CN109786349B

CN109786349B - Exhaust type device and device welding structure

Info

Publication number: CN109786349B
Application number: CN201810026998.0A
Authority: CN
Inventors: 杨琼; 谭阳生
Original assignee: Suzhou Nexun High Energy Semiconductor Co ltd
Current assignee: Suzhou Nexun High Energy Semiconductor Co ltd
Priority date: 2018-01-11
Filing date: 2018-01-11
Publication date: 2020-11-03
Anticipated expiration: 2038-01-11
Also published as: CN109786349A

Abstract

The invention provides an exhaust device and a device welding structure, and relates to the technical field of microelectronics. In the welding process, due to the existence of foreign matters such as foreign matters, bubbles can be generated at the positions of the foreign matters and can be discharged to the outside along the first exhaust groove, so that the welding voidage is reduced. Meanwhile, due to the existence of the first exhaust groove, the solder block can be filled into the first exhaust groove after being melted. Compared with the prior art, the air exhaust device provided by the invention has the advantages that bubbles generated in the welding process are exhausted through the first air exhaust groove, so that the void ratio is reduced, and meanwhile, the solder can uniformly overflow.

Description

Exhaust type device and device welding structure

Technical Field

The invention relates to the technical field of microelectronics, in particular to an exhaust device and a device welding structure.

Background

In the field of microelectronic technology, the packaging efficiency is directly affected by the quality of the packaging technology, in some packaging, in order to improve the production efficiency, a layer of solder is directly manufactured on the bottom surface of a chip or a capacitor, and the chip or the capacitor is directly welded during packaging conveniently.

In the prior art, bubbles are easily generated due to the existence of impurities such as foreign matters in the welding process, and the area of the welding flux on the bottom surface of the chip or the capacitor is too large, so that the generated bubbles cannot be smoothly discharged, the welding voidage is greatly improved, and the welding quality is reduced. Meanwhile, due to the generation of bubbles, the overflow of the solder is not uniform.

In view of the above, it is important to design and manufacture an exhaust device having an exhaust function, which can smoothly exhaust bubbles generated by soldering, reduce a void ratio, and make solder overflow uniformly.

Disclosure of Invention

An object of the present invention is to provide a vent type device having a vent function capable of smoothly discharging bubbles generated by soldering to reduce a void ratio and uniformly overflowing solder.

Another object of the present invention is to provide a device soldering structure capable of smoothly discharging bubbles generated by soldering, so that the soldering quality is greatly improved.

The invention is realized by adopting the following technical scheme.

The utility model provides an exhaust formula device, includes device main part, cladding material and a plurality of solder block, and the cladding material subsides are established a side surface at the device main part, and a plurality of solder block set up and keep away from a side surface of device main part and outside protruding at the cladding material, and form first exhaust groove between two adjacent solder blocks, every first exhaust groove with external intercommunication on the extending direction.

Further, every solder bump includes a plurality of sub-solder bumps, and a plurality of sub-solder bumps evenly set up on the cladding material, form the second air discharge duct between two adjacent sub-solder bumps, the second air discharge duct communicates with the external world on the extending direction for further even inside gaseous that produces of discharge welding in-process.

Further, the solder mass has a quadrilateral or triangular shape.

Further, the width of the first vent groove is set to be between 1/10 and 1/2 of the solder mass width in the direction of the width of the vent groove, so that the gas can be sufficiently exhausted from the solder mass while ensuring the soldering quality.

Furthermore, the width of one end, close to the middle part of the coating, of at least one first exhaust groove is smaller than that of one end, far away from the middle part of the coating, of the first exhaust groove, so that gas generated by welding can be exhausted to the outside better.

Further, the width of the second exhaust groove is smaller than the width of the first exhaust groove.

Further, the material of the plating layer is gold plating layer, silver plating layer or nickel plating layer.

Furthermore, the solder block is made of gold-silicon alloy solder block, gold-tin alloy solder block or gold-copper alloy solder block.

Further, the exhaust grooves are formed by etching or deposition.

The utility model provides a device welded structure, includes welding body and exhaust formula device, and the exhaust formula device includes device main part, cladding material and a plurality of solder block, and the cladding material subsides are established on a side surface of device main part, and a plurality of solder block set up and keep away from a side surface of device main part and outside protruding at the cladding material, and form first exhaust groove between two adjacent solder blocks, every first exhaust groove on the extending direction with external intercommunication. The welding body is provided with a welding position, and the device main body is welded on the welding position through a plurality of welding fluxes.

The invention has the following beneficial effects:

the invention provides an exhaust device, wherein a plurality of solder blocks are arranged at the bottom of a device main body, a plating layer is arranged between each solder block and the device main body, a first exhaust groove is formed between every two adjacent solder blocks, and each first exhaust groove is communicated with the outside in the extending direction. In the welding process, due to the existence of foreign matters such as foreign matters, bubbles can be generated at the positions of the foreign matters, the solder block can be in a melting state during welding, and the generated bubbles can be discharged to the outside along the first exhaust groove, so that the welding voidage is reduced. Meanwhile, due to the existence of the first exhaust groove, the solder block can be filled into the first exhaust groove after being melted. Compared with the prior art, the air exhaust device provided by the invention has the advantages that bubbles generated in the welding process are exhausted through the first air exhaust groove, so that the void ratio is reduced, and meanwhile, the solder can uniformly overflow.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic diagram of a first view of an exhaust device according to a first embodiment of the present invention;

fig. 2 is a schematic structural diagram of a second view angle of the exhaust type device according to the first embodiment of the present invention;

FIG. 3 is a schematic structural diagram of an exhaust type device according to a second embodiment of the present invention;

fig. 4 is a schematic structural view of an exhaust type device according to a third embodiment of the present invention;

fig. 5 is a schematic structural diagram of an exhaust device according to a fourth embodiment of the present invention.

Icon: 100-vented devices; 110-a device body; 130-plating; 150-solder bumps; 151-sub-solder masses; 170-first exhaust groove; 190-second vent groove.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships conventionally put on the products of the present invention when used, and are only used for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "connected," "mounted," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Some embodiments of the invention are described in detail below with reference to the accompanying drawings. Features in the embodiments described below may be combined with each other without conflict.

First embodiment

Referring to fig. 1 and 2 in combination, the present embodiment provides a venting device 100, which includes a device main body 110, a plating layer 130, and a plurality of solder bumps 150, wherein the plating layer 130 is attached to a side surface of the device main body 110, the plurality of solder bumps 150 are disposed on a side surface of the plating layer 130 away from the device main body 110 and protrude outward, a first venting groove 170 is formed between two adjacent solder bumps 150, and each first venting groove 170 is communicated with the outside in an extending direction.

It should be noted that the device body 110 and the electronic device may be a chip, a capacitor or other electronic devices, but they have a common feature that they have solder bumps 150 on the bottom to facilitate soldering.

In the present embodiment, the plating layer 130 is laid on the bottom of the device body 110 and has a thickness of 0.2um to 10um for enhancing solderability of the plurality of solder bumps and protecting the device body 110. Preferably, the thickness of the plating layer 130 is 0.5um to 2 um.

In the present embodiment, the plating layer 130 is gold plating. It should be noted that the material of the plating layer 130 is not limited to this, and may be other metal materials, such as silver or nickel, etc., or alloy materials, such as a NiPbAu alloy plating layer, etc.

The solder mass 150 is used for soldering the device body 110 during mounting, and the solder mass 150 is made of gold-tin alloy. It should be noted that the material of the solder bump is not limited to this, and may be other alloy materials, such as gold silicon alloy, gold copper alloy, or gold germanium alloy.

In the present embodiment, each solder bump has a thickness of 1um to 20um for soldering the device body 110. Preferably, the thickness of each welding block is 3um-10um, and the condition of excessive welding slag is avoided while the welding is ensured to be in place.

In the present embodiment, the solder masses 150 are quadrilateral in shape, and a plurality of rectangular solder masses 150 are arranged on the plating layer 130 with a space between two adjacent solder masses 150, thereby forming a first gas discharge groove 170 for discharging gas generated during soldering and reducing the void ratio. The air exhaust structure is not arranged in the original welding structure, bubbles can be generated at impurity positions due to the existence of impurities such as foreign matters in the welding process, but the bubbles cannot be smoothly exhausted due to the fact that welding materials around the bubbles are in a melting state, and therefore a cavity exists below the device. The presence of the first exhaust groove 170 enables gas generated during welding to be smoothly discharged along the first exhaust groove 170, thereby reducing a void ratio.

In this embodiment, the first exhaust grooves 170 between two adjacent solder masses 150 on any same side can be made into exhaust grooves with different widths, that is, the two adjacent solder masses 150 are made into trapezoids, and the width of the end close to the middle of the plating layer 130 is smaller than that of the end far from the middle of the plating layer 130, so as to better exhaust the gas generated by soldering to the outside.

It should be noted that the shape of the solder mass 150 is not limited to a quadrilateral, but may be a circle or other irregular shapes, and the like, and is not limited herein.

In the present embodiment, in order to ensure the soldering quality while the gas can be sufficiently discharged out of the solder mass 150, the width of each first gas discharge groove 170 is set to be between 1/10 and 1/2 of the width of the solder mass 150 in the direction of the width of the gas discharge groove. In the field of microelectronic devices, the width of the first exhaust groove 170 is 50um-500um, which is convenient for exhausting gas generated by welding to the outside; preferably, the width of the first exhaust groove 170 is 150um to 250um, so that the gas can be exhausted as much as possible while the welding quality is ensured.

In this embodiment, the solder mass 150 is processed by deposition, but the present invention is not limited thereto, and the solder mass 150 may be disposed on the plating layer 130 by electroplating or other methods capable of forming solder.

In this embodiment, the first exhaust groove 170 is formed by etching or deposition. Of course, the first air-bleed groove 170 may be directly surrounded or chiseled by the solder masses 150, but any manner of forming a groove structure in the bottom of the device is within the scope of the present invention.

In summary, the present embodiment provides an exhaust device 100, a plurality of solder blocks 150 are disposed at the bottom of a device main body 110, a plurality of first exhaust grooves 170 are disposed between the solder blocks 150, and the gas generated in the soldering process can be exhausted through the first exhaust grooves 170, so that the void ratio after the soldering is completed is reduced, and the solder overflow is more uniform.

Second embodiment

Referring to fig. 3, the present embodiment provides an exhaust device 100, the basic structure and principle thereof and the technical effects thereof are the same as those of the first embodiment, and for the sake of brief description, no part of the description of the present embodiment refers to the corresponding contents of the first embodiment.

In the present embodiment, each solder bump 150 includes a plurality of sub-solder bumps 151, the plurality of sub-solder bumps 151 are uniformly disposed on the plating layer 130, a second air vent groove 190 is formed between two adjacent sub-solder bumps 151, and the second air vent groove 190 is communicated with the outside in the extending direction. Preferably, the number of the sub-solder masses 151 is four, so that the second air vent grooves 190 are arranged crosswise.

In the present embodiment, each sub-solder bump 151 has the same shape as the solder bump 150, and 4 rectangular sub-solder bumps 151 are arrayed on the plating layer 130 with a space between two adjacent sub-solder bumps 151 in the same solder bump 150, thereby forming the second air release groove 190 for further uniformly releasing the air generated inside during the soldering process.

In this embodiment, the width of the second exhaust groove 190 is smaller than the width of the first exhaust groove 170, so as to ensure the welding quality. Of course, here, the width of the second exhaust groove 190 may be equal to the width of the first exhaust groove 170 to achieve smooth exhaust.

The exhaust device 100 provided by the embodiment further decomposes the solder block 150 and is provided with the second exhaust groove 190, so that the exhaust effect is better, the void ratio is further reduced, and the solder overflows uniformly.

Third embodiment

Referring to fig. 4, the present embodiment provides an exhaust device 100, the basic structure and principle thereof and the technical effects thereof are the same as those of the first embodiment, and for the sake of brief description, no part of the description of the present embodiment refers to the corresponding contents of the first embodiment.

In the embodiment, the solder bumps 150 are triangular, and the number of the solder bumps 150 is also 4, so that two first exhaust grooves 170 are formed, and the first exhaust grooves 170 are obliquely and alternately arranged. The 4 solder masses 150 are assembled to one another to form a rectangle, and the edge of each solder mass 150 coincides with the edge of the rectangle. Both first exhaust slots 170 pass through the center of the rectangle, making the exhaust more uniform.

In the vent device 100 of the present embodiment, the solder bump 150 is triangular and the first venting grooves 170 are obliquely and alternately arranged, so that the gas in the soldering process can be smoothly vented.

Fourth embodiment

Referring to fig. 5, the present embodiment provides an exhaust device 100, the basic structure and principle thereof and the technical effects thereof are the same as those of the first embodiment, and for the sake of brief description, no part of the present embodiment is mentioned, and reference may be made to the corresponding contents of the first embodiment.

The first exhaust groove 170 extends outwards from the middle of the plating layer 130, and the width of one end of the first exhaust groove 170 close to the middle of the plating layer 130 is smaller than that of one end of the first exhaust groove 170 far away from the middle of the plating layer 130, so that gas generated by welding can be better exhausted to the outside. Each of the first exhaust grooves 170 extends in the same direction as the width direction or the length direction of the plating layer 130.

In this embodiment, the first exhaust groove 170 is 4, and 4 first exhaust grooves 170 are outwards extended by cladding layer 130 central point, and every two adjacent first exhaust grooves 170's contained angle is the same for first exhaust groove 170 distributes evenly, makes things convenient for exhaust gas.

It should be noted that the first exhaust groove 170 may be inclined, so that the length of the first exhaust groove 170 is increased to facilitate the exhaust of the gas.

In the welding process, the gas gathering that the welding produced is to first gas groove 170, because the narrow outer wide shape in first gas groove 170 for the edge of two adjacent welding pieces is difficult for bonding, has avoided blockking up the condition appearance of first gas groove 170, and the convenience is discharged the external world smoothly with the gas that the welding produced.

Fifth embodiment

The present embodiment provides a device soldering structure, which includes a soldering body (not shown) and a vent device 100, wherein the basic structure and principle of the vent device 100 and the technical effect thereof are the same as those of the first embodiment, and for the sake of brief description, reference may be made to the corresponding contents of the first embodiment where nothing is mentioned in this embodiment.

The exhaust type device 100 includes a device body 110, a plating layer 130, and a plurality of solder bumps 150, wherein the plating layer 130 is attached to a side surface of the device body 110, the plurality of solder bumps 150 are disposed on a side surface of the plating layer 130 away from the device body 110 and protrude outward, a first exhaust groove 170 is formed between two adjacent solder bumps 150, and each first exhaust groove 170 is communicated with the outside in the extending direction. The soldering body has a soldering site, and the device main body 110 is soldered to the soldering site by a plurality of solder bumps 150.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides an exhaust formula device, its characterized in that includes device main part, cladding material and a plurality of solder block, the cladding material is pasted and is established a side surface of device main part, it is a plurality of the solder block sets up the cladding material is kept away from a side surface of device main part and outside arch, and adjacent two form first exhaust groove between the solder block, every first exhaust groove communicates with the external world on the extending direction, first exhaust groove is arranged in discharging the bubble that produces among the welding process.

2. The vent device of claim 1, wherein each of the solder bumps comprises a plurality of sub-solder bumps, the plurality of sub-solder bumps are uniformly disposed on the plating layer, and a second vent groove is formed between two adjacent sub-solder bumps, and the second vent groove is communicated with the outside in the extending direction.

3. The vented device of claim 1, wherein the solder mass has a quadrilateral or triangular shape.

4. The vent device of claim 1 or 3, wherein the width of the first vent groove is between 1/10 and 1/2 of the solder bump width in the direction of the vent groove width.

5. The exhaust gas type device according to claim 1, wherein at least one of the first exhaust grooves has a width at an end thereof closer to the central portion of the plating layer smaller than a width at an end thereof farther from the central portion of the plating layer.

6. The exhaust gas type device according to claim 2, wherein a width of the second exhaust groove is smaller than a width of the first exhaust groove.

7. The exhaust gas type device according to claim 1, wherein the plating is gold plating, silver plating, or nickel plating.

8. The vented device of claim 1, wherein the solder mass is a gold silicon alloy solder mass, a gold tin alloy solder mass, or a gold copper alloy solder mass.

9. The exhaust device of claim 1, wherein the exhaust grooves are formed by etching or deposition.

10. A device bonding structure comprising a bonding body having a bonding site thereon, and the vented device of any one of claims 1 to 9, wherein the device body is bonded to the bonding site by a plurality of solder bumps.