CN206559730U - The local potting structure of printed circuit board (PCB) - Google Patents
The local potting structure of printed circuit board (PCB) Download PDFInfo
- Publication number
- CN206559730U CN206559730U CN201720255392.5U CN201720255392U CN206559730U CN 206559730 U CN206559730 U CN 206559730U CN 201720255392 U CN201720255392 U CN 201720255392U CN 206559730 U CN206559730 U CN 206559730U
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- circuit board
- printed circuit
- pcb
- component
- encapsulating
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of local potting structure of printed circuit board (PCB), including printed circuit board (PCB) and some sensitiveness components and some non-sensibility components that are arranged on the printed circuit board (PCB)；The printed circuit board (PCB) is provided with encapsulating area and non-encapsulating area, and some sensitiveness components are laid within the encapsulating area, and some non-sensibility components are laid within the non-encapsulating area；The encapsulating area is provided with embedding glue-line and the embedding glue-line coats some sensitiveness components, on the one hand realizes the protection to sensitiveness component by local encapsulating, has on the other hand saved glue amount, reduced work hours, reduced cost, be relatively beneficial to environmental protection.
Description
Technical field
The utility model is related to field of electronic devices, the local potting structure of more particularly to a kind of printed circuit board (PCB).
Background technology
In the design of printed circuit board (PCB), various electronics member devices are laid out generally according to the structure or function design of circuit diagram
Part, then carries out overall encapsulating to cover all components being arranged on printed circuit board (PCB), so that playing protection is dispersed in print
The effect to the sensitivity such as steam, fire, vibrations or the component for being also easy to produce noise on printed circuit board.However, on circuit board generally
The also element insensitive to above-mentioned external environment, and encapsulating protection need not be carried out.The mode of full encapsulating wastes glue amount, increases
Cost payout, while also not environmentally.
Utility model content
The utility model provides a kind of local potting structure of printed circuit board (PCB), overcomes present in prior art not
Foot part.
The technical scheme that the utility model solves above-mentioned technical problem is as follows：
A kind of local potting structure of printed circuit board (PCB), including printed circuit board (PCB) and be arranged on the printed circuit board (PCB)
Some sensitiveness components and some non-sensibility components；The printed circuit board (PCB) is provided with encapsulating area and non-encapsulating
Area, some sensitiveness components are arranged within the encapsulating area, and some non-sensibility components are arranged in described
Within non-encapsulating area；The encapsulating area is provided with embedding glue-line and the embedding glue-line coats some sensitiveness components.
Optionally, in addition to spacing frame, the spacing frame is arranged on the printed circuit board (PCB) and separates the encapsulating area
With non-encapsulating area, the encapsulating layer is formed within the spacing frame.
Optionally, the sensitiveness component includes rapid wear component, inflammable component, moisture sensitivity component and made an uproar
Sound produces component.
Optionally, the sensitiveness component includes electric capacity and inductance.
Optionally, the non-sensibility component includes resistance, diode and triode.
Optionally, the embedding glue-line is epoxy resin embedding adhesive, organic siliconresin casting glue or polyurethane pouring sealant.
The beneficial effects of the utility model are：
The utility model is laid out to printed circuit board (PCB), and sensitiveness component is concentrated and is laid within encapsulating area, non-
Sensitiveness component is concentrated and is laid within non-encapsulating area, then carries out encapsulating to encapsulating area so that casting glue coats those sensitivities
Property component, rather than encapsulating area is without encapsulating, so as on the one hand realize the guarantor to sensitiveness component by local encapsulating
Shield, has on the other hand saved glue amount, has reduced work hours, reduced cost, be relatively beneficial to environmental protection.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model (vertical view)；
Fig. 2 is the schematic cross-section along A-A directions in Fig. 1.
Embodiment
Principle of the present utility model and feature are described below in conjunction with accompanying drawing, example is served only for explaining this practicality
It is new, it is not intended to limit scope of the present utility model.
With reference to Fig. 1 and Fig. 2, a kind of local potting structure of printed circuit board (PCB) of an embodiment, including printed circuit board (PCB) 1 with
And it is arranged at some sensitiveness components 2, some non-sensibility components 3 and spacing frame 4 on the printed circuit board (PCB) 1.Institute
State printed circuit board (PCB) 1 and encapsulating area a and non-encapsulating area b, some rows of sensitiveness component 2 are separated to form by spacing frame 4
It is distributed within the encapsulating area a, some non-sensibility components 3 are arranged within the non-encapsulating area b.The encapsulating area
A is provided with embedding glue-line 5 and the embedding glue-line 5 coats some sensitiveness components 2.Sensitiveness component 2 refers to easy production
Raw negative effect or the component easily influenceed by extraneous factor, including rapid wear component, inflammable component, moisture sensitivity member
Device and noise produce component, thus need to carry out encapsulating protection, and non-sensibility component 3 is in contrast.Embedding glue-line 5 is
Epoxy resin embedding adhesive, organic siliconresin casting glue or polyurethane pouring sealant, specifically can according to actual noise reduction, protection against the tide, it is fire-retardant,
The demands such as antidetonation are selected.
For example, in a LED driving power supply circuit board, there are the sensitiveness component such as inductance, electric capacity, they
Noise is also easy to produce in the course of work, it is necessary to carry out encapsulating to it to weaken influence of the noise to user.And also have one in circuit board
Belong to non-sensibility component for noise a bit, such as：Resistance, diode, triode etc., without entering to non-sensibility component
Row encapsulating, therefore, the sensitiveness component that inductance, electric capacity etc. are also easy to produce into noise, which is concentrated, to be arranged within spacing frame, and resistance,
Diode, the non-sensibility component such as triode is arranged in outside spacing frame, and its annexation still meets the reality of corresponding function
It is existing.To silica filled organopolysiloxane glue class casting glue within spacing frame to coat above-mentioned sensitive element, so as to reduce the generation of noise.And
Without encapsulating outside spacing frame, so as to reduce the encapsulating area to circuit board, glue amount is saved, while also acting as same noise abatement
Effect.
In another embodiment, temperature is higher in the operating condition for the part component on printed circuit board (PCB), such as runs into bright
The accidents such as on fire, blast easily occur for fire, can concentrate above-mentioned inflammable component and be laid in the local encapsulating of progress in zonule, lead to
Cross the casting glue with flame retardant effect and realize corresponding protection.
In another embodiment, the part component on printed circuit board (PCB) easily collides in transportation and waits mechanical
Property damage accident, above-mentioned rapid wear component can concentrate and be laid in cell by such as inductance core fragmentation, electrochemical capacitor leakage etc.
Local encapsulating is carried out in domain, corresponding protection is realized by the casting glue with damping effect.
In another embodiment, there is obvious heat dissipation problem in the part component on printed circuit board (PCB), bad meeting of radiating
Shorten its service life, above-mentioned easy heating element can be concentrated and be laid in the local encapsulating of progress in zonule, by with scattered
The casting glue of thermal effect realizes corresponding protection.
In another embodiment, the part component on printed circuit board (PCB) is very sensitive to steam, holds in wet condition
Easily failure, above-mentioned moisture sensitivity component can be concentrated and be laid in the local encapsulating of progress in zonule, by being imitated with water proof
The casting glue of fruit realizes corresponding protection.
Above-described embodiment is only used for further illustrating the local potting structure of printed circuit board (PCB) of the present utility model, but this reality
Be not limited to embodiment with new, it is every according to technical spirit of the present utility model above example is made it is any simple
Modification, equivalent variations and modification, each fall within the protection domain of technical solutions of the utility model.
Claims (6)
1. a kind of local potting structure of printed circuit board (PCB), it is characterised in that：Including printed circuit board (PCB) and it is arranged at the print
Some sensitiveness components and some non-sensibility components on printed circuit board；The printed circuit board (PCB) provided with encapsulating area with
And non-encapsulating area, some sensitiveness components are laid within the encapsulating area, some non-sensibility component cloth
Within the non-encapsulating area；The encapsulating area is provided with embedding glue-line and embedding glue-line cladding some sensitiveness members
Device.
2. the local potting structure of printed circuit board (PCB) according to claim 1, it is characterised in that：Also include spacing frame, institute
State spacing frame to be arranged on the printed circuit board (PCB) and separate the encapsulating area and non-encapsulating area, the encapsulating layer is formed at described
Within spacing frame.
3. the local potting structure of printed circuit board (PCB) according to claim 1, it is characterised in that：The sensitiveness component
Component is produced including rapid wear component, inflammable component, moisture sensitivity component and noise.
4. the local potting structure of printed circuit board (PCB) according to claim 3, it is characterised in that：The sensitiveness component
Including electric capacity and inductance.
5. the local potting structure of printed circuit board (PCB) according to claim 1, it is characterised in that：The non-sensibility member device
Part includes resistance, diode and triode.
6. the local potting structure of printed circuit board (PCB) according to claim 1, it is characterised in that：The embedding glue-line is ring
Epoxy resin embedding glue, organic siliconresin casting glue or polyurethane pouring sealant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720255392.5U CN206559730U (en) | 2017-03-16 | 2017-03-16 | The local potting structure of printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720255392.5U CN206559730U (en) | 2017-03-16 | 2017-03-16 | The local potting structure of printed circuit board (PCB) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206559730U true CN206559730U (en) | 2017-10-13 |
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ID=60364205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720255392.5U Active CN206559730U (en) | 2017-03-16 | 2017-03-16 | The local potting structure of printed circuit board (PCB) |
Country Status (1)
| Country | Link |
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| CN (1) | CN206559730U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020035939A (en) * | 2018-08-31 | 2020-03-05 | アイシン精機株式会社 | Circuit board device and method of potting the same |
| WO2021042889A1 (en) * | 2019-09-06 | 2021-03-11 | 中兴通讯股份有限公司 | Main board, denoising method and terminal |
-
2017
- 2017-03-16 CN CN201720255392.5U patent/CN206559730U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020035939A (en) * | 2018-08-31 | 2020-03-05 | アイシン精機株式会社 | Circuit board device and method of potting the same |
| WO2021042889A1 (en) * | 2019-09-06 | 2021-03-11 | 中兴通讯股份有限公司 | Main board, denoising method and terminal |
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