CN109686708A - A kind of air-tightness and the radiator structure of non-airtight encapsulation - Google Patents
A kind of air-tightness and the radiator structure of non-airtight encapsulation Download PDFInfo
- Publication number
- CN109686708A CN109686708A CN201811582742.4A CN201811582742A CN109686708A CN 109686708 A CN109686708 A CN 109686708A CN 201811582742 A CN201811582742 A CN 201811582742A CN 109686708 A CN109686708 A CN 109686708A
- Authority
- CN
- China
- Prior art keywords
- chip
- ceramic cartridge
- ceramic
- radiator structure
- heat pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Abstract
The present invention discloses the radiator structure of a kind of air-tightness and non-airtight encapsulation, belongs to integrated antenna package technical field.The radiator structure of air-tight packaging includes ceramic cartridge and metal cover board, and metal cover board is welded as a whole with the ceramic cartridge；Wherein, heat pipe is embedded in the ceramic cartridge and the metal cover board；The heat pipe, which is formed, is filled with coolant liquid in sealed circuit and the heat pipe.The radiator structure of non-airtight encapsulation includes ceramic cartridge, is embedded with heat pipe in the ceramic cartridge；The heat pipe seals and inside is filled with coolant liquid.Accelerate electronic system and extraneous heat transfer, compensate for the drawback of the heat-sinking capability deficiency by high air quantity motor, contemporary electronic systems high density, the growth requirement of high complexity, for the higher system encapsulation of power can be met.
Description
Technical field
The present invention relates to integrated antenna package technical field, in particular to the heat dissipation of a kind of air-tightness and non-airtight encapsulation
Structure.
Background technique
Ceramic packaging technology meets the miniaturization of electronic system component, the requirement of high integration and high reliability, big at present
Amount is used in the Modern Electronics change system such as aviation, military project, medical treatment.The technology is more with its wiring number of plies, shape and ruler
Very little customizable makes it become the first choice of system in package, system-level with the promotion of ceramic package internal wiring ability
The integrated level of encapsulation improves rapidly, meets the miniaturization of hyundai electronics change system, the urgent need of low cost, high integration.
Wherein, system-level ceramic packaging technology, since integrated level height is higher and higher, power consumption is increasing, in order to meet
Radiating requirements then need that high air quantity motor is relied on to realize, this requirement that electronics are minimized is difficult to realize.
In order to meet the radiating requirements of contemporary electronic systems miniaturization and great-power electronic system simultaneously, need to develop one kind
The radiator structure of ceramic package.
Summary of the invention
The purpose of the present invention is to provide a kind of passive radiator structures of ceramic package, to solve to be unable to satisfy electronics at present
The problem of system compact and great-power electronic system radiating demand.
In order to solve the above technical problems, the present invention provides a kind of radiator structure of air-tight packaging, comprising:
Ceramic cartridge；
Metal cover board is welded as a whole with the ceramic cartridge；Wherein, it is embedded in the ceramic cartridge and the metal cover board
There is heat pipe；The heat pipe, which is formed, is filled with coolant liquid in sealed circuit and the heat pipe.
Optionally, chip is posted by packing material upside-down mounting on the ceramic cartridge or chip is posted in non-upside-down mounting.
Optionally, when chip is posted in upside-down mounting on the ceramic cartridge, the front of the chip is mounted by packing material
On the ceramic cartridge, the back side of the chip is bonded by heat-conducting glue with the metal cover board.
Optionally, when chip is posted in upside-down mounting non-on the ceramic cartridge, the back side of the chip is pasted by packing material
On the ceramic cartridge, the front of the chip is connect by spun gold with ceramic cartridge.
Optionally, the production method of the ceramic cartridge and metal cover board that are embedded with heat pipe includes 3D printing and casting.
The present invention also provides a kind of radiator structures of non-airtight encapsulation, comprising:
Ceramic cartridge is embedded with heat pipe in the ceramic cartridge；The heat pipe seals and inside is filled with coolant liquid.
Optionally, chip is posted by packing material upside-down mounting on the ceramic cartridge or chip is posted in non-upside-down mounting.
Optionally, when chip is posted in upside-down mounting on the ceramic cartridge, the front of the chip is mounted by packing material
On the ceramic cartridge, the back side of the chip is fitted with heat sink cover board by heat-conducting glue.
Optionally, when chip is posted in upside-down mounting non-on the ceramic cartridge, the back side of the chip is pasted by packing material
On the ceramic cartridge, the front of the chip is connect by spun gold with ceramic cartridge.
Optionally, the production method for being embedded with the ceramic cartridge of heat pipe includes 3D printing and casting.
The radiator structure of a kind of air-tightness and non-airtight encapsulation, the heat dissipation knot of air-tight packaging are provided in the present invention
Structure includes ceramic cartridge and metal cover board, and metal cover board is welded as a whole with the ceramic cartridge；Wherein, the ceramic cartridge and
Heat pipe is embedded in the metal cover board；The heat pipe, which is formed, is filled with coolant liquid in sealed circuit and the heat pipe.Non- gas
The radiator structure of close property encapsulation includes ceramic cartridge, is embedded with heat pipe in the ceramic cartridge；The heat pipe seals and inside is filled out
Filled with coolant liquid.
The invention has the following advantages:
(1) using heat pipe to be integrated in inside ceramic cartridge and metal cover board, the integration of cooling system and packaging body is realized
Preparation accelerates electronic system and extraneous heat transfer, compensates for the drawback of the heat-sinking capability deficiency by high air quantity motor, can expire
Sufficient contemporary electronic systems high density, the growth requirement of high complexity, for the higher system encapsulation of power；
(2) different heat pipe forms is used, realizes the radiator structure in gastight ceramic encapsulation and non-airtight ceramic package
In application；
(3) using heat pipe and the integral preparation process of ceramic cartridge, technical process is simplified, the process-cycle is shortened, improved
Packaging efficiency.
Detailed description of the invention
Fig. 1 is the radiator structure schematic diagram for the air-tight packaging that the embodiment of the present invention one provides；
The radiator structure schematic diagram of air-tight packaging when Fig. 2 is the flip-chip of the offer of the embodiment of the present invention one；
Fig. 3 be the embodiment of the present invention one provide chip non-upside-down mounting when air-tight packaging radiator structure schematic diagram；
Fig. 4 is the radiator structure schematic diagram of non-airtight encapsulation provided by Embodiment 2 of the present invention；
The radiator structure schematic diagram that non-airtight encapsulates when Fig. 5 is flip-chip provided by Embodiment 2 of the present invention；
The radiator structure schematic diagram of non-airtight encapsulation when Fig. 6 is chip provided by Embodiment 2 of the present invention non-upside-down mounting.
Specific embodiment
Heat dissipation below in conjunction with the drawings and specific embodiments to a kind of air-tightness proposed by the present invention and non-airtight encapsulation
Structure is described in further detail.According to following explanation and claims, advantages and features of the invention will be become apparent from.It needs
Bright, attached drawing is all made of very simplified form and using non-accurate ratio, only conveniently, lucidly to aid in illustrating
The purpose of the embodiment of the present invention.
Embodiment one
The embodiment of the present invention one provides a kind of radiator structure of air-tight packaging, and structure is as shown in Figure 1.The air-tightness envelope
The radiator structure of dress includes ceramic cartridge 1 and metal cover board 2, and the ceramic cartridge 1 and the metal cover board 2 are welded as a whole；
And the ceramic cartridge 1 and the metal cover board 2 in be embedded with heat pipe 3, the heat pipe 3 forms sealed circuit and the heat pipe
Coolant liquid 4 is filled in 3.Preferably, the production method of the ceramic cartridge 1 and metal cover board 2 that are embedded with heat pipe includes 3D printing
And casting.
Specifically, posting chip 6 by 5 upside-down mounting of packing material on the ceramic cartridge 1 or chip 6 is posted in non-upside-down mounting.Such as
Shown in Fig. 2, when chip 6 is posted in upside-down mounting on the ceramic cartridge 1, the front of the chip is mounted on institute by packing material 5
It states on ceramic cartridge 1, the back side of the chip 6 is bonded by heat-conducting glue 7 with the metal cover board 1.
As shown in figure 3, the back side of the chip 6 passes through filling when chip 6 is posted in non-upside-down mounting on the ceramic cartridge 1
Material 5 is mounted on the ceramic cartridge 1, and the front of the chip is connect by spun gold 8 with ceramic cartridge.
Embodiment two
Second embodiment of the present invention provides a kind of radiator structure of non-airtight encapsulation, structure is as shown in Figure 4.It is described non-hermetically sealed
Property encapsulation radiator structure include ceramic cartridge 1, be embedded with heat pipe 3 in the ceramic cartridge 1；The sealing of heat pipe 3 and inside
Filled with coolant liquid 4.Preferably, the production method for being embedded with the ceramic cartridge 1 of heat pipe includes 3D printing and casting.
Specifically, posting chip 6 by 5 upside-down mounting of packing material on the ceramic cartridge 1 or chip 6 is posted in non-upside-down mounting.Such as
Shown in Fig. 5, when chip 6 is posted in upside-down mounting on the ceramic cartridge 1, the front of the chip 6 is mounted on institute by packing material 5
It states on ceramic cartridge 1, the back side of the chip 6 is fitted with heat sink cover board 9 by heat-conducting glue 7.
As shown in fig. 6, the back side of the chip 6 passes through filling when chip 6 is posted in non-upside-down mounting on the ceramic cartridge 1
Material 5 is mounted on the ceramic cartridge 1, and the front of the chip 6 is connect by spun gold 8 with ceramic cartridge 1.
Foregoing description is only the description to present pre-ferred embodiments, not to any restriction of the scope of the invention, this hair
Any change, the modification that the those of ordinary skill in bright field does according to the disclosure above content, belong to the protection of claims
Range.
Claims (10)
1. a kind of radiator structure of air-tight packaging characterized by comprising
Ceramic cartridge；
Metal cover board is welded as a whole with the ceramic cartridge；Wherein, it is embedded in the ceramic cartridge and the metal cover board
There is heat pipe；The heat pipe, which is formed, is filled with coolant liquid in sealed circuit and the heat pipe.
2. the passive radiator structure of ceramic package as described in claim 1, which is characterized in that by filling out on the ceramic cartridge
Fill that chip is posted in material upside-down mounting or chip is posted in non-upside-down mounting.
3. the passive radiator structure of ceramic package as claimed in claim 2, which is characterized in that when upside-down mounting on the ceramic cartridge
When posting chip, the front of the chip is mounted on the ceramic cartridge by packing material, and the back side of the chip passes through
Heat-conducting glue is bonded with the metal cover board.
4. the passive radiator structure of ceramic package as claimed in claim 2, which is characterized in that when on the ceramic cartridge it is non-fall
When dress posts chip, the back side of the chip is mounted on the ceramic cartridge by packing material, and the front of the chip is logical
Spun gold is crossed to connect with ceramic cartridge.
5. the passive radiator structure of ceramic package as described in claim 1, which is characterized in that be embedded with the ceramic cartridge of heat pipe
Production method with metal cover board includes 3D printing and casting.
6. a kind of radiator structure of non-airtight encapsulation characterized by comprising
Ceramic cartridge is embedded with heat pipe in the ceramic cartridge；The heat pipe seals and inside is filled with coolant liquid.
7. such as the passive radiator structure for the ceramic package that claim 6 is stated, which is characterized in that pass through filling on the ceramic cartridge
Chip is posted in material upside-down mounting or chip is posted in non-upside-down mounting.
8. the passive radiator structure of ceramic package as claimed in claim 7, which is characterized in that when upside-down mounting on the ceramic cartridge
When posting chip, the front of the chip is mounted on the ceramic cartridge by packing material, and the back side of the chip passes through
Heat-conducting glue is fitted with heat sink cover board.
9. the passive radiator structure of ceramic package as claimed in claim 7, which is characterized in that when on the ceramic cartridge it is non-fall
When dress posts chip, the back side of the chip is mounted on the ceramic cartridge by packing material, and the front of the chip is logical
Spun gold is crossed to connect with ceramic cartridge.
10. the passive radiator structure of ceramic package as claimed in claim 6, which is characterized in that be embedded with the ceramic tube of heat pipe
The production method of shell includes 3D printing and casting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811582742.4A CN109686708A (en) | 2018-12-24 | 2018-12-24 | A kind of air-tightness and the radiator structure of non-airtight encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811582742.4A CN109686708A (en) | 2018-12-24 | 2018-12-24 | A kind of air-tightness and the radiator structure of non-airtight encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109686708A true CN109686708A (en) | 2019-04-26 |
Family
ID=66188885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811582742.4A Pending CN109686708A (en) | 2018-12-24 | 2018-12-24 | A kind of air-tightness and the radiator structure of non-airtight encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109686708A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111146151A (en) * | 2019-12-27 | 2020-05-12 | 中国电子科技集团公司第十三研究所 | Packaging structure capable of simultaneously realizing heat dissipation and air tightness of flip chip and preparation method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11233698A (en) * | 1997-05-30 | 1999-08-27 | Hewlett Packard Co <Hp> | Semiconductor package lid with heat pipe |
| CN2681327Y (en) * | 2003-12-29 | 2005-02-23 | 威盛电子股份有限公司 | Flip-chip heat radiation packaging arrangement |
| CN101989585A (en) * | 2009-07-30 | 2011-03-23 | 台湾积体电路制造股份有限公司 | Microelectronic package |
| CN203238029U (en) * | 2013-04-22 | 2013-10-16 | 安徽北方芯动联科微系统技术有限公司 | MEMS element provided with structure reducing packaging stress |
| CN103489838A (en) * | 2013-10-15 | 2014-01-01 | 北京大学 | Enhanced radiation three-dimensional packaging structure and packaging method for same |
| US20140126150A1 (en) * | 2012-11-08 | 2014-05-08 | David W. Song | Heat dissipation lid having direct liquid contact conduits |
| CN105304577A (en) * | 2015-07-28 | 2016-02-03 | 中国电子科技集团公司第十研究所 | Preparation method for multi-chip module heat dissipation packaging ceramic composite substrate |
-
2018
- 2018-12-24 CN CN201811582742.4A patent/CN109686708A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11233698A (en) * | 1997-05-30 | 1999-08-27 | Hewlett Packard Co <Hp> | Semiconductor package lid with heat pipe |
| CN2681327Y (en) * | 2003-12-29 | 2005-02-23 | 威盛电子股份有限公司 | Flip-chip heat radiation packaging arrangement |
| CN101989585A (en) * | 2009-07-30 | 2011-03-23 | 台湾积体电路制造股份有限公司 | Microelectronic package |
| US20140126150A1 (en) * | 2012-11-08 | 2014-05-08 | David W. Song | Heat dissipation lid having direct liquid contact conduits |
| CN203238029U (en) * | 2013-04-22 | 2013-10-16 | 安徽北方芯动联科微系统技术有限公司 | MEMS element provided with structure reducing packaging stress |
| CN103489838A (en) * | 2013-10-15 | 2014-01-01 | 北京大学 | Enhanced radiation three-dimensional packaging structure and packaging method for same |
| CN105304577A (en) * | 2015-07-28 | 2016-02-03 | 中国电子科技集团公司第十研究所 | Preparation method for multi-chip module heat dissipation packaging ceramic composite substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111146151A (en) * | 2019-12-27 | 2020-05-12 | 中国电子科技集团公司第十三研究所 | Packaging structure capable of simultaneously realizing heat dissipation and air tightness of flip chip and preparation method |
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Application publication date: 20190426 |
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| RJ01 | Rejection of invention patent application after publication |