CN221052034U

CN221052034U - Horizontal electroplating device

Info

Publication number: CN221052034U
Application number: CN202322471238.XU
Authority: CN
Inventors: 梁伟裕; 杨景章
Original assignee: Guangdong Zhihui Industrial Equipment Co ltd
Current assignee: Guangdong Zhihui Industrial Equipment Co ltd
Priority date: 2023-09-12
Filing date: 2023-09-12
Publication date: 2024-05-31
Anticipated expiration: 2033-09-12

Abstract

The utility model discloses a horizontal electroplating device, which comprises an annular conveyor belt and an electroplating clamp, wherein the annular conveyor belt is provided with a mounting seat, the annular conveyor belt is provided with a slope plate, a first surface of the slope plate is provided with a first area and a second area, the height of the first area is lower than that of the second area, a transition surface is arranged between the first area and the second area, the annular conveyor belt is provided with an electroplating cathode or a deplating cathode, and the electroplating cathode or the deplating cathode respectively corresponds to the first area and the second area; the electroplating fixture comprises a base, a first conductive clamping plate, a second conductive clamping plate and a conductive assembly, wherein the first conductive clamping plate and the second conductive clamping plate form a clamping mechanism, the conductive assembly is connected with an electroplating cathode or a deplating cathode, an eccentric driving mechanism is arranged on the base and connected with the second conductive clamping plate, and the second conductive clamping plate can be driven to move relative to the first conductive clamping plate so as to enable the clamping mechanism to be opened or closed. The utility model can realize automatic plate feeding and plate removing and can improve the working efficiency.

Description

Horizontal electroplating device

Technical Field

The utility model relates to the technical field of circuit board production equipment, in particular to a horizontal electroplating device.

Background

In the printed circuit board industry, it is desirable to plate a thin layer of copper on the surface of a printed circuit board. In the current industry, the work efficiency is low mostly through manual upper plate. In addition, the problem that the copper plating of the surface of the printed circuit board is uneven also easily occurs in manual board feeding, so that the production rejection rate is higher.

Disclosure of utility model

The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, the utility model provides a horizontal electroplating device which can improve the working efficiency.

The embodiment of the utility model provides a horizontal electroplating device, which comprises:

The device comprises an annular conveyor belt, a plurality of mounting seats arranged along the conveying direction, a slope plate is arranged on the annular conveyor belt and below the mounting seats, the slope plate is arranged around the annular conveyor belt, a first area and a second area are arranged on the first surface of the slope plate, the height of the first area is lower than that of the second area, a transition surface is arranged between the first area and the second area, an electroplating cathode or a deplating cathode is arranged on the annular conveyor belt and above the mounting seats, and the position of the electroplating cathode is adapted to the first area;

The electroplating clamp comprises a base, a first conductive clamping plate, a second conductive clamping plate and a conductive assembly, wherein the base is connected with the mounting seat, the first conductive clamping plate is arranged on the base, the first conductive clamping plate and the second conductive clamping plate form a clamping mechanism, the first conductive clamping plate and the second conductive clamping plate are electrically connected with the conductive assembly, the conductive assembly is connected with an electroplating cathode or a stripping cathode, an eccentric driving mechanism is arranged on the base and is abutted to the first surface of the slope plate, the eccentric driving mechanism is connected with the second conductive clamping plate and can drive the second conductive clamping plate to move relative to the first conductive clamping plate, so that the clamping mechanism is opened or closed.

According to some embodiments of the utility model, the first side of the endless conveyor is provided with a plating assembly comprising a plating zone and an electroless plating zone, the position of the plating zone being adapted to the first zone of the ramp plate.

According to some embodiments of the utility model, a first spray assembly, a second spray assembly, a first electroplating anode and a second electroplating anode are arranged in the electroplating area, the first spray assembly is positioned above the second spray assembly, a deck gap is formed between the first spray assembly and the second spray assembly, and the first electroplating anode and the second electroplating anode are respectively positioned on the upper side and the lower side of the deck gap.

According to some embodiments of the utility model, the electroless plating zone is provided with an in-plate transfer mechanism disposed at an in-plate end of the plating zone and an out-plate transfer mechanism disposed at an out-plate end of the plating zone.

According to some embodiments of the utility model, the second side of the endless conveyor is provided with an electroplating bath in which a circulation pump is mounted.

According to some embodiments of the utility model, the second side of the endless conveyor belt is further provided with a copper-dissolving tank, in which a copper-dissolving tank pump is mounted.

According to some embodiments of the utility model, the first spray assembly is communicated with a first spray pump, and a first spray flowmeter and a first flow regulating valve are communicated between the first spray assembly and the first spray pump.

According to some embodiments of the utility model, the second spray assembly is communicated with a second spray pump, and a second spray flowmeter and a second flow regulating valve are communicated between the second spray assembly and the second spray pump.

According to some embodiments of the utility model, the conductive assembly comprises a first conductive member, a second conductive member and a third conductive member, wherein the first conductive member is respectively connected to the first conductive clamping plate and the second conductive clamping plate in a conductive manner, the third conductive member is installed on the first conductive clamping plate, a first end of the second conductive member is hinged with the third conductive member, a second end of the second conductive member is abutted against the first conductive member, and a tension spring is further connected between the second conductive member and the third conductive member.

According to some embodiments of the utility model, the eccentric driving mechanism comprises a guide rod, a telescopic spring, a first eccentric cam and a second eccentric cam, wherein a guide part is arranged on the first conductive clamping plate, a pushing part is arranged on the second conductive clamping plate, a first end of the guide rod is connected with the pushing part, a second end of the guide rod penetrates through the guide part, the telescopic spring is sleeved on the guide rod, the first end of the telescopic spring is abutted to the guide part, the second end of the telescopic spring is abutted to the pushing part, the first eccentric cam is arranged on the first side of the base, the second eccentric cam is arranged on the second side of the base, and the first eccentric cam and the second eccentric cam are connected through a rotating rod penetrating through the base and can push the pushing part in the rotating process.

The embodiment of the utility model has at least the following beneficial effects:

The annular conveyor belt drives the electroplating clamp to synchronously move in the rotating process, in the moving process, when the electroplating clamp moves to the position corresponding to the first area of the slope plate, the conductive component is in contact with the electroplating cathode, the clamping mechanism is closed under the action of the eccentric driving mechanism, so that the circuit board to be processed is clamped to move and be electroplated, when the electroplating clamp moves to the position of the second area of the slope plate for use, the conductive component is in contact with the deplating cathode, the clamping mechanism is opened under the action of the eccentric driving mechanism, so that the circuit board is separated from the electroplating clamp and leaves the electroplating area, automatic plate feeding and automatic plate stripping of the electroplating process of the circuit board can be realized, and the working efficiency can be improved.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

FIG. 1 is a schematic top view of a horizontal plating apparatus according to an embodiment of the utility model;

FIG. 2 is a front cross-sectional view of a horizontal plating apparatus according to an embodiment of the utility model;

FIG. 3 is a schematic view of a plating jig according to an embodiment of the present utility model;

FIG. 4 is a schematic view showing a state change of an electroplating clamp according to an embodiment of the utility model;

fig. 5 is a side cross-sectional view of a horizontal plating apparatus according to an embodiment of the utility model.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

In the description of the present utility model, the meaning of "a number" means one or more, the meaning of "a plurality" means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and "above", "below", "within", etc. are understood to include the present number. If any, the terms "first," "second," etc. are used for distinguishing between technical features only, and should not be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present utility model, unless explicitly defined otherwise, terms such as "disposed," "connected," and the like should be construed broadly, and those skilled in the art can reasonably ascertain the specific meaning of the terms in the present utility model in connection with the specific contents of the technical proposal.

Referring to fig. 1, 2 and 3, the present embodiment discloses a horizontal electroplating device, which includes an endless conveyor belt 100 and an electroplating fixture 200, wherein the endless conveyor belt 100 is provided with a plurality of mounting seats 110 arranged along a conveying direction, in this embodiment, the endless conveyor belt 100 is in an oblong shape, the endless conveyor belt 100 can rotate circularly, and in the rotation process, the mounting seats 110 can be driven to rotate synchronously. As shown in fig. 3, a ramp plate 120 is disposed on the endless conveyor 100 below the mounting base 110, the ramp plate 120 is disposed around the endless conveyor 100, and a first surface of the ramp plate 120 has a first area 121 and a second area 122, wherein the first area 121 is lower than the second area 122, and a transition surface 123 is disposed between the first area 121 and the second area 122, wherein the transition surface 123 may be an inclined surface or an arc surface. As shown in fig. 2, an electroplating cathode 130 or a deplating cathode 140 is disposed on the endless conveyor 100 above the mounting seat 110, the position of the electroplating cathode 130 is adapted to the first area 121, and the deplating cathode 140 is located at a position outside the first area 121.

Referring to fig. 3 and 4, the electroplating fixture 200 includes a base 210, a first conductive clamping plate 220, a second conductive clamping plate 230 and a conductive assembly 240, wherein the base 210 is connected with the mounting base 110, the first conductive clamping plate 220 is mounted on the base 210, the first conductive clamping plate 220 and the second conductive clamping plate 230 form a clamping mechanism 201, the first conductive clamping plate 220 and the second conductive clamping plate 230 are both electrically connected to the conductive assembly 240, the conductive assembly 240 is connected with the electroplating cathode 130 or the deplating cathode 140, an eccentric driving mechanism 250 abutting against a first surface of the ramp plate 120 is mounted on the base 210, and the eccentric driving mechanism 250 is connected with the second conductive clamping plate 230 and can drive the second conductive clamping plate 230 to move relative to the first conductive clamping plate 220 so as to open or close the clamping mechanism 201.

In order to further understand the inventive concept of the present embodiment, the following describes the operation process of the plating jig 200 in detail.

Referring to fig. 1 to 4, a plurality of mounting seats 110 are disposed on the endless conveyor 100, and each mounting seat 110 is provided with a plating jig 200. Since the mounting base 110 is disposed along the conveying direction of the endless conveyor 100, and the electroplating cathode 130 or the stripping cathode 140 is disposed on the endless conveyor 100 above the mounting base 110, the conductive component 240 of the electroplating fixture 200 is connected to the electroplating cathode 130 or the stripping cathode 140 at the corresponding position. For one of the plating jigs 200, the eccentric driving mechanism 250 of the plating jig 200 abuts against the first surface of the ramp plate 120, when the abutting position is the first area 121 of the ramp plate 120, the clamping mechanism 201 consisting of the first conductive clamping plate 220 and the second conductive clamping plate 230 is closed, at this time, the circuit board 010 to be processed can be clamped and synchronously moved along with the endless conveyor belt 100, so as to enter the plating area 310, and since the conductive assembly 240 is connected with the plating cathode 130, the conductive assembly 240 energizes the circuit board 010 through the first conductive clamping plate 220 and the second conductive clamping plate 230, so as to perform plating; along with the rotation of the endless conveyor 100, the electroplating clamp 200 moves from the first area 121 to the second area 122 of the ramp plate 120, and as the second area 122 of the ramp plate 120 is higher than the first area 121, the eccentric driving mechanism 250 deflects under the guidance of the transition surface 123 of the ramp plate 120, so that the second conductive clamping plate 230 moves relative to the first conductive clamping plate 220, thereby opening the clamping mechanism 201, separating the circuit board 010 from the electroplating clamp 200 and leaving the electroplating area 310, and repeating the above processes in a circulating manner, without manual plate feeding in the production process, automatic plate feeding and automatic plate stripping can be realized, and the work efficiency can be improved.

Wherein, the first conductive clamping plate 220 and the second conductive clamping plate 230 are both L-shaped clamping plates. Specifically, the first conductive plate and the second conductive plate are installed parallel to each other, that is, the portion of the first conductive plate having a longer length is parallel to the portion of the second conductive plate having a longer length, and the portion of the first conductive plate having a shorter length is parallel to the portion of the second conductive plate having a shorter length, so that the shorter portions of the first conductive plate and the second conductive plate can touch each other, thereby forming the clamping mechanism 201, and the l-shaped clamping plate can horizontally clamp and move the circuit board 010.

Referring to fig. 3, a positioning block 211 is disposed on the base 210, a guiding hole is disposed on the positioning block 211, and the second conductive clamping plate 230 is disposed through the guiding hole and is capable of moving in the guiding hole relative to the first conductive clamping plate 220. Specifically, the first conductive clamping plate 220 is relatively fixedly installed on the base 210, and since the second conductive clamping plate 230 is penetrating through the guide hole and can move in the guide hole relative to the first conductive clamping plate 220, during the moving process, the clamping portions of the first conductive clamping plate 220 and the second conductive clamping plate 230 are close to each other, so that the circuit board 010 to be processed can be clamped or loosened.

The L-shaped clamping plate comprises a first bending portion 202 and a second bending portion 203, the length of the first bending portion 202 is shorter than that of the second bending portion 203, and an electroplating-preventing coating is arranged on the surface of the first bending portion 202. Because the first bending portion 202 is used for clamping the circuit board 010 and is soaked in the electroplating solution when in use, the electroplating-preventing coating can enable the conductive contact surfaces of the first conductive clamping plate 220 and the second conductive clamping plate 230 to be smooth and not easy to be coated with copper, copper plating is uniform, and cost can be reduced for customers. Wherein, the anti-electroplating coating can be a teflon material coating.

Referring to fig. 3, the conductive assembly 240 includes a first conductive member 241, a second conductive member 242 and a third conductive member 243, wherein the first conductive member 241 is electrically connected to the first conductive clamping plate 220 and the second conductive clamping plate 230 respectively, the third conductive member 243 is mounted on the first conductive clamping plate 220, a first end of the second conductive member 242 is hinged to the third conductive member 243, and mainly plays a role of rotation, and a second end of the second conductive member 242 is abutted to the first conductive member 241.

A tension spring 244 is further connected between the second conductive member 242 and the third conductive member 243, and the tension spring 244 can apply tension to the second conductive member 242, so that the second end of the second conductive member 242 continuously applies pressure to the first conductive member 241, and good contact between the first conductive member 241 and the electroplating cathode 130 or the stripping cathode 140 is ensured.

Referring to fig. 3 and 4, the eccentric driving mechanism 250 includes a guide rod 251 and a telescopic spring 252, a guide portion 221 is disposed on the first conductive clamping plate 220, a pushing portion 231 is disposed on the second conductive clamping plate 230, a first end of the guide rod 251 is connected with the pushing portion 231, a second end of the guide rod 251 is disposed through the guide portion 221, the telescopic spring 252 is sleeved on the guide rod 251, a first end of the telescopic spring 252 is abutted to the guide portion 221, and a second end of the telescopic spring 252 is abutted to the pushing portion 231. Since the second conductive clamping plate 230 can move relative to the first conductive clamping plate 220, the guide 221 and the guide bar 251 perform a guiding function during the movement. When an external force (e.g., a pushing force of the second eccentric cam 254) acts on the pushing portion 231, the clamping mechanism 201 opens, and the second conductive clamping plate 230 compresses the expansion spring 252; when the external force is removed, the extension spring 252 releases energy and closes the clamping mechanism 201.

The eccentric driving mechanism 250 further includes a first eccentric cam 253 and a second eccentric cam 254, the first eccentric cam 253 is mounted on a first side of the base 210, the second eccentric cam 254 is mounted on a second side of the base 210, the first eccentric cam 253 and the second eccentric cam 254 are connected through a rotating rod penetrating through the base 210, and the second eccentric cam 254 can push the pushing portion 231 in the rotating process. After the plating jig 200 is mounted on the mount 110, the first eccentric cam 253 abuts against the first surface of the ramp plate 120. When the position where the first eccentric cam 253 abuts is the first area 121 of the ramp plate 120, the second eccentric cam 254 does not apply pushing force to the pushing portion 231, the telescopic spring 252 is in an extended state, and the clamping mechanism 201 is closed; when the abutting position of the first eccentric cam 253 is transferred from the first region 121 to the second region 122 of the ramp plate 120 along with the rotation of the endless conveyor belt 100, as the second region 122 of the ramp plate 120 is higher than the first region 121, and a transition surface 123 is arranged between the first region 121 and the second region 122 of the ramp plate 120, the first eccentric cam 253 drives the second eccentric cam 254 to rotate through a rotating rod under the guidance of the transition surface 123, and the second eccentric cam 254 applies a pushing force to the pushing part 231, so that the second conductive clamping plate 230 is pushed to move and compresses and stores energy to the telescopic spring 252, the clamping mechanism 201 is opened, and the circuit board 010 is further released.

The back side of the base 210 is provided with an installation clamping position 212, and the base 210 and the installation seat 110 are clamped and installed.

Referring to fig. 1, a plating assembly 300 is disposed on a first side of the endless conveyor belt 100, and the plating assembly 300 includes a plating area 310 and a non-plating area 320, wherein the plating area 310 is positioned to be adapted to the first area 121 of the ramp plate 120. The circuit board 010 to be processed is carried from the non-plating area to the plating area 310 in a flat state by a carrying mechanism such as a carrying roller, and since the position of the settling area is adapted to the first area 121 of the ramp plate 120, that is, when the circuit board 010 is carried to the plating area 310, the holding mechanism 201 of the plating jig 200 is closed, thereby holding the circuit board 010, so that the circuit board 010 moves and is plated following the endless conveyor 100 within the plating area 310.

Specifically, referring to fig. 2, a first spray assembly 311, a second spray assembly 312, a first electroplating anode 313 and a second electroplating anode 314 are disposed in the electroplating area 310, the first spray assembly 311 is located above the second spray assembly 312, a deck gap is formed between the first spray assembly 311 and the second spray assembly 312, and the first electroplating anode 313 and the second electroplating anode 314 are respectively located at the upper side and the lower side of the deck gap. After the circuit board 010 enters the electroplating area 310, the circuit board 010 moves in the walking board gap, and the first spraying assembly 311 and the second spraying assembly 312 respectively spray the upper surface and the lower surface of the circuit board 010, wherein the first spraying assembly 311 and the second spraying assembly 312 adopt large-flow nozzles and spray the surface of the circuit board 010 at a short distance, so that bubbles attached to the surface of the circuit board 010 can be eliminated, and the circuit board 010 can obtain a uniform copper plating effect in the electroplating area 310.

Referring to fig. 1, the electroless plating area 320 is provided with an in-plate conveying mechanism 321 and an out-plate conveying mechanism 322, the in-plate conveying mechanism 321 is disposed at an in-plate end of the plating area 310, and the out-plate conveying mechanism 322 is disposed at an out-plate end of the plating area 310. Wherein, the plate feeding conveying mechanism 321 and the plate discharging conveying mechanism 322 can both adopt a conveying roller way. Before the circuit board 010 enters the plating area 310, the circuit board 010 is conveyed by the board-in conveying mechanism 321, and when the circuit board 010 leaves the plating area 310, the circuit board 010 is conveyed by the board-out conveying mechanism 322.

The second side of the endless conveyor 100 is provided with a plating solution tank, and a circulation pump 331 is installed in the plating solution tank, and the circulation pump 331 can ensure that the liquid in the plating solution tank flows uniformly, so that the plating solution is more uniform.

The second side of the endless conveyor 100 is further provided with a copper-dissolving tank in which a copper-dissolving tank pump 332 is installed, the copper-dissolving tank pump 332 ensuring that copper balls placed in the copper-dissolving tank can be dissolved in the plating solution.

Referring to fig. 5, in order to improve the uniformity of electroplating, the first spray assembly 311 is connected to a first spray pump 333, and a first spray flowmeter 334 and a first flow regulating valve 335 are connected between the first spray assembly 311 and the first spray pump 333, where the first spray flowmeter 334 can monitor the spray flow and control the flow through the first flow regulating valve 335, so as to facilitate improving the uniformity of spraying.

Likewise, the second spray assembly 312 is communicated with the second spray pump 336, and a second spray flowmeter 337 and a second flow regulating valve 338 are communicated between the second spray assembly 312 and the second spray pump 336, so that the uniformity of spraying can be improved.

Referring to fig. 1 to 5, in use, the circuit board 010 to be processed enters the plating assembly 300 in a flat state and is transferred from the non-plating region 320 to the plating region 310 of the plating assembly 300, specifically, the circuit board 010 is transferred to the plating region 310 by the board transfer mechanism 321, the position of the board transfer mechanism 321 corresponds to the second region 122 of the ramp plate 120 of the endless conveyor belt 100, the position of the plating region 310 corresponds to the first region 121 of the ramp plate 120, a transition surface 123 is provided between the second region 122 and the first region 121, and when the circuit board 010 is transferred to a position corresponding to the transition surface 123, since the transition surface 123 moves from a higher position to a lower position, the first eccentric cam 253 of the eccentric driving mechanism 250 drives the second eccentric cam 254 to rotate through the rotating rod, the second eccentric cam 254 gradually withdraws the pushing force applied to the pushing portion 231, and the telescopic spring 252 releases the energy to move the second conductive clamping plate 230 relative to the first conductive clamping plate 220, so that the clamping mechanism 201 of the plating clamp 200 is shifted from the open state to the closed state, and the circuit board 010 is clamped. At this time, the endless conveyor 100 can drive the circuit board 010 to move in the plating area 310, and in the moving process, the first spraying assembly 311 and the second spraying assembly 312 spray the circuit board 010, and in addition, since the conductive assembly 240 of the plating jig 200 is connected with the plating cathode 130 on the endless conveyor 100, the first conductive clamping plate 220 and the second conductive clamping plate 230 of the plating jig 200 clamp the circuit board 010, and the first plating anode 313 and the second plating anode 314 are disposed in the plating area 310, so that the circuit board 010 is conductive and plated in the moving process of the plating area 310. When the circuit board 010 moves from the plating area 310 to the board delivering mechanism 322, the position of the plating jig 200 is shifted from the first area 121 to the second area 122 of the ramp board 120, that is, from the position with a lower height to the position with a higher height, under the guiding action of the transition surface 123, the first eccentric cam 253 drives the second eccentric cam 254 to rotate through the rotating rod, the second eccentric cam 254 applies a pushing force to the pushing part 231, thereby pushing the second conductive clamping plate 230 to move and compressing and storing energy to the telescopic spring 252, expanding the clamping mechanism 201, and further releasing the circuit board 010, the circuit board 010 is sent out of the plating assembly 300 through the board out transfer mechanism 322. The electroplating clamp 200 of the embodiment can clamp thick plates or thin plates without manual adjustment, so that the pollution of bath solution is reduced; the surface of the soaking area of the electroplating clamp 200 is sprayed with a teflon material coating, and the conductive contact surfaces of the first conductive clamping plate 220 and the second conductive clamping plate 230 are smooth and not easy to be coated with copper, copper plating is uniform, and cost reduction is facilitated; the horizontal conveying automatic upper/lower plate is simple and easy to operate; the electroplating clamp 200 has good conductivity, does not drop the plate, has reliable structure and is not easy to deform, thereby being beneficial to reducing the rejection rate of products in the production process.

The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather is intended to cover all modifications, equivalents, or alternatives falling within the spirit and principles of the application.

Claims

1. A horizontal plating apparatus, comprising:

2. The horizontal plating apparatus as recited in claim 1, wherein a first side of the endless conveyor belt is provided with a plating assembly, the plating assembly comprising a plating area and a non-plating area, a position of the plating area being adapted to a first area of the ramp plate.

3. The horizontal plating apparatus according to claim 2, wherein a first spray assembly, a second spray assembly, a first plating anode and a second plating anode are disposed in the plating area, the first spray assembly is located above the second spray assembly, a deck gap is formed between the first spray assembly and the second spray assembly, and the first plating anode and the second plating anode are located on upper and lower sides of the deck gap, respectively.

4. A horizontal plating apparatus according to claim 2 or 3, wherein the non-plating area is provided with an inlet plate transfer mechanism and an outlet plate transfer mechanism, the inlet plate transfer mechanism being provided at an inlet plate end of the plating area, and the outlet plate transfer mechanism being provided at an outlet plate end of the plating area.

5. A horizontal plating apparatus according to claim 3, wherein the second side of the endless conveyor is provided with a plating bath in which a circulation pump is installed.

6. The horizontal plating apparatus as recited in claim 5, wherein the second side of said endless conveyor belt is further provided with a copper-dissolving tank having a copper-dissolving tank pump installed therein.

7. The horizontal plating apparatus of claim 3, 5 or 6, wherein the first spray assembly is in communication with a first spray pump, and wherein a first spray flow meter and a first flow regulating valve are in communication between the first spray assembly and the first spray pump.

8. The horizontal plating apparatus according to claim 3, 5 or 6, wherein the second spray assembly is in communication with a second spray pump, and a second spray flow meter and a second flow regulating valve are in communication between the second spray assembly and the second spray pump.

9. The horizontal plating apparatus of claim 1, wherein the conductive assembly comprises a first conductive member, a second conductive member, and a third conductive member, the first conductive member is electrically connected to the first conductive clamping plate and the second conductive clamping plate, the third conductive member is mounted on the first conductive clamping plate, a first end of the second conductive member is hinged to the third conductive member, a second end of the second conductive member abuts against the first conductive member, and a tension spring is further connected between the second conductive member and the third conductive member.

10. The horizontal electroplating device according to claim 1 or 9, wherein the eccentric driving mechanism comprises a guide rod, a telescopic spring, a first eccentric cam and a second eccentric cam, a guide part is arranged on the first conductive clamping plate, a pushing part is arranged on the second conductive clamping plate, a first end of the guide rod is connected with the pushing part, a second end of the guide rod penetrates through the guide part, the telescopic spring is sleeved on the guide rod, the first end of the telescopic spring is abutted to the guide part, the second end of the telescopic spring is abutted to the pushing part, the first eccentric cam is arranged on the first side of the base, the second eccentric cam is arranged on the second side of the base, the first eccentric cam and the second eccentric cam are connected through a rotating rod penetrating through the base, and the second eccentric cam can push the pushing part in the rotating process.