CN207719204U - A kind of encapsulating structure with dust-proof effect - Google Patents
A kind of encapsulating structure with dust-proof effect Download PDFInfo
- Publication number
- CN207719204U CN207719204U CN201721616973.3U CN201721616973U CN207719204U CN 207719204 U CN207719204 U CN 207719204U CN 201721616973 U CN201721616973 U CN 201721616973U CN 207719204 U CN207719204 U CN 207719204U
- Authority
- CN
- China
- Prior art keywords
- pedestal
- protective cover
- dust
- heat
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000000694 effects Effects 0.000 title claims abstract description 21
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 44
- 230000001681 protective effect Effects 0.000 claims abstract description 42
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 28
- 239000004411 aluminium Substances 0.000 claims abstract description 27
- 238000005538 encapsulation Methods 0.000 claims abstract description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000000741 silica gel Substances 0.000 claims abstract description 18
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 18
- 239000000428 dust Substances 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000919 ceramic Substances 0.000 claims abstract description 7
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 7
- 239000010703 silicon Substances 0.000 claims abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of encapsulating structures with dust-proof effect, including protective cover, encapsulate chip and pedestal, protective cover and encapsulation chip are equipped with above the pedestal, and encapsulation chip is located inside protective cover, the encapsulation chip is fixedly connected with pedestal, the protective cover surface is equipped with silica gel water proof ring and dust excluder, and dust excluder is located at below silica gel water proof ring, the protective cover both sides are equipped with heat emission hole, the encapsulation beneath chips are equipped with heat-dissipating aluminium plate, it is equipped with heat conductive silica gel between the heat-dissipating aluminium plate and encapsulation chip, the pedestal both sides are arranged with anticollison block, and buffer layer is equipped between anticollison block and pedestal, ceramic silicon glue-line is equipped with below the pedestal.The utility model is novel in design, simple in structure, easy to operation, production cost is low, and applicability is extensive, improves the performance of the dust-proof of packed electronic component, waterproof and antistatic, accelerate heat dissipation, is conducive to the using effect for improving electronic component, and extend service life.
Description
Technical field
The utility model is related to a kind of encapsulating structure, more particularly to a kind of encapsulating structure with dust-proof effect.
Background technology
With the development of science and technology, we many intelligent electronic products occur at one's side, our life is enriched, is improved
The quality of life.These electronic products are mostly by the chip inside manipulation to realize work, chip be that a kind of volume is opposite
Smaller and complicated electronic product, to prolonged use it is necessary to being packaged protection to it.
Existing chip-packaging structure, most characteristics that can all have dust and water protection, but protection is ineffective, no
Conducive to the service life of extension chip.For this purpose, it is proposed that a kind of encapsulating structure with dust-proof effect.
Utility model content
The main purpose of the utility model is to provide a kind of encapsulating structures with dust-proof effect, novel in design, structure
Simply, easy to operation, production cost is low, and applicability is extensive, improves the dust-proof of packed electronic component, waterproof and antistatic
Performance accelerates heat dissipation, is conducive to the using effect for improving electronic component, and extend service life, can effectively solve background
The problems in technology.
To achieve the above object, the technical solution that the utility model is taken is：
A kind of encapsulating structure with dust-proof effect, including protective cover, encapsulation chip and pedestal, the pedestal top are equipped with
Protective cover and encapsulation chip, and encapsulate chip and be located inside protective cover, the encapsulation chip is fixedly connected with pedestal, the protection
It covers surface and is equipped with silica gel water proof ring and dust excluder, and dust excluder is located at below silica gel water proof ring, the protective cover both sides are equipped with
Heat emission hole, the encapsulation beneath chips are equipped with heat-dissipating aluminium plate, heat conductive silica gel, institute are equipped between the heat-dissipating aluminium plate and encapsulation chip
It states pedestal both sides and is arranged with anticollison block, and be equipped with buffer layer between anticollison block and pedestal, ceramic silicon is equipped with below the pedestal
Glue-line.
Further, the buffer layer includes rubber pad and spring, and spring is located inside rubber pad.
Further, the protective cover bottom end is equipped with fixture block, and the base-plates surface is equipped with card slot corresponding with fixture block, institute
Protective cover is stated to connect with substrate latch fastener.
Further, the heat-dissipating aluminium plate surface is equipped with radiating aluminium sheet, and radiating aluminium sheet is array.
Further, the heat emission hole side is equipped with Air Filter, and Air Filter is fixedly connected with protective cover.
Compared with prior art, the utility model has the advantages that：
1. the utility model is novel in design, simple in structure, easy to operation, production cost is low, and applicability is extensive, improve by
The dust-proof of electronic component, the performance of waterproof and antistatic are encapsulated, heat dissipation is accelerated, is conducive to the using effect for improving electronic component,
And extend service life.
2. the utility model is connect by protective cover with substrate latch fastener, be advantageously implemented protective cover and pedestal Fast Installation or
Person dismantles, and saves the time, and protective cover surface is equipped with dust excluder, improves dust-proof effect；Silica gel water proof ring is located at base-plates surface,
Be conducive to the infiltration for stopping outside water, while further functioning as the benefit sealed to protective cover junction.
3. the utility model slows down impact of the external force to pedestal, avoids encapsulation by being equipped with anticollison block and buffer layer
Chip causes to loosen due to external force collision, prolongs the service life.
4. the utility model accelerates, to encapsulating the heat dissipation of chip, to improve heat dissipation by being equipped with heat-dissipating aluminium plate and heat emission hole
Quality.
Description of the drawings
Fig. 1 is a kind of overall structure diagram of the encapsulating structure with dust-proof effect of the utility model.
Fig. 2 is a kind of buffer layer structure schematic diagram of the encapsulating structure with dust-proof effect of the utility model.
Fig. 3 is a kind of radiating aluminum plate structure schematic diagram of the encapsulating structure with dust-proof effect of the utility model.
In figure：1, protective cover；2, chip is encapsulated；3, Air Filter；4, heat emission hole；6, silica gel water proof ring；7, dust excluder；8, block
Slot；9, fixture block；10, ceramic silicon glue-line；11, heat conductive silica gel；12, heat-dissipating aluminium plate；13, anticollison block；14, buffer layer；15, pedestal；
16, rubber pad；17, spring；18, radiating aluminium sheet.
Specific implementation mode
To make the technical means, creative features, achievement of purpose, and effectiveness of the utility model be easy to understand, below
In conjunction with specific implementation mode, the utility model is expanded on further.
As shown in Figs. 1-3, a kind of encapsulating structure with dust-proof effect, including protective cover 1, encapsulation chip 2 and pedestal 15,
15 top of the pedestal is equipped with protective cover 1 and encapsulation chip 2, and encapsulates chip 2 and be located inside protective cover 1, the encapsulation chip 2
It is fixedly connected with pedestal 15,1 surface of the protective cover is equipped with silica gel water proof ring 6 and dust excluder 7, and dust excluder 7 is anti-positioned at silica gel
5 lower section of hydrosphere, 1 both sides of the protective cover are equipped with heat emission hole 4, and 2 lower section of the encapsulation chip is equipped with heat-dissipating aluminium plate 12, described to dissipate
It is equipped with heat conductive silica gel 11 between hot aluminium sheet 12 and encapsulation chip 2,15 both sides of the pedestal are arranged with anticollison block 13, and anticollison block
Buffer layer 14 is equipped between 13 and pedestal 15,15 lower section of the pedestal is equipped with ceramic silicon glue-line 10.
Wherein, the buffer layer 14 includes rubber pad 16 and spring 17, and spring 17 is located inside rubber pad 16, buffer layer
14 are conducive to slow down shock of the external force to pedestal 15, extend 15 service life of pedestal.
Wherein, 1 bottom end of the protective cover is equipped with fixture block 9, and 15 surface of the pedestal is equipped with card slot 8 corresponding with fixture block 9,
The protective cover 1 is snapped connection with pedestal 15, is advantageously implemented protective cover 1 and 15 Fast Installation of pedestal or dismounting.
Wherein, 12 surface of the heat-dissipating aluminium plate is equipped with radiating aluminium sheet 18, and radiating aluminium sheet 18 is array, and radiating aluminium sheet 18 has
It radiates conducive to acceleration.
Wherein, 4 side of the heat emission hole is equipped with Air Filter 3, and Air Filter 3 is fixedly connected with protective cover 1, and heat emission hole 4 has
It radiates conducive to encapsulation chip 2, while Air Filter 3 is effectively prevented external dust and is entered in protective cover 1 by heat emission hole 4
Portion.
It should be noted that the utility model is a kind of encapsulating structure with dust-proof effect, in use, 1 table of protective cover
Face is equipped with dust excluder 7, and dust excluder 7 is located at 8 junction of fixture block 9 and card slot, is effectively prevented external dust and enters protective cover 1
It is internal；Silica gel water proof ring 5 is located at 1 surface of protective cover, and is located at 15 surface of pedestal, effectively stops that extraneous moisture passes through card slot
8 enter inside protective cover 1；It encapsulates 2 lower section of chip and is equipped with heat-dissipating aluminium plate 12, be equipped between heat-dissipating aluminium plate 12 and encapsulation chip 2
Heat conductive silica gel 11,12 surface of heat-dissipating aluminium plate are equipped with radiating aluminium sheet 18, and the heat that encapsulation chip 2 generates is transmitted by heat conductive silica gel 11
To heat-dissipating aluminium plate 12, by 18 rapid cooling of radiating aluminium sheet；15 both sides of pedestal are arranged with anticollison block 13, and anticollison block 13 and base
Buffer layer 14, external force collision to 13 surface of anticollison block are equipped between seat 15,17 rapid desufflation of rubber pad 16 and spring slows down outer
Impact force of the power to pedestal 15；15 lower section of pedestal is equipped with ceramic silicon glue-line 10, and ceramic silicon glue-line 10 has the work(of insulation and protection
Can, it is effectively protected pedestal 15；1 both sides of protective cover are equipped with heat emission hole 4, and heat emission hole 4 is used for radiating, and 4 side of heat emission hole is equipped with
Air Filter 3, and Air Filter 3 is fixedly connected with protective cover 1, Air Filter 3 prevents extraneous dust logical while heat emission hole 4 radiates
Heat emission hole 4 is crossed to enter inside protective cover 1.
The advantages of basic principles and main features and the utility model of the utility model have been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the present utility model is not limited to the above embodiments, described in above embodiments and description
Only illustrate the principles of the present invention, on the premise of not departing from the spirit and scope of the utility model, the utility model is also
It will have various changes and improvements, these various changes and improvements fall within the scope of the claimed invention.The utility model
Claimed range is defined by the appending claims and its equivalent thereof.
Claims (5)
1. a kind of encapsulating structure with dust-proof effect, including protective cover (1), encapsulation chip (2) and pedestal (15), the pedestal
(15) top is equipped with protective cover (1) and encapsulation chip (2), and encapsulates chip (2) and be located at protective cover (1) inside, the encapsulation core
Piece (2) is fixedly connected with pedestal (15), it is characterised in that：Protective cover (1) surface is equipped with silica gel water proof ring (5) and dust excluder
(7), and dust excluder (7) is located at below silica gel water proof ring (5), and protective cover (1) both sides are equipped with heat emission hole (4), the envelope
It is equipped with heat-dissipating aluminium plate (12) below cartridge chip (2), heat conductive silica gel is equipped between the heat-dissipating aluminium plate (12) and encapsulation chip (2)
(11), pedestal (15) both sides are arranged with anticollison block (13), and buffer layer is equipped between anticollison block (13) and pedestal (15)
(14), it is equipped with ceramic silicon glue-line (10) below the pedestal (15).
2. a kind of encapsulating structure with dust-proof effect according to claim 1, it is characterised in that：The buffer layer (14)
Including rubber pad (16) and spring (17), and spring (17) is located at rubber pad (16) inside.
3. a kind of encapsulating structure with dust-proof effect according to claim 1, it is characterised in that：The protective cover (1)
Bottom end be equipped with fixture block (9), pedestal (15) surface be equipped with card slot (8) corresponding with fixture block (9), the protective cover (1) with
Pedestal (15) snaps connection.
4. a kind of encapsulating structure with dust-proof effect according to claim 1, it is characterised in that：The heat-dissipating aluminium plate
(12) surface is equipped with radiating aluminium sheet (18), and radiating aluminium sheet (18) is array.
5. a kind of encapsulating structure with dust-proof effect according to claim 1, it is characterised in that：The heat emission hole (4)
Side is equipped with Air Filter (3), and Air Filter (3) is fixedly connected with protective cover (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721616973.3U CN207719204U (en) | 2017-11-28 | 2017-11-28 | A kind of encapsulating structure with dust-proof effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721616973.3U CN207719204U (en) | 2017-11-28 | 2017-11-28 | A kind of encapsulating structure with dust-proof effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207719204U true CN207719204U (en) | 2018-08-10 |
Family
ID=63057670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721616973.3U Expired - Fee Related CN207719204U (en) | 2017-11-28 | 2017-11-28 | A kind of encapsulating structure with dust-proof effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207719204U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109103145A (en) * | 2018-08-15 | 2018-12-28 | 王晓勇 | A kind of the semiconductor packages unit and packaging method of anti-electric shock and electric leakage |
| CN109738995A (en) * | 2018-12-25 | 2019-05-10 | 武汉恒泰通技术有限公司 | A kind of 5G high-speed optical module die package device |
| CN112885940A (en) * | 2021-01-08 | 2021-06-01 | 深圳市科润光电股份有限公司 | COB technology-based heat dissipation structure for LED packaging unit |
-
2017
- 2017-11-28 CN CN201721616973.3U patent/CN207719204U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109103145A (en) * | 2018-08-15 | 2018-12-28 | 王晓勇 | A kind of the semiconductor packages unit and packaging method of anti-electric shock and electric leakage |
| CN109738995A (en) * | 2018-12-25 | 2019-05-10 | 武汉恒泰通技术有限公司 | A kind of 5G high-speed optical module die package device |
| CN112885940A (en) * | 2021-01-08 | 2021-06-01 | 深圳市科润光电股份有限公司 | COB technology-based heat dissipation structure for LED packaging unit |
| CN112885940B (en) * | 2021-01-08 | 2021-11-30 | 深圳市科润光电股份有限公司 | COB technology-based heat dissipation structure for LED packaging unit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 523000, 3, Xincheng Road, Songshan Lake, Guangdong, Dongguan Patentee after: Dongguan Zhongzhi Technology Co.,Ltd. Address before: 523000, 3, Xincheng Road, Songshan Lake, Guangdong, Dongguan Patentee before: DONGGUAN SINOWIN OPTO-ELECTRONIC Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180810 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |