CN109661104A - A kind of printed circuit board and electronic equipment - Google Patents
A kind of printed circuit board and electronic equipment Download PDFInfo
- Publication number
- CN109661104A CN109661104A CN201811615898.8A CN201811615898A CN109661104A CN 109661104 A CN109661104 A CN 109661104A CN 201811615898 A CN201811615898 A CN 201811615898A CN 109661104 A CN109661104 A CN 109661104A
- Authority
- CN
- China
- Prior art keywords
- pad
- circuit board
- printed circuit
- pad hole
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention relates to electronic technology fields, more particularly to a kind of printed circuit board and electronic equipment, wherein, the first pad hole and the second pad hole are offered on the end face of printed circuit board, the first pad and the second pad matched with first pad hole and second pad hole is respectively arranged at the edge of first pad hole and second pad hole, the aperture of first pad hole is greater than the aperture of second pad hole, first kind pin and the second class pin pass through welding and are separately positioned in first pad hole and second pad hole, the power of the first kind pin is greater than the power of the second class pin, electronic equipment includes above-mentioned printed circuit board.The present invention is by after welding, having welding material on the two sides of pad hole for the aperture increases of the first pad hole, to increase the heat dissipation area of first kind pin, extends the service life of printed circuit board and electronic equipment.
Description
Technical field
The present invention relates to electronic technology field more particularly to a kind of printed circuit boards and electronic equipment.
Background technique
With the development of electronic technology, it is assembled using the printed circuit board of layout design due to having to reduce wiring and reduce
The advantages of mistake, also achieves great development therewith.But as the power density of power device is continuously improved, heat dissipation is at system
An about problem of printed circuit board development.
In the prior art, existing printed circuit board is mostly standard design on the market, as shown in Figure 1, the printing electricity of standard
The aperture of pad hole 3 ' on road plate 1 ' is that standard etc. is big.Corresponding, the diameter of the welding pin of electronic component is also mark
Quasi-, since pin and pad hole 3 ' they are all standard sizes, it is essentially identical that pin, which is welded to the heat dissipation effect on pad 2 ',.
Since calorific value is very big at work for some pins of some electronic components (such as high-power chip), and standardize pad structure
Heat dissipation performance be difficult to match the heat dissipation capacity of this pin, this will have a direct impact on printed circuit board 1 ' and using the circuit board
The service life of electronic equipment.
Therefore, a kind of printed circuit board and electronic equipment are needed to solve above-mentioned technical problem.
Summary of the invention
The purpose of the present invention is to provide printed circuit board and electronic equipments, can accelerate high-power first kind pin
Heat distributes, to extend the service life of printed circuit board and electronic equipment.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of printed circuit board offers the first pad hole and the second pad hole on the end face of the printed circuit board,
The edge of first pad hole and second pad hole is respectively arranged with and first pad hole and second pad
The first pad and the second pad that hole matches, the aperture of first pad hole are greater than the aperture of second pad hole, the
A kind of pin and the second class pin pass through welding and are separately positioned in first pad hole and second pad hole, described
The power of first kind pin is greater than the power of the second class pin.
Preferably, the aperture of first pad hole is 1.2~2 times of second pad aperture.
Preferably, the material of the substrate of the printed circuit board is epoxy resin.
Preferably, the material of first pad and second pad is tin.
Preferably, solder mask is provided on the end face of the printed circuit board.
Preferably, the material for welding the first kind pin and the second class pin is tin.
A kind of electronic equipment, including printed circuit board described in any of the above item.
Beneficial effects of the present invention:
A kind of printed circuit board and electronic equipment provided by the present invention make the aperture of the first pad hole be greater than the second pad
The aperture in hole, by the way that high-power first kind pin to be arranged in by welding in the first pad hole, due to the first weldering
The aperture of disk hole is larger, and welding material can flow through the first pad hole, has welding material, two sides on the two sides of the first pad hole
Welding material can radiate, radiated by original single side, become present two sides heat dissipation, increase the heat dissipation of first kind pin
Area, and then the heat for accelerating first kind pin distributes, and extends the service life of printed circuit board and electronic equipment.
Detailed description of the invention
Fig. 1 is the schematic diagram of printed circuit board in the prior art；
Fig. 2 is a kind of schematic diagram of printed circuit board of the present invention；
In figure:
1 '-printed circuit board；2 '-pads；3 '-pad holes；
1- printed circuit board；The first pad of 2-；The first pad hole of 3-；The second pad of 4-；The second pad hole of 5-.
Specific embodiment
Technical solution of the present invention is further illustrated with embodiment with reference to the accompanying drawing.It is understood that this place
The specific embodiment of description is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to
Convenient for description, in attached drawing, only the parts related to the present invention are shown and it is not all.
As shown in Fig. 2, a kind of printed circuit board provided by the invention, the first weldering is offered on the end face of printed circuit board 1
Disk hole 3 and the second pad hole 5, the edge of the first pad hole 3 and the second pad hole 5 be respectively arranged with the first pad hole 3 and
The first pad 2 and the second pad 4 that second pad hole 5 matches, the second pad hole 5 are standard soldering board hole, the first pad hole 3
Aperture is greater than the aperture of the second pad hole 5, and first kind pin and the second class pin pass through welding and be separately positioned on the first pad
In hole 3 and the second pad hole 5, the power of first kind pin is greater than the power of the second class pin.
Further, the first pad hole 2 is too big and be connected to adjacent pad hole in order to prevent, thus make adjacent pin it
Between generate connection, it is preferable that 3 aperture of the first pad hole is 1.2~2 times of 5 aperture of the second pad hole.Welding process in order to prevent
In, welding material flows to the short circuit caused between pin on adjacent pin, is coated in two end faces of printed circuit board 1
Solder mask, the color of solder mask are general green or blue, and the material selection of the substrate of printed circuit board 1 has excellent power
The insulating materials epoxy resin of performance, dimensional stability outstanding is learned, guarantees that printed circuit board 1 preferably meets job requirement.
For the convenience of welding, while it being not likely to produce oxidation, the material of the first pad 2 and the second pad 4 is all made of tin.Welding material choosing
Tin low with fusing point, and being easy to bond with device pin common metal.After electric iron is heated to certain temperature, it can incite somebody to action
Tin melts, and then can weld to pin.
Further, the present invention also provides a kind of electronic equipment, including printed circuit board as described above.
A kind of printed circuit board and electronic equipment provided by the invention weld material since the aperture of the first pad hole 3 is larger
Material can flow through the first pad hole 3, have welding material on the two sides of the first pad hole 3, since there are the two sides of welding material
It can radiate, to increase the heat dissipation area of first kind pin, and then the heat for accelerating first kind pin distributes, extend printing
The service life of circuit board 1 and electronic equipment.
Obviously, the above embodiment of the present invention is just for the sake of clearly illustrating examples made by the present invention, and being not is pair
The restriction of embodiments of the present invention.For those of ordinary skill in the art, may be used also on the basis of the above description
To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.It is all this
Made any modifications, equivalent replacements, and improvements etc., should be included in the claims in the present invention within the spirit and principle of invention
Protection scope within.
Claims (7)
1. a kind of printed circuit board, which is characterized in that offer the first pad hole (3) on the end face of the printed circuit board (1)
With the second pad hole (5), the edge of first pad hole (3) and second pad hole (5) be respectively arranged with it is described
The first pad (2) and the second pad (4) that first pad hole (3) and second pad hole (5) match, first pad
The aperture in hole (3) is greater than the aperture of second pad hole (5), and first kind pin and the second class pin pass through welding and set respectively
It sets in first pad hole (3) and second pad hole (5), the power of the first kind pin is greater than second class
The power of pin.
2. a kind of printed circuit board according to claim 1, which is characterized in that the aperture of first pad hole (3) is
1.2~2 times of the aperture of second pad hole (5).
3. a kind of printed circuit board according to claim 1, which is characterized in that the substrate material of the printed circuit board (1)
Material is epoxy resin.
4. a kind of printed circuit board according to claim 1, which is characterized in that first pad (2) and described second
The material of pad (4) is tin.
5. a kind of printed circuit board according to claim 1, which is characterized in that on the end face of the printed circuit board (1)
It is coated with solder mask.
6. a kind of printed circuit board according to claim 1, which is characterized in that weld the first kind pin and described
The material of two class pins is tin.
7. a kind of electronic equipment, which is characterized in that including printed circuit board described in any one of claims 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811615898.8A CN109661104A (en) | 2018-12-27 | 2018-12-27 | A kind of printed circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811615898.8A CN109661104A (en) | 2018-12-27 | 2018-12-27 | A kind of printed circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109661104A true CN109661104A (en) | 2019-04-19 |
Family
ID=66117189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811615898.8A Pending CN109661104A (en) | 2018-12-27 | 2018-12-27 | A kind of printed circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109661104A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201039588Y (en) * | 2007-05-29 | 2008-03-19 | 深圳市和而泰电子科技有限公司 | Double-side circuit board with welding tray structure |
| CN201042106Y (en) * | 2007-06-07 | 2008-03-26 | 杭州华三通信技术有限公司 | A circuit board penetration hole and its circuit board |
| CN201466057U (en) * | 2009-04-16 | 2010-05-12 | 刘粤荣 | High-power led circuit board |
| CN103096618A (en) * | 2011-10-31 | 2013-05-08 | 联发科技（新加坡）私人有限公司 | Printed circuit board and electronic apparatus thereof |
| CN106376175A (en) * | 2016-08-31 | 2017-02-01 | 深圳天珑无线科技有限公司 | Printed circuit board and mobile terminal |
| CN207398178U (en) * | 2017-11-09 | 2018-05-22 | 浙江兰达光电科技有限公司 | High-power ultraviolet LED copper base |
-
2018
- 2018-12-27 CN CN201811615898.8A patent/CN109661104A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201039588Y (en) * | 2007-05-29 | 2008-03-19 | 深圳市和而泰电子科技有限公司 | Double-side circuit board with welding tray structure |
| CN201042106Y (en) * | 2007-06-07 | 2008-03-26 | 杭州华三通信技术有限公司 | A circuit board penetration hole and its circuit board |
| CN201466057U (en) * | 2009-04-16 | 2010-05-12 | 刘粤荣 | High-power led circuit board |
| CN103096618A (en) * | 2011-10-31 | 2013-05-08 | 联发科技（新加坡）私人有限公司 | Printed circuit board and electronic apparatus thereof |
| CN106376175A (en) * | 2016-08-31 | 2017-02-01 | 深圳天珑无线科技有限公司 | Printed circuit board and mobile terminal |
| CN207398178U (en) * | 2017-11-09 | 2018-05-22 | 浙江兰达光电科技有限公司 | High-power ultraviolet LED copper base |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190419 |