CN109738995A - A kind of 5G high-speed optical module die package device - Google Patents
A kind of 5G high-speed optical module die package device Download PDFInfo
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- CN109738995A CN109738995A CN201811592048.0A CN201811592048A CN109738995A CN 109738995 A CN109738995 A CN 109738995A CN 201811592048 A CN201811592048 A CN 201811592048A CN 109738995 A CN109738995 A CN 109738995A
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Abstract
The invention discloses a kind of 5G high-speed optical module die package devices, including encapsulating shell and encapsulation headgear, inserted block is fixedly connected on the right side of the encapsulating shell, it is offered on the left of the encapsulation headgear and the mutually matched slot of inserted block, the right side of the encapsulating shell is mutually clamped by inserted block with the left side for encapsulating headgear, the inside of the encapsulating shell is equipped with optical module, external fixed block is fixedly connected on the right side of optical module, dust excluding plate is fixedly connected on the right side of external fixed block, golden finger is fixedly connected on the right side of dust excluding plate, encapsulation headgear inner wall and be located at golden finger on the left of be fixedly connected with blend stop, the present invention relates to encapsulation device for optical module technical fields.The 5G high-speed optical module die package device, it solves existing light module package to fix using adhesive or resin-encapsulated, cause operating procedure complicated, increase manpower output, and using these optical modules using when due to squeezing and shaking the problem of optical module can be made to be detached from encapsulating shell.
Description
Technical field
The present invention relates to encapsulation device for optical module technical field, specially a kind of 5G high-speed optical module die package device.
Background technique
Optical module is made of opto-electronic device, functional circuit and optical interface etc., and opto-electronic device includes emitting and receiving two
Part, briefly, the effect of optical module are exactly photoelectric conversion, and transmitting terminal converts electrical signals into optical signal, are passed by optical fiber
After sending, optical signal is converted into electric signal again by receiving end, when existing light module package, will be connected with fiber waveguide device and optical fiber
The fiber unit receiving of connection is inside the shell, fixed inside the shell by the fiber unit using adhesive or resin.1, pan feeding group:
Card is put into cassette, is pulled down card to carrying arm using vacuum chuck by drawing treibgas cylinder.2, expect frame group: chip is heated
After adhesive tape is accordingly put in entering bin, then chip hot melt adhesive is imported by material-guiding wheel and rushes gummed paper mould, prewelding group rushes chipset
Deng the band after punching is directed respectively into corresponding position and is kept well.3, prewelding group: by generating elements heat, temperature inductor and temperature
Spend controller cooperation control heating temperature, the prewelding time sets by touch screen, pot soldering tip carry out under the action of the cylinder hot melt adhesive with
Module gum will use corresponding pot soldering tip instead according to different modules, such as eight contacts and six contacts.4, module quality identification group:
Bad module identifying hole is incuded by reflection electric eye, and gives signal to PLC, if receiving perforating module signal, PLC can will be bad
Module by signal is transmitted to mold punching group, and mold is not punched a little modules, and the corresponding card of this module without spot welding, arrive by not hot weld
Card is sent into waste material box when encapsulating IC detection group.5, mold: 1, being fixed in mold sliding slot by set of molds by four screws,
Different types of module is facilitated to carry out die change.2, it is pushed from the bottom up when being punched by cylinder, it is ensured that module hair when encapsulation
Stab down, 3, sweep away come module by transfer front and rear cylinders using vacuum chuck pick up progress front and back up and down conveying, position row
Cheng Jun is adjustable.
Existing light module package is fixed using adhesive or resin-encapsulated, causes operating procedure complicated, it is defeated to increase manpower
Out, and using these optical modules using when optical module can be made to be detached from encapsulating shell, and existing optical mode due to squeezing and shaking
Block is unable to rapid cooling in encapsulating shell, can be dust-proof although using, and heat dissipation is inconvenient, so that internal photoelectric device
Part, functional circuit are easy aging.
Summary of the invention
(1) the technical issues of solving
In view of the deficiencies of the prior art, it the present invention provides a kind of 5G high-speed optical module die package device, solves existing
Some light module packages are fixed using adhesive or resin-encapsulated, cause operating procedure complicated, increase manpower output, and use
These optical modules using when optical module can be made to be detached from encapsulating shell and existing optical module in encapsulating shell not due to squeezing and shaking
Energy rapid cooling, so that the problem of internal photoelectric device, functional circuit are easy aging.
(2) technical solution
In order to achieve the above object, the present invention is achieved by the following technical programs: a kind of 5G high-speed optical module core envelope
Assembling device, including encapsulating shell and encapsulation headgear are fixedly connected with inserted block, the left side of the encapsulation headgear on the right side of the encapsulating shell
It offers and is mutually clamped by inserted block with the left side for encapsulating headgear with the mutually matched slot of inserted block, the right side of the encapsulating shell,
The inside of the encapsulating shell is equipped with optical module, is fixedly connected with external fixed block, the external fixation on the right side of the optical module
It is fixedly connected with dust excluding plate on the right side of block, golden finger is fixedly connected on the right side of the dust excluding plate, the encapsulation headgear inner wall
And be located on the left of golden finger and be fixedly connected with blend stop, fixed hole, the encapsulation are offered in the middle part of the external fixed block
The inner wall of shell and it is located at the top of fixed hole and offers counter sink, the inner wall of the encapsulating shell and the bottom for being located at fixed hole
Shell through-hole is offered, is connected with fixed link between the fixed hole, shell through-hole and the inner surface of counter sink.
Preferably, heat sink, the optical module top and bottom are fixedly connected at the top and bottom of the optical module
Left side offer sliding slot, the inner wall of the encapsulating shell and side for being located at sliding slot is equipped with clamping elastic device.
Preferably, the clamping elastic device includes fixed cylinder, and the top of the fixed cylinder and the inner wall of encapsulating shell are fixed
The inside of connection, the fixed cylinder is equipped with spring.
Preferably, the bottom of the spring is fixedly connected with spring blocking plate, and the two sides of spring blocking plate with the inner wall of fixed cylinder
It is slidably connected, the bottom of the spring blocking plate is fixedly connected with compression bar.
Preferably, be fixedly connected with the first fixed backing plate on the left of the encapsulating shell inner wall, the left side of the optical module and
The second fixed backing plate, the described first fixed backing plate and the second fixed backing plate phase are fixedly connected on the right side of the first fixed backing plate
Mutually close side is fixedly connected to anti-displacement protrusion.
Preferably, it is fixedly connected with caoutchouc elasticity block between the described first fixed backing plate and the second fixed backing plate, described the
One fixed backing plate and second fixes the side of backing plate and is fixedly connected to retaining ring at the top of caoutchouc elasticity block.
Preferably, the top and bottom of the encapsulating shell open up the first threaded hole, the inside spiral shell of first threaded hole
Line is connected with screw thread inlet cylinder, and the outer surface on screw thread inlet cylinder top is fixedly connected with the first rotating ring.
Preferably, the second threaded hole, the internal whorl connection of second threaded hole are offered on the left of the encapsulating shell
There is screw thread gas outlet, the outer surface on screw thread gas outlet top is fixedly connected with the second rotating ring.
(3) beneficial effect
The present invention provides a kind of 5G high-speed optical module die package devices.Have compared with prior art following beneficial to effect
Fruit:
(1), the 5G high-speed optical module die package device, by being equipped with optical module in the inside of encapsulating shell, optical module
Right side is fixedly connected with external fixed block, and dust excluding plate is fixedly connected on the right side of external fixed block, and the right side of dust excluding plate is fixed to be connected
Be connected to golden finger, encapsulation headgear inner wall and be located on the left of golden finger and be fixedly connected with blend stop, opened in the middle part of external fixed block
Equipped with fixed hole, the inner wall of encapsulating shell and it is located at the top of fixed hole and offers counter sink, the inner wall of encapsulating shell and is located at
The bottom of fixed hole offers shell through-hole, is connected with fixation between fixed hole, shell through-hole and the inner surface of counter sink
Bar is solved existing light module package and is fixed using adhesive or resin-encapsulated, causes operating procedure complicated, it is defeated to increase manpower
Out, and using these optical modules using when due to squeeze and shake can make optical module be detached from encapsulating shell the problem of.
(2), the 5G high-speed optical module die package device is scattered by being fixedly connected at the top and bottom of optical module
Hot plate, the left side at the top and bottom of optical module offer sliding slot, the inner wall of the encapsulating shell and side for being located at sliding slot is equipped with clamping
Elastic device, the top and bottom of encapsulating shell open up the first threaded hole, the internal whorl of the first threaded hole be connected with screw thread into
Inflator, the outer surface on screw thread inlet cylinder top are fixedly connected with the first rotating ring, the second threaded hole are offered on the left of encapsulating shell,
The internal whorl of second threaded hole is connected with screw thread gas outlet, and the outer surface on screw thread gas outlet top is fixedly connected with the second turn
Ring solves existing optical module and is unable to rapid cooling in encapsulating shell, can be dust-proof although using, and heat dissipation is not square
Just, so that the problem of internal photoelectric device, functional circuit are easy aging.
(3), the 5G high-speed optical module die package device, it is solid by being fixedly connected with first on the left of encapsulating shell inner wall
Determine backing plate, the left side of optical module and is located on the right side of the first fixed backing plate and is fixedly connected with the second fixed backing plate, the first fixed pad
Plate and the second fixed backing plate side close to each other are fixedly connected to anti-displacement protrusion, the first fixed backing plate and the second fixed pad
Caoutchouc elasticity block is fixedly connected between plate, the first fixed backing plate and second fix the side of backing plate and be located at caoutchouc elasticity block
Top is fixedly connected to retaining ring, can be effectively prevented optical module by caoutchouc elasticity block because vibration when using is damaged
It is bad, and when the damage of caoutchouc elasticity block, so that two retaining rings mutually stop, it can prevent optical module and encapsulating shell inner wall from colliding
And damage, improve security performance.
(4), the 5G high-speed optical module die package device, it is described be fixedly connected at the top and bottom of optical module it is scattered
Hot plate, the left side at the top and bottom of optical module offer sliding slot, the inner wall of the encapsulating shell and side for being located at sliding slot is equipped with clamping
Elastic device, clamping elastic device include fixed cylinder, the top of fixed cylinder is fixedly connected with the inner wall of encapsulating shell, fixed cylinder it is interior
Portion is equipped with spring, and the bottom of spring is fixedly connected with spring blocking plate, and the two sides of spring blocking plate are slidably connected with the inner wall of fixed cylinder,
The bottom of spring blocking plate is fixedly connected with compression bar, optical module can be fixed to encapsulating shell by clamping elastic device, so that encapsulation
Optical module can quickly and effectively will be fixed to the inside of encapsulating shell by shell, so that staff is easier for installation.
Detailed description of the invention
Fig. 1 is the schematic diagram of structure of the invention；
Fig. 2 is the schematic diagram of internal structure of the present invention；
Fig. 3 is the structural schematic diagram of present invention clamping elastic device；
Fig. 4 is the partial enlarged view of structure at A in Fig. 2 of the present invention；
Fig. 5 is the partial enlarged view of structure at B in Fig. 2 of the present invention.
In figure, 1- encapsulating shell, 2- encapsulation headgear, 3- inserted block, 4- slot, 5- optical module, the external fixed block of 6-, 7- are dust-proof
Plate, 8- golden finger, 9- blend stop, 10- fixed hole, 11- counter sink, 12- shell through-hole, 13- fixed link, 14- heat sink, 15- are sliding
Slot, 16- clamping elastic device, 17- fixed cylinder, 18- spring, 19- spring blocking plate, 20- compression bar, the fixed backing plate of 21- first, 22- the
Two fixed backing plates, 23- anti-displacement protrusion, 24- caoutchouc elasticity block, 25- retaining ring, the first threaded hole of 26-, 27- screw thread inlet cylinder,
The first rotating ring of 28-, the second threaded hole of 29-, 30- screw thread gas outlet, the second rotating ring of 31-.
Specific embodiment
Technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only
It is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill people
Member's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
Fig. 1-4 is please referred to, the embodiment of the present invention provides a kind of technical solution: a kind of 5G high-speed optical module die package dress
It sets, including encapsulating shell 1 and encapsulation headgear 2, the right side of encapsulating shell 1 is fixedly connected with inserted block 3, and the left side of encapsulation headgear 2 offers
It is mutually clamped by inserted block 3 with the left side for encapsulating headgear 2 with the right side of the mutually matched slot 4 of inserted block 3, encapsulating shell 1, encapsulating shell
1 inside is equipped with optical module 5, and the right side of optical module 5 is fixedly connected with external fixed block 6, and the right side of external fixed block 6 is fixed to be connected
It is connected to dust excluding plate 7, the right side of dust excluding plate 7 is fixedly connected with golden finger 8, left side encapsulation 2 inner wall of headgear and positioned at golden finger 8
It is fixedly connected with blend stop 9, the middle part of external fixed block 6 offers fixed hole 10, the inner wall of encapsulating shell 1 and is located at fixed hole
10 top offers counter sink 11, the inner wall of the encapsulating shell 1 and bottom for being located at fixed hole 10 offers shell through-hole 12, fixed
It is connected with fixed link 13 between through-hole 10, shell through-hole 12 and the inner surface of counter sink 11, solves existing 5 envelope of optical module
Dress is fixed using adhesive or resin-encapsulated, causes operating procedure complicated, increases manpower output, and use these optical modules 5
Due to squeezing and shaking the problem of optical module 5 can be made to be detached from encapsulating shell 1 when use, the top and bottom of optical module 5 are fixed to be connected
It is connected to heat sink 14, the left side of 5 top and bottom of optical module offers sliding slot 15, the inner wall of encapsulating shell 1 and is located at sliding slot 15
Side be equipped with clamping elastic device 16, clamping elastic device 16 includes fixed cylinder 17, the top of fixed cylinder 17 and encapsulating shell 1
Inner wall is fixedly connected, and the inside of fixed cylinder 17 is equipped with spring 18, and the bottom of spring 18 is fixedly connected with spring blocking plate 19, and spring blocking plate
Inner wall of 19 two sides with fixed cylinder 17 is slidably connected, and the bottom of spring blocking plate 19 is fixedly connected with compression bar 20, by being clamped bullet
Property device 16 can by optical module 5 be fixed to encapsulating shell 1, optical module 5 will be quickly and effectively fixed to by encapsulating shell 1
The inside of encapsulating shell 1 is fixedly connected with the first fixed pad so that staff is easier for installation on the left of 1 inner wall of encapsulating shell
Plate 21, the left side of optical module 5 and the right side for being located at the first fixed backing plate 21 are fixedly connected with the second fixed backing plate 22, and first is fixed
Backing plate 21 and the second fixed backing plate 22 side close to each other are fixedly connected to anti-displacement protrusion 23, the first fixed 21 He of backing plate
Caoutchouc elasticity block 24, the side of the first fixed backing plate 21 and the second fixed backing plate 22 are fixedly connected between second fixed backing plate 22
And the top for being located at caoutchouc elasticity block 24 is fixedly connected to retaining ring 25, can be effectively prevented optical mode by caoutchouc elasticity block 24
Block 5 is damaged because of vibration when using, and when caoutchouc elasticity block 24 damages, so that two retaining rings 25 mutually stop, it can
It is damaged with preventing optical module 5 and 1 inner wall of encapsulating shell from colliding, improves security performance, the top and bottom of encapsulating shell 1 open up
First threaded hole 26, the internal whorl of the first threaded hole 26 are connected with screw thread inlet cylinder 27, the appearance on 27 top of screw thread inlet cylinder
Face is fixedly connected with the first rotating ring 28, and the left side of encapsulating shell 1 offers the second threaded hole 29, the inside spiral shell of the second threaded hole 29
Line is connected with screw thread gas outlet 30, and the outer surface on 30 top of screw thread gas outlet is fixedly connected with the second rotating ring 31, solves existing
Some optical modules 5 are unable to rapid cooling in encapsulating shell, can be dust-proof although using, and heat dissipation is inconvenient, so that interior
The problem of portion's opto-electronic device, functional circuit are easy aging.
When installation, optical module 5 is first plugged into the inside of encapsulating shell 1 by 1 side of encapsulating shell, elastic device 16 will be clamped
Compression bar 20 be fixed in sliding slot 15, by the first threaded hole 26 and the second threaded hole 29 difference precession screw thread inlet cylinder 27 and screw thread
Gas outlet 30, by the first rotating ring 28 and 31 turn screw thread inlet cylinder 27 of the second rotating ring and screw thread gas outlet 30, then will envelope
The slot 4 of dress headgear 2 is fixedly attached on the inserted block 3 on 1 right side of encapsulating shell, and the setting of golden finger 8 is arrived to the right side of encapsulating shell 1, is made
The left side that blend stop 9 is arrived in the setting of golden finger 8 is obtained, in use, encapsulation headgear 2 is plugged into contact mouth out.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (8)
1. a kind of 5G high-speed optical module die package device, including encapsulating shell (1) and encapsulation headgear (2), the encapsulating shell (1)
Right side is fixedly connected with inserted block (3), offered on the left of the encapsulation headgear (2) with inserted block (3) mutually matched slot (4),
The right side of the encapsulating shell (1) is mutually clamped by inserted block (3) with the left side for encapsulating headgear (2), it is characterised in that: the encapsulation
The inside of shell (1) is equipped with optical module (5), is fixedly connected with external fixed block (6) on the right side of the optical module (5), described external
It is fixedly connected on the right side of fixed block (6) dust excluding plate (7), is fixedly connected with golden finger (8), institute on the right side of the dust excluding plate (7)
State encapsulation headgear (2) inner wall and be located at golden finger (8) on the left of be fixedly connected with blend stop (9), the external fixed block (6)
Middle part offers fixed hole (10), the inner wall of the encapsulating shell (1) and be located at fixed hole (10) at the top of offer countersunk head
Hole (11), the inner wall of the encapsulating shell (1) and the bottom for being located at fixed hole (10) offer shell through-hole (12), and the fixation is logical
Fixed link (13) are connected between hole (10), shell through-hole (12) and the inner surface of counter sink (11).
2. a kind of 5G high-speed optical module die package device according to claim 1, it is characterised in that: the optical module
(5) it is fixedly connected at the top and bottom of heat sink (14), the left side at the top and bottom of the optical module (5) offers cunning
Slot (15), the inner wall of the encapsulating shell (1) and the side for being located at sliding slot (15) are equipped with clamping elastic device (16).
3. a kind of 5G high-speed optical module die package device according to claim 2, it is characterised in that: the clamping elasticity
Device (16) includes fixed cylinder (17), and the top of the fixed cylinder (17) is fixedly connected with the inner wall of encapsulating shell (1), the fixation
The inside of cylinder (17) is equipped with spring (18).
4. a kind of 5G high-speed optical module die package device according to claim 3, it is characterised in that: the spring (18)
Bottom be fixedly connected with spring blocking plate (19), and inner wall of the two sides of spring blocking plate (19) with fixed cylinder (17) is slidably connected, institute
The bottom for stating spring blocking plate (19) is fixedly connected with compression bar (20).
5. a kind of 5G high-speed optical module die package device according to claim 1, it is characterised in that: the encapsulating shell
(1) it is fixedly connected with first fixed backing plate (21) on the left of inner wall, the left side of the optical module (5) and is located at the first fixed backing plate
(21) second fixed backing plate (22), described first fixed backing plate (21) and second fixed backing plate (22) phase are fixedly connected on the right side of
Mutually it is raised (23) to be fixedly connected to anti-displacement for close side.
6. a kind of 5G high-speed optical module die package device according to claim 5, it is characterised in that: described first is fixed
Be fixedly connected with caoutchouc elasticity block (24) between backing plate (21) and second fixed backing plate (22), described first fixed backing plate (21) and
Second fixes the side of backing plate (22) and is fixedly connected to retaining ring (25) at the top of caoutchouc elasticity block (24).
7. a kind of 5G high-speed optical module die package device according to claim 1, it is characterised in that: the encapsulating shell
(1) top and bottom open up the first threaded hole (26), the internal whorl of first threaded hole (26) be connected with screw thread into
The outer surface of inflator (27), screw thread inlet cylinder (27) top is fixedly connected with the first rotating ring (28).
8. a kind of 5G high-speed optical module die package device according to claim 1, it is characterised in that: the encapsulating shell
(1) it is offered on the left of the second threaded hole (29), the internal whorl of second threaded hole (29) is connected with screw thread gas outlet
(30), the outer surface on screw thread gas outlet (30) top is fixedly connected with the second rotating ring (31).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811592048.0A CN109738995A (en) | 2018-12-25 | 2018-12-25 | A kind of 5G high-speed optical module die package device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811592048.0A CN109738995A (en) | 2018-12-25 | 2018-12-25 | A kind of 5G high-speed optical module die package device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109738995A true CN109738995A (en) | 2019-05-10 |
Family
ID=66360269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811592048.0A Pending CN109738995A (en) | 2018-12-25 | 2018-12-25 | A kind of 5G high-speed optical module die package device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111256665A (en) * | 2020-02-13 | 2020-06-09 | 山东省国土测绘院 | Multifunctional geographic information surveying instrument |
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Application publication date: 20190510 |