CN210403767U

CN210403767U - LED packaging structure

Info

Publication number: CN210403767U
Application number: CN201921849099.7U
Authority: CN
Inventors: 杨诗超; 杨泽树
Original assignee: Huizhou Xinhuili Photoelectric Material Co Ltd
Current assignee: Huizhou Xinhuili Photoelectric Material Co Ltd
Priority date: 2019-10-30
Filing date: 2019-10-30
Publication date: 2020-04-24
Anticipated expiration: 2029-10-30

Abstract

The utility model discloses a LED packaging structure, including the LED chip, bear the weight of the metal heat sink of LED chip, the ring casing sets up at the base of metal heat sink upper portion limit week, set up in the base top and cover the lamp lid of LED chip, fill fluorescent powder layer and the packing glue film of setting between lamp lid and LED chip, be connected through solid crystal glue between LED chip and the metal heat sink, the inside top surface of base is provided with the phase transition brilliant piece of a plurality of equidistance symmetric distribution in the limit week of metal heat sink, the phase transition brilliant piece bonds on the base through solid crystal glue, the limit week cladding of phase transition brilliant piece has one deck epoxy to drip the colloid. The phase-change crystal block is packaged between the LED chip and the fluorescent powder layer by adopting the epoxy resin drop colloid with high heat-conducting property, when the fluorescent powder coating generates heat and accumulates heat, the phase-change crystal block can absorb heat and melt, absorb certain heat, circularly absorb the heat accumulated by the fluorescent powder coating, increase the heat dissipation way of the LED chip and achieve the purpose of stabilizing the luminous efficiency of the LED chip.

Description

LED packaging structure

Technical Field

The utility model belongs to the technical field of the LED encapsulation, concretely relates to LED packaging structure.

Background

The LED has the advantages of high efficiency, low power consumption and good safety and is widely applied to various illumination fields, on one hand, the use reliability of the LED mainly lies in the packaging of the LED, epoxy resin is mainly used as a packaging filling material in the packaging structure of the LED at present, although the LED has excellent electrical insulation and sealing performance, the thermal conductivity of the epoxy resin is poor, the fluorescent powder coating can be converted into heat while converting light energy, so that the fluorescent powder coating generates heat, the temperature of the LED chip is also increased, the LED chip can only be transmitted through the metal substrate at the bottom, the heat dissipation effect is limited, and the light emitting efficiency of the LED chip is reduced due to the accumulation of the heat.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a LED packaging structure to solve the problem that proposes among the above-mentioned background art.

This utility model adopts for achieving the above purpose:

the utility model provides a LED packaging structure, includes LED chip, bears the metal heat sink, the ring gear of LED chip and sets up at the base of metal heat sink upper portion limit week, sets up in base top and cover the lamp lid of LED chip, fill fluorescent powder layer and the packing glue film of setting between lamp lid and LED chip, be connected through solid crystal glue between LED chip and the metal heat sink, the inside top surface of base is provided with the phase transition crystalline cube of a plurality of equidistance symmetric distribution in the limit week of metal heat sink, the phase transition crystalline cube bonds on the base through solid crystal glue, the limit week cladding of phase transition crystalline cube has one deck epoxy to drip the colloid, fluorescent powder layer covers and sets up on LED chip, epoxy drip the colloid and meets with the base, the packing glue film is filled between fluorescent powder layer and lamp lid.

It is further noted that the top surface of the metal heat sink is flush with the top surface of the interior of the base.

Further, the thickness of the phase-change crystal block is smaller than the sum of the thicknesses of the LED chip and the crystal-fixing glue.

Further, the filling adhesive layer is a colloid layer formed by adopting heat-resistant low-light-decay epoxy resin glue.

It is further explained that the epoxy resin drop colloid is a colloid layer formed by thermal conductive epoxy resin colloid.

Compared with the prior art, the beneficial effects of the utility model reside in that:

the phase-change crystal block is packaged between the LED chip and the fluorescent powder layer by adopting the epoxy resin drop colloid with high heat-conducting property, when the fluorescent powder coating generates heat and accumulates heat, the phase-change crystal block can absorb heat and melt, absorb certain heat, and circularly absorb the heat accumulated by the fluorescent powder coating after being cooled and crystallized and solidified, so that the heat dissipation way of the LED chip is increased, and the purpose of stabilizing the luminous efficiency of the LED chip is achieved.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural diagram of the present invention;

wherein: 1. an LED chip; 2. a metal heat sink; 3. a base; 4. a lamp cover; 5. a phosphor layer; 6. filling the adhesive layer; 7. die bonding glue; 8. phase-change crystal blocks; 9. the epoxy resin is dripped into the colloid.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, the present invention provides the following technical solutions:

an LED packaging structure comprises an LED chip 1, a metal heat sink 2 bearing the LED chip 1, a base 3 arranged on the periphery of the upper part of the metal heat sink 2 in an annular sleeve manner, a lamp cover 4 arranged above the base 3 and covering the LED chip 1, a fluorescent powder layer 5 and a filling adhesive layer 6 filled between the lamp cover 4 and the LED chip 1, wherein the filling adhesive layer 6 is a colloid layer formed by adopting heat-resistant low-light-attenuation epoxy resin glue, the top surface of the metal heat sink 2 is flush with the top surface inside the base 3, the LED chip 1 is connected with the metal heat sink 2 through the solid crystal glue 7, a plurality of phase-change crystal blocks 8 distributed equidistantly and symmetrically are arranged on the periphery of the metal heat sink 2 on the top surface inside the base 3, the thickness of each phase-change crystal block 8 is smaller than the sum of the thicknesses of the LED chip 1 and the solid crystal glue 7, the phase-change crystal blocks 8 are adhered to the base 3 through the solid crystal glue 7, and the periphery of each phase-change crystal block 8 is coated with a layer, the LED lamp is characterized in that the epoxy resin dripping colloid 9 is a colloid layer formed by thermal conductive epoxy resin glue, the fluorescent powder layer 5 is arranged on the LED chip 1 and the epoxy resin dripping colloid 9 in a covering mode and connected with the base 3, and the filling glue layer 6 is filled between the fluorescent powder layer 5 and the lamp cover 4. In actual production, metal heat sink 2 sets up earlier in base 3, then bond LED chip 1 at metal heat sink 2 tops through using solid crystal glue 7, bond phase change crystal on base 3 through using solid crystal glue 7 simultaneously, treat solid crystal glue 7 between them and all solidify the back completely, glue heat conductivity epoxy and drip and cover phase change brilliant piece 8, treat heat conductivity epoxy and glue the back completely, form epoxy glue dripping layer promptly, be connected the gold thread between LED chip 1 and the contact pin of base 3, then lay the phosphor powder coating and cover on LED chip 1 and epoxy glue dripping body 9, then place heat-resisting low light decay epoxy with certain thickness in phosphor powder coating top, treat the complete cure back, form filling glue layer 6 promptly, install lamp lid 4 and accomplish LED chip 1's encapsulation on base 3 promptly.

Adopt epoxy glue of dripping 9 with high heat conductivility to encapsulate phase transition brilliant piece 8 between LED chip 1 and phosphor layer 5, when the phosphor coating accumulated heat that generates heat, phase transition brilliant piece 8 can the heat absorption melting, absorbs certain heat, waits to cool off the back crystallization and solidifies, and the heat that the phosphor coating accumulated is absorbed in the circulation, has increased LED chip 1's heat dissipation way.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An LED packaging structure, its characterized in that: including LED chip (1), bear metal heat sink (2), the ring casing setting of LED chip (1) base (3) in metal heat sink (2) upper portion limit week, set up base (3) top and cover lamp lid (4) of LED chip (1), fill fluorescent powder layer (5) and packing glue film (6) that set up between lamp lid (4) and LED chip (1), be connected through solid crystal glue (7) between LED chip (1) and the metal heat sink (2), base (3) inside top surface is provided with a plurality of equidistance symmetric distribution's phase transition crystal block (8) in the limit week of metal heat sink (2), phase transition crystal block (8) bond on base (3) through solid crystal glue (7), the limit week cladding of phase transition crystal block (8) has one deck epoxy to drip colloid (9), fluorescent powder layer (5) cover and set up at LED chip (1), The epoxy resin is dripped on the colloid (9) and connected with the base (3), and the filling adhesive layer (6) is filled between the fluorescent powder layer (5) and the lamp cover (4).

2. The LED package structure of claim 1, wherein: the top surface of the metal heat sink (2) is flush with the top surface inside the base (3).

3. The LED package structure of claim 1, wherein: the thickness of the phase change crystal block (8) is smaller than the sum of the thicknesses of the LED chip (1) and the crystal fixing glue (7).

4. The LED package structure of claim 1, wherein: the filling adhesive layer (6) is a colloid layer formed by adopting heat-resistant low-light-decay epoxy resin glue.

5. The LED package structure of claim 1, wherein: the epoxy resin dripping colloid (9) is a colloid layer formed by thermal conductive epoxy resin glue.