CN207083277U - A kind of package substrate for improving damping effect - Google Patents
A kind of package substrate for improving damping effect Download PDFInfo
- Publication number
- CN207083277U CN207083277U CN201720882502.0U CN201720882502U CN207083277U CN 207083277 U CN207083277 U CN 207083277U CN 201720882502 U CN201720882502 U CN 201720882502U CN 207083277 U CN207083277 U CN 207083277U
- Authority
- CN
- China
- Prior art keywords
- protection board
- package substrate
- damping effect
- installing plate
- upper protection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of package substrate for improving damping effect; including installing plate, insulating barrier, upper protection board and lower protection board; the installation plate surface is provided with insulating barrier; the installing plate lower end is connected with protection board; the upper protection board side is provided with fin, and the upper protection board opposite side is provided with chipset, snib is connected with above the chipset; described snib one end is connected with dust cover, and the dust boot surface is provided with air-vent.The utility model below installing plate by setting spring; damping effect is formed using spring; rubber column is connected in lower spring end; certain buffering is formed while damping, whole package substrate and surface circuit are always shaped as protecting, by setting upper protection board and lower protection board; shock absorption buffering mechanism in package substrate can be protected; by being flexibly connected dust cover by snib in upper protection board one end, dust-proof, the normal operation of the guarantee each circuit assembly in substrate upper end is carried out to package substrate.
Description
Technical field
A kind of package substrate is the utility model is related to, more particularly to a kind of package substrate for improving damping effect.
Background technology
Package substrate is PCB, i.e. term in printed substrate, substrate can be provided for chip electrical connection, protection, support,
Radiating, assembling and other effects, to realize more pins, reduce encapsulating products volume, improve electrical property and thermal diffusivity, VHD or
The purpose of multi-chip module, the most structure of traditional package substrate is more single, and it is simply situated between as chip bearing and conduction
Matter, do not possess more adaptability, reply different situations or environment under using effect differ, such as its slowing down vibration this
On the one hand, neither one effective manner is protected to realize that damping is formed to package substrate, easily causes substrate and its upper end electricity
The damage of road assembly, and traditional package substrate does not have proofing dust and protecting when tackling varying environment, after dust intrusion easily
The operational effect of substrate is influenceed, therefore traditional package substrate still has larger limitation in actual use, therefore, I
Propose it is a kind of improve damping effect package substrate.
Utility model content
Main purpose of the present utility model is to provide a kind of package substrate for improving damping effect, by under installing plate
Side sets spring, certain damping effect is formed to package substrate using spring, and connect rubber column, profit in lower spring end simultaneously
Certain buffering is formed while damping with the characteristics of quality of rubber materials elasticity is big, wearability is excellent, to whole package substrate and its table
Face circuit assembly forms protection, can by connecting protection board and the protection board under the connection of rubber column lower end in spring upper end
Protection is formed to the shock absorption buffering mechanism in package substrate, the using effect of package substrate is improved, by upper protection board one end
By snib be flexibly connected dust cover, dust is completely cut off using dust cover, each circuit assembly in protective substrate surface it is normal
Operation, while air-vent is set in dust boot surface, on the one hand with ventilation effect, on the other hand heat can be carried out to circuit board
Gas is discharged, and effectively can be solved the problems, such as in background technology.
To achieve the above object, the technical scheme that the utility model is taken is：
A kind of package substrate for improving damping effect, including installing plate, insulating barrier, upper protection board and lower protection board, it is described
Installation plate surface is provided with insulating barrier, and the installing plate lower end is connected with protection board, and the upper protection board side is provided with scattered
Backing, the upper protection board opposite side are provided with chipset, and snib, snib one end activity are connected with above the chipset
It is connected with dust cover, the dust boot surface is provided with air-vent, is provided with spring below the upper protection board, under the spring
End is connected with rubber column, and the rubber column lower end is fixedly connected with lower protection board.
Further, the upper protection board is flexibly connected by snib with dust cover.
Further, the spring and the rubber column spaced set below upper protection board have multigroup.
Further, the air-vent has multigroup in dust boot surface spaced set.
Further, the installing plate corner is provided with mounting hole.
Further, the insulating barrier is the insulating barrier of quality of rubber materials.
Compared with prior art, the utility model has the advantages that：
1st, by setting spring below installing plate, package substrate can be formed using the dilatation of spring certain
Damping effect, and rubber column is connected in lower spring end simultaneously, using the characteristics of quality of rubber materials elasticity is big, wearability is excellent in damping
Certain buffering is formed simultaneously, helps effectively to slow down dither effect of the substrate in the case where tackling different service conditions, to whole encapsulation base
Plate and its surface circuit are always shaped as protecting.
2nd, can be to package substrate by connecting protection board and the protection board under the connection of rubber column lower end in spring upper end
Interior shock absorption buffering mechanism forms protection, helps damping effect of package substrate when in face of being used under adverse circumstances normal, carries
Rise the using effect of package substrate.
3rd, by being flexibly connected dust cover by snib in upper protection board one end, dust-proof guarantor can be formed to package substrate
Shield, because the environmental aspect of all kinds of package substrates actual use differs, dust is met with sometimes and invades and harasses and influences using effect, is led to
Cross and dust is completely cut off using dust cover, the normal operation of each circuit assembly in protective substrate surface, while in dust boot surface
Air-vent is set, on the one hand with ventilation effect, on the other hand can carry out hot gas discharge to circuit board.
Brief description of the drawings
Fig. 1 is a kind of overall structure diagram for the package substrate for improving damping effect of the utility model.
Fig. 2 is a kind of overlooking the structure diagram for the package substrate for improving damping effect of the utility model.
In figure：1st, installing plate；2nd, insulating barrier；3rd, upper protection board；4th, lower protection board；5th, spring；6th, rubber column；7th, breathe freely
Hole；8th, dust cover；9th, fin；10th, chipset；11st, snib；12nd, mounting hole.
Embodiment
Technological means, creation characteristic, reached purpose and effect to realize the utility model are easy to understand, below
With reference to embodiment, the utility model is expanded on further.
As shown in Figure 1-2, a kind of package substrate for improving damping effect, including installing plate 1, insulating barrier 2, upper protection board 3
With lower protection board 4, the surface of installing plate 1 is provided with insulating barrier 2, and the lower end of installing plate 1 is connected with protection board 3, described
The upper side of protection board 3 is provided with fin 9, and the upper opposite side of protection board 3 is provided with chipset 10, the top of chipset 10
Snib 11 is connected with, described one end of snib 11 is connected with dust cover 8, and the surface of dust cover 8 is provided with air-vent 7, institute
State the lower section of protection board 3 and be provided with spring 5, the lower end of spring 5 is connected with rubber column 6, and the lower end of rubber column 6 is fixedly connected
There is lower protection board 4.
Wherein, the upper protection board 3 is flexibly connected by snib 11 with dust cover 8, and dust cover 8 can be dismounted,
To tackle different service conditions.
Wherein, the spring 5 and rubber column 6 spaced set below upper protection board 3 have multigroup, can be to installing plate 1
And surface circuit is always shaped as protecting, damping, buffering effect is lifted.
Wherein, the air-vent 7 has multigroup in the surface spaced set of dust cover 8, helps package substrate to be aerated scattered
Heat.
Wherein, 1 four jiaos of the installing plate is provided with mounting hole 12, helps to be balanced fixation to installing plate 1.
Wherein, the insulating barrier 2 is the insulating barrier of quality of rubber materials, utilizes the wearability and insulating properties that quality of rubber materials is extremely strong
The safety in utilization of substrate is ensured, prevents the generation of unexpected situation.
It should be noted that the utility model is a kind of package substrate for improving damping effect, it is mainly subtracted by addition
Shake buffer component and medium and provide damping effect to package substrate, be embodied in, by setting spring 5 below installing plate 1,
Certain damping effect is formed to package substrate using the dilatation of spring 5, while rubber column 6, profit are connected in the lower end of spring 5
Certain buffering is formed while damping with the characteristics of quality of rubber materials elasticity is big, wearability is excellent, helps effective substrate that slows down answering
To the dither effect under different service conditions, whole package substrate and its surface circuit are always shaped as protecting, by upper guarantor
The one end of backplate 3 is flexibly connected dust cover 8 by snib 11, and package substrate can be helped dust-proof, because all kinds of package substrates are actual
The environmental aspect used differs, and meets with dust sometimes and invades and harasses and influence using effect, therefore dust is carried out using dust cover 8
Isolation, the normal operation of each circuit assembly in protective substrate surface, while air-vent 7 is set on the surface of dust cover 8, on the one hand have
Ventilation effect, on the other hand hot gas discharge can be carried out to circuit board, by the protection board 3 in the connection of the upper end of spring 5 and in rubber
The lower protection board 4 of the lower end of glue post 6 connection, can form protection to the shock absorption buffering mechanism in package substrate, help package substrate to exist
Damping effect when being used under adverse circumstances is normal, lifts the using effect of package substrate.
The advantages of general principle and principal character of the present utility model and the utility model has been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the utility model is not restricted to the described embodiments, described in above-described embodiment and specification
Simply illustrate principle of the present utility model, on the premise of the spirit and scope of the utility model is not departed from, the utility model is also
Various changes and modifications are had, these changes and improvements are both fallen within claimed the scope of the utility model.The utility model
Claimed scope is by appended claims and its equivalent thereof.
Claims (6)
1. a kind of package substrate for improving damping effect, including installing plate (1), insulating barrier (2), upper protection board (3) and lower protection
Plate (4), it is characterised in that：Installing plate (1) surface is provided with insulating barrier (2), and installing plate (1) lower end is connected with guarantor
Backplate (3), upper protection board (3) side are provided with fin (9), and upper protection board (3) opposite side is provided with chipset
(10) snib (11), is connected with above the chipset (10), described snib (11) one end is connected with dust cover (8), institute
State dust cover (8) surface and be provided with air-vent (7), be provided with spring (5) below the upper protection board (3), under the spring (5)
End is connected with rubber column (6), and rubber column (6) lower end is fixedly connected with lower protection board (4).
A kind of 2. package substrate for improving damping effect according to claim 1, it is characterised in that：The upper protection board
(3) it is flexibly connected by snib (11) with dust cover (8).
A kind of 3. package substrate for improving damping effect according to claim 1, it is characterised in that：The spring (5) and
Rubber column (6) spaced set below upper protection board (3) has multigroup.
A kind of 4. package substrate for improving damping effect according to claim 1, it is characterised in that：The air-vent (7)
On dust cover (8) surface, spaced set has multigroup.
A kind of 5. package substrate for improving damping effect according to claim 1, it is characterised in that：The installing plate (1)
Four corners are provided with mounting hole (12).
A kind of 6. package substrate for improving damping effect according to claim 1, it is characterised in that：The insulating barrier (2)
For the insulating barrier of quality of rubber materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720882502.0U CN207083277U (en) | 2017-07-20 | 2017-07-20 | A kind of package substrate for improving damping effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720882502.0U CN207083277U (en) | 2017-07-20 | 2017-07-20 | A kind of package substrate for improving damping effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207083277U true CN207083277U (en) | 2018-03-09 |
Family
ID=61424109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720882502.0U Expired - Fee Related CN207083277U (en) | 2017-07-20 | 2017-07-20 | A kind of package substrate for improving damping effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207083277U (en) |
-
2017
- 2017-07-20 CN CN201720882502.0U patent/CN207083277U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180309 Termination date: 20180720 |