CN205249677U

CN205249677U - Heat pipe heat conduction structure

Info

Publication number: CN205249677U
Application number: CN201520909354.8U
Authority: CN
Inventors: 余原生
Original assignee: Individual
Current assignee: Individual
Priority date: 2015-11-16
Filing date: 2015-11-16
Publication date: 2016-05-18
Anticipated expiration: 2025-11-16

Abstract

The utility model provides a heat pipe heat conduction structure, include: electron device, flexible circuit board, heat pipe, the flexible circuit board parcel is in the one end or the parcel of heat pipe are in a plurality of position of heat pipe, electron device is located the flexible circuit board top, just the flexible circuit board corresponds open electron device's bottom has the through -hole, through -hole department is equipped with heat sink stopping, thereby the heat that electron device produced is through the bottom heat sink stopping transmits on the heat pipe and distribute away, simultaneously, because electron device with the connection has between the flexible circuit board, thereby heat pipe heat conduction structure still has electrical connection's effect, owing to use electric hookup is done to the flexible circuit board, makes original the generating heat on a plurality of incorgruous planes of solid and curved surface that distribute electron device can use current ripe automatic surface mounting technology welding, reduces the technology degree of difficulty by a wide margin, improves the qualification rate.

Description

A kind of heat pipe for thermal conductivity structure

Technical field

The utility model relates to field of electronic devices, refers to especially a kind of heat pipe for thermal conductivity structure.

Background technology

Existing electronic product will be tackled small size, it is the requirement that meets again heat conduction and part heat radiation when adopting the electric connection that has heat conduction function PCB to meet electronic device to require that the requirement that the electric connection that should meet electronic device in the application of high power density requires to meet again heat conduction and heat radiation adopts best technical scheme, take away for heat conduction PCB being spread out of to heat rapidly that to adopt heat pipe transferring heat be also best scheme at present, the heat spreading out of through heat pipe can adopt various radiators by initiatively or passive mode be dispersed into the place of low temperature.

Have based on the current adoptable heat conduction PCB of above scheme aluminium base, the metallic circuit of copper base, ceramic base circuit board, is used in traditional PCB improvement and the heat conduction PCB that comes in addition. But these circuit boards respectively have shortcoming, due to cover between copper and Metal Substrate, exist the reason of electrical apparatus insulation layer cause thermal conductivity factor (thermal conductivity factor 0.8-6w/m.k) on the low side ceramic base circuit board by material different with technique accomplish not only to insulate not only heat conduction (thermal conductivity factor 20-170w/m.k) but based on its fragility large and cost height but also limited its purposes, traditional PCB improvement and the heat conduction PCB that comes because of be in its insulating barrier, add its thermal conductivity factor of ceramic powder of heat conduction also can only be fair with aluminium base.

The modes such as heat conduction PCB connected mode common and heat pipe adopts welding, bonding, and machinery is fixing.

Welding manner thermal resistance minimum but complex process, bonding way thermal resistance maximum but technique is simple, mechanical means thermal resistance is more complicated between the two technique.

For example: the headlight for vehicles of LED is owing to will mating the optical focus of reflector, the LED of 20-40w is multiple incorgruous plane and the curved surface that must concentrate on the solid of the wide 100mm2 surface area of 5-6mm, because there are corresponding relation in the light output of LED and life-span with junction temperature, (light of the higher LED of junction temperature is exported less, life-span is shorter), and the heat flow density of this application is up to 40w/cm2, and heat be passed out to reflector dispels the heat outward, existing best technical scheme is LED to be welded on copper base the copper base mode of welding or mechanical connection to be fixed to cover and to have on the copper isothermal rod of heat pipe or on the copper isothermal rod of real core, heat is passed out to reflector again dispel the heat outward, because the existence of more this heat conduction bottleneck of particularly copper base of link makes the LED junction temperature of this high heat flux higher, affect light output and life-span, cause the headlight for vehicles of present LED can't large-scale application.

Utility model content

The utility model proposes a kind of heat pipe for thermal conductivity structure, solved the problem of mentioning in above-mentioned.

The technical solution of the utility model is achieved in that a kind of heat pipe for thermal conductivity structure, comprise: electronic device, flexible PCB, heat pipe, described flexible PCB is wrapped in one end of described heat pipe, described electronic device is positioned at described flexible PCB top, and the bottom of the corresponding described electronic device of described flexible PCB has through hole, described through hole is provided with heat sink inserts, thereby the heat that described electronic device produces is delivered on described heat pipe and distributes through the described heat sink inserts of bottom, simultaneously, owing to having and being connected between described electronic device and described flexible PCB, thereby described heat pipe for thermal conductivity structure also has the effect of electrical connection, owing to using described flexible PCB to do electric connection, the described electronic device of heating that makes to be originally distributed on the multiple incorgruous planes of solid and curved surface can weld by the automation surface attachment process of existing maturation, significantly reduce technology difficulty, improve qualification rate, thereby significantly reduce manufacturing cost more than 10 times.

Further, described heat pipe comprises endotherm section and heat release section, and described flexible PCB wraps up described endotherm section.

Further, described heat sink inserts is high heat conduction inserts, as aluminium nitride, and carborundum etc., radiating effect is good.

Further, described flexible PCB is high temperature resistant self-adhesion flexible PCB, and heat-resisting strong with adhesiving effect, meanwhile, the described flexible PCB of high temperature resistant self-adhesion is below 1/10 of cost of Metal Substrate or ceramic base, and the manufacturing cost of circuit is significantly reduced.

Further, described heat sink inserts is that scolder is welded on described heat pipe, on the direct described heat pipe that is welded on Metal Substrate with scolder, remove thermal conductivity factor various circuit substrates and one deck weld layer less than normal on passage of heat than old heat conduction technical scheme, make the thermal resistance of described heat pipe for thermal conductivity structure significantly improve 1-2 more than the order of magnitude than old heat conduction technical scheme, the application of large heat flow density is achieved.

Described heat pipe for thermal conductivity structure of the present utility model has following technique effect:

First, because described electronic device is directly welded on the described heat pipe of Metal Substrate with scolder by described heat sink inserts, remove thermal conductivity factor various circuit substrates and one deck weld layer less than normal on passage of heat than old heat conduction technical scheme, make the thermal resistance of described heat pipe for thermal conductivity structure significantly improve 1-2 more than the order of magnitude than old heat conduction technical scheme, the application of large heat flow density is achieved.

Moreover, because the described flexible PCB that uses high temperature resistant self-adhesion does electric connection, the described electronic device of heating that makes to be originally distributed on the multiple incorgruous planes of solid and curved surface can weld by the automation surface attachment process of existing maturation, significantly reduce technology difficulty, improve qualification rate, thereby significantly reduce manufacturing cost more than 10 times.

Further, because flexible PCB described in the high temperature resistant self-adhesion using is below 1/10 of cost of Metal Substrate or ceramic base, the manufacturing cost of circuit is significantly reduced.

Brief description of the drawings

In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.

Fig. 1 is the cross section structure schematic diagram of an embodiment of a kind of heat pipe for thermal conductivity structure of the utility model.

Detailed description of the invention

Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiment. Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.

As shown in Figure 1, a kind of heat pipe for thermal conductivity structure, comprise: electronic device 1, flexible PCB 2, heat pipe 3, flexible PCB 2 is wrapped in one end of heat pipe 3, electronic device 1 is positioned at flexible PCB 2 tops, and the bottom of the corresponding electronic device 1 of flexible PCB 2 has through hole, through hole is provided with heat sink inserts 4, thereby the heat that electronic device 1 produces is delivered on heat pipe 3 and distributes through the heat sink inserts 4 of bottom, simultaneously, owing to having and being connected between electronic device 1 and flexible PCB 2, thereby heat pipe for thermal conductivity structure also has the effect of electrical connection.

Further, heat pipe comprises endotherm section 31 and heat release section 32, and flexible PCB 2 wraps up endotherm section 31.

Further, heat sink inserts 4 is high heat conduction aluminium nitride, the inserts such as carborundum, and radiating effect is good.

Further, flexible PCB 2 is high temperature resistant self-adhesion flexible PCB, and heat-resisting strong with adhesiving effect, meanwhile, the flexible PCB 2 of high temperature resistant self-adhesion is below 1/10 of cost of Metal Substrate or ceramic base, and the manufacturing cost of circuit is significantly reduced.

Further, heat sink inserts is that scolder 4 is welded on heat pipe 3, and heat pipe 3 is also Metal Substrate, as copper base etc.

The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any amendment of doing, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.

Claims

1. a heat pipe for thermal conductivity structure, it is characterized in that, comprise: electronic device, flexible PCB, heat pipe, described flexible PCB is wrapped in one end of described heat pipe or is wrapped in several positions of described heat pipe, described electronic device is positioned at described flexible PCB top, and the bottom of the corresponding described electronic device of described flexible PCB has through hole, and described through hole is provided with heat sink inserts.

2. heat pipe for thermal conductivity structure described in claim 1, is characterized in that: described heat pipe comprises endotherm section and heat release section, described flexible PCB wraps up described endotherm section.

3. heat pipe for thermal conductivity structure described in claim 1, is characterized in that: described heat sink inserts is high heat conduction inserts.

4. heat pipe for thermal conductivity structure described in claim 1, is characterized in that: described flexible PCB is high temperature resistant self-adhesion flexible PCB.

5. heat pipe for thermal conductivity structure described in claim 1, is characterized in that: described heat sink inserts is that scolder is welded on described heat pipe.