tank 2, the electroplating tank 3, the post-electroplating treatment tank 4 and the automatic discharging device 9 in a spanning manner, the substrate guiding device 7 is fixed in the pre-electroplating treatment tank 2, the electroplating tank 3 and the post-electroplating treatment tank 4 in a spanning manner and is positioned below the substrate conveying device 6, and the water retaining devices 8 of the electroplating tank are respectively fixed on the front surface and the rear surface of the electroplating tank 3;
in this embodiment, the automatic feeding device 5 includes an automatic feeding operation device and a base material box 51, and the automatic feeding operation device includes an a slide carriage 52, a B slide carriage 53, a precision slide block 54, an origin return cylinder 55, a speed following and pressing cylinder 56, a speed following and pressing block 57, an open clamping cylinder 58, an open clamping block 59, a steel plate conveying limit block 510, a cylinder up-and-down movement mechanism 511, a cylinder turnover mechanism 512, a rotating arm 513, a base material suction cup 514, a vacuum negative pressure valve 515, and a vacuum negative pressure source 516; the A sliding seat 52 and the B sliding seat 53 are respectively installed on the rack 1 through the precision sliding block 54, the A sliding seat 52 is connected with the B sliding seat 53 through a sliding seat connecting piece, and the origin return cylinder 55 and the steel plate conveying limiting block 510 are installed on the rack 1; the speed following pressing cylinder 56 and the clamping opening cylinder 58 are arranged on the slide A52, the speed following pressing block 57 is arranged on the speed following pressing cylinder 56, and the clamping opening pressing block 59 is arranged on the clamping opening cylinder 58; the cylinder up-and-down movement mechanism 511 is installed on the B sliding seat 53, the cylinder turnover mechanism 513 is installed at the lower end of the cylinder up-and-down movement mechanism 511, the cylinder turnover mechanism 512 is connected with the substrate sucker 514 through the rotating arm 513, the vacuum negative pressure valve 515 is connected with the substrate sucker 514, the vacuum negative pressure source 516 is connected with the vacuum negative pressure valve 514 through a negative pressure pipeline, and the vacuum negative pressure source 516 is installed at the top of the rack 1; the speed-following compaction cylinder 56 drives the speed-following pressure block 57 to compact the substrate conveying device 6, so that the horizontal movement of the slide A52 and the slide B53 follows the substrate conveying device 6 to move synchronously, the cylinder up-and-down movement mechanism 511 drives the cylinder turnover mechanism 512 to move vertically and up and down, the cylinder turnover mechanism 512 drives the substrate sucker 514 to turn over by 90 degrees through the rotating arm 513, the substrate sucker 514 is butted with the substrate box 51 to realize substrate material taking when turning to the lowest point, the substrate sucker 514 is butted with the substrate conveying device 6 to realize substrate material loading when turning to the highest point, the unclamping cylinder 58, the unclamping pressure block 59 and the conveying steel plate limiting block 510 are matched with the substrate conveying device 6 when used for substrate material loading, and the original point return cylinder 55 is used for matching the slide A52 after substrate loading is finished, The B slide 53 returns to the origin for secondary feeding;
preferably, the whole structure of the automatic blanking device 9 is consistent with that of the automatic feeding device 5;
preferably, the base material conveying device 6 comprises a conveying device power reducer 61, a conveying driving wheel 62, a conveying driven wheel 63, a conveying rail bracket 64, a conveying rail 65, a conveying pulley 66, a conveying pulley fixing plate 67, a conveying steel plate 68, a plating base material clamp 69, a conductive brush 610 and a cathode copper bar 611; the conveying device power speed reducer 61 is installed on the rack 1, the conveying driving wheel 62 and the conveying driven wheel 63 are respectively arranged at two ends of the rack 1, the conveying driving wheel 62 and the conveying driven wheel 63 are connected through the conveying steel plate 68, the conveying device power speed reducer 61 is connected with the conveying driving wheel 62, the conveying track 65 is fixed on the rack 1 through the conveying track support 64, the conveying pulley 66 is installed on the conveying track 65, the conveying pulley 66 is connected with the conveying steel plate 68 through the conveying pulley fixing plate 67, the electroplating base material clamp 69 is installed at the lower end of the conveying steel plate 68, the conductive brush 610 is fixed on the conveying pulley fixing plate 67, the cathode copper bar 611 is fixed on the conveying track support 64, and the conductive brush 610 forms sliding friction with the cathode copper bar 611 under the driving of the conveying pulley fixing plate 67, the cathode copper bar 611 is connected with an external electroplating rectifier, and the current output by the external electroplating rectifier is transmitted to the electroplating base material clamp 69 through the cathode copper bar 611, the conductive brush 610, the conveying pulley fixing plate 67 and the conveying steel plate 68 in sequence, so that the continuous electroplating of the base material is realized;
preferably, the substrate guiding device 7 comprises two guiding frames, a fixing component; each guide frame comprises two side end plates 71, fixing lugs 72, connecting rods 73, cathode baffle plates 74, connecting plates 75, guide plates 76, flexible guide strips 77 and flexible guide strip connecting blocks 78, and the fixing assembly comprises a fixing screw 79, an adjusting nut 710, an upper fixing plate 711 and a lower fixing plate 712; the fixing lug 72 is arranged at the upper part of the side end plate 71, the upper parts of the two side end plates 71 are connected with the upper fixing plate 711 through the connecting rod 73, and the fixing screw 79 and the adjusting nut 710 are used for fixing the fixing lug 72 with the lower fixing plate 711; the lower parts of the two side end plates are connected through the connecting plate 75, and the cathode baffle 74 and the guide plate 76 are arranged between the lower parts of the two side end plates; the two side end plates 71 are respectively provided with the flexible guide bar connecting blocks 78, and the two flexible guide bar connecting blocks 78 are connected through the flexible guide bars 77; the two guide frames are symmetrically arranged, and the bottoms of the two guide frames are fixedly connected through the lower fixing plate 712;
preferably, the plating bath water retaining device 8 comprises a power assembly 81, a power transmission assembly 82, a first water retaining guide wheel 83, a second water retaining guide wheel 84, a water retaining guide wheel fixing box 85, a first conveying positioning wheel 86 and a second conveying positioning wheel 87; the first water retaining guide wheel 83 and the second water retaining guide wheel 84 are installed in the water retaining guide wheel fixing box 85, the surfaces of the first water retaining guide wheel 83 and the second water retaining guide wheel 84 are in contact with each other, and the power assembly 81 drives the first water retaining guide wheel 83 and the second water retaining guide wheel 84 to rotate reversely through the power transmission assembly 82; the first conveying positioning wheel 86 and the second conveying positioning wheel 87 are arranged above the water retaining guide wheel fixing box 85;
preferably, the equipment further comprises a substrate clamp deplating device, wherein the substrate clamp deplating device is respectively fixed on the back surfaces of the electroplating post-treatment tank 4 and the electroplating tank 3;
preferably, the equipment further comprises a substrate clip drying device, and the substrate clip drying device is fixed on the back of the electroplating pretreatment tank 2.
The working principle is as follows: when the electroplating device works, the conveying device power reducer 61 drives the conveying driving wheel 62 to rotate, so as to drive the conveying steel plate 68 to circularly move, the conveying steel plate 68 drives the conveying pulley 66 to slide along the conveying track 65 through the conveying pulley fixing plate 67, and meanwhile, the electroplating substrate clamp 69 also circularly moves along with the conveying steel plate 68;
when feeding, the base material is stacked in the base material box 51, the cylinder turnover mechanism 512 turns over the base material sucker 514 to the lowest point through the rotating arm 513, the cylinder up-and-down movement mechanism 511 drives the cylinder turnover mechanism 512 to move downwards, so that the base material sucker 514 enters the base material box 51, the vacuum negative pressure source 516 is started to make the base material sucker 514 adsorb a base material, then the cylinder up-and-down movement mechanism 511 moves upwards to pull the base material sucker 514 out of the base material box 51, the cylinder turnover mechanism 512 drives the base material sucker 514 to turn over to the highest point through the rotating arm 513, the cylinder up-and-down movement mechanism 511 moves upwards, meanwhile, the speed following pressing cylinder 56 drives the speed following pressing block 57 to press the conveying steel plate 68, and the unclamping cylinder 58 drives the unclamping pressing block 59 to press the upper end portion of the electroplating base material clamp 69 to open, the conveying steel plate limiting block 510 plays a role in supporting the conveying steel plate 68, then the substrate sucker 514 drives the substrate to move to the electroplating substrate clamp 69, the unclamping cylinder 58 drives the unclamping pressure block 59 to retract, the electroplating substrate clamp 69 clamps the substrate, the vacuum negative pressure source 516 stops working, the speed-following pressing cylinder 56 drives the speed-following pressure block 57 to retract, the electroplating substrate clamp 69 drives the substrate to continue moving, and feeding is finished; the original point return cylinder 55 is used for returning the slide bases A and B52 and 53 to the original points after the loading of the base material is finished so as to carry out secondary loading;
when the base material moves in the base material guide device 7, the base material passes through the gap between the two side end plates 71, and the base material guide device 7 can ensure that the moving direction of the base material is unchanged when the base material is subjected to other processes during moving, and also ensures the moving stability of the base material;
when the base material enters and exits the electroplating bath 3, the base material passes through the water retaining device 8 of the electroplating bath, at the moment, the conveying steel plate 68 passes through the space between the first conveying positioning wheel 86 and the second conveying positioning wheel 87, the combination of the structure plays a role in guiding the conveying steel plate 68, so that the moving base material is just positioned between the first water retaining guide wheel 83 and the second water retaining guide wheel 84, the first water retaining guide wheel 83 and the second water retaining guide wheel 84 form a reverse rotation phenomenon under the driving of the power assembly 81 and the power transmission assembly 82, the base material moving to the position can pass through smoothly, and meanwhile, a good water retaining effect can be achieved; when the base material moves in the electroplating tank 3, the current output by the external electroplating rectifier is transmitted to the electroplating base material clamp 69, so that the continuous electroplating of the base material is realized;
after the base material comes out of the electroplating post-treatment tank 4, the processing procedure is finished, and blanking is performed at this time, the automatic blanking device 9 has the same structure as the automatic feeding device 5, and the working flow principle during blanking can be deduced according to the working flow principle during feeding, so that the base material is popular and easy to understand and is not described herein.
The above description is intended to describe in detail the preferred embodiments of the present invention, but the embodiments are not intended to limit the scope of the claims of the present invention, and all equivalent changes and modifications made within the technical spirit of the present invention should fall within the scope of the claims of the present invention.

Claims (4)

1. A vertical continuous electroplating equipment is characterized in that: the electroplating pre-treatment tank, the electroplating post-treatment tank, the automatic feeding device, the substrate conveying device, the substrate guiding device, the electroplating tank water retaining device and the automatic discharging device are all arranged on the frame; the electroplating pretreatment tank, the electroplating tank and the electroplating post-treatment tank are fixed at the middle section of the frame, the automatic feeding device is fixed in front of the electroplating pretreatment tank, and the automatic discharging device is fixed behind the electroplating post-treatment tank; the substrate conveying device is fixed above the automatic feeding device, the pre-electroplating treatment tank, the electroplating tank, the post-electroplating treatment tank and the automatic discharging device in a spanning manner, the substrate guiding device is fixed in the pre-electroplating treatment tank, the electroplating tank and the post-electroplating treatment tank in a spanning manner and is positioned below the substrate conveying device, and the water retaining devices of the electroplating tank are respectively fixed in the front and the back of the electroplating tank;
the automatic feeding device comprises an automatic feeding operation device and a base material box, wherein the automatic feeding operation device comprises an A sliding seat, a B sliding seat, a precision sliding block, an original point return cylinder, a speed following and pressing block, a clamp opening cylinder, a clamp opening and pressing block, a steel plate conveying limiting block, a cylinder up-and-down movement mechanism, a cylinder turnover mechanism, a rotating arm, a base material sucker, a vacuum negative pressure valve and a vacuum negative pressure source; the A sliding seat and the B sliding seat are respectively installed on the rack through the precision sliding blocks, the A sliding seat is connected with the B sliding seat through a sliding seat connecting piece, and the original point return cylinder and the conveying steel plate limiting block are installed on the rack; the speed following pressing cylinder and the opening clamping cylinder are arranged on the sliding seat A, the speed following pressing block is arranged on the speed following pressing cylinder, and the opening clamping pressing block is arranged on the opening clamping cylinder; the cylinder up-and-down movement mechanism is installed on the sliding seat B, the cylinder turnover mechanism is installed at the lower end of the cylinder up-and-down movement mechanism, the cylinder turnover mechanism is connected with the substrate sucker through the rotating arm, the vacuum negative pressure valve is connected with the substrate sucker, the vacuum negative pressure source is connected with the vacuum negative pressure valve through a negative pressure pipeline, and the vacuum negative pressure source is installed at the top of the rack; the speed-following pressing cylinder drives the speed-following pressing block to press the substrate conveying device, so that the A sliding seat and the B sliding seat move horizontally to follow the substrate conveying device to move synchronously, the cylinder up-and-down movement mechanism drives the cylinder turnover mechanism to move vertically and up, the cylinder turnover mechanism drives the substrate sucker to turn over by 90 degrees through the rotating arm, the substrate sucker is butted with the substrate box when turning to the lowest point to realize substrate material taking, the substrate sucker is butted with the substrate conveying device when turning to the highest point to realize substrate material loading, the unclamping cylinder, the unclamping pressing block and the conveying steel plate limiting block are matched with the substrate conveying device when used for substrate material loading, and the original point returning cylinder is used for returning the A sliding seat and the B sliding seat to the original point after the substrate material loading is finished so as to carry out secondary loading;
the base material conveying device comprises a conveying device power speed reducer, a conveying driving wheel, a conveying driven wheel, a conveying rail support, a conveying rail, a conveying pulley fixing plate, a conveying steel plate, an electroplating base material clamp, a conductive brush and a cathode copper bar; the conveying device power reducer is arranged on the rack, the conveying driving wheel and the conveying driven wheel are respectively arranged at two end parts of the rack, the conveying driving wheel is connected with the conveying driven wheel through the conveying steel plate, the conveying device power reducer is connected with the conveying driving wheel, the conveying track is fixed on the rack through the conveying track support, the conveying pulley is arranged on the conveying track, the conveying pulley is connected with the conveying steel plate through the conveying pulley fixing plate, the electroplating base material clamp is arranged at the lower end of the conveying steel plate, the conductive brush is fixed on the conveying pulley fixing plate, the cathode copper bar is fixed on the conveying track support, the conductive brush is driven by the conveying pulley fixing plate to form sliding friction with the cathode copper bar, and the cathode copper bar is connected with an external electroplating rectifier, the current output by the external electroplating rectifier is transmitted to the electroplating base material clamp through the cathode copper bar, the conductive brush, the conveying pulley fixing plate and the conveying steel plate in sequence, so that the continuous electroplating of the base material is realized;
the substrate guiding device comprises two guiding frames and a fixing assembly; each guide frame comprises two side end plates, fixing lugs, a connecting rod, a cathode baffle, a connecting plate, a guide plate, a flexible guide bar and a flexible guide bar connecting block, and the fixing assembly comprises a fixing screw rod, an adjusting nut, an upper fixing plate and a lower fixing plate; the upper parts of the side end plates are provided with the fixing lugs, the upper parts of the two side end plates are connected with the upper fixing plate through the connecting rods, and the fixing screws and the adjusting nuts are used for fixing the fixing lugs with the lower fixing plate; the lower parts of the two side end plates are connected through the connecting plate, and the cathode baffle and the guide plate are arranged between the lower parts of the two side end plates; the two side end plates are respectively provided with the flexible guide bar connecting blocks, and the two flexible guide bar connecting blocks are connected through the flexible guide bars; the two guide frames are symmetrically arranged, and the bottoms of the two guide frames are fixedly connected through the lower fixing plate;
the plating bath water retaining device comprises a power assembly, a power transmission assembly, a first water retaining guide wheel, a second water retaining guide wheel, a water retaining guide wheel fixing box, a first conveying positioning wheel and a second conveying positioning wheel; the first water retaining guide wheel and the second water retaining guide wheel are arranged in the water retaining guide wheel fixing box, the surfaces of the first water retaining guide wheel and the second water retaining guide wheel are mutually contacted, and the power assembly drives the first water retaining guide wheel and the second water retaining guide wheel to mutually rotate reversely through the power transmission assembly; the first conveying positioning wheel and the second conveying positioning wheel are arranged above the water retaining guide wheel fixing box.
2. A vertical continuous plating apparatus according to claim 1, characterized in that: the whole structure of the automatic blanking device is consistent with that of the automatic feeding device.
3. A vertical continuous plating apparatus according to claim 2, characterized in that: the electroplating post-treatment device is characterized by further comprising a substrate clamp deplating device, wherein the substrate clamp deplating device is respectively fixed on the back surfaces of the electroplating post-treatment tank and the electroplating tank.
4. A vertical continuous plating apparatus according to claim 3, characterized in that: the device is characterized by further comprising a substrate clip blow-drying device, wherein the substrate clip blow-drying device is fixed on the back surface of the electroplating pretreatment tank.
CN201910126350.5A 2019-02-20 2019-02-20 Vertical continuous electroplating equipment Active CN109797422B (en)

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CN112210815B (en) * 2020-10-17 2021-06-01 十堰市协兴工贸股份有限公司 Intelligent electroplating device for surface of metal pipe fitting
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