CN109686691B - 一种半导体片加工专用定位加工台 - Google Patents
一种半导体片加工专用定位加工台 Download PDFInfo
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- CN109686691B CN109686691B CN201910174605.5A CN201910174605A CN109686691B CN 109686691 B CN109686691 B CN 109686691B CN 201910174605 A CN201910174605 A CN 201910174605A CN 109686691 B CN109686691 B CN 109686691B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 36
- 230000005540 biological transmission Effects 0.000 claims abstract description 20
- 235000012431 wafers Nutrition 0.000 claims description 29
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 7
- 238000003825 pressing Methods 0.000 description 8
- 230000006872 improvement Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 239000004830 Super Glue Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 239000003507 refrigerant Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201910174605.5A CN109686691B (zh) | 2019-03-08 | 2019-03-08 | 一种半导体片加工专用定位加工台 |
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CN201910174605.5A CN109686691B (zh) | 2019-03-08 | 2019-03-08 | 一种半导体片加工专用定位加工台 |
Publications (2)
Publication Number | Publication Date |
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CN109686691A CN109686691A (zh) | 2019-04-26 |
CN109686691B true CN109686691B (zh) | 2021-01-01 |
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CN201910174605.5A Active CN109686691B (zh) | 2019-03-08 | 2019-03-08 | 一种半导体片加工专用定位加工台 |
Country Status (1)
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CN (1) | CN109686691B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111794995A (zh) * | 2020-07-20 | 2020-10-20 | 泉州智驰自动化机械有限公司 | 一种风扇热管组件性能多功能检测装置 |
CN112018001B (zh) * | 2020-08-14 | 2023-05-05 | 成芯半导体(江苏)有限公司 | 一种半导体封装设备 |
CN114566564B (zh) * | 2022-02-10 | 2023-09-05 | 浙江晶盛机电股份有限公司 | 一种太阳能电池片高速叠瓦的规整装置及其规整机构 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202655751U (zh) * | 2012-06-28 | 2013-01-09 | 杭州大和热磁电子有限公司 | 一种热电致冷组件半自动组立装置 |
CN205343822U (zh) * | 2015-12-30 | 2016-06-29 | 博纳云智(天津)科技有限公司 | 一种3d打印机成型平台升降结构 |
CN105904144A (zh) * | 2016-06-08 | 2016-08-31 | 广东科杰机械自动化有限公司 | 一种焊线夹具 |
CN207719246U (zh) * | 2018-01-24 | 2018-08-10 | 泉州市依科达半导体致冷科技有限公司 | 一种半导体制冷片焊接装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0146216B1 (ko) * | 1995-04-24 | 1998-11-02 | 정문술 | 반도체 소자검사기의 소자로딩,언로딩장치 |
US10041973B2 (en) * | 2013-09-04 | 2018-08-07 | Infineon Technologies Ag | Method and apparatus for dynamic alignment of semiconductor devices |
CN207425811U (zh) * | 2017-11-14 | 2018-05-29 | 陈宝玉 | 一种基用于mems传感器的半导体封装器 |
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2019
- 2019-03-08 CN CN201910174605.5A patent/CN109686691B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202655751U (zh) * | 2012-06-28 | 2013-01-09 | 杭州大和热磁电子有限公司 | 一种热电致冷组件半自动组立装置 |
CN205343822U (zh) * | 2015-12-30 | 2016-06-29 | 博纳云智(天津)科技有限公司 | 一种3d打印机成型平台升降结构 |
CN105904144A (zh) * | 2016-06-08 | 2016-08-31 | 广东科杰机械自动化有限公司 | 一种焊线夹具 |
CN207719246U (zh) * | 2018-01-24 | 2018-08-10 | 泉州市依科达半导体致冷科技有限公司 | 一种半导体制冷片焊接装置 |
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Effective date of registration: 20201214 Address after: 277200 Economic Development Zone of Sangcun Town, Shanting District, Zaozhuang City, Shandong Province Applicant after: Zaozhuang Dahe Industrial Machinery Co.,Ltd. Address before: 409130 Baiyan formation, Chengnan Juwei, Nanbin Town, Shizhu Tujia Autonomous County, Chongqing (Industrial incubation building 605-15) Applicant before: CHONGQING ZHOUJIN ELECTRONIC TECHNOLOGY Co.,Ltd. |
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Address after: 277200 Economic Development Zone of Sangcun Town, Shanting District, Zaozhuang City, Shandong Province Patentee after: Shandong Dahe Machinery Manufacturing Co.,Ltd. Address before: 277200 Economic Development Zone of Sangcun Town, Shanting District, Zaozhuang City, Shandong Province Patentee before: Zaozhuang Dahe Industrial Machinery Co.,Ltd. |
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Effective date of registration: 20240112 Address after: No. 9 Baodugu Road, Development Zone, Sangcun Town, Shanting District, Zaozhuang City, Shandong Province, 277200 Patentee after: Shandong Chenda Intelligent Equipment Co.,Ltd. Address before: 277200 Economic Development Zone of Sangcun Town, Shanting District, Zaozhuang City, Shandong Province Patentee before: Shandong Dahe Machinery Manufacturing Co.,Ltd. |