CN109689735B - 桥联有机硅树脂、膜、电子器件以及相关方法 - Google Patents

桥联有机硅树脂、膜、电子器件以及相关方法 Download PDF

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Publication number
CN109689735B
CN109689735B CN201780055973.7A CN201780055973A CN109689735B CN 109689735 B CN109689735 B CN 109689735B CN 201780055973 A CN201780055973 A CN 201780055973A CN 109689735 B CN109689735 B CN 109689735B
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silicone resin
group
independently
bridged
film
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CN109689735A (zh
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傅鹏飞
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Dow Silicones Corp
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Dow Corning Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C08G77/52—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages containing aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/14—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Silicon Polymers (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
CN201780055973.7A 2016-09-30 2017-09-29 桥联有机硅树脂、膜、电子器件以及相关方法 Active CN109689735B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662402246P 2016-09-30 2016-09-30
US62/402246 2016-09-30
PCT/US2017/054407 WO2018064530A1 (en) 2016-09-30 2017-09-29 Bridged silicone resin, film, electronic device and related methods

Publications (2)

Publication Number Publication Date
CN109689735A CN109689735A (zh) 2019-04-26
CN109689735B true CN109689735B (zh) 2021-11-26

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Country Status (6)

Country Link
US (1) US10844179B2 (https=)
JP (1) JP6908694B2 (https=)
KR (1) KR102350185B1 (https=)
CN (1) CN109689735B (https=)
TW (1) TWI742160B (https=)
WO (1) WO2018064530A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102905697B1 (ko) * 2019-12-27 2025-12-31 한국전자통신연구원 고분자 필름 제조 방법 및 고분자 필름 조성물
EP4416553A1 (en) * 2021-10-15 2024-08-21 Dow Silicones Corporation High refractive index photoresist composition

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US6252030B1 (en) * 1999-03-17 2001-06-26 Dow Corning Asia, Ltd. Hydrogenated octasilsesquioxane-vinyl group-containing copolymer and method for manufacture
JP2002284999A (ja) * 2001-03-27 2002-10-03 National Institute Of Advanced Industrial & Technology シルセスキオキサン系ポリマー成形体及びその製造方法
TWI254069B (en) * 2000-01-31 2006-05-01 Dow Corning Toray Silicone Electrically insulating resin composition and method for forming thin film therefrom
CN101098911A (zh) * 2004-12-07 2008-01-02 松下电工株式会社 透射紫外线的多面硅倍半氧烷聚合物
US7557035B1 (en) * 2004-04-06 2009-07-07 Advanced Micro Devices, Inc. Method of forming semiconductor devices by microwave curing of low-k dielectric films
CN101563300A (zh) * 2006-12-20 2009-10-21 陶氏康宁公司 用固化的有机硅树脂组合物涂布或层压的玻璃基底
CN101910947A (zh) * 2008-01-11 2010-12-08 第一毛织株式会社 硅基硬掩模组合物(Si-SOH；Si基旋涂硬掩模)以及使用该组合物制造半导体集成电路器件的方法
CN101970540A (zh) * 2008-03-05 2011-02-09 陶氏康宁公司 倍半硅氧烷树脂
CN102146277A (zh) * 2009-12-21 2011-08-10 信越化学工业株式会社 聚硅氧树脂组成物及其硬化物
CN103450248A (zh) * 2013-09-13 2013-12-18 合肥学院 一种含芳环桥联倍半硅氧烷单体的制备方法

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US3220972A (en) 1962-07-02 1965-11-30 Gen Electric Organosilicon process using a chloroplatinic acid reaction product as the catalyst
US3296291A (en) 1962-07-02 1967-01-03 Gen Electric Reaction of silanes with unsaturated olefinic compounds
NL131800C (https=) 1965-05-17
US3516946A (en) 1967-09-29 1970-06-23 Gen Electric Platinum catalyst composition for hydrosilation reactions
US3814730A (en) 1970-08-06 1974-06-04 Gen Electric Platinum complexes of unsaturated siloxanes and platinum containing organopolysiloxanes
GB1476314A (en) 1973-06-23 1977-06-10 Dow Corning Ltd Coating process
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JP4338554B2 (ja) 2003-04-23 2009-10-07 信越化学工業株式会社 硬化性シリコーン樹脂組成物
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KR101272208B1 (ko) * 2005-02-16 2013-06-07 다우 코닝 도레이 캄파니 리미티드 강화 실리콘 수지 필름 및 이의 제조방법
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6252030B1 (en) * 1999-03-17 2001-06-26 Dow Corning Asia, Ltd. Hydrogenated octasilsesquioxane-vinyl group-containing copolymer and method for manufacture
TWI254069B (en) * 2000-01-31 2006-05-01 Dow Corning Toray Silicone Electrically insulating resin composition and method for forming thin film therefrom
JP2002284999A (ja) * 2001-03-27 2002-10-03 National Institute Of Advanced Industrial & Technology シルセスキオキサン系ポリマー成形体及びその製造方法
US7557035B1 (en) * 2004-04-06 2009-07-07 Advanced Micro Devices, Inc. Method of forming semiconductor devices by microwave curing of low-k dielectric films
CN101098911A (zh) * 2004-12-07 2008-01-02 松下电工株式会社 透射紫外线的多面硅倍半氧烷聚合物
CN101563300A (zh) * 2006-12-20 2009-10-21 陶氏康宁公司 用固化的有机硅树脂组合物涂布或层压的玻璃基底
CN101910947A (zh) * 2008-01-11 2010-12-08 第一毛织株式会社 硅基硬掩模组合物(Si-SOH；Si基旋涂硬掩模)以及使用该组合物制造半导体集成电路器件的方法
CN101970540A (zh) * 2008-03-05 2011-02-09 陶氏康宁公司 倍半硅氧烷树脂
CN102146277A (zh) * 2009-12-21 2011-08-10 信越化学工业株式会社 聚硅氧树脂组成物及其硬化物
CN103450248A (zh) * 2013-09-13 2013-12-18 合肥学院 一种含芳环桥联倍半硅氧烷单体的制备方法

Also Published As

Publication number Publication date
KR20190051026A (ko) 2019-05-14
KR102350185B1 (ko) 2022-01-17
TW201829556A (zh) 2018-08-16
JP2019529643A (ja) 2019-10-17
WO2018064530A1 (en) 2018-04-05
US10844179B2 (en) 2020-11-24
TWI742160B (zh) 2021-10-11
CN109689735A (zh) 2019-04-26
US20200172678A1 (en) 2020-06-04
JP6908694B2 (ja) 2021-07-28

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