CN208227437U - A kind of double-sided PCB of included scolding tin - Google Patents
A kind of double-sided PCB of included scolding tin Download PDFInfo
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- CN208227437U CN208227437U CN201820786256.3U CN201820786256U CN208227437U CN 208227437 U CN208227437 U CN 208227437U CN 201820786256 U CN201820786256 U CN 201820786256U CN 208227437 U CN208227437 U CN 208227437U
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- scolding tin
- layer
- double
- heat
- sided pcb
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Abstract
The utility model relates to circuit board technology fields, especially a kind of double-sided PCB of included scolding tin, its key points of the technical solution are that: including substrate and the circuit layer that positive and negative two surface of substrate is arranged in, and the perforation through the substrate and the circuit layer, the perforation hole wall is provided with conductive layer, the conductive layer is connected to the circuit layer, and the conductive layer surface is provided with soldering-tin layer, and the soldering-tin layer extends circuit layer and forms scolding tin circle.A kind of double-sided PCB of included scolding tin of the utility model has the advantages that simplified welding mode.
Description
Technical field
The utility model relates to circuit board technology field, especially a kind of double-sided PCB of included scolding tin.
Background technique
Circuit board is indispensable component in current electronic product, and with advances in technology, on circuit board
Integrated electronic device is more and more, and circuit board makes circuit miniaturization, intuitiveization, the batch production and optimization for fixed circuit
Electrical appliance layout plays an important role.Double-sided PCB is the extension of single-sided circuit board, and double-sided PCB two sides, which has, to be covered copper and walk
Line, and the route between two layers can be connected by via hole, it is allowed to form required network connection.
In the prior art, usually soldering tin bar is sent into after welding surface and it is heated using soldering appliance, when scolding tin melts
Soldering tin bar and soldering appliance are removed after a certain amount of, the fixation to component can be realized in scolding tin after solidifying again.The welding manner
Need to control soldering appliance while controlling soldering tin bar, it is inconvenient for operation.
Utility model content
In view of the deficiencies of the prior art, the purpose of this utility model is to provide a kind of double-sided PCB of included scolding tin,
Has the advantages that simplified welding mode.
The above-mentioned purpose of the utility model has the technical scheme that a kind of two-sided electricity of included scolding tin
Road plate, including substrate and the circuit layer that positive and negative two surface of substrate is arranged in, and passing through through the substrate and the circuit layer
Hole, the perforation hole wall are provided with conductive layer, and the conductive layer is connected to the circuit layer, and the conductive layer surface is provided with weldering
Tin layers, the soldering-tin layer extend circuit layer and form scolding tin circle.
Using the above scheme, component pin is inserted into from perforation, and the soldering-tin layer and soldering-tin layer of conductive layer surface setting extend
Out circuit layer formed scolding tin circle is heated dissolve after be covered on component pin, scolding tin can fix component after solidifying again,
Scolding tin is connected with conductive layer after fixation, realizes that component is connected with circuit, this circuit board is not necessarily to additional scolding tin, operates more square
Just.
Further, the substrate at the perforation aperture offers the annular groove for placing scolding tin.
Using the above scheme, there is a ring annular groove at perforation aperture, scolding tin can be placed in annular groove, increase soldering tin amount, keep away
Exempt from rosin joint occur.
Further, the annular groove groove wall is provided with inclined-plane, and the inclined-plane is obliquely installed to the perforation (5) direction.
Using the above scheme, it can flow, make between component pin and perforation to perforation direction along inclined-plane after scolding tin melts
It connects stronger.
Further, angle is 45 ° between the inclined-plane and the scolding tin circle.
Using the above scheme, guarantee to increase the mobility after scolding tin melts under the premise of soldering tin amount.
Further, the circuit layer surface is provided with heat-conducting layer.
Using the above scheme, the heat that circuit layer generates can be transferred to heat-conducting layer and distribute, and prevent from generating when welding
High temperature damages circuit layer.
Further, the thermally conductive layer surface is provided with solder mask.
Using the above scheme, the place other than perforation is flowed to after preventing scolding tin heating and melting, causes short circuit.
Further, the solder mask offers several heat release holes, and the heat release hole is plugged with several heat-conducting layer tables
The heat-conducting block of face protrusion setting.
Using the above scheme, the heat of heat-conducting layer can be distributed by the heat-conducting block that surface is arranged without through welding resistance
Layer accelerates radiating rate.
Further, the heat-conducting block end face is provided with metal fin.
Using the above scheme, after the heat transfer of circuit layer is to heat-conducting layer, metal fin is passed to again by heat-conducting block
It passes to except circuit board, further speeds up radiating rate, improve heat dissipation effect.
In conclusion the utility model has the following beneficial effects:
First, circuit board perforation hole wall is equipped with soldering-tin layer, soldering-tin layer extends circuit layer and is formed on scolding tin circle and perforation
The annular groove of Fang Kaishe is filled with scolding tin, and when welding can directly heat the scolding tin of setting on circuit boards and consolidate to component
It is fixed, it is not necessarily to additional scolding tin, simplifies welding mode.
Second, the heat-conducting layer being arranged between circuit layer and solder mask passes through heat-conducting block and metal fin for circuit board
Heat distributes, and the high temperature generated when welding is avoided to damage circuit.
Detailed description of the invention
Fig. 1 is a kind of overall structure diagram of the double-sided PCB of included scolding tin in the utility model.
In figure, 1, substrate;2, circuit layer;3, heat-conducting layer;4, solder mask;5, perforation;6, conductive layer;7, soldering-tin layer;8,
Annular groove;9, heat-conducting block;10, metal fin;11, heat release hole;12, inclined-plane;13, scolding tin circle.
Specific embodiment
A kind of double-sided PCB of included scolding tin, referring to Fig. 1, including substrate 1, positive and negative two surface of substrate 1 is printed with electricity
Road floor 2,2 surface of circuit layer are fitted with heat-conducting layer 3, and 3 surface of heat-conducting layer is fitted with solder mask 4, thermally conductive in the present embodiment
Layer 3 uses thermal conductive silicon colloid, has the function of insulating heat-conductive, and the solder mask 4 in the present embodiment uses ink;Circuit board, which offers, to be passed through
It is through at the perforation 5 of substrate 1, circuit layer 2, heat-conducting layer 3 and solder mask 4, the hole wall of perforation 5 is covered with conductive layer 6, conductive layer 6
For copper foil, 6 surface of conductive layer is covered with soldering-tin layer 7, and soldering-tin layer 7 extends solder mask 4 and is formed with scolding tin circle 13;5 aperture of perforation
Place offers the annular groove 8 that a circle self-reference substrate 1 extends to solder mask 4, and the groove face of annular groove 8 is obliquely installed shape inclined-plane at 45 °
12, while scolding tin is filled in annular groove 8.
Referring to Fig. 1, heat-conducting layer 3 is provided with heat-conducting block 9, heat-conducting block 9 and heat-conducting layer 3 close to 4 side surface bulge of solder mask
Material is identical and is connected as one with heat-conducting layer 3, and heat-conducting block 9 can be led in cylindrical type setting or the setting of other polygonal column bodies
9 end face of heat block is bonded with metal fin 10 identical with 9 section of heat-conducting block, and 10 material of metal fin in the present embodiment is adopted
Use aluminium copper;Solder mask 4 offers heat release hole 11, and heat release hole 11 is through-hole, and heat-conducting block 9 is plugged in heat release hole 11, heat
It can be distributed by metal fin 10 to outside circuit board;Due to the circuit layer of 6 connecting substrate of conductive layer, 1 two sides of 5 hole wall of perforation
2, thus perforation 5 can turning circuit plate two sides route, component pin can be fixed on any one face annular groove 8 by when welding.
Design principle: circuit board offers perforation 5, covers soldering-tin layer 7 in 5 hole wall of perforation, soldering-tin layer 7 extends solder mask
4 form scolding tin circle 13, offer the annular groove 8 that a circle self-reference substrate 1 extends to solder mask 4, the slot of annular groove 8 at 5 aperture of perforation
Face is obliquely installed, and annular groove 8 is filled with scolding tin, and the scolding tin of double-sided PCB is arranged in heating and melting when welding, is solidified again
The fixation to component can be realized afterwards;Excessive temperature is generated when on the other hand, to prevent welding to damage circuit board,
Heat-conducting layer 3 is set between solder mask 4 and circuit layer 2, and heat-conducting layer 3 will be warm with metal fin 10 by the heat-conducting block 9 on its surface
Heat release hole 11 of the amount through solder mask 4 is distributed to except circuit board.
The above is only the preferred embodiment of the utility model, and the protection scope of the utility model is not limited merely to
Above-described embodiment, technical solution belonging to the idea of the present invention belong to the protection scope of the utility model.It should refer to
Out, for those skilled in the art, it is without departing from the principle of the utility model it is several improvement and
Retouching, these improvements and modifications also should be regarded as the protection scope of the utility model.
Claims (8)
1. a kind of double-sided PCB of included scolding tin, it is characterized in that: including substrate (1) and setting on positive and negative two surface of substrate (1)
Circuit layer (2), and run through the perforation (5) of the substrate (1) and the circuit layer (2), perforation (5) hole wall is provided with
Conductive layer (6), the conductive layer (6) are connected to the circuit layer (2), and conductive layer (6) surface is provided with soldering-tin layer (7),
The soldering-tin layer (7) extends circuit layer (2) and forms scolding tin circle (13).
2. the double-sided PCB of included scolding tin according to claim 1, it is characterized in that: being located at the perforation (5) aperture
The substrate (1) offer the annular groove (8) for placing scolding tin.
3. the double-sided PCB of included scolding tin according to claim 2, it is characterized in that: the annular groove (8) cell wall is arranged
Have inclined-plane (12), the inclined-plane (12) is obliquely installed to the perforation (5) direction.
4. the double-sided PCB of included scolding tin according to claim 3, it is characterized in that: the inclined-plane (12) and the scolding tin
Enclosing angle between (13) is 45 °.
5. the double-sided PCB of included scolding tin according to claim 1, it is characterized in that: the circuit layer (2) surface is all provided with
It is equipped with heat-conducting layer (3).
6. the double-sided PCB of included scolding tin according to claim 5, it is characterized in that: the heat-conducting layer (3) surface is all provided with
It is equipped with solder mask (4).
7. the double-sided PCB of included scolding tin according to claim 6, it is characterized in that: the solder mask (4) is if offer
Dry heat release hole (11), the heat release hole (11) are plugged with the heat-conducting block (9) of several heat-conducting layer (3) surface bulge settings.
8. the double-sided PCB of included scolding tin according to claim 7, it is characterized in that: several heat-conducting blocks (9) end face
It is provided with metal fin (10).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201820786256.3U CN208227437U (en) | 2018-05-24 | 2018-05-24 | A kind of double-sided PCB of included scolding tin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201820786256.3U CN208227437U (en) | 2018-05-24 | 2018-05-24 | A kind of double-sided PCB of included scolding tin |
Publications (1)
Publication Number | Publication Date |
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CN208227437U true CN208227437U (en) | 2018-12-11 |
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CN201820786256.3U Active CN208227437U (en) | 2018-05-24 | 2018-05-24 | A kind of double-sided PCB of included scolding tin |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021017556A1 (en) * | 2019-07-26 | 2021-02-04 | 广东美的制冷设备有限公司 | Circuit board, frequency conversion air conditioner control panel, and air conditioner |
-
2018
- 2018-05-24 CN CN201820786256.3U patent/CN208227437U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021017556A1 (en) * | 2019-07-26 | 2021-02-04 | 广东美的制冷设备有限公司 | Circuit board, frequency conversion air conditioner control panel, and air conditioner |
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