CN109706461B - 一种镁合金用表面处理方法及其在制备蚀刻板上的应用 - Google Patents
一种镁合金用表面处理方法及其在制备蚀刻板上的应用 Download PDFInfo
- Publication number
- CN109706461B CN109706461B CN201910105691.4A CN201910105691A CN109706461B CN 109706461 B CN109706461 B CN 109706461B CN 201910105691 A CN201910105691 A CN 201910105691A CN 109706461 B CN109706461 B CN 109706461B
- Authority
- CN
- China
- Prior art keywords
- surface treatment
- magnesium alloy
- acid
- treatment method
- mesh
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000861 Mg alloy Inorganic materials 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 63
- 238000004381 surface treatment Methods 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title description 3
- 238000005260 corrosion Methods 0.000 claims abstract description 39
- 230000007797 corrosion Effects 0.000 claims abstract description 38
- 239000003112 inhibitor Substances 0.000 claims abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000001035 drying Methods 0.000 claims abstract description 18
- 238000005406 washing Methods 0.000 claims abstract description 15
- 239000008367 deionised water Substances 0.000 claims abstract description 11
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 11
- 150000007522 mineralic acids Chemical class 0.000 claims abstract description 6
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 claims description 14
- 238000007598 dipping method Methods 0.000 claims description 13
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 12
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 10
- 229910017604 nitric acid Inorganic materials 0.000 claims description 10
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 9
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 9
- 239000008103 glucose Substances 0.000 claims description 9
- -1 amide compound Chemical class 0.000 claims description 7
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 claims description 6
- 239000001361 adipic acid Substances 0.000 claims description 5
- 235000011037 adipic acid Nutrition 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- WXMKPNITSTVMEF-UHFFFAOYSA-M sodium benzoate Chemical compound [Na+].[O-]C(=O)C1=CC=CC=C1 WXMKPNITSTVMEF-UHFFFAOYSA-M 0.000 claims description 5
- 239000004299 sodium benzoate Substances 0.000 claims description 5
- 235000010234 sodium benzoate Nutrition 0.000 claims description 5
- LSBDFXRDZJMBSC-UHFFFAOYSA-N 2-phenylacetamide Chemical compound NC(=O)CC1=CC=CC=C1 LSBDFXRDZJMBSC-UHFFFAOYSA-N 0.000 claims description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 150000007524 organic acids Chemical class 0.000 claims description 4
- 229920005862 polyol Polymers 0.000 claims description 4
- 150000003077 polyols Chemical class 0.000 claims description 4
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 claims description 4
- 239000011698 potassium fluoride Substances 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 claims description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- IMQLKJBTEOYOSI-GPIVLXJGSA-N Inositol-hexakisphosphate Chemical compound OP(O)(=O)O[C@H]1[C@H](OP(O)(O)=O)[C@@H](OP(O)(O)=O)[C@H](OP(O)(O)=O)[C@H](OP(O)(O)=O)[C@@H]1OP(O)(O)=O IMQLKJBTEOYOSI-GPIVLXJGSA-N 0.000 claims description 3
- IMQLKJBTEOYOSI-UHFFFAOYSA-N Phytic acid Natural products OP(O)(=O)OC1C(OP(O)(O)=O)C(OP(O)(O)=O)C(OP(O)(O)=O)C(OP(O)(O)=O)C1OP(O)(O)=O IMQLKJBTEOYOSI-UHFFFAOYSA-N 0.000 claims description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- 239000000467 phytic acid Substances 0.000 claims description 3
- 229940068041 phytic acid Drugs 0.000 claims description 3
- 235000002949 phytic acid Nutrition 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- MHSKRLJMQQNJNC-UHFFFAOYSA-N terephthalamide Chemical compound NC(=O)C1=CC=C(C(N)=O)C=C1 MHSKRLJMQQNJNC-UHFFFAOYSA-N 0.000 claims description 3
- MIMUSZHMZBJBPO-UHFFFAOYSA-N 6-methoxy-8-nitroquinoline Chemical compound N1=CC=CC2=CC(OC)=CC([N+]([O-])=O)=C21 MIMUSZHMZBJBPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 2
- 239000004327 boric acid Substances 0.000 claims description 2
- 229950001902 dimevamide Drugs 0.000 claims description 2
- IPWFJLQDVFKJDU-UHFFFAOYSA-N pentanamide Chemical compound CCCCC(N)=O IPWFJLQDVFKJDU-UHFFFAOYSA-N 0.000 claims description 2
- 235000003270 potassium fluoride Nutrition 0.000 claims description 2
- 235000013024 sodium fluoride Nutrition 0.000 claims description 2
- 239000011775 sodium fluoride Substances 0.000 claims description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 2
- 230000008569 process Effects 0.000 abstract description 42
- 238000005530 etching Methods 0.000 abstract description 35
- 238000000576 coating method Methods 0.000 abstract description 15
- 239000011248 coating agent Substances 0.000 abstract description 14
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 238000007639 printing Methods 0.000 abstract description 7
- 239000002253 acid Substances 0.000 abstract description 6
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 238000005265 energy consumption Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 3
- 239000002994 raw material Substances 0.000 abstract description 2
- 238000002791 soaking Methods 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 26
- 238000011179 visual inspection Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 11
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000003292 glue Substances 0.000 description 7
- 238000000227 grinding Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 239000000956 alloy Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000003513 alkali Substances 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 244000137852 Petrea volubilis Species 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 229910001297 Zn alloy Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007745 plasma electrolytic oxidation reaction Methods 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- JLVVSXFLKOJNIY-UHFFFAOYSA-N Magnesium ion Chemical compound [Mg+2] JLVVSXFLKOJNIY-UHFFFAOYSA-N 0.000 description 1
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000007739 conversion coating Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910001425 magnesium ion Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- QLNJFJADRCOGBJ-UHFFFAOYSA-N propionamide Chemical compound CCC(N)=O QLNJFJADRCOGBJ-UHFFFAOYSA-N 0.000 description 1
- 229940080818 propionamide Drugs 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Landscapes
- ing And Chemical Polishing (AREA)
Abstract
Description
前处理工艺 | 接触角 | 曝光时间 | 显影解析度 | 蚀刻后图形完整性 |
光板 | 33 | 500s | 3pt | 0.06mm完整清晰,6pt完整清晰 |
实施例1 | 10 | 500s | 3pt | 0.03mm完整清晰,3pt完整清晰 |
实施例2 | 11.84 | 500s | 3pt | 0.04mm完整清晰,4pt完整清晰 |
实施例3 | 16.51 | 500s | 3pt | 0.03mm完整清晰,4pt完整清晰 |
实施例4 | 5.4 | 500s | 3pt | 0.05mm完整清晰,4pt完整清晰 |
实施例5 | 20 | 500s | 3pt | 0.04mm完整清晰,3pt完整清晰 |
对比例3 | 26 | 500s | 4pt | 0.07mm完整清晰,6pt完整清晰 |
对比例4 | 21 | 500s | 5pt | 0.07mm完整清晰,7pt完整清晰 |
对比例5 | 22 | 500s | 3pt | 0.06mm完整清晰,5pt完整清晰 |
对比例6 | 21 | 500s | 4pt | 0.06mm完整清晰,6pt完整清晰 |
对比例7 | 23 | 500s | 3pt | 0.07mm完整清晰,6pt完整清晰 |
对比例8 | 23 | 500s | 4pt | 0.07mm完整清晰,5pt完整清晰 |
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910105691.4A CN109706461B (zh) | 2019-02-01 | 2019-02-01 | 一种镁合金用表面处理方法及其在制备蚀刻板上的应用 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910105691.4A CN109706461B (zh) | 2019-02-01 | 2019-02-01 | 一种镁合金用表面处理方法及其在制备蚀刻板上的应用 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109706461A CN109706461A (zh) | 2019-05-03 |
CN109706461B true CN109706461B (zh) | 2020-12-25 |
Family
ID=66264214
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910105691.4A Active CN109706461B (zh) | 2019-02-01 | 2019-02-01 | 一种镁合金用表面处理方法及其在制备蚀刻板上的应用 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109706461B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112981383B (zh) * | 2021-02-10 | 2022-11-01 | 重庆大学 | 一种表面处理液及铜散热片的表面处理方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100383283C (zh) * | 2006-04-19 | 2008-04-23 | 东南大学 | 镁或其合金表面处理方法 |
CN100588743C (zh) * | 2007-04-09 | 2010-02-10 | 比亚迪股份有限公司 | 一种用于处理镁合金表面的酸性溶液及处理方法 |
CN102199775B (zh) * | 2010-03-24 | 2012-10-17 | 汉达精密电子(昆山)有限公司 | 镁合金酸洗溶液及方法 |
-
2019
- 2019-02-01 CN CN201910105691.4A patent/CN109706461B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN109706461A (zh) | 2019-05-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101519016B (zh) | 在金属表面制作图案的方法 | |
KR101637794B1 (ko) | 금속 표면 및 금속 표면의 처리 방법 | |
CN110079848B (zh) | 铝合金化学粗砂面处理方法 | |
CN106736306B (zh) | 一种电子产品金属壳体及其表面处理方法 | |
CN101736383B (zh) | 铝合金的阳极多色表面处理方法 | |
EP0020021A2 (en) | Method for the direct electrodeposition of a chromium layer on a metal substrate and a lithographic sheet comprising a metal substrate covered with such an electrodeposited chromium layer | |
CN109706461B (zh) | 一种镁合金用表面处理方法及其在制备蚀刻板上的应用 | |
CA1137392A (en) | Process for hydrophilization of metal surfaces and/or metal oxide surfaces | |
GB2567505A (en) | Aluminium panels | |
US8337634B2 (en) | Methods and removers for removing anodized films | |
CN107443875A (zh) | 一种凹印版辊的制备工艺 | |
CN105026621A (zh) | 铝合金的表面处理方法 | |
TWI303180B (zh) | ||
CN101852987B (zh) | 一种金属表面可控灰度连续阶调工艺 | |
CN108048841A (zh) | 一种铭牌加工方法 | |
TWI553164B (zh) | Surface treatment of aluminum products | |
CN108728848A (zh) | 表面具有木质纹理的金属板材制备工艺及其制备品 | |
KR20060023929A (ko) | 마그네슘 또는 마그네슘 합금 하우징 및 그 제조 방법 | |
JPS60203496A (ja) | 平版印刷版用アルミニウム基材及び平版印刷版用アルミニウム支持体の製造法 | |
CN109280922A (zh) | 一种钢件化学镀镍磷合金膜层化学退镀的工艺方法 | |
US3386901A (en) | Method of forming an electrolytically etched plate | |
WO2021054862A2 (ru) | Способ воспроизведения авторских рисунков на металлографской доске методом углубленной гравюры | |
KR101029893B1 (ko) | 알루미늄 안내판 제조방법 | |
JPH02215599A (ja) | 平版印刷版用支持体 | |
CA1077433A (en) | Roughening aluminium plate electrochemically in neutral salt solution |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220221 Address after: 226100 No. 188-1, Jinyang South Road, Yuelai Town, Haimen District, Nantong City, Jiangsu Province Patentee after: Nantong Volker New Material Technology Co.,Ltd. Address before: Room J6, 1 / F, building 6, 4299 Jindu Road, Minhang District, Shanghai 201100 Patentee before: SHANGHAI MEIYIN TECHNOLOGY Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230608 Address after: 226100 No. 188-1, Jinyang South Road, Yuelai Town, Haimen District, Nantong City, Jiangsu Province Patentee after: Nantong Emji Technology Co.,Ltd. Address before: 226100 No. 188-1, Jinyang South Road, Yuelai Town, Haimen District, Nantong City, Jiangsu Province Patentee before: Nantong Volker New Material Technology Co.,Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20240605 Address after: 226100 No. 188-1, Jinyang South Road, Yuelai Town, Haimen District, Nantong City, Jiangsu Province Patentee after: Nantong Volker New Material Technology Co.,Ltd. Country or region after: China Address before: 226100 No. 188-1, Jinyang South Road, Yuelai Town, Haimen District, Nantong City, Jiangsu Province Patentee before: Nantong Emji Technology Co.,Ltd. Country or region before: China |