CN209675285U - A kind of flip-chip packaged LED chip light source module group - Google Patents
A kind of flip-chip packaged LED chip light source module group Download PDFInfo
- Publication number
- CN209675285U CN209675285U CN201920409823.8U CN201920409823U CN209675285U CN 209675285 U CN209675285 U CN 209675285U CN 201920409823 U CN201920409823 U CN 201920409823U CN 209675285 U CN209675285 U CN 209675285U
- Authority
- CN
- China
- Prior art keywords
- light source
- led chip
- source bracket
- chip
- flip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 12
- 239000003292 glue Substances 0.000 claims description 8
- 238000004806 packaging method and process Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 7
- 230000005855 radiation Effects 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 2
- 230000003760 hair shine Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The utility model discloses a kind of flip-chip packaged LED chip light source module group, including light source bracket, sidebar is provided on the upper end of the light source bracket, reflector is provided on the inner sidewall of the sidebar, the lower end surface of the reflector is arranged on the upper surface of light source bracket, bottom on the upper surface of the light source bracket in reflector is provided with several groups light source mechanism, the light source mechanism is by several reflective convex blocks, first LED chip, second LED chip and third LED chip composition, the lower end surface of the reflective convex block is arranged on the upper surface of light source bracket, first LED chip, second LED chip and third LED chip are arranged on the upper surface of reflective convex block, in the first LED chip on the upper surface of the light source bracket, the two sides of second LED chip and third LED chip are all provided with It is equipped with pad.The utility model structure is simple, and rationally, the utilization rate of light efficiency is higher for design, reduces light decay, the dissipating effect of light efficiency is more preferable, while high reliablity, and heat dissipation performance is more preferable.
Description
Technical field
The utility model relates to LED sealed in unit technical field, specially a kind of flip-chip packaged LED chip light source module group.
Background technique
As LED application field is increasingly extensive, competition is also white-hot day by day, thus high performance-price ratio is broken out of an encirclement as LED product
Sharp weapon.In order to pursue high performance-price ratio, industry generallys use small-sized package body, increases chip driving current, to a certain extent
Current development trend is agreed with.
Conventional apparatus has following deficiency:
1, LED light source is 360 degree and is irradiated in the process of transmitting light, but the LED light source mould group irradiation passed through
Range only has 180 degree, causes the waste of light source to a certain extent, be easy to cause light decay, while when voltage instability timing, respectively
The intensity that a LED exhales light is different, reduces radiation response;
2, simultaneously in existing LED light source mould group LED chip connect with conductive structure be it is more complicated, conductive pin is easy
Fracture affects service life, while the also apparent problem that radiates of LED light source.
Utility model content
The purpose of this utility model is to provide a kind of flip-chip packaged LED chip light source module groups, to solve above-mentioned background skill
The LED light source mould group irradiation that the LED light source proposed in art is 360 degree in the process of transmitting light and is irradiated, but passes through
Range only has 180 degree, causes the waste of light source to a certain extent, be easy to cause light decay, while when voltage instability timing, respectively
The problem of intensity that a LED exhales light is different, reduces radiation response.
To achieve the above object, the utility model provides the following technical solutions: a kind of flip-chip packaged LED chip light source die
Group, including light source bracket are provided with sidebar on the upper end of the light source bracket, are provided on the inner sidewall of the sidebar reflective
Cup, the lower end surface of the reflector is arranged on the upper surface of light source bracket, in reflector on the upper surface of the light source bracket
Bottom be provided with several groups light source mechanism, the light source mechanism is by several reflective convex blocks, the first LED chip, the second LED core
Piece and third LED chip composition, the lower end surface of the reflective convex block are arranged on the upper surface of light source bracket, the first LED
Chip, the second LED chip and third LED chip are arranged on the upper surface of reflective convex block, the upper surface of the light source bracket
On in the two sides of the first LED chip, the second LED chip and third LED chip be provided with pad, first LED chip,
The two sides of two LED chips and third LED chip pass through set key line and connect with pad, lead on the upper surface of the light source bracket
It crosses and opens up groove and be provided with conductive pin, be threadedly coupled in the lower end of conductive pin by opening up thread groove on the light source bracket
There is conductive column, the upper end of the conductive column and conductive pin are electrically connected, set inside the reflector in the upper end of light source mechanism
Packaging plastic is set, the upper end of the packaging plastic is provided with box dam glue, and the two sides of the light source bracket offer several gas ports,
Heat dissipation cavity is provided with inside the light source bracket between gas port, the upper and lower end face of the heat dissipation cavity is disposed as waveform.
Preferably, several heat release holes, the upper surface of the light source bracket are offered on the lower end surface of the light source bracket
On be provided with insulating layer.
Preferably, several radiating grooves are offered on the lateral surface of the sidebar.
Preferably, at least three groups of the quantity of the light source mechanism.
Preferably, series connection is taken between first LED chip, the second LED chip and third LED chip.
Preferably, the quantity of the pad at least there are four.
Compared with prior art, the utility model has the beneficial effects that
1, for the utility model by being provided with several groups light source mechanism on light source bracket, light source mechanism is anti-by several
Light convex block, the first LED chip, the second LED chip and third LED chip composition, while the first LED chip, the second LED chip and
The two sides of third LED chip pass through key line and connect with pad, by the effect of reflective convex block, can effectively improve light
Utilization rate reduces the speed loss of light source, prevents light decay, while LED chip light source module group shines more uniform, and radiation response is more
It is good;
2, the utility model is by being provided with conductive pin, light source branch by opening up groove on the upper surface of light source bracket
Be threaded with conductive column by opening up thread groove in the lower end of conductive pin on frame, at the same inside light source bracket gas port it
Between be provided with heat dissipation cavity, the upper and lower end face of heat dissipation cavity is disposed as wave, connects between the conductive structure in device more stable
It is convenient, facilitate production and processing, while heat dissipation effect is more preferable, increases the service life of device.
Detailed description of the invention
Fig. 1 is a kind of flip-chip packaged LED chip light source module group overall structure diagram of the utility model;
Fig. 2 is a kind of flip-chip packaged LED chip light source module group entirety side view of the utility model;
Fig. 3 is a kind of flip-chip packaged LED chip light source module group overall top view of the utility model.
In figure: 1, light source bracket;101, gas port;102, heat dissipation cavity;103, heat release hole;2, sidebar;21, radiating groove;3,
Reflector;4, light source mechanism;5, reflective convex block;6, the first LED chip;7, the second LED chip;8, third LED chip;9, it welds
Disk;10, conductive pin;11, conductive column;12, packaging plastic;13, box dam glue.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of flip-chip packaged LED chip light source module group, packet
It includes light source bracket 1, has sidebar 2 by hot-melt adhesive paste on the upper end of light source bracket 1, pass through glue adhesion on the inner sidewall of sidebar 2
There is reflector 3, the lower end surface of reflector 3 is sticked in by glue on the upper surface of light source bracket 1, the upper surface of light source bracket 1
On in the bottom of reflector 3 several groups light source mechanism 4 is installed, light source mechanism 4 is by several reflective convex blocks 5, the first LED chip
6, the second LED chip 7 and third LED chip 8 form, and the lower end surface of reflective convex block 5 sticks in the upper of light source bracket 1 by glue
On end face, the first LED chip 6, the second LED chip 7 and third LED chip 8 stick in the upper end of reflective convex block 5 by glue
On face, heated on the upper surface of light source bracket 1 in the two sides of the first LED chip 6, the second LED chip 7 and third LED chip 8
It is connected with pad 9, the two sides of the first LED chip 6, the second LED chip 7 and third LED chip 8 pass through welding key line and pad
9 are electrically connected, and are equipped with conductive pin 10 by opening up groove on the upper surface of light source bracket 1, draw on light source bracket 1 in conduction
The lower end of foot 10 is threaded with conductive column 11 by opening up thread groove, and the upper end of conductive column 11 electrically connects with conductive pin 10
It connects, is packaged with packaging plastic 12 in the upper end of light source mechanism 4 inside reflector 3, the upper end of packaging plastic 12 is packaged with box dam glue 13, light
The two sides of source bracket 1 offer several gas ports 101, offer heat dissipation cavity between gas port 101 inside light source bracket 1
102, the upper and lower end face of heat dissipation cavity 102 is integrally molded so as waveform.
Several heat release holes 103 are offered on the lower end surface of light source bracket 1, are coated with insulation on the upper surface of light source bracket 1
Layer, is conducive to further export the heat inside heat dissipation cavity 102, while preventing from leaking electricity;If being offered on the lateral surface of sidebar 2
Dry radiating groove 21, is conducive to further progress heat dissipation;At least three groups of the quantity of light source mechanism 4, it is strong to be conducive to increase light
Degree;Series connection is taken between first LED chip 6, the second LED chip 7 and third LED chip 8, is conducive to preferably control first
The work of LED chip 6, the second LED chip 7 and third LED chip 8;The quantity of pad 9 at least there are four, advantageously ensure that
It is stably connected between one LED chip 6, the second LED chip 7 and third LED chip 8.
Working principle: in use device, directly conductive column 11 and external power output apparatus are attached, are powered
The first LED chip 6 in light source mechanism 4, the second LED chip 7 and the work of third LED chip 8 shine afterwards, the light being aimed downwardly
By the reflex of reflective convex block 5, change direction and irradiate upwards, while the heat that light source mechanism 4 generates can be transmitted from scattered
It in hot chamber 102, is then discharged from gas port 101, heat release hole 103 and radiating groove 21, reduces the first LED chip 6, the second LED core
Heat when piece 7 and third LED chip 8 work, while during encapsulation, staff does not need Rewelding and carries out electricity
Road connection, it is only necessary to conductive column 11 is screwed into the threaded hole of light source bracket 1 and connect with conductive pin 10, the present apparatus can be with
The utilization rate for effectively improving light reduces the speed loss of light source, prevents light decay, while LED chip light source module group shines more
Uniformly, radiation response is more preferable, connects between the conductive structure in device and more stablizes convenient, facilitates production and processing, radiate simultaneously
Effect is more preferable, increases the service life of device.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of flip-chip packaged LED chip light source module group, including light source bracket (1), it is characterised in that: the light source bracket (1)
Upper end on be provided with sidebar (2), be provided with reflector (3) on the inner sidewall of the sidebar (2), under the reflector (3)
End face is arranged on the upper surface of light source bracket (1), sets on the upper surface of the light source bracket (1) in the bottom of reflector (3)
It is equipped with several groups light source mechanism (4), the light source mechanism (4) is by several reflective convex blocks (5), the first LED chip (6), second
LED chip (7) and third LED chip (8) composition, the lower end surface of the reflective convex block (5) are arranged in the upper end of light source bracket (1)
On face, first LED chip (6), the second LED chip (7) and third LED chip (8) are arranged at the upper of reflective convex block (5)
On end face, in the first LED chip (6), the second LED chip (7) and third LED chip on the upper surface of the light source bracket (1)
(8) two sides are provided with pad (9), first LED chip (6), the second LED chip (7) and third LED chip (8)
Two sides pass through set key line and connect with pad (9), are provided on the upper surface of the light source bracket (1) by opening up groove and are led
Electric pin (10) is threaded with conduction by opening up thread groove in the lower end of conductive pin (10) on the light source bracket (1)
Column (11), the upper end and conductive pin (10) of the conductive column (11) are electrically connected, and the reflector (3) is internal in light source mechanism
(4) packaging plastic (12) are arranged in upper end, and the upper end of the packaging plastic (12) is provided with box dam glue (13), the light source bracket (1)
Two sides offer several gas ports (101), be provided between gas port (101) inside the light source bracket (1) scattered
The upper and lower end face of hot chamber (102), the heat dissipation cavity (102) is disposed as waveform.
2. a kind of flip-chip packaged LED chip light source module group according to claim 1, it is characterised in that: the light source bracket
(1) several heat release holes (103) are offered on lower end surface, are provided with insulating layer on the upper surface of the light source bracket (1).
3. a kind of flip-chip packaged LED chip light source module group according to claim 1, it is characterised in that: the sidebar (2)
Several radiating grooves (21) are offered on lateral surface.
4. a kind of flip-chip packaged LED chip light source module group according to claim 1, it is characterised in that: the light source mechanism
(4) at least three groups of quantity.
5. a kind of flip-chip packaged LED chip light source module group according to claim 1, it is characterised in that: first LED core
Series connection is taken between piece (6), the second LED chip (7) and third LED chip (8).
6. a kind of flip-chip packaged LED chip light source module group according to claim 1, it is characterised in that: the pad (9)
Quantity at least there are four.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920409823.8U CN209675285U (en) | 2019-03-28 | 2019-03-28 | A kind of flip-chip packaged LED chip light source module group |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920409823.8U CN209675285U (en) | 2019-03-28 | 2019-03-28 | A kind of flip-chip packaged LED chip light source module group |
Publications (1)
Publication Number | Publication Date |
---|---|
CN209675285U true CN209675285U (en) | 2019-11-22 |
Family
ID=68573078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201920409823.8U Expired - Fee Related CN209675285U (en) | 2019-03-28 | 2019-03-28 | A kind of flip-chip packaged LED chip light source module group |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN209675285U (en) |
-
2019
- 2019-03-28 CN CN201920409823.8U patent/CN209675285U/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN201081170Y (en) | Bake-free encapsulated high-efficiency high-heat dissipation performance high-power LED light source | |
WO2010066128A1 (en) | Package module of small power led chip | |
CN105529390B (en) | A kind of integrated UVLED modules of the Self-concentration of inorganic encapsulated | |
CN102364710A (en) | Light emitting diode (LED) white light source device | |
CN211045465U (en) | High-power flip L ED packaging structure | |
CN201173463Y (en) | Reflection-free double image-free integral radiation high light efficiency high power LED road lamp | |
CN209675285U (en) | A kind of flip-chip packaged LED chip light source module group | |
CN104900784B (en) | The manufacture method of LED encapsulation structure | |
CN206364057U (en) | The encapsulating structure and lighting device of the controllable rising angles of CSP LED | |
CN202487656U (en) | All-dimensional lighting LED packaging structure | |
CN106920870A (en) | A kind of high-power UV LED chip eutectic weldering inverted structure | |
CN207883721U (en) | A kind of LED light bar with excellent heat dispersion performance | |
CN206271750U (en) | The EMC supports of Flip-Chip Using | |
CN206349386U (en) | A kind of LED lamp bead structure with stability and refractive index | |
CN202674951U (en) | Efficient heat-radiating light-emitting diode (LED) fluorescent tube | |
CN201829498U (en) | Light emitting diode (LED) integrated light source panel | |
CN213878149U (en) | Evenly-distributed white light LED packaging structure | |
CN201096315Y (en) | Infrared light source device | |
CN210403767U (en) | LED packaging structure | |
CN203589024U (en) | High-power UVLED vertical chip integration module | |
CN210349876U (en) | LED packaging structure | |
CN207249307U (en) | A kind of back light source structure | |
CN208422955U (en) | A kind of UV-LED light source and its lamps and lanterns | |
CN207967034U (en) | A kind of aluminum substrate with lens function | |
CN203103348U (en) | COB base plate structure-equipped LED lamp source |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191122 |
|
CF01 | Termination of patent right due to non-payment of annual fee |