CN109716497B - 用于宽范围温度控制的加热器基座组件 - Google Patents

用于宽范围温度控制的加热器基座组件 Download PDF

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Publication number
CN109716497B
CN109716497B CN201780057399.9A CN201780057399A CN109716497B CN 109716497 B CN109716497 B CN 109716497B CN 201780057399 A CN201780057399 A CN 201780057399A CN 109716497 B CN109716497 B CN 109716497B
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China
Prior art keywords
support member
shaft
base assembly
substrate
thermal
Prior art date
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Active
Application number
CN201780057399.9A
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English (en)
Chinese (zh)
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CN109716497A (zh
Inventor
K·阿拉亚瓦里
A·巴拉克里希纳
S·巴录佳
A·K·班塞尔
M·J·布舍
J·C·罗查-阿尔瓦雷斯
S·T·斯里尼瓦桑
T·乌拉维
周建华
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201780057399.9A 2016-09-22 2017-09-13 用于宽范围温度控制的加热器基座组件 Active CN109716497B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662398310P 2016-09-22 2016-09-22
US62/398,310 2016-09-22
PCT/US2017/051373 WO2018057369A1 (en) 2016-09-22 2017-09-13 Heater pedestal assembly for wide range temperature control

Publications (2)

Publication Number Publication Date
CN109716497A CN109716497A (zh) 2019-05-03
CN109716497B true CN109716497B (zh) 2023-09-26

Family

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CN201780057399.9A Active CN109716497B (zh) 2016-09-22 2017-09-13 用于宽范围温度控制的加热器基座组件

Country Status (6)

Country Link
US (1) US10910238B2 (https=)
JP (1) JP7073349B2 (https=)
KR (1) KR102236934B1 (https=)
CN (1) CN109716497B (https=)
TW (2) TWI729447B (https=)
WO (1) WO2018057369A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106607320B (zh) * 2016-12-22 2019-10-01 武汉华星光电技术有限公司 适用于柔性基板的热真空干燥装置
KR102460313B1 (ko) * 2018-12-13 2022-10-28 주식회사 원익아이피에스 기판 처리 장치의 서셉터 및 기판 처리 장치
TWI811307B (zh) * 2019-03-12 2023-08-11 鴻創應用科技有限公司 陶瓷電路複合結構及其製造方法
US12420314B2 (en) * 2019-10-18 2025-09-23 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor cleaning apparatus and method
US11515176B2 (en) * 2020-04-14 2022-11-29 Applied Materials, Inc. Thermally controlled lid stack components
US20220028710A1 (en) * 2020-07-21 2022-01-27 Applied Materials, Inc. Distribution components for semiconductor processing systems
US12020957B2 (en) * 2020-08-31 2024-06-25 Applied Materials, Inc. Heater assembly with process gap control for batch processing chambers
JP7490508B2 (ja) * 2020-09-09 2024-05-27 日本電子株式会社 三次元積層造形装置
US12563991B2 (en) * 2021-08-25 2026-02-24 Applied Materials, Inc. Thermal choke plate
TWI890199B (zh) * 2022-12-02 2025-07-11 日商鎧俠股份有限公司 半導體裝置冷卻裝置

Citations (8)

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Publication number Priority date Publication date Assignee Title
JPH11265931A (ja) * 1997-10-30 1999-09-28 Tokyo Electron Ltd 真空処理装置
JPWO2003060973A1 (ja) * 2002-01-10 2005-05-19 東京エレクトロン株式会社 処理装置
JP2006194679A (ja) * 2005-01-12 2006-07-27 Tokyo Electron Ltd 温度／厚さ測定装置，温度／厚さ測定方法，温度／厚さ測定システム，制御システム，制御方法
CN102844854A (zh) * 2009-12-18 2012-12-26 应用材料公司 宽范围晶圆温度控制的多功能加热器/冷却器基座
JP2013162010A (ja) * 2012-02-07 2013-08-19 Dainippon Screen Mfg Co Ltd 熱処理装置
CN104871305A (zh) * 2012-12-14 2015-08-26 应用材料公司 用于基板处理腔室部件的热辐射阻挡层
CN104990175A (zh) * 2015-07-28 2015-10-21 珠海格力电器股份有限公司 一种辐射换热板组件
CN204793612U (zh) * 2015-04-17 2015-11-18 李后杰 用于激光二极管的封装结构

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EP1132956A4 (en) * 1998-10-29 2005-04-27 Tokyo Electron Ltd VACUUM GENERATOR UNIT
JP2003060973A (ja) * 2001-08-21 2003-02-28 Mitsubishi Heavy Ind Ltd 監視カメラ誘導用送信器、監視カメラ、及び、監視システム
US7718930B2 (en) * 2003-04-07 2010-05-18 Tokyo Electron Limited Loading table and heat treating apparatus having the loading table
CN100358098C (zh) 2005-08-05 2007-12-26 中微半导体设备(上海)有限公司 半导体工艺件处理装置
US20070169703A1 (en) * 2006-01-23 2007-07-26 Brent Elliot Advanced ceramic heater for substrate processing
US7705238B2 (en) * 2006-05-22 2010-04-27 Andrew Llc Coaxial RF device thermally conductive polymer insulator and method of manufacture
WO2010008827A2 (en) * 2008-06-24 2010-01-21 Applied Materials, Inc. Pedestal heater for low temperature pecvd application
US8733280B2 (en) * 2010-12-20 2014-05-27 Intermolecular, Inc. Showerhead for processing chamber
US9089007B2 (en) 2012-04-27 2015-07-21 Applied Materials, Inc. Method and apparatus for substrate support with multi-zone heating
WO2014116392A1 (en) * 2013-01-25 2014-07-31 Applied Materials, Inc. Electrostatic chuck with concentric cooling base
US9698074B2 (en) 2013-09-16 2017-07-04 Applied Materials, Inc. Heated substrate support with temperature profile control
US20150194326A1 (en) 2014-01-07 2015-07-09 Applied Materials, Inc. Pecvd ceramic heater with wide range of operating temperatures

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11265931A (ja) * 1997-10-30 1999-09-28 Tokyo Electron Ltd 真空処理装置
JPWO2003060973A1 (ja) * 2002-01-10 2005-05-19 東京エレクトロン株式会社 処理装置
JP2006194679A (ja) * 2005-01-12 2006-07-27 Tokyo Electron Ltd 温度／厚さ測定装置，温度／厚さ測定方法，温度／厚さ測定システム，制御システム，制御方法
CN102844854A (zh) * 2009-12-18 2012-12-26 应用材料公司 宽范围晶圆温度控制的多功能加热器/冷却器基座
JP2013162010A (ja) * 2012-02-07 2013-08-19 Dainippon Screen Mfg Co Ltd 熱処理装置
CN104871305A (zh) * 2012-12-14 2015-08-26 应用材料公司 用于基板处理腔室部件的热辐射阻挡层
CN204793612U (zh) * 2015-04-17 2015-11-18 李后杰 用于激光二极管的封装结构
CN104990175A (zh) * 2015-07-28 2015-10-21 珠海格力电器股份有限公司 一种辐射换热板组件

Also Published As

Publication number Publication date
KR102236934B1 (ko) 2021-04-05
US20180082866A1 (en) 2018-03-22
JP2019533306A (ja) 2019-11-14
WO2018057369A1 (en) 2018-03-29
JP7073349B2 (ja) 2022-05-23
TW202015169A (zh) 2020-04-16
CN109716497A (zh) 2019-05-03
TWI671851B (zh) 2019-09-11
TW201814823A (zh) 2018-04-16
TWI729447B (zh) 2021-06-01
US10910238B2 (en) 2021-02-02
KR20190043645A (ko) 2019-04-26

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